CN210854219U - Automatic arrangement machine for wafer base - Google Patents

Automatic arrangement machine for wafer base Download PDF

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Publication number
CN210854219U
CN210854219U CN201921786876.8U CN201921786876U CN210854219U CN 210854219 U CN210854219 U CN 210854219U CN 201921786876 U CN201921786876 U CN 201921786876U CN 210854219 U CN210854219 U CN 210854219U
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CN
China
Prior art keywords
guide rail
locate
vibration
manipulator
automatic arrangement
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CN201921786876.8U
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Chinese (zh)
Inventor
吴延剑
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Zhuhai Dong Jingda Electronics Technology Co ltd
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Zhuhai Dong Jingda Electronics Technology Co ltd
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Priority to CN201921786876.8U priority Critical patent/CN210854219U/en
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Abstract

The utility model aims at providing a simple structure, high-efficient save time, precision height, operation are stable and can effectively reduce the wafer base automatic balance machine of cost of labor. The utility model discloses a vibration dish, locate the terminal straight guide rail that shakes of vibration dish ejection of compact, locate the terminal material district, the locating of getting of the guide rail ejection of compact that directly shakes get the material district get the manipulator of material district top and locate in proper order CCD camera, charging tray subassembly and defective products district of manipulator movement track below, the vibration dish is equipped with first discernment subassembly and second discernment subassembly along defeated material direction in proper order. The utility model discloses be applied to automation equipment's technical field.

Description

Automatic arrangement machine for wafer base
Technical Field
The utility model relates to an automatic change the technical field of equipment, in particular to automatic balance machine of wafer base.
Background
The existing 3225SMD base wobble plate process: after the bases are cleaned, 5 thousand bases are packed in bulk into one bag, an operator manually places one 3225SMD base on the carrying disc in a specified direction each time by using plastic tweezers, the next dispensing procedure can be performed only when the 3225SMD base is placed in the specified direction, and the manual placement of the 3225SMD base by using the plastic tweezers is low in efficiency and difficult to meet the production requirements. Moreover, when the operator operates the device, the direction of the electrode of the base needs to be distinguished by naked eyes, the phenomenon of the base reverse is often caused by mistake, and the reverse of the base seat can cause defective products in the post engineering.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that overcome prior art not enough, provide a simple structure, high-efficient save time, the precision is high, the operation is stable and can effectively reduce the wafer base automatic balance machine of cost of labor.
The utility model adopts the technical proposal that: the utility model discloses a vibration dish, locate the terminal straight guide rail that shakes of vibration dish ejection of compact, locate the terminal material district, the locating of getting of the guide rail ejection of compact that directly shakes get the material district get the manipulator of material district top and locate in proper order CCD camera, charging tray subassembly and defective products district of manipulator movement track below, the vibration dish is equipped with first discernment subassembly and second discernment subassembly along defeated material direction in proper order.
It can be seen by above-mentioned scheme that the vibration dish is arranged the base product and is carried, first discernment subassembly with the base product that the second discernment subassembly carried out vertical placing to the base product blows and falls rearrange in the vibration dish and will arrange the base product according to certain orientation, arrange the base product of accomplishing according to certain direction and be carried in proper order directly shake the guide rail with get on the material district, finally via the manipulator puts qualified base product on the charging tray subassembly, unqualified base product is put on the defective products district.
According to a preferred scheme, the first identification assembly comprises a first air hole and a second air hole which are sequentially arranged along the conveying direction of the vibration disc, and a first high-definition camera is oppositely arranged on the second air hole.
According to the scheme, the first air holes are always kept for blowing air, and the base products which are longitudinally arranged are blown down into the vibration disc; and the transversely arranged base products are conveyed to the first high-definition camera to be shot and identified on the front and the back, and the base products on the back are blown into base products on the front through the second air holes and are conveyed continuously by the vibration disc.
One preferred scheme is, the second discernment subassembly includes along the defeated material direction of vibration dish sets gradually third gas pocket and fourth gas pocket, fourth gas pocket is to being provided with the second high definition camera.
According to the scheme, the third air holes are always kept to blow air, and the base products which are longitudinally arranged are blown down into the vibration disc; the second high-definition camera identifies the conveyed base product, and the base product on the reverse side is blown down into the vibration disc through the fourth air hole.
One preferred scheme is that one end of the vibration disc, which is close to the direct vibration guide rail, is provided with a third high-definition camera and a fifth air hole, and the feed end of the direct vibration guide rail is provided with a sensor.
According to the scheme, the third high-definition camera identifies the front side and the back side of the base product, and the base product on the back side is blown down into the vibration disc through the fifth air hole; in addition, when base products are fully stacked on the direct vibration guide rail, the sensor detects and identifies and sends a signal to the background system, and the background system controls all base products which are conveyed in sequence to be blown down to the vibration disc through the fifth air hole, and the base products are not fed on the direct vibration guide rail any longer.
According to a preferable scheme, the manipulator comprises a pressing cylinder, a rotating motor in transmission connection with the pressing cylinder and a suction nozzle in running fit with the rotating motor.
According to the scheme, when the base products are conveyed to the material taking area, the lower air cylinder drives the suction nozzle to move downwards and suck and convey the base products tightly, when the manipulator conveys the base products to the upper portion of the CCD camera, the CCD camera shoots and identifies the base products, qualified products which are placed correctly are placed in the material tray, the base products which need to rotate are driven by the rotating motor to rotate through the suction nozzle, the rotation of the base products is finally realized, and unqualified base products are conveyed to the unqualified base area through the manipulator.
According to a preferable scheme, the material tray assembly comprises a sliding rail, a material tray which is in sliding fit with the sliding rail, and a driving motor which is in transmission connection with the material tray.
According to the scheme, the grooves which are uniformly arranged and matched with the base products are formed in the material tray, when one row of grooves are placed in the manipulator, the material tray is driven by the driving motor to slide on the sliding rail, and the sliding distance of the material tray is consistent with the row spacing of the grooves.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
As shown in fig. 1, in this embodiment, the utility model discloses a vibration dish 1, locate the terminal guide rail 2 that directly shakes of 1 ejection of compact of vibration dish, locate directly shake 2 ejection of compact terminal of guide rail and get material district 3, locate get the manipulator 4 of material district 3 top and locate in proper order CCD camera 5, charging tray 21 subassembly 6 and defective products district 7 of 4 movement tracks belows of manipulator, vibration dish 1 is equipped with first discernment subassembly and second discernment subassembly along defeated material direction in proper order.
Further, first discernment subassembly includes along the defeated material direction of vibration dish 1 sets gradually first gas pocket 8 and second gas pocket 9, second gas pocket 9 subtend is provided with first high definition camera 10.
Further, the second identification component comprises a third air hole 11 and a fourth air hole 12 which are sequentially arranged along the material conveying direction of the vibration disc 1, and a second high-definition camera 13 is oppositely arranged on the fourth air hole 12.
Furthermore, a third high-definition camera 14 and a fifth air hole 15 are arranged at one end, close to the straight vibration guide rail 2, of the vibration disc 1, and a sensor 16 is arranged at the feed end of the straight vibration guide rail 2.
Further, the manipulator 4 comprises a pressing cylinder 17, a rotating motor 18 in transmission connection with the pressing cylinder 17, and a suction nozzle 19 in running fit with the rotating motor 18.
Further, the tray assembly 6 comprises a slide rail 20, a tray 21 which is slidably fitted on the slide rail 20, and a driving motor which is in transmission connection with the tray 21.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.

Claims (6)

1. An automatic balance machine of wafer base, its characterized in that: it includes vibration dish (1), locates vibration dish (1) the terminal straight guide rail (2) that shakes of ejection of compact, locate straight shake guide rail (2) the terminal material district (3) of getting of ejection of compact, locate get manipulator (4) of material district (3) top and locate in proper order CCD camera (5), charging tray subassembly (6) and defective products district (7) of manipulator (4) movement track below, vibration dish (1) is equipped with first discernment subassembly and second discernment subassembly along defeated material direction in proper order.
2. The wafer pedestal automatic arrangement machine of claim 1, wherein: first discernment subassembly includes along first gas pocket (8) and second gas pocket (9) that vibrating disc (1) defeated material direction set gradually, second gas pocket (9) subtend is provided with first high definition camera (10).
3. The wafer pedestal automatic arrangement machine of claim 1, wherein: the second identification component comprises a third air hole (11) and a fourth air hole (12) which are sequentially arranged along the conveying direction of the vibration disc (1), and the fourth air hole (12) is oppositely provided with a second high-definition camera (13).
4. The wafer pedestal automatic arrangement machine of claim 1, wherein: the vibration disc (1) is close to one end of the direct vibration guide rail (2) is provided with a third high-definition camera (14) and a fifth air hole (15), and a sensor (16) is arranged at the feeding end of the direct vibration guide rail (2).
5. The wafer pedestal automatic arrangement machine of claim 1, wherein: the manipulator (4) comprises a pressing cylinder (17), a rotating motor (18) in transmission connection with the pressing cylinder (17) and a suction nozzle (19) in running fit with the rotating motor (18).
6. The wafer pedestal automatic arrangement machine of claim 1, wherein: the charging tray assembly (6) comprises a sliding rail (20), a charging tray (21) which is in sliding fit with the sliding rail (20) and a driving motor which is in transmission connection with the charging tray (21).
CN201921786876.8U 2019-10-23 2019-10-23 Automatic arrangement machine for wafer base Active CN210854219U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921786876.8U CN210854219U (en) 2019-10-23 2019-10-23 Automatic arrangement machine for wafer base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921786876.8U CN210854219U (en) 2019-10-23 2019-10-23 Automatic arrangement machine for wafer base

Publications (1)

Publication Number Publication Date
CN210854219U true CN210854219U (en) 2020-06-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921786876.8U Active CN210854219U (en) 2019-10-23 2019-10-23 Automatic arrangement machine for wafer base

Country Status (1)

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CN (1) CN210854219U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113306760A (en) * 2021-05-25 2021-08-27 贝隆精密科技股份有限公司 Flexible vibration manipulator plate placing machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113306760A (en) * 2021-05-25 2021-08-27 贝隆精密科技股份有限公司 Flexible vibration manipulator plate placing machine
CN113306760B (en) * 2021-05-25 2022-06-10 贝隆精密科技股份有限公司 Flexible vibration manipulator plate placing machine

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