CN210838438U - Semiconductor laser generator for positioning - Google Patents
Semiconductor laser generator for positioning Download PDFInfo
- Publication number
- CN210838438U CN210838438U CN201922010415.8U CN201922010415U CN210838438U CN 210838438 U CN210838438 U CN 210838438U CN 201922010415 U CN201922010415 U CN 201922010415U CN 210838438 U CN210838438 U CN 210838438U
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- semiconductor laser
- laser generator
- water
- positioning
- mounting
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Abstract
The utility model discloses a semiconductor laser generator is used in location, including semiconductor laser generator, semiconductor laser generator both sides surface mounting has the heating panel, and the outside surface screw thread fastening of heating panel installs the cooling tube apron, the water-cooled tube has been placed to the draw-in groove formula between heating panel and the cooling tube apron, semiconductor laser generator bottom surface center department installs the connecting rod, and connecting rod lower extreme welding installation has the rotary sphere, the rotary sphere outside is provided with two sets of stoppers, and the embedded fastening screw that installs in stopper one side. A semiconductor laser generator for location, be equipped with connecting rod, rotary sphere, stopper and fastening screw, heating panel and water-cooling tube, mounting panel, first vacuum chuck and second vacuum chuck can multi-angle adjusting semiconductor laser generator for give off the heat that semiconductor laser generator produced when using, make things convenient for semiconductor laser generator's installation fixed.
Description
Technical Field
The utility model relates to a laser generator field, in particular to semiconductor laser generator is used in location.
Background
The laser generator is a device capable of emitting laser light, and the core components of the laser generator are an excitation source and a working medium with a metastable energy level, and the laser generator is generally divided into a solid laser generator, a liquid laser generator and a gas laser generator; the method is widely applied to the fields of information scanning, laser ranging, laser cutting, laser positioning, optical fiber communication and the like; present semiconductor laser generator for location has certain drawback, and at first, when current semiconductor laser generator adjustment location position, but angle of adjustment is little, and semiconductor laser generator receives the temperature influence great, and current laser generator cooling system is timely effective inadequately, and semiconductor laser generator mounting means is single in addition, and there is not the way to adapt to different installation environment. To this end, we propose a semiconductor laser generator for positioning.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a semiconductor laser generator for positioning, which can effectively solve the problems of the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a semiconductor laser generator for positioning comprises a semiconductor laser generator, wherein heat dissipation plates are arranged on the two sides of the semiconductor laser generator, a cooling pipe cover plate is arranged on the outer surface of each heat dissipation plate in a threaded fastening mode, a water cooling pipe is arranged between each heat dissipation plate and the corresponding cooling pipe cover plate in a clamping groove mode, a connecting rod is arranged in the center of the bottom surface of the semiconductor laser generator, a rotating ball body is arranged at the lower end of the connecting rod in a welding mode, two groups of limiting blocks are arranged on the outer portion of the rotating ball body, fastening screws are embedded into one sides of the limiting blocks, supporting blocks are welded to the lower surfaces of the limiting blocks, mounting plates are arranged on the four corners of the mounting plates in a threaded fastening mode, the mounting plates are connected with first vacuum chucks through screws and two groups of, and the pipe orifices at the two ends of the water-cooling pipe are respectively provided with a water inlet valve and a water outlet valve.
Preferably, five groups of radiating fins are uniformly distributed on the surface of one side of the radiating plate, the radiating fins are rectangular, and water cooling tube placing clamping grooves are formed in the five groups of radiating fins.
Preferably, the limiting blocks are of incomplete hemispherical structures, the inner portions of the limiting blocks are spherical cavities, the diameter of each spherical cavity in each limiting block is larger than the diameter of the outer spherical surface of each rotary sphere, and the two groups of limiting blocks are symmetrically arranged.
Preferably, four waist-shaped screw mounting through grooves are formed among the four through holes of the mounting plate.
Preferably, the bottoms of the second vacuum chuck and the first vacuum chuck are arc-shaped structures, and vent holes are formed in the surfaces of the second vacuum chuck and the first vacuum chuck.
Preferably, the water-cooling pipe is a U-shaped bent pipe.
Compared with the prior art, the utility model discloses following beneficial effect has:
in the utility model, through the added connecting rod, the rotary sphere, the limit blocks and the fastening screws, when the positioning position of the semiconductor laser generator is adjusted, the connecting rod drives the rotary sphere to freely rotate between the two groups of limit blocks in all directions, so as to realize multi-angle adjustment, when the required position is adjusted, the fastening screws on both sides can be screwed, the adjustment mode is simple, through the added heat dissipation plate and the added water cooling pipe, the heat generated during the working of the instrument can be more quickly, timely and effectively dissipated by utilizing the dual heat dissipation structure of the heat dissipation plate heat dissipation fins and the multi-bend water cooling pipe, the use stability and the service life of instrument parts are improved, through the added mounting plate, the first vacuum chucks and the second vacuum chucks, during the mounting, the four groups of the first vacuum chucks can meet the mounting environment of the general mounting environment, and the second vacuum chucks can, carry out the screw-thread fastening installation through four U-shaped through-holes on the mounting panel, can satisfy the installation environment of high strength high stability, three kinds of structures above utilizing can adapt to different installation environment demands.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a semiconductor laser generator for positioning according to the present invention;
FIG. 2 is a schematic view of a cooling system of a semiconductor laser generator for positioning according to the present invention;
FIG. 3 is a cross-sectional view of a stopper of a semiconductor laser generator for positioning according to the present invention;
fig. 4 is a schematic view of a mounting plate structure of a semiconductor laser generator for positioning according to the present invention.
In the figure: 1. a semiconductor laser generator; 2. a heat dissipation plate; 3. a water-cooled tube; 4. a cooling tube cover plate; 5. a connecting rod; 6. rotating the sphere; 7. a limiting block; 8. a support block; 9. fastening screws; 10. mounting a plate; 11. a first vacuum chuck; 12. a screw; 13. a nut; 14. a second vacuum chuck; 15. a water inlet valve; 16. and a water outlet valve.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in FIGS. 1 to 4, a semiconductor laser generator for positioning comprises a semiconductor laser generator 1, wherein heat dissipation plates 2 are arranged on the surfaces of two sides of the semiconductor laser generator 1, cooling tube cover plates 4 are tightly and threadedly arranged on the outer surfaces of the heat dissipation plates 2, water cooling tubes 3 are arranged between the heat dissipation plates 2 and the cooling tube cover plates 4 in a clamping groove manner, a connecting rod 5 is arranged at the center of the bottom surface of the semiconductor laser generator 1, a rotary sphere 6 is welded and arranged at the lower end of the connecting rod 5, two groups of limit blocks 7 are arranged on the outer part of the rotary sphere 6, fastening screws 9 are embedded and arranged on one side of each limit block 7, supporting blocks 8 are welded and arranged on the lower surfaces of the limit blocks 7, mounting plates 10 are tightly and threadedly arranged on the lower surfaces of the supporting blocks 8, four corners of the mounting, the central position of the bottom surface of the mounting plate 10 is provided with a second vacuum chuck 14 in a clamping groove type, and the pipe orifices at the two ends of the water-cooling pipe 3 are respectively provided with a water inlet valve 15 and a water outlet valve 16.
Five groups of radiating fins are uniformly distributed on the surface of one side of the radiating plate 2, the radiating fins are rectangular, and water-cooled tubes 3 are arranged in the five groups of radiating fins to be placed in clamping grooves; the limiting blocks 7 are in incomplete hemispherical structures, the inner parts of the limiting blocks 7 are spherical cavities, the diameter of the spherical cavity in each limiting block 7 is larger than the diameter of the outer spherical surface of the rotary sphere 6, and the two groups of limiting blocks 7 are symmetrically arranged; four kidney-shaped screw mounting through grooves are formed among the through holes at the four positions of the mounting plate 10; the bottoms of the second vacuum chuck 14 and the first vacuum chuck 11 are arc-shaped structures, and vent holes are formed in the surfaces of the second vacuum chuck and the first vacuum chuck; the water-cooling pipe 3 is a U-shaped bent pipe.
Before the positioning semiconductor laser generator is used, different installation modes are selected according to different installation environments, when the installation environment is a general environment, four groups of first vacuum chucks 11 adsorb the installation plane, the relative positions between the first vacuum chucks 11 and the installation plate 10 are fixed through adjusting screws 12 and nuts 13, when the installation environment is narrow and cannot meet the installation space of the four groups of first vacuum chucks 11, the second vacuum chucks 14 adsorb the installation plane, when the equipment installation needs to ensure high strength and high stability, the equipment is fastened and installed through the waist-shaped through holes on the installation plate 10, before the positioning semiconductor laser generator is used, a water inlet valve 15 and a water outlet valve 16 are opened, a cooling system starts to work, when the positioning semiconductor laser generator 1 is used, the rotary sphere 6 can freely rotate in all directions in the space between the two groups of limiting blocks 7 under the driving of the connecting rod 5, realize multi-angle and adjust, when adjusting required position, screw up both sides fastening screw 9, fixed rotary sphere 6 can. The work efficiency of the whole positioning semiconductor laser generator 1 is improved after improvement, and the functions are more comprehensive and practical.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A semiconductor laser generator for positioning, comprising a semiconductor laser generator (1), characterized in that: the semiconductor laser generator (1) is provided with heating panels (2) on the surfaces of two sides, cooling tube cover plates (4) are mounted on the outer surfaces of the heating panels (2) in a threaded fastening mode, water-cooled tubes (3) are placed in a clamping groove mode between the heating panels (2) and the cooling tube cover plates (4), connecting rods (5) are mounted at the centers of the bottom surfaces of the semiconductor laser generator (1), rotary spheres (6) are mounted at the lower ends of the connecting rods (5) in a welding mode, two groups of limit blocks (7) are arranged on the outer portions of the rotary spheres (6), fastening screws (9) are mounted on one sides of the limit blocks (7) in an embedded mode, supporting blocks (8) are welded on the lower surfaces of the limit blocks (7), mounting plates (10) are mounted on the lower surfaces of the supporting blocks (8) in a threaded fastening mode, four through holes are formed in four, the screw rod (12) passes through a through hole of the mounting plate (10), a second vacuum chuck (14) is installed in a clamping groove mode at the center position of the bottom surface of the mounting plate (10), and a water inlet valve (15) and a water outlet valve (16) are installed on pipe orifices at two ends of the water cooling pipe (3) respectively.
2. A positioning semiconductor laser generator as claimed in claim 1, wherein: five groups of radiating fins are uniformly distributed on the surface of one side of the radiating plate (2), the radiating fins are rectangular, and water-cooling tubes (3) are arranged in the five groups of radiating fins to place clamping grooves.
3. A positioning semiconductor laser generator as claimed in claim 1, wherein: the limiting blocks (7) are of incomplete hemispheroid structures, the interior of each limiting block is a spherical cavity, the diameter of the spherical cavity in each limiting block (7) is larger than the diameter of the outer spherical surface of the rotary sphere (6), and the limiting blocks (7) are symmetrically arranged.
4. A positioning semiconductor laser generator as claimed in claim 1, wherein: four waist-shaped screw mounting through grooves are formed among the through holes at four positions of the mounting plate (10).
5. A positioning semiconductor laser generator as claimed in claim 1, wherein: the bottoms of the second vacuum sucker (14) and the first vacuum sucker (11) are arc-shaped structures, and vent holes are formed in the surfaces of the second vacuum sucker and the first vacuum sucker.
6. A positioning semiconductor laser generator as claimed in claim 1, wherein: the water-cooling pipe (3) is a U-shaped bent pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922010415.8U CN210838438U (en) | 2019-11-20 | 2019-11-20 | Semiconductor laser generator for positioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922010415.8U CN210838438U (en) | 2019-11-20 | 2019-11-20 | Semiconductor laser generator for positioning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210838438U true CN210838438U (en) | 2020-06-23 |
Family
ID=71265319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922010415.8U Expired - Fee Related CN210838438U (en) | 2019-11-20 | 2019-11-20 | Semiconductor laser generator for positioning |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210838438U (en) |
-
2019
- 2019-11-20 CN CN201922010415.8U patent/CN210838438U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200623 Termination date: 20211120 |