CN210837728U - Rectifier bridge based on aluminum wire bonding process - Google Patents
Rectifier bridge based on aluminum wire bonding process Download PDFInfo
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- CN210837728U CN210837728U CN201921454341.0U CN201921454341U CN210837728U CN 210837728 U CN210837728 U CN 210837728U CN 201921454341 U CN201921454341 U CN 201921454341U CN 210837728 U CN210837728 U CN 210837728U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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Abstract
The utility model discloses a rectifier bridge based on aluminum wire bonding technology, which at least comprises an aluminum-based copper-clad plate, a chip, a first liner layer, a second liner layer and a power terminal, wherein the aluminum-based copper-clad plate is preformed into a circuit pattern which is used for realizing the electrical connection inside the rectifier bridge; the power terminal is directly welded on the circuit pattern and is used for being connected with an external circuit; the first gasket layer is arranged between the aluminum-based copper-clad plate and the chip and is electrically connected with the circuit pattern and the chip; the chip adopts a bare chip, and the lower electrode of the bare chip is electrically connected with the first liner layer; the second liner layer is disposed on the upper electrode of the chip and electrically connects the chip with the circuit pattern by bonding through an aluminum wire. The technical scheme can realize the connection between the chip and the circuit by adopting an aluminum wire bonding process under the original chip process condition.
Description
Technical Field
The utility model relates to a power electronic technology field especially relates to a rectifier bridge based on aluminium wire bonding technology.
Background
The power rectifier bridge is an important basic element in the power electronic technology field, and with the improvement of the process, the field tries to use aluminum wire bonding to realize the electrical connection of the bare chip, however, in the prior art, in order to adapt to the aluminum wire bonding process for the chip, the bare chip is shipped, and the upper electrode of the bare chip is subjected to an aluminum plating process, which causes the manufacturing process of the bare chip to be complicated, because the upper electrode and the lower electrode of the standard bare chip are subjected to a conventional silver plating process.
Therefore, it is necessary to provide a technical solution to solve the technical problems of the prior art.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is necessary to provide a rectifier bridge based on an aluminum wire bonding process, so that the connection between a chip and a circuit can be realized by using the aluminum wire bonding process under the original chip process condition, and the performance of the power rectifier bridge is improved while the cost is reduced.
In order to solve the technical problem existing in the prior art, the technical scheme of the utility model as follows:
a rectifier bridge based on an aluminum wire bonding process is characterized by at least comprising an aluminum-based copper-clad plate, a chip, a first substrate layer, a second substrate layer and a power terminal, wherein,
the aluminum-based copper-clad plate is pre-formed with a circuit pattern, and the circuit pattern is used for realizing the electrical connection inside the rectifier bridge;
the power terminal is directly welded on the circuit pattern and is used for being connected with an external circuit;
the first lining layer is arranged between the aluminum-based copper-clad plate and the chip and is electrically connected with the circuit pattern and the chip;
the chip adopts a bare chip, and the lower electrode of the bare chip is electrically connected with the first liner layer;
the second liner layer is disposed on the upper electrode of the chip and electrically connects the chip with the circuit pattern by bonding through an aluminum wire.
As a further improvement scheme, the upper electrode and the lower electrode are subjected to a silver plating process when the bare chip is delivered from a factory.
As a further improvement scheme, the aluminum-based copper-clad plate is sequentially provided with an aluminum bottom plate, an insulating layer and a copper foil layer, wherein the insulating layer is made of a ceramic insulating material.
As a further improvement, the copper foil layer adopts copper foil with copper teeth.
As a further improvement, the copper foil layer has a thickness of 3 ounces or greater.
As a further improvement scheme, the ceramic insulating material is made of a mixed material of ceramic powder and epoxy resin.
In a further development, the second lining layer is made of copper, iron, molybdenum or kovar.
In a further development, the second substrate layer is made of red copper and is electrically connected to the chip upper electrode by soldering.
In a further development, the first lining layer is made of copper, iron, molybdenum or kovar.
In a further development, the first substrate layer is made of red copper and is connected to the circuit pattern by soldering.
Compared with the prior art, the utility model discloses following technological effect has:
1. the second lining layer is arranged to realize the electrical connection between the bare chip and the circuit, the bare chip leaving the factory in the original double-sided silver plating process can be directly electrically connected with the second lining, and then aluminum wire bonding is directly carried out through the second lining, so that the existing chip preparation process is not required to be changed, and the process complexity and the cost of product realization are reduced.
2. The aluminum-based copper-clad plate is adopted to replace the traditional copper base plate and the traditional ceramic copper-clad plate, so that the material cost is reduced; meanwhile, a circuit pattern is directly formed on the aluminum-based copper-clad plate, so that a circuit pattern is formed without splicing copper sheets or copper connecting bridges in the prior art, the cost is further reduced, and the process is simplified.
3. In order to reduce because the cancellation falls ceramic substrate and copper sheet and adopts the copper foil to replace the influence of back to the rectifier bridge performance, the utility model discloses only need set up first lining lamella (2) between chip and aluminium base copper-clad plate to reduce chip structural stress, and improved insulating properties and anti surge current. The material of the lining can be selected and the thickness of the lining can be adjusted according to the actual application requirements.
4. The aluminum wire bonding technology is adopted to replace the traditional gasket and copper connecting bridge, the structural stress of the chip is reduced, the material is changed from rare metal and the copper connecting bridge needing special treatment into the conventional aluminum wire, the cost is further reduced, and the product competitiveness is greatly improved.
5. The utility model discloses in, power terminal beading is on the circuit pattern to only need adopt the power terminal of a specification, reduced material kind and quantity, simplified the back end assembly degree of difficulty.
Drawings
Fig. 1 is a schematic structural diagram of a rectifier bridge in the prior art.
Fig. 2 is the utility model discloses a rectifier bridge structure schematic diagram based on aluminium wire bonding technology.
The following detailed description of the invention will be made in conjunction with the above-described drawings.
Detailed Description
The technical solution provided by the present invention will be further explained with reference to the accompanying drawings.
At present, the prior art generally adopts a process of arranging an integrated packaging chip on a ceramic copper-clad plate, and the process has more types of assembly materials, complex process and higher cost. Referring to fig. 1, a structural block diagram of a power rectifier bridge in the prior art is shown, and the power rectifier bridge is formed by melting and welding a copper base plate, a ceramic copper-clad plate, a chip, a gasket, a copper connecting bridge and a power terminal together through lead-containing solder; meanwhile, in order to further reduce stress, a layer of gasket is added between the copper connecting bridge and the chip, so that gaskets are added for an upper electrode and a lower electrode of the chip, and the gasket is usually rare metal molybdenum, so that the gasket is high in price and cannot be regenerated. In the prior art, a power terminal connected with a chip is directly welded on the chip, and power terminals with various length specifications are needed due to the height difference, so that the assembly difficulty is increased; in addition, the cost is greatly increased due to the adoption of the integrated packaging chip and the structure of the copper base plate and the ceramic copper-clad plate. Therefore, a rectifier bridge process and a rectifier bridge structure are urgently needed in the prior art, and the cost of a product is greatly reduced under the condition that the requirement of certain performance is met.
In order to solve the technical problems in the prior art, referring to fig. 2, the utility model provides a rectifier bridge based on aluminum wire bonding process, at least comprising an aluminum-based copper-clad plate 1, a chip 3, a first liner layer 2, a second liner layer 9 and a power terminal 4, wherein the aluminum-based copper-clad plate 1 is preformed with a circuit pattern, and the circuit pattern is used for realizing the electrical connection inside the rectifier bridge; the power terminal 4 is directly welded on the circuit pattern and is used for being connected with an external circuit; the first lining layer 2 is arranged between the aluminum-based copper-clad plate 1 and the chip 3 and is electrically connected with the circuit pattern and the chip 3; the chip 3 adopts a bare chip, and the lower electrode of the bare chip is electrically connected with the first substrate layer 2; a second substrate layer 9 is provided on the upper electrode of the chip 3 and electrically connects the chip 3 with the circuit pattern by bonding through an aluminum wire 5.
In the above technical solution, in order to reduce the cost, the chip 3 is electrically connected to the circuit pattern by using a bare chip and an aluminum wire bonding method. The aluminum wire bonding technology is adopted to replace the traditional gasket and copper connecting bridge, the structural stress of the chip is reduced, the material is changed from rare metal and the copper connecting bridge needing special treatment into the conventional aluminum wire, the cost is further reduced, and the product competitiveness is greatly improved.
Meanwhile, in order to not increase the complexity of the bare chip process, the second liner layer is arranged to realize the electrical connection between the bare chip and the circuit, so that the bare chip leaving the factory in the original double-sided silver plating process can be directly electrically connected with the second liner, and then the aluminum wire bonding is directly carried out through the second liner, the existing chip preparation process does not need to be changed, and the process complexity and the cost of product realization are reduced. Therefore, adopt the utility model discloses technical scheme, the bare chip all adopts silver-plating technology from top to bottom when dispatching from the factory, can the direct welding.
In the technical scheme, the aluminum-based copper-clad plate 1 is formed with a circuit pattern in advance, the aluminum-based copper-clad plate 1 is sequentially provided with the aluminum base plate 6, the insulating layer 7 and the copper foil layer 8, a circuit pattern can be formed on the copper foil layer 8 by adopting an engraving process or an etching process, and the circuit pattern is obtained by designing through circuit design software in advance and is used for realizing the electrical connection inside the rectifier bridge. The aluminum-based copper-clad plate is adopted to replace the traditional copper base plate and the traditional ceramic copper-clad plate, so that the material cost is reduced; meanwhile, a circuit pattern is directly formed on the aluminum-based copper-clad plate, so that a circuit pattern is formed without splicing copper sheets or copper connecting bridges in the prior art, the cost is further reduced, and the process is simplified.
In order to reduce the influence on the rectifier bridge performance after the ceramic substrate is removed and the copper sheet is replaced by the copper foil, in the utility model, the first liner layer 2 is arranged between the aluminum-based copper-clad plate 1 and the chip 3 and is electrically connected with both the circuit pattern and the chip 3; thereby reducing the stress of the chip structure and improving the insulating property and the surge current resistance. By adopting the technical scheme, the material of the gasket and the thickness of the adjusting gasket can be selected according to the actual application requirements so as to meet the application requirements, the overall design of the rectifier bridge can be adjusted according to the actual application requirements without changing, the applicability of the product is greatly improved, and the research and development difficulty is reduced.
In a preferred embodiment, the lower electrode of the chip 3 is directly soldered to the first substrate layer 2, the upper electrode is also connected to the second substrate layer 9 by soldering, and the upper electrode of the chip 3 is electrically connected to the circuit pattern by aluminum wire bonding through the second substrate layer 9.
Additionally, the utility model discloses in, be used for 4 lug welds of power terminal that are connected with external circuit on the circuit diagram to only need adopt the power terminal of a specification, reduced material kind and quantity, simplified the back end assembly degree of difficulty.
In the prior art, an insulating layer of an aluminum substrate is usually made of glass fiber, so that the heat dissipation performance is poor, and the application requirement of a power rectifier bridge is difficult to meet. Therefore, in a preferred embodiment, the insulating layer of the aluminum-based copper-clad plate 1 is made of a ceramic insulating material, specifically, a mixed material of ceramic powder and epoxy resin, and the heat dissipation capacity can be adjusted according to the mixing proportion.
In addition, the thickness of the copper foil layer is increased to more than 3 ounces for the purpose of improving the current carrying capacity of the circuit pattern. Meanwhile, the copper foil layer is a copper foil with copper teeth on the back surface, and the copper foil has high peel strength and temperature resistance. The overall performance of the rectifier bridge is further improved.
In a preferred embodiment, the first and second substrate layers 2 and 9 can be made of copper, iron, molybdenum or kovar, etc., with various options, while the prior art is limited by its process and structure, and can generally only be made of molybdenum.
In order to simplify the process, the first and second substrate layers 2 and 9 may be made of red copper so as to be directly connected to the circuit pattern by soldering.
It should be noted that the utility model provides a chip is rectifier chip, and the rectifier bridge structure of above-mentioned design can directly be encapsulated to rectifier bridge module.
The above description of the embodiments is only intended to help understand the method of the present invention and its core ideas. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A rectifier bridge based on an aluminum wire bonding process is characterized by at least comprising an aluminum-based copper-clad plate (1), a chip (3), a first liner layer (2), a second liner layer (9) and a power terminal (4),
the aluminum-based copper-clad plate (1) is pre-formed with a circuit pattern, and the circuit pattern is used for realizing the electrical connection inside a rectifier bridge;
the power terminal (4) is directly welded on the circuit pattern and is used for being connected with an external circuit;
the first liner layer (2) is arranged between the aluminum-based copper-clad plate (1) and the chip (3) and is electrically connected with the circuit pattern and the chip (3);
the chip (3) adopts a bare chip, and the lower electrode of the bare chip is electrically connected with the first substrate layer (2);
the second substrate layer (9) is arranged on the upper electrode of the chip (3) and electrically connects the chip (3) with the circuit pattern by means of bonding via an aluminum wire (5).
2. The rectifier bridge based on the aluminum wire bonding process as claimed in claim 1, wherein the bare chip is manufactured by a silver plating process for both the upper electrode and the lower electrode.
3. The rectifier bridge based on the aluminum wire bonding process as claimed in claim 1 or 2, wherein the aluminum-based copper-clad plate (1) is sequentially provided with an aluminum base plate (6), an insulating layer (7) and a copper foil layer (8), wherein the insulating layer (7) is made of a ceramic insulating material.
4. The rectifier bridge based on the aluminum wire bonding process as claimed in claim 3, wherein the copper foil layer (8) is copper foil with copper teeth.
5. The aluminum wire bonding process-based rectifier bridge of claim 3, wherein the copper foil layer (8) has a thickness of 3 ounces or more.
6. The rectifier bridge based on the aluminum wire bonding process as claimed in claim 3, wherein the second substrate layer (9) is made of copper, iron, molybdenum or Kovar.
7. The rectifier bridge based on the aluminum wire bonding process as claimed in claim 6, wherein the second substrate layer (9) is made of red copper and electrically connected with the upper electrode of the chip (3) by means of soldering.
8. The rectifier bridge based on the aluminum wire bonding process as claimed in claim 3, wherein the first substrate layer (2) is made of copper, iron, molybdenum or Kovar.
9. The rectifier bridge based on the aluminum wire bonding process as claimed in claim 8, wherein the first substrate layer (2) is made of red copper and is connected with the circuit pattern by means of soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921454341.0U CN210837728U (en) | 2019-09-03 | 2019-09-03 | Rectifier bridge based on aluminum wire bonding process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921454341.0U CN210837728U (en) | 2019-09-03 | 2019-09-03 | Rectifier bridge based on aluminum wire bonding process |
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| CN210837728U true CN210837728U (en) | 2020-06-23 |
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| CN201921454341.0U Active CN210837728U (en) | 2019-09-03 | 2019-09-03 | Rectifier bridge based on aluminum wire bonding process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933577A (en) * | 2020-07-15 | 2020-11-13 | 中国电子科技集团公司第二十九研究所 | Local large-area welding board-level interconnection integration method for airtight packaging unit |
-
2019
- 2019-09-03 CN CN201921454341.0U patent/CN210837728U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933577A (en) * | 2020-07-15 | 2020-11-13 | 中国电子科技集团公司第二十九研究所 | Local large-area welding board-level interconnection integration method for airtight packaging unit |
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