CN210837696U

CN210837696U - Wafer operation table

Info

Publication number: CN210837696U
Application number: CN201922268225.6U
Authority: CN
Inventors: 吴亚红; 万世伟
Original assignee: SiEn Qingdao Integrated Circuits Co Ltd
Current assignee: SiEn Qingdao Integrated Circuits Co Ltd
Priority date: 2019-12-17
Filing date: 2019-12-17
Publication date: 2020-06-23
Anticipated expiration: 2029-12-17

Abstract

The utility model provides a wafer operation platform for the in-process that shifts the wafer in the wafer box places the wafer box. The wafer operating platform comprises an operating platform body and a buffer pad; the cushion pad is positioned on the workbench body, the horizontal plane of the cushion pad is higher than that of the workbench body, and the width of the cushion pad is smaller than that of the bottom of the wafer box; when the wafer box is placed on the buffer pad and wafers are placed in the wafer box, the wafers firstly contact with the buffer pad and then fall into the clamping grooves of the wafer box and are fixed. The utility model discloses a wafer operation platform can reduce the impact force that the wafer received at the in-process that the wafer box was placed to the wafer through the structural design who improves, can greatly reduce the piece risk of wafer, and the sharp edge that can reduce the wafer simultaneously is favorable to prolonging the life of wafer box, reduction in production cost to the damage that the wafer box caused. The wafer operating platform of the utility model has the advantages of simple structure, convenient use and great industrial utilization value.

Description

Wafer operation table

Technical Field

The utility model relates to a semiconductor chip makes the field, especially relates to a wafer operation platform.

Background

Although chip manufacturing has been highly automated, there are occasions when it is necessary to do this by manual operation of a worker. For example, in batch operation (split, that is, dividing a batch of wafers into a plurality of small batches) or turnover operation of thin wafers, since the thickness of the thin wafers is very small, if a robot arm is used for operation, fragments of the thin wafers are very easily generated, and therefore, a worker usually needs to grip the thin wafers with fingers after wearing a finger stall or transfer the thin wafers from one wafer cassette to another wafer cassette (hereinafter referred to as a target wafer cassette for distinction) with a suction pen. In the operation process, the target wafer box is usually placed on a workbench, when the wafer is transferred into the target wafer box, due to the structural limitation of the wafer box and the reason that the wafer is damaged due to the fact that a worker touches the target wafer box, the worker usually does not loosen his hand when the wafer touches the bottom of the target wafer box, but when the wafer is at a certain distance from the target wafer box, the worker loosens his fingers or releases the suction force of the suction pen, so that the wafer vertically falls into the clamping groove of the target wafer box. Due to the structure of the wafer box (the bottom of the wafer box is usually not supported, and the wafer is erected in the clamping grooves at two sides of the wafer box), when the wafer falls, the wafer firstly contacts with the workbench and then is erected and fixed by the clamping groove of the target wafer box. Since the table is a hard table, once the wafer contacts the table, a large impact force is generated to damage the wafer, and the sharp edge of the wafer cuts the inner side of the target wafer box to damage the target wafer box.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide a wafer worktable for solving the problems in the prior art that during the process of transferring a wafer to a wafer box, a large impact force is generated when the wafer contacts with a worktable, which easily causes damage to the wafer and the wafer box.

To achieve the above and other related objects, the present invention provides a wafer table for placing a wafer cassette during transfer of a wafer into the wafer cassette, the wafer table including a table body and a cushion pad; the cushion pad is positioned on the workbench body, the horizontal plane of the cushion pad is higher than that of the workbench body, and the width of the cushion pad is smaller than that of the bottom of the wafer box; when a wafer box is placed on the buffer pad and wafers are placed in the wafer box, the wafers firstly contact with the buffer pad and then fall into the clamping grooves of the wafer box and are fixed.

Optionally, the width of the buffer pad is 30-40 mm.

Optionally, the length of the buffer pad is greater than or equal to the length of the wafer cassette.

Optionally, the cushion pad comprises one or a combination of a silicone pad and a pearl wool pad.

Optionally, the workbench body is further provided with two wafer box fixing grooves, the two wafer box fixing grooves are located on two sides of the cushion pad and are arranged in parallel with the cushion pad, and a distance between the two wafer box fixing grooves is matched with the size of the wafer box.

Optionally, the material of the table body comprises stainless steel.

Optionally, the surface of the cushion pad is a concave surface, and the radian of the concave surface is matched with the edge size of a wafer to be placed.

Optionally, a groove is formed in the workbench body, the cushion pad is located in the groove, and the thickness of the cushion pad is greater than the depth of the groove.

More optionally, the depth of the groove is 8-10 mm, and the thickness of the buffer pad is 12-14 mm.

Optionally, a cushion installation groove is further disposed on the workbench body, the cushion installation groove is located on a side surface of the groove and communicated with the groove, and the cushion installation groove facilitates installation or removal of the cushion.

Compared with the prior art, the utility model discloses a wafer operation platform has following beneficial effect: the utility model discloses a wafer operation platform is through the structural design who improves, place the wafer box on the cushion pad back, to the in-process of wafer box internal transfer wafer, the wafer drops the in-process of wafer box when having a take the altitude apart from the wafer box earlier with the cushion pad that is located wafer box bottom portion contacts, can reduce the impact force that the wafer received, can greatly reduce the piece risk of wafer, can reduce the damage that the sharp edge of wafer caused the wafer box simultaneously, be favorable to prolonging the life of wafer box, and the reduction in production cost. The utility model discloses simple structure, convenient to use has great industry value.

Drawings

Fig. 1 is a schematic structural view of the wafer stage according to the present invention when no cushion pad is placed thereon.

Fig. 2 is a schematic structural view of the wafer stage according to the present invention when the cushion pad is placed thereon.

Fig. 3 is a schematic side view of the wafer cassette with wafers placed on the wafer stage according to the present invention.

Fig. 4 is a schematic top view of the wafer cassette with wafers on the wafer stage according to the present invention.

Description of the element reference numerals

1 workbench body

11 groove

12 wafer box fixing groove

13 cushion mounting groove

14 auxiliary groove

2 buffer cushion

3 wafer box

4 wafer

Detailed Description

The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.

Please refer to fig. 1 to 4. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope covered by the technical content disclosed in the present invention without affecting the function and the achievable purpose of the present invention. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes. And in the drawings of this specification, the same structures are not generally repeatedly labeled for the sake of brevity.

As shown in fig. 1 to 4, the present invention provides a wafer platform for placing a wafer cassette during transferring a wafer into the wafer cassette, the wafer platform includes a platform body 1 and a cushion pad 2; the cushion pad 2 is positioned on the workbench body 1, the horizontal plane of the cushion pad 2 is higher than the horizontal plane of the workbench body 1, for example, 1-3 cm higher than the horizontal plane of the workbench body 1, and the width of the cushion pad 2 is smaller than the width of the bottom of the wafer box 3; when the wafer box 3 is placed on the cushion pad 2 and wafers are placed in the wafer box 3, the wafers firstly contact with the cushion pad 2 and then fall into the clamping grooves of the wafer box 3 and are fixed. The utility model discloses a wafer operation platform is through the structural design who improves, place the wafer box on the cushion pad back, to the in-process of wafer box internal transfer wafer, the wafer drops the in-process of wafer box when having a take the altitude apart from the wafer box earlier with the cushion pad that is located wafer box bottom portion contacts, can reduce the impact force that the wafer received, can greatly reduce the piece risk of wafer, can reduce the damage that the sharp edge of wafer caused the wafer box simultaneously, be favorable to prolonging the life of wafer box, and the reduction in production cost. The utility model discloses simple structure, convenient to use is applicable to and shifts the wafer to all operational situations of target wafer box, is particularly useful for being used for placing target wafer box in the transfer process of thin slice wafer.

It should be noted that the width of the wafer box 3 refers to the size of the wafer box 3 along the horizontal radial direction of the wafer 4 when the wafer 4 is placed in the wafer box 3, and the length of the wafer box 3 refers to the size of the wafer 4 in the stacking direction, and these specific parameters are different according to the size and the number of the wafers 4 to be placed. The specific structure of the wafer box 3 varies according to the manufacturer, but usually has openings at the top and bottom, and the wafer 4 is fixed by a slot with a certain curvature on the sidewall. Therefore wafer box 3 place in the utility model discloses a during on wafer operation platform's blotter 2, blotter 2 expose in wafer box 3's bottom, and wafer 4 is shifting to wafer box 3's in-process, when having the direction of height vertical whereabouts of certain distance apart from wafer box 3, earlier with blotter 2 contacts, then just is embedded into in wafer box 3's the draw-in groove by fixed. Because of the buffering cushion, the impact force of the wafer in the descending process is greatly reduced, so that the risk of fragments can be obviously reduced, the impact of the sharp edge of the wafer on the wafer box in the process is also greatly reduced, the damage of the wafer box can be effectively reduced, the service life of the wafer box can be prolonged, the production cost can be reduced, particles generated when the wafer scratches the wafer box can be reduced, and the cleanliness of the wafer can be improved.

The width of the buffer pad 2 is not suitable to be too small, otherwise, the wafer is difficult to accurately contact the buffer pad 2 in the falling process, and the too small buffer pad 2 may damage the wafer 4, but is also not suitable to be too large, otherwise, the buffer pad 2 cannot protrude out of the bottom surface of the wafer box 3 and cannot contact the falling wafer before the worktable body 1, and the width of the buffer pad 2 and the width of the bottom opening of the wafer box 3 also need to correspond to each other, and is usually not more than half of the width of the bottom opening of the wafer box 3, for example, 1/4-1/3 of the width of the bottom opening of the wafer box 3. The inventor of the utility model finds that, after many times of experiments, when the width of the buffer pad 2 is 30-40 mm, and more preferably 40mm, the buffer pad can be basically matched with the size of a wafer box commonly seen on the market.

The length of the buffer pad 2 can be set as required, and it is required to ensure that all wafers 4 in the wafer box 3 can contact the buffer pad 2. In one example, the length of the buffer pad 2 is greater than or equal to the length of the wafer box 3, so that the buffer pad 2 can be customized according to the length of the wafer box 3, and standardization of material management is facilitated. Of course, when the wafer cassette 3 is placed on the wafer stage, it is necessary to ensure that the cushion pad 2 is located below, and preferably right below, the central line of the cushion pad 2 in the longitudinal direction preferably coincides with the central line of the wafer cassette 3 in the longitudinal direction, so as to ensure that the wafer 4 is smoothly contacted with the cushion pad 2 in the process of transferring into the wafer cassette 3.

The buffer pad 2 may be made of any material that has a good buffering force and is not easily worn, so as to prevent the wafer 4 from being contaminated by particles generated when the wafer 4 is in contact with the buffer pad. In this embodiment, as an example, the buffer pad 2 includes one or two combinations of a silica gel pad and a pearl cotton pad, that is, the buffer pad 2 may be a silica gel pad, a pearl cotton pad, or a combination of the two, and the silica gel pad and/or the pearl cotton pad are not only wear-resistant, but also easily attached to the hard table top of the workbench body 1, and in addition, have advantages of low cost, convenient replacement, and the like.

The buffer pad 2 may have a substantially horizontal structure, such as a substantially horizontal rectangular column, so that the buffer pad can be horizontally placed on the worktable body 1 with the surface thereof being horizontal, and corners of the buffer pad 2 may be chamfered to reduce friction between the buffer pad 2 and the later-mentioned recess 11. In another example, the surface of the buffer pad 2 is a concave surface, that is, the thickness of the edge of the buffer pad 2 is slightly greater than the middle thickness to present a certain slope or gradually increases from the middle to both sides to present a smooth shape, and the radian of the concave surface matches with the edge size of the wafer 4 to be placed, so that when the wafer 4 falls into the wafer box 3, the wafer 4 first contacts with both sides of the concave surface of the buffer pad 2, then slides to the bottom of the buffer pad 2, and finally is completely fixed in the clamping groove of the wafer box 3. The concave surface design is beneficial to further reducing the impact force on the wafer in the process of placing the wafer, and is beneficial to further reducing the damage of the wafer.

The workbench body 1 has a surface on which the wafer box 3 is placed, the bottom of the workbench body can be supported by support legs so that the wafer workbench has a proper height suitable for workers to work, and the support legs and the workbench body 1 can be fixed by screws (not marked) and the like. The material of the workbench body 1 can be set as required. In this embodiment, as an example, the worktable body 1 may be made of a hard metal material with a large mass, such as stainless steel, which can stably support the wafer cassette 3, prevent the wafer cassette 3 from turning on one side, and facilitate the processing of the subsequently mentioned structures, such as the groove 11.

The wafer cassette 3 may be directly placed on the work table body 1. In this embodiment, in order to better fix the wafer box 3 and avoid the side-tipping of the wafer box 3, two wafer box fixing grooves 12 are further disposed on the worktable body 1, the two wafer box fixing grooves 12 are located on two sides of the cushion pad 2 and are parallel to the cushion pad 2, and are preferably symmetrically distributed with the cushion pad 2 as a center, that is, the distance between the two wafer box fixing grooves 12 and the cushion pad 2 is equal, and the distance between the two wafer box fixing grooves 12 matches the size of the wafer box 3, more precisely, the size of the bottom of the wafer box 3. For example, the bottom of the wafer box 3 generally has two supports (left and right sides), the size and depth of the wafer box fixing groove 12 are matched with the size of the support of the wafer box 3, when the wafer box 3 is placed on the workbench body 1, the two supports of the wafer box 3 are correspondingly placed in the wafer box fixing groove 12, and according to the different structure of the wafer box 3, for example, if the two ends of the support of the wafer box 3 also have inward extending portions, the two ends of the wafer box fixing groove 12 can be correspondingly provided with auxiliary grooves 14 to bear the inward extending portions of the wafer box 3.

The cushion pad 2 may be directly placed on the workbench body 1, or may be fixed on the workbench body 1 by means of an adhesive or the like. However, in a further example, in order to better fix the buffer pad 2 and facilitate replacement of the buffer pad 2, as an example, the workbench body 1 is provided with a groove 11, the buffer pad 2 is located in the groove 11, and the thickness of the buffer pad 2 is greater than the depth of the groove 11. The depth of the groove 11 may be determined according to the size of the wafer cassette 3, but it is required to ensure that the depth matches the size of the buffer pad 2, so as to ensure that the horizontal surface of the buffer pad 2 is higher than the horizontal surface of the worktable body 1 when the buffer pad 2 is placed in the groove 11, for example, about 1-3 cm higher. The utility model discloses an inventor is through many times experimental discovery, the degree of depth of recess 11 is 8 ~ 10mm, the thickness of blotter 2 is comparatively suitable for 12 ~ 14mm, can avoid blotter 2 influences the steady placing of wafer box 3 can be ensured simultaneously blotter 2 plays better cushioning effect.

In a further example, a cushion installation groove 13 is further provided on the workbench body 1, the cushion installation groove 13 is located at a side of the groove 11 and is communicated with the groove 11, the cushion installation groove 13 facilitates installation or removal of the cushion 2, the cushion installation groove 13 can be provided at either side of the groove 11 or at both sides thereof, but is preferably provided at a side wall in the middle of the groove 11, when the cushion 2 needs to be replaced or cleaned, a worker can extend from the cushion installation groove 13 to the lower portion of the cushion 2 to lift the cushion 2, and a slope can be provided at a connection portion of the cushion installation groove 13 and the groove 11 so as to apply force to contact the cushion 2.

Use the utility model discloses a wafer operation platform carries out the transfer operation process of wafer as follows: the wafer operation table is placed stably to enable the operation table body to be in a horizontal state, the cushion pad is placed on the operation table body (the cushion pad is placed in the groove when the groove is formed), then a wafer box to be placed with wafers is placed on the operation table body (the support of the wafer box is fixed in the wafer box clamping groove when the wafer box clamping groove is formed), the wafer box is ensured to be located right above the cushion pad, and then the wafer transfer operation can be started. When the wafer is transferred to the upper part of the wafer box for a certain distance, the wafer is released, the wafer vertically falls into the wafer box under the action of gravity, and the bottom of the wafer box is in an open state, so that the wafer is firstly contacted with the buffer pad positioned at the bottom of the wafer box and slowly slides into the clamping groove of the wafer box under the buffer of the buffer pad to realize complete fixation. The utility model discloses a wafer operation platform not only is applicable to the manual transfer of wafer, also is applicable to simultaneously that the machinery shifts the in-process and bears the weight of the wafer box. The utility model discloses a wafer operation platform is particularly useful for the transfer operation in-process of thin slice wafer, is favorable to reducing the damaged risk of wafer, reduces the damage of wafer to the wafer box, helps reduction in production cost, improves the operation yield.

As described above, the present invention provides a wafer stage for placing a wafer cassette during transferring a wafer into the wafer cassette, the wafer stage including a stage body and a cushion pad; the cushion pad is positioned on the workbench body, the horizontal plane of the cushion pad is higher than that of the workbench body, and the width of the cushion pad is smaller than that of the bottom of the wafer box; when a wafer box is placed on the buffer pad and wafers are placed in the wafer box, the wafers firstly contact with the buffer pad and then fall into the clamping grooves of the wafer box and are fixed. The utility model discloses a wafer operation platform is through the structural design who improves, place the wafer box on the cushion pad back, to the in-process of wafer box internal transfer wafer, the wafer drops the in-process of wafer box earlier and is located the cushion pad of wafer box bottom when having a take the altitude apart from the wafer box and contacts, can reduce the impact force that the wafer received, can greatly reduce wafer piece risk, can reduce the damage that the sharp edge of wafer caused the wafer box simultaneously, be favorable to prolonging the life of wafer box, and the production cost is reduced. The utility model discloses simple structure, convenient to use. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A wafer table for positioning a wafer cassette during transfer of a wafer into the cassette, the wafer table comprising:

an operation table body;

the cushion pad is positioned on the workbench body, the horizontal plane of the cushion pad is higher than that of the workbench body, and the width of the cushion pad is smaller than that of the bottom of the wafer box;

when a wafer box is placed on the buffer pad and wafers are placed in the wafer box, the wafers firstly contact with the buffer pad and then fall into the clamping grooves of the wafer box and are fixed.

2. The wafer table of claim 1, wherein: the width of the buffer pad is 30-40 mm.

3. The wafer table of claim 1, wherein: the length of the buffer pad is greater than or equal to that of the wafer box.

4. The wafer table of claim 1, wherein: the buffer pad comprises one or the combination of two of a silica gel pad and a pearl wool pad.

5. The wafer table of claim 1, wherein: the workbench body is further provided with two wafer box fixing grooves, the two wafer box fixing grooves are located on two sides of the cushion pad and are arranged in parallel with the cushion pad, and the distance between the two wafer box fixing grooves is matched with the size of the wafer box.

6. The wafer table of claim 1, wherein: the material of the workbench body comprises stainless steel.

7. The wafer table of claim 1, wherein: the surface of the buffer pad is a concave surface, and the radian of the concave surface is matched with the edge size of a wafer to be placed.

8. A wafer table according to any of claims 1-7, wherein: the workbench body is provided with a groove, the cushion pad is positioned in the groove, and the thickness of the cushion pad is larger than the depth of the groove.

9. The wafer table of claim 8, wherein: the depth of the groove is 8-10 mm, and the thickness of the cushion pad is 12-14 mm.

10. The wafer table of claim 8, wherein: still be provided with the blotter mounting groove on the operation platform body, the blotter mounting groove is located the side of recess and with the recess is linked together.