CN210836131U

CN210836131U - Fingerprint identification device

Info

Publication number: CN210836131U
Application number: CN201922144042.3U
Authority: CN
Inventors: 于泽; 吕子熏
Original assignee: Shenzhen Chipsailing Technology Co ltd
Current assignee: Shenzhen Chipsailing Technology Co ltd
Priority date: 2019-12-02
Filing date: 2019-12-02
Publication date: 2020-06-23
Anticipated expiration: 2029-12-02

Abstract

The utility model provides a fingerprint identification device belongs to fingerprint identification technical field. The method comprises the following steps: a substrate set including a first substrate having a first circuit surface and a second substrate having a second circuit surface, the first circuit surface being adhered to the second circuit surface; the induction element comprises a first electrode layer, a second electrode layer and an insulating layer arranged between the first electrode layer and the second electrode layer, wherein the first electrode layer is formed on the first circuit surface, the second electrode layer is formed on the second circuit surface, and the first electrode layer is electrically connected with the second electrode layer; the fingerprint identification chip is arranged on the first circuit surface and electrically connected with the first electrode layer. The utility model provides a conducting layer processing at second floor electrode place is on smooth substrate surface, and technology is simpler, can hoisting device's production yield, reduce holistic cost.

Description

Fingerprint identification device

Technical Field

The utility model belongs to the technical field of fingerprint identification, more specifically say, relate to a fingerprint identification device.

Background

With the rise of electronic commerce, the development of remote payment is thousands of days, and the business demand of biometric identification is rapidly increased, wherein the capacitive fingerprint identification technology is most widely accepted in the market. The typical fingerprint identification device comprises a fingerprint identification chip and a sensor consisting of a plurality of sensing elements, wherein the fingerprint identification chip is used for driving the sensing elements and receiving fingerprint signals generated by the sensing elements, and fingerprint images are generated according to the sizes of the fingerprint signals.

In the prior art, most of the inductive elements are composed of two layers of electrodes and an insulating layer between the electrodes, and the processing method of the inductive elements comprises the following steps: the first conducting layer is first machined, the first conducting layer is then etched to form the first electrode pattern, one insulating layer is machined to expose the parts to be connected, the second conducting layer is machined on the insulating layer, and the second conducting layer is finally etched to form the second electrode pattern to complete the induction element area. The method needs more working procedures and has higher cost.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a fingerprint identification device aims at solving among the prior art many and with high costs technical problem of fingerprint identification device's sensing element manufacturing procedure.

In order to achieve the above object, the utility model adopts the following technical scheme: provided is a fingerprint recognition device including:

a substrate set comprising a first substrate having a first circuit surface and a second substrate having a second circuit surface, the first circuit surface being adhered to the second circuit surface.

The induction element comprises a first electrode layer, a second electrode layer and an insulating layer arranged between the first electrode layer and the second electrode layer, wherein the first electrode layer is formed on the first circuit surface, the second electrode layer is formed on the second circuit surface, and the first electrode layer is electrically connected with the second electrode layer.

The fingerprint identification chip is arranged on the first circuit surface and is electrically connected with the first electrode layer;

furthermore, the fingerprint identification device further comprises a first anisotropic conductive adhesive which is arranged between the first electrode layer and the second electrode layer and used for adhesion and enabling the first electrode layer and the second electrode layer to be electrically connected, a closed inner cavity is formed by the first anisotropic conductive adhesive, the first circuit surface and the second circuit surface in a surrounding mode, and the insulating layer is contained in the closed inner cavity.

Further, the insulating layer is insulating glue or insulating plastic.

Further, the first substrate is a glass substrate.

Furthermore, the second substrate is a glass substrate, a flexible circuit board, a plastic panel or a printed circuit board.

Further, the fingerprint identification device further comprises an outer shell, and the outer shell is electrically connected with the first electrode layer.

The utility model provides a fingerprint identification device's beneficial effect lies in: compared with the prior art, the conducting layer where the second layer electrode of the induction element is located is processed on the surface of the flat substrate, the process is simpler, the production yield of the device is improved, and the overall production cost is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a fingerprint identification device according to an embodiment of the present invention;

fig. 2 is a schematic view of a first substrate structure of a fingerprint identification device according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a second substrate of the fingerprint identification device according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a fingerprint identification device according to an embodiment of the present invention;

fig. 5 is a schematic sectional view taken along a line a-a in fig. 1 according to an embodiment of the present invention.

In the figure: 1. a substrate group; 11. a first substrate; 12. a second substrate; 2. an inductive element; 21. a first electrode layer; 22. a second electrode layer; 23. an insulating layer; 3. a fingerprint identification chip; 4. a first anisotropic conductive paste; 5. a second anisotropic conductive paste; 6. a third anisotropic conductive paste; 7. an outer housing.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

As shown in fig. 1 to 5, the present invention provides a fingerprint identification device, which includes a substrate set 1, an inductive element 2 and a fingerprint identification chip 3. The substrate group 1 comprises a first substrate 11 and a second substrate 12, both of which are square, wherein the first substrate 11 comprises a first circuit surface, the second substrate 12 comprises a second circuit surface, the upper surface of the second substrate 12 is a finger contact surface for collecting fingerprint information, and the first substrate 11 and the second substrate 12 are fixedly connected in a mode that the first circuit surface is adhered to the second circuit surface; the sensing element 2 is used for generating a corresponding electric signal when a finger of a user touches the upper surface of the second substrate 12, the sensing element 2 comprises a second electrode layer 22, an insulating layer 23 and a first electrode layer 21 which are sequentially arranged from top to bottom, the first electrode layer 21 is formed on the first circuit surface, the second electrode layer 22 is formed on the second circuit surface, and the first electrode layer 21 and the second electrode layer 22 have different circuit patterns; the fingerprint identification chip 3 is adhered to the first circuit surface through the second anisotropic conductive adhesive 5, and due to the conductive effect of the perpendicular direction of the anisotropic conductive adhesive, the fingerprint identification chip 3 is electrically connected with the first electrode layer 21, so that the fingerprint identification chip 3 can receive the sensing signal from the sensing element 2, and the first electrode layer 21 is electrically connected with the second electrode layer 22, so that the fingerprint identification chip 3 is indirectly electrically connected with the second electrode layer 22, and the second electrode layer 22 can receive the driving signal from the fingerprint identification chip 3. In the present invention, the conductive layer where the second electrode 22 of the sensing element 2 is located is processed on the surface of the flat second substrate 12, the process is simple and the yield is high.

Further, as shown in fig. 2, in an embodiment of the present invention, the fingerprint identification apparatus further includes a first anisotropic conductive adhesive 4, the first anisotropic conductive adhesive 4 is located between the first electrode layer 21 and the second electrode layer 22, the first anisotropic conductive adhesive 4 forms a closed cavity with the first circuit surface and the second circuit surface, the insulating layer 23 is accommodated in the closed cavity, the first anisotropic conductive adhesive 4 can adhere the first circuit surface and the second circuit surface together to connect and fix the first substrate 11 and the second substrate 12, and since the anisotropic conductive adhesive has the characteristics of good vertical conductivity and non-conductivity in the horizontal direction, the circuit pattern of the first electrode layer 21 can be electrically connected with the circuit pattern of the second electrode layer 22, since the fingerprint identification chip 3 is electrically connected with the first electrode layer 21 through the second anisotropic conductive adhesive 5, thereby indirectly realizing the electrical connection between the fingerprint identification chip 3 and the second electrode layer 22, and enabling the second electrode layer 22 to receive the driving signal from the fingerprint identification chip 3.

As shown in fig. 1 and fig. 5, in an embodiment of the present invention, the insulating layer 23 is formed by processing in a closed cavity formed by the first anisotropic conductive adhesive 4 and the first circuit surface and the second circuit surface, when the first anisotropic conductive adhesive 4 is coated on the surface of the first substrate 11 or/and the second substrate 12, a gap is left to inject the insulating material into the closed cavity from the gap, the insulating material is filled with adhesive or plastic supporting particles, and can be vacuumized from the gap to achieve the purpose of insulation, and the gap is sealed by dispensing after the insulating layer 23 is processed. The anisotropic conductive adhesive is used for bonding, and the vacuum or filling adhesive and plastic particle insulation are used, so that the process is simpler than the existing processes of processing and etching the insulating layer, the production yield of the device can be improved, and the overall cost can be reduced.

Further, in an embodiment of the present invention, the thickness of the first substrate 11 is preferably 0.3mm-1.1mm, the substrate is hard, the thickness can be slightly thinner, and the thickness of the substrate is thicker if the substrate is soft, so as to provide sufficient support and protection for the device, so as to prevent the device from being broken or fractured due to external impact. Of course, in other embodiments of the present invention, the first substrate 11 may have other thicknesses according to practical situations and requirements, and is not limited herein.

The utility model provides an in an embodiment the thickness of second base plate 12 is not more than 0.2mm to reach better fingerprint signal acquisition volume, second base plate 12 can be glass panels, flexible circuit board, plastic panel or printed circuit board, and these materials have good dimensional stability.

As shown in fig. 4, further, the fingerprint identification apparatus further includes an outer casing 7, the outer casing 7 is adhered to the first circuit surface through a third anisotropic conductive adhesive 6, and since the outer casing 7 and the first electrode layer 21 establish an electrical connection relationship through the vertical conductive action of the anisotropic conductive adhesive, a specific potential can be provided to the outer casing 7, and the purpose of providing the specific potential to the outer casing 7 is to: firstly, fingers generally contact the sensing area and the outer shell 7 at the same time, so that noise on the fingers flows into the outer shell 7 first and is not sensed by the sensing area; second, an external ESD (electrostatic discharge) current will flow into the outer casing 7 first and will not enter the sensing area or even the fingerprint identification chip 3. In addition, the fingerprint identification chip 3 and the substrate group 1 are wrapped by the outer shell 7, and only the sensing area is exposed for finger contact, so that the device is protected from mechanical collision, and the whole fingerprint identification device is more attractive.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A fingerprint recognition device, comprising:

a substrate set comprising a first substrate having a first circuit surface and a second substrate having a second circuit surface, the first circuit surface being adhered to the second circuit surface;

the induction element comprises a first electrode layer, a second electrode layer and an insulating layer arranged between the first electrode layer and the second electrode layer, wherein the first electrode layer is formed on the first circuit surface, the second electrode layer is formed on the second circuit surface, and the first electrode layer is electrically connected with the second electrode layer;

and the fingerprint identification chip is arranged on the first circuit surface and electrically connected with the first electrode layer.

2. The fingerprint identification device according to claim 1, further comprising a first anisotropic conductive adhesive disposed between the first electrode layer and the second electrode layer for adhering and electrically connecting the first electrode layer and the second electrode layer, wherein the first anisotropic conductive adhesive, the first circuit surface and the second circuit surface enclose a closed cavity, and the insulating layer is accommodated in the closed cavity.

3. The fingerprint recognition device of claim 2, wherein the insulating layer is an insulating glue or an insulating plastic.

4. The fingerprint recognition device of claim 1, wherein the first substrate is a glass substrate.

5. The fingerprint recognition device of claim 1, wherein the second substrate is a glass substrate, a flexible circuit board, a plastic panel, or a printed circuit board.

6. The fingerprint recognition device according to any one of claims 1 to 5, further comprising an outer housing, wherein the outer housing is electrically connected to the first electrode layer.