CN207182324U - Ultrasonic sensor and electronic installation - Google Patents
Ultrasonic sensor and electronic installation Download PDFInfo
- Publication number
- CN207182324U CN207182324U CN201721167430.8U CN201721167430U CN207182324U CN 207182324 U CN207182324 U CN 207182324U CN 201721167430 U CN201721167430 U CN 201721167430U CN 207182324 U CN207182324 U CN 207182324U
- Authority
- CN
- China
- Prior art keywords
- ultrasonic sensor
- piezoelectric element
- conductive electrode
- electrode
- pixel electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Transducers For Ultrasonic Waves (AREA)
Abstract
The utility model discloses a kind of ultrasonic sensor and electronic installation.Ultrasonic sensor includes base material, multiple pixel electrodes, piezoelectric element, conductive electrode and the process chip being connected with multiple pixel electrodes.Base material includes visible area and non-visible area.Multiple pixel electrodes are produced on visible area and are in array distribution.Piezoelectric element is arranged on base material and covers multiple pixel electrodes.Piezoelectric element is used to launch ultrasonic wave and produces electric signal after the ultrasonic wave of thing reflection to be detected is received.Multiple pixel electrodes are used to receive electric signal.Conductive electrode is set on the piezoelectric element.Piezoelectric element is between base material and conductive electrode.Process chip is used to handle electric signal to form the ultrasonograph of thing to be detected.Because each pixel electrode can determine pressing position and the piezoelectric element caused electric signal on the position of thing to be detected according to the electric signal received, data volume to be processed needed for process chip is low, and ultrasonic sensor recognition efficiency is high.
Description
Technical field
Fingerprint identification technology field is the utility model is related to, more particularly to a kind of ultrasonic sensor and electronic installation.
Background technology
The emission electrode of existing ultrasonic sensor and receiving electrode typically in crisscross structure, when it needs to be determined that
Emission electrode and receiving electrode is needed to confirm jointly during the position of certain point, therefore control required during ultrasonic sensor work
Make signal transacting caused by more complicated and ultrasonic sensor is also more complicated, and then influence the identification of ultrasonic sensor
Efficiency.
Utility model content
The utility model embodiment provides a kind of ultrasonic sensor and electronic installation.
The ultrasonic sensor of the utility model embodiment, including：
Base material, the base material include visible area and non-visible area；
Multiple pixel electrodes, multiple pixel electrodes are produced on the visible area and are in array distribution；
Piezoelectric element, the piezoelectric element set on the substrate and cover multiple pixel electrodes, the piezoelectricity
Element is used to launch ultrasonic wave and produces electric signal, multiple pixel electrodes after the ultrasonic wave of thing reflection to be detected is received
For receiving the electric signal；
Conductive electrode, the conductive electrode are arranged on the piezoelectric element, the piezoelectric element be located at the base material with
Between the conductive electrode；And
The process chip being connected with multiple pixel electrodes, the process chip are used to handle the electric signal to be formed
The ultrasonograph of the thing to be detected.
Each pixel electrode of the ultrasonic sensor of the utility model embodiment can be according to the electric signal received
Determine that thing to be detected is pressed against the position on ultrasonic sensor and the piezoelectric element caused electric signal on the position, so as to subtract
Lack process chip need data volume to be processed, improve the recognition efficiency of ultrasonic sensor.
In some embodiments, the piezoelectric element is that layer structure overall made of piezoelectric (is also piece
Shape structure).
Because piezoelectric element is overall layer structure, piezoelectric element easy to manufacture and cost of manufacture is relatively low.
In some embodiments, the piezoelectric element includes multiple piezo columns, and multiple piezo columns are arranged on described
On base material and it is in array distribution, multiple piezo columns are corresponding with multiple pixel electrodes, each piezo column covering pair
The pixel electrode answered.
Because multiple piezo column arrays on piezoelectric element are set, therefore each piezo column is produced by adjacent piezo column
Electrical interference and vibration interference it is smaller, so as to compared to the overall laminated structure being made out of a piezoelectric material, present embodiment
Piezoelectric element under ul-trasonic irradiation caused electric signal it is more accurate, and then process chip handle the electric signal formation ultrasound
Ripple image is more accurate.
In some embodiments, on the base material formed with multiple image element circuits in array distribution and with it is multiple described
A plurality of wire corresponding to image element circuit, multiple image element circuits are corresponding with multiple pixel electrodes, each pixel electricity
Road connects with the corresponding pixel electrode, and the every wire is used to connect the corresponding image element circuit and the processing core
Piece.
Present embodiment is easy to pixel electrode to be electrically connected with process chip by setting image element circuit and wire.
In some embodiments, the ultrasonic sensor also includes：
Connection electrode, the connection electrode be arranged on the side of remote multiple pixel electrodes of the base material and with institute
State process chip connection；And
Lead, the pixel electrode are connected to the connection electrode by the lead, and the conductive electrode passes through described
Lead is connected to the connection electrode.
Present embodiment is easy to pixel electrode electric with circuit board respectively with conductive electrode by setting lead and connection electrode
Connection.
In some embodiments, the conductive electrode is overall layer structure.
In this way, being easy to the energization of process chip control conductive electrode, while make conductive electrode easy to manufacture and be fabricated to
This is relatively low.
In some embodiments, the conductive electrode includes layer structure and prolonged respectively from the both ends of layered structure
The extended structure stretched, layered structure wrap the piezoelectric element jointly with the extended structure.
Present embodiment is by setting extended structure to be easy to process chip to be electrically connected with conductive electrode.
In some embodiments, the conductive electrode includes multiple spaced list structures, each list structure
The conductive electrode it is corresponding with the pixel electrode in a row or column.
Pixel electrode is corresponding with the conductive electrode of list structure to be easy to pixel electrode to be applied on the piezoelectric element with conductive electrode
Add high frequency voltage (such as：Frequency is more than 20KHZ voltage), while it is easy to pixel electrode and conductive electrode by piezoelectric element inverse
Caused electric signal is delivered in other elements under piezo-electric effect.Relative to the conductive electrode of layer structure, list structure is led
Electrode be more convenient for process chip control conductive electrode signal input and output, so as to improve ultrasonic sensor identification refer to
The precision of line.
In some embodiments, the material of the conductive electrode is tin indium oxide, nano-silver thread, metal grill, nanometer
Any one in carbon pipe and graphene.
In this way, conductive electrode has preferable toughness and translucency made of above-mentioned material, so as to by the conductive electrode
Manufactured ultrasonic sensor has preferable toughness；When ultrasonic sensor is arranged on the lower section of display screen, have preferable
The ultrasonic sensor of translucency will not block the viewing area of display screen, while be arranged on the supersonic sensing below display screen
Device can keep the integral color of display screen consistent and make display screen more attractive in appearance.
In some embodiments, the light transmittance of the conductive electrode is more than 90%.
In this way, when ultrasonic sensor is arranged on the lower section of display screen, there is the supersonic sensing of preferable translucency
Device will not block the viewing area of display screen, while be arranged on the ultrasonic sensor below display screen and can keep the whole of display screen
Body solid colour and make display screen more attractive in appearance.
In some embodiments, the material of the base material is any one in glass, sapphire, polyvinyl chloride.
In this way, the cost of base material is relatively low, translucency is preferable, the cost of ultrasonic sensor is relatively low made of the base material；
When ultrasonic sensor is arranged on the lower section of display screen, the ultrasonic sensor with preferable translucency will not block display
The viewing area of screen, while being arranged on the ultrasonic sensor below display screen can keep the integral color of display screen unanimously to make
Display screen is more attractive in appearance.
In some embodiments, the material of the pixel electrode is tin indium oxide, nano-silver thread, metal grill, nanometer
Any one in carbon pipe and graphene.
In this way, pixel electrode has preferable toughness and translucency made of above-mentioned material, so as to by the pixel electrode
Manufactured ultrasonic sensor has preferable toughness.When ultrasonic sensor is arranged on the lower section of display screen, have preferable
The ultrasonic sensor of translucency will not block the viewing area of display screen, while be arranged on the supersonic sensing below display screen
Device can keep the integral color of display screen consistent and make display screen more attractive in appearance.
In some embodiments, the ultrasonic sensor also includes circuit board, multiple pixel electrodes, described leads
Electrode and the process chip are electrically connected with the circuit board.
In this way, it is easy to ultrasonic sensor to be electrically connected by the connector on circuit board with other electronic components.
The electronic installation of the utility model embodiment includes：
Housing；And
Ultrasonic sensor described in any of the above-described embodiment, the ultrasonic sensor set on the housing or
It is housed in the housing.
Each pixel electrode of the electronic installation of the utility model embodiment can determine according to the electric signal received
Thing to be detected is pressed against the position on ultrasonic sensor and the piezoelectric element caused electric signal on the position, so as to reduce
Process chip need data volume to be processed, the recognition efficiency for improving ultrasonic sensor.
In some embodiments, the electronic installation also includes display screen, and the ultrasonic sensor is arranged on described
When in housing, the ultrasonic sensor is corresponding with the display screen.
In this way, ultrasonic sensor is arranged in housing, ultrasonic sensor is set to be not take up the area of display screen, so as to carry
The screen accounting of electronic installation is risen.
In some embodiments, the electronic installation also includes display screen, bonnet and side frame, the display screen and institute
The opposite both sides that bonnet is located at the electronic installation are stated, the side frame connects the display screen and the bonnet, the ultrasound
Wave sensor is arranged in the housing and covered on the side frame or after described.
So, on the one hand, ultrasonic sensor is arranged in housing, ultrasonic sensor is not take up the face of display screen
Product, so as to improve the screen accounting of electronic installation；On the other hand, ultrasonic sensor can be fabricated to side fingerprint recognition module
Or back side fingerprint recognition module, there is provided more diversified Consumer's Experience.
The additional aspect and advantage of the utility model embodiment will be set forth in part in the description, partly will be under
Become obvious in the description in face, or recognized by practice of the present utility model.
Brief description of the drawings
Of the present utility model above-mentioned and/or additional aspect and advantage can retouch from reference to accompanying drawings below to embodiment
It will be apparent and be readily appreciated that in stating, wherein：
Fig. 1 is the sectional view of the ultrasonic sensor of some embodiments of the utility model；
Fig. 2 is the decomposing schematic representation of the ultrasonic sensor of some embodiments of the utility model；
Fig. 3 is the structural representation of the base material of some embodiments of the utility model；
Fig. 4 is the sectional view of the ultrasonic sensor of some embodiments of the utility model；
Fig. 5 is the decomposing schematic representation of the ultrasonic sensor of some embodiments of the utility model；
Fig. 6 is the sectional view of the ultrasonic sensor of some embodiments of the utility model；
Fig. 7 is the decomposing schematic representation of the ultrasonic sensor of some embodiments of the utility model；
Fig. 8 is the floor map of the electronic installation of some embodiments of the utility model；
Fig. 9 is the floor map of the electronic installation of some embodiments of the utility model；
Figure 10 is the decomposing schematic representation of the ultrasonic sensor of some embodiments of the utility model；
Figure 11 is the sectional view of the ultrasonic sensor of some embodiments of the utility model；
Figure 12 is the sectional view of the ultrasonic sensor of some embodiments of the utility model；With
Figure 13 is the sectional view of the ultrasonic sensor of some embodiments of the utility model；
Main element and symbol description：
Ultrasonic sensor 100, base material 10, visible area 10a, non-visible area 10b, image element circuit 12, wire 14, pixel electricity
Pole 20, piezoelectric element 30, piezo column 32, insulating barrier 34, conductive electrode 40, layer structure 42, extended structure 44, process chip
50th, connection electrode 60, lead 70, pixel electrode lead 72, conductive electrode lead 74, circuit board 80；
Electronic installation 200, display screen 201, housing 202, side frame 203.
Embodiment
Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein
Same or similar label represents same or similar element or the element with same or like function from beginning to end.Lead to below
It is exemplary to cross the embodiment being described with reference to the drawings, and is only used for explaining the utility model, and it is not intended that to this practicality
New limitation.
In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ",
The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " be based on orientation shown in the drawings or position relationship, be only for
Be easy to describe the utility model and simplify to describe, rather than instruction or imply signified device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.In addition, term " first ",
" second " is only used for describing purpose, and it is not intended that indicating or implying relative importance or imply the technology indicated by indicating
The quantity of feature.Thus, " first " is defined, the feature of " second " can be expressed or implicitly include one or more
The feature.In description of the present utility model, " multiple " are meant that two or more, unless otherwise clearly specific
Limit.
, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in description of the present utility model
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly
Connection；It can be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be in
Between medium be indirectly connected, can be connection or the interaction relationship of two elements of two element internals.For this area
For those of ordinary skill, concrete meaning of the above-mentioned term in the utility model can be understood as the case may be.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it
" under " can directly be contacted including the first and second features, it is not directly to contact but lead to that can also include the first and second features
The other characterisation contact crossed between them.Moreover, fisrt feature second feature " on ", " top " and " above " include the
One feature is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.First is special
Sign second feature " under ", " lower section " and " below " including fisrt feature immediately below second feature and obliquely downward, or only
Represent that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing different structure of the present utility model.
In order to simplify disclosure of the present utility model, hereinafter the part and setting of specific examples are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relation between setting.In addition, various specific techniques and the example of material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
Fig. 1 and Fig. 2 is referred to, the ultrasonic sensor 100 of the utility model embodiment includes base material 10, multiple pixels
Electrode 20, piezoelectric element 30, conductive electrode 40 and process chip 50.Base material 10 includes visible area 10a and non-visible area 10b.It is more
Individual pixel electrode 20 is produced on visible area 10a and is in array distribution.Piezoelectric element 30 is arranged on base material 10 and covered multiple
Pixel electrode 20, piezoelectric element 30 are used to launch ultrasonic wave and produce telecommunications after the ultrasonic wave of thing reflection to be detected is received
Number, multiple pixel electrodes 20 are used to receive the electric signal.Conductive electrode 40 is arranged on piezoelectric element 30, and piezoelectric element 30 is located at
Between pixel electrode 20 and conductive electrode 40.Process chip 50 is connected with multiple pixel electrodes 20, and process chip 50 is used to handle
The electric signal is to form the ultrasonograph of thing to be detected.
Fig. 2 and Fig. 3 is referred to, base material 10 includes visible area 10a and non-visible area 10b.Non-visible area 10b surface coating
There is ink layer.Ink layer can play a part of shading and decoration.Pixel electrode 20 is produced on visible area 10a.
In some embodiments, non-visible area 10b sets (as shown in Figure 2) around visible area 10a, or non-visible area
10b is located at visible area 10a at least side (as shown in Figure 3).
Thing to be detected can be finger, test template etc..Density and supersonic sensing of the pixel electrode 20 on base material 10
The acquisition precision positive correlation of device 100, the density of the pixel electrode 20 of present embodiment can detect ultrasonic sensor 100
The fingermark image of thing to be detected.Piezoelectric element 30 can be layer structure overall made of piezoelectric (such as Fig. 1 and Fig. 2 institutes
Show), multiple piezo columns 32 (as shown in Figures 4 and 5) in array distribution can also be included.Conductive electrode 40 can be overall
Layer structure (as shown in Figures 1 and 2), or conductive electrode 40 (such as Fig. 6 and figure of spaced multiple list structures
Shown in 7).Process chip 50 can be also used for controlling the energization of conductive electrode 40 and pixel electrode 20.When process chip 50 controls
Conductive electrode 40 and pixel electrode 20 be powered so that conductive electrode 40 be applied with pixel electrode 20 high frequency voltage (such as：Frequently
Rate is more than 20KHZ voltage) when, wherein conductive electrode 40 applies high frequency voltage and pixel electrode 20 is grounded, and piezoelectric element 30 exists
Ultrasonic wave is produced in the presence of high frequency voltage and outwards launches ultrasonic wave；If finger is placed on supersonic sensing 100, finger
The ultrasonic wave of the transmitting of piezoelectric element 30 can be reflected and be passed back to piezoelectric element 30, due to fingerprint, thus piezoelectricity member on finger be present
The finger reflectance ultrasound ripple that each position receives on part 30 is incomplete same, so as to which 30 each position of piezoelectric element is in ultrasonic wave
Electric signal (or inverse piezoelectric signal) also incomplete same, electric signal caused by each position on piezoelectric element 30 caused by effect is lower
The fingerprint pattern of finger can be collectively forming；Process chip 50 controls each position of the multiple reception of pixel electrodes 20 piezoelectric elements 30
The electric signal is delivered in process chip 50 by the electric signal caused by putting, multiple pixel electrodes 20, and process chip 50 is handled
The electric signal is to form the ultrasonograph of thing to be detected (fingerprint pattern for including finger), so as to identify the finger of thing to be detected
Line.
Each pixel electrode 20 of the ultrasonic sensor 100 of the utility model embodiment can be according to the electricity received
Signal determines position and the piezoelectric element 30 caused electric signal on the position that finger is pressed against on ultrasonic sensor 100,
So as to the recognition efficiency for reducing the need of process chip 50 data volume to be processed, improving ultrasonic sensor 100.
Referring to Fig. 8, the electronic installation 200 of the utility model embodiment includes housing 202 and the utility model is any
The ultrasonic sensor 100 of embodiment.Ultrasonic sensor 100 can be arranged on housing 202.
Referring to Fig. 9, in other embodiments, ultrasonic sensor 100 can also be arranged in housing 202.For example,
Electronic installation 200 also includes display screen 201, ultrasonic sensor 100 be located at the lower section of display screen 201 and with display screen 201
Viewing area is corresponding.In this way, ultrasonic sensor 100 is arranged in housing 202, ultrasonic sensor 100 is set to be not take up display screen
201 area, so as to improve the screen accounting of electronic installation 200.
Please continue to refer to Fig. 9, in some embodiments, electronic installation 200 also includes bonnet (not shown) and side frame
203, display screen 201 is located at bonnet on the opposite both sides of electronic installation 200, and side frame 203 connects display screen 201 and bonnet,
Ultrasonic sensor 100 is arranged in housing 202 and is located on side frame 203 or is arranged in housing 202 and is covered after being located at.
So, on the one hand, ultrasonic sensor 100 is arranged in housing 202, ultrasonic sensor 100 is not take up display screen 201
Area, so as to improve the screen accounting of electronic installation 200；On the other hand, ultrasonic sensor 100 can be fabricated to side fingerprint
Identify module or back side fingerprint recognition module, there is provided more diversified Consumer's Experience.Electronic installation 100 can be mobile phone, put down
The devices such as plate computer, Intelligent bracelet, lock, gate inhibition.
When ultrasonic sensor 100 is arranged on housing 202, or is arranged in housing 202, ultrasonic sensor 100
It can be fixed by glue or Optically Clear Adhesive (OCA) optical cement.It is preferred that ultrasonic sensor
100 can be fixed by OCA optical cements.For example, when ultrasonic sensor 100 is arranged on housing 202, ultrasonic wave passes
Sensor 100 can be fixed on housing 202 by OCA optical cements；When ultrasonic sensor 100 is arranged in housing 202, surpass
Sonic sensor 100 can be fixed by OCA optical cements and conformed on display screen 201, or is fixed on side frame 203 or bonnet
On.Due to OCA optical cements have the advantages that water white transparency, light transmission rate more than 90%, cementing strength it is good, in this way, when super
When sonic sensor 100 is conformed on display screen 201 by the fixation of OCA optical cements, the display work(of display screen 201 is not interfered with
Energy.
Fig. 1 and Fig. 8 is referred to, in some embodiments, when ultrasonic sensor 100 is applied to electronic installation 200,
Conductive electrode 40 is close to the inner side of electronic installation 200, inner side of the base material 10 away from electronic installation 200, to cause supersonic sensing
When device 100 works, the caused ultrasonic wave in the presence of high frequency voltage of piezoelectric element 30 is outwards launched and passes through base material 10, reaches
Thing to be detected, again pass through base material 10 after thing to be detected transmitting and received by piezoelectric element 30 to produce electric signal.
Referring to Fig. 1 and Fig. 2, the ultrasonic sensor 100 of the utility model embodiment includes base material 10, multiple
Pixel electrode 20, piezoelectric element 30, the process chip 50 of conductive electrode 40.
The material of base material 10 is any one in glass, sapphire, polyvinyl chloride (Polyvinyl chloride, PVC)
Kind.Base material 10 can be with the layer structure of rectangular, circular, oval, triangle, polygon.The shape and display screen of base material 10
201 shape matches.Base material 10 can be the cover plate of electronic installation 200.
Multiple pixel electrodes 20 are produced on base material 10 and are in array distribution, that is to say, that multiple pixel electrodes 20 include
The pixel electrode 20 and the spaced pixel electrode 20 of multiple row that higher order interlace is set.The material of pixel electrode 20 is tin indium oxide
(Indium tin oxide, ITO), nano-silver thread (Agnanowire), metal grill (metal mesh), CNT and
Any one in graphene (Graphene), pixel electrode 20 has preferable toughness and printing opacity made of above-mentioned material
Property, so as to which ultrasonic sensor 100 has preferable toughness made of the pixel electrode 20；When ultrasonic sensor 100 is set
Put at the lower section of display screen 201, the ultrasonic sensor 100 with preferable translucency will not block the aobvious of display screen 201
Show area, while the ultrasonic sensor 100 for being arranged on the lower section of display screen 201 can keep the integral color of display screen 201 consistent
And make display screen 201 more attractive in appearance.In some embodiments, the light transmittance of pixel electrode 20 is more than 90%, when ultrasonic wave passes
When sensor 100 is arranged on the lower section of display screen 201, the ultrasonic sensor 100 with preferable translucency will not block display
The viewing area of screen 201, while the ultrasonic sensor 100 for being arranged on the lower section of display screen 201 can keep the entirety of display screen 201
Solid colour and make display screen 201 more attractive in appearance.
Piezoelectric element 30 is arranged on base material 10 and covers multiple pixel electrodes 20.Piezoelectric element 30 is by piezoelectric system
Into.Piezoelectric element 30 receives ultrasonic wave according to the direct piezoelectric effect of piezoelectric, and the inverse piezoelectric effect according to piezoelectric is sent
Ultrasonic wave.
Fig. 1 and Fig. 2 is referred to, in some embodiments, piezoelectric element 30 is stratiform overall made of piezoelectric
Structure (being also laminated structure).The shape of piezoelectric element 30 and the shape of base material 10 match.The material of piezoelectric element 30 can
Piezoelectric ceramics or Kynoar (Polyvinylidene fluoride, PVDF) are thought, when the material of piezoelectric element 30 is poly-
During vinylidene, piezoelectric element 30 has preferable pliability, and now the pliability of ultrasonic sensor 100 is also preferable.
Fig. 4 and Fig. 5 is referred to, in some embodiments, piezoelectric element 30 includes multiple piezo columns 32.Multiple piezo columns
32 are arranged on base material 10 and are in array distribution.Multiple piezo columns 32 are corresponding with multiple pixel electrodes 20.Each piezo column 32 covers
Pixel electrode 20 corresponding to lid.The upper surface of piezo column 32 is connected with conductive electrode 40, lower surface and the pixel electricity of piezo column 32
Pole 20 connects.Because the array of multiple piezo columns 32 on piezoelectric element 30 is set, therefore each piezo column 32 is by adjacent pressure
Electrically interference and vibration interference are smaller caused by electric post 32, so as to compared to the overall layer structure being made out of a piezoelectric material,
The piezoelectric element 30 of present embodiment caused electric signal under ul-trasonic irradiation is more accurate, and then process chip 50 handles the electricity
The ultrasonograph that signal is formed is more accurate.The material of piezo column 32 is Kynoar.
Fig. 4 and Fig. 5 is referred to, in some embodiments, when piezoelectric element 30 includes multiple piezo columns 32, piezoelectricity member
Part 30 also includes being used for the insulating barrier 34 for filling the gap between multiple piezo columns 32.
In this way, the space between piezo column 32 is filled using insulating barrier 34, on the one hand, the knot of piezoelectric element 30 can be caused
Structure is stable, and left and right skew will not occur for the position of piezo column 32；On the other hand, can prevent from sending out in ultrasonic wave between piezo column 32
Penetrate and had an impact mutually with receive process, reduce lateral noise.
The material of insulating barrier 34 can be epoxy resin.Because epoxy resin has to the surface of metal and nonmetallic materials
Excellent adhesive strength, dielectric properties are good, and deformation retract rate is small, and product size stability is good, and hardness is high, and pliability is preferable,
The features such as to alkali and most of solvent-stable.Therefore, insulating barrier 34 uses epoxy resin to cause multiple as filled media
Good adhesion between piezo column 32, and cause piezoelectric element 30 that there is good mechanicalness.
Fig. 1 and Fig. 2 is referred to, conductive electrode 40 is arranged on the side of remote pixel electrode 20 of piezoelectric element 30,
That is piezoelectric element 30 is between pixel electrode 20 and conductive electrode 40.Conductive electrode 40 is whole made of conductive material
The layer structure of body, the shape and the shape of piezoelectric element 30 of conductive electrode 40 match.The material of conductive electrode 40 is oxidation
Any one in indium tin, nano-silver thread, metal grill, CNT and graphene.In some embodiments, conductive electricity
The light transmittance of pole 40 is more than 90%.
Process chip 50 is connected with multiple pixel electrodes 20, and process chip 50 is to be detected to be formed for handling the electric signal
The ultrasonograph of thing.Process chip 50 can be arranged on base material 10 and can also be arranged on outside base material 10.
Each pixel electrode 20 of the ultrasonic sensor 100 of the utility model embodiment can be according to the electricity received
Signal determines position and the piezoelectric element 30 caused electric signal on the position that finger is pressed against on ultrasonic sensor 100,
So as to the recognition efficiency for reducing the need of process chip 50 data volume to be processed, improving ultrasonic sensor 100.
The ultrasonic sensor 100 of the utility model embodiment also has the advantages that：First, multiple pixel electricity
Pole 20 is produced on base material 10, is easy to make the higher pixel electrode 20 of precision, is referred to so as to lift the identification of ultrasonic sensor 100
The precision of line.
Second, the light transmittance of pixel electrode 20 and conductive electrode 40 is all higher than 90%, when ultrasonic sensor 100 is arranged on
During the lower section of display screen 201, the ultrasonic sensor 100 with preferable translucency will not block the viewing area of display screen 201,
Being arranged on the ultrasonic sensor 100 of the lower section of display screen 201 simultaneously can keep the integral color of display screen 201 consistent and make to show
Display screen 201 is more attractive in appearance.
3rd, conductive electrode 40 is easy to process chip 50 to control the energization of conductive electrode 40, together in overall layer structure
When make the easy to manufacture of conductive electrode 40 and cost of manufacture is relatively low.
4th, the material of conductive electrode 40 is tin indium oxide, nano-silver thread, metal grill, CNT and graphene
In any one, conductive electrode 40 has preferable toughness and translucency made of above-mentioned material, so as to electric by conduction
Ultrasonic sensor 100 made of pole 40 has preferable toughness；When ultrasonic sensor 100 is arranged under display screen 201
Fang Shi, the ultrasonic sensor 100 with preferable translucency will not block the viewing area of display screen 201, while be arranged on aobvious
The ultrasonic sensor 100 of the lower section of display screen 201 can keep the integral color of display screen 201 consistent and make display screen 201 more
It is attractive in appearance.
5th, ultrasonic sensor 100 is arranged in housing 202, ultrasonic sensor 100 is not take up display screen 201
Area, so as to improve the screen accounting of electronic installation 200.
Referring to Fig. 10, in some embodiments, formed with multiple image element circuits 12 in array distribution on base material 10
And a plurality of wire 14 corresponding with multiple image element circuits 12, multiple image element circuits 12 are corresponding with multiple pixel electrodes 20, each picture
Plain circuit 12 connects with corresponding pixel electrode 20, and every wire 14 is used to connect corresponding image element circuit 12 and process chip
50.Image element circuit 12 is arranged between base material 10 and pixel electrode 20, can be formed in multiple image element circuits 12 of array distribution
On the visible area 10a of base material 10, wire 14 can be arranged on the same side with image element circuit 12 of base material 10 (such as Figure 10 institutes
Show).In this way, being easy to the making of image element circuit 12 and wire 14, and it is easy to pixel electrode 20 to be connected with process chip 50.At other
In embodiment, wire 14 can also be arranged on the opposite side with image element circuit 12 of base material 10.
Figure 11 is referred to, in some embodiments, the ultrasonic sensor 100 of above-mentioned embodiment also includes connection electricity
Pole 60 and lead 70.Connection electrode 60 is arranged on the side of remote multiple pixel electrodes 20 of base material 10 and connected with process chip 50
Connect.Pixel electrode 20 is connected to connection electrode 60 by lead 70, and conductive electrode 40 is connected to connection electrode 60 by lead 70.
Lead 70 includes a plurality of pixel electrode lead 72 that is connected with pixel electrode 20, every pixel electrode lead 72 respectively with a picture
Plain electrode 20 connects.Lead 70 also includes the conductive electrode lead 74 of connection corresponding with conductive electrode 40, when conductive electrode 40 is
During the layer structure of entirety, conductive electrode lead 74 is one；When conductive electrode 40 is a plurality of spaced list structure
During conductive electrode 40, the quantity of conductive electrode lead 74 is consistent with the quantity of the conductive electrode 40 of list structure.Present embodiment
By setting lead 70 and connection electrode 60, it is easy to pixel electrode 20 to be electrically connected respectively with process chip 50 with conductive electrode 40.
Refer to Figure 12, in some embodiments, the conductive electrode 40 of above-mentioned embodiment include layer structure 42 and
The extended structure 44 each extended over from the both ends of layer structure 42, layer structure 42 wrap piezoelectricity member jointly with extended structure 44
Part 30.Extended structure 44 can be that the edge of layer structure 42 integrally stretches out to be formed, and extended structure 44 can be stratiform knot
The part at the edge of structure 42 stretches out to be formed.Process chip 50 is electrically connected by extended structure 44 with conductive electrode 40.Such as
This, by setting extended structure 44 to be easy to process chip 50 to be electrically connected with conductive electrode 40.
Fig. 6 and Fig. 7 is referred to, in some embodiments, the conductive electrode 40 of above-mentioned embodiment includes multiple intervals
The conductive electrode 40 of the list structure of setting, the conductive electrode 40 of each list structure and the pixel electrode 20 in same row are right
Should.In other embodiments, the conductive electrode 40 of each list structure is corresponding with the pixel electrode 20 in same a line.Pixel electricity
Pole 20 is corresponding with the conductive electrode 40 of list structure to be easy to pixel electrode 20 to apply height on piezoelectric element 30 with conductive electrode 40
Frequency voltage (such as：Frequency is more than 20KHZ voltage), while it is easy to pixel electrode 20 and conductive electrode 40 to be used for piezoelectric element
30 under inverse piezoelectric effect caused electric signal be delivered in other elements.Relative to the conductive electrode 40 of layer structure, strip
The conductive electrode 40 of structure be more convenient for process chip 50 control conductive electrode 40 signal input and output, so as to improve ultrasound
Wave sensor 100 identifies the precision of fingerprint.
Figure 13 is referred to, in some embodiments, the ultrasonic sensor 100 of above-mentioned embodiment also includes circuit board
80, multiple pixel electrodes 20, conductive electrode 40 and process chip 50 are electrically connected with circuit board 80.Process chip 50 can be with
It is arranged on circuit board 80.Specifically, circuit board 80 can be flexible PCB, and circuit board 80 can be arranged on the remote of base material 10
On side from pixel electrode 20.Circuit board 80 is provided with connector in order to which ultrasonic sensor 100 passes through on circuit board 80
Connector electrically connected with other electronic components.
It should be noted that mentioned in the utility model " multiple pixel electrodes 20 are produced on the visible area 10a of base material 10
On " in making include by plated film, light blockage coating/development/exposure, etching, remove photoresistance, the technique such as annealing by pixel electrode
20 are directly produced on the visible area 10a of base material 10.
In the description of this specification, reference term " some embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment party
Formula or example description specific features, structure, material or feature be contained at least one embodiment of the present utility model or
In example.In this manual, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.And
And specific features, structure, material or the feature of description can close in any one or more embodiments or example
Suitable mode combines.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one feature.In description of the present utility model, " multiple " are meant that at least two, such as two
It is individual, three etc., unless otherwise specifically defined.
Although embodiment of the present utility model has been shown and described above, it is to be understood that above-mentioned embodiment party
Formula is exemplary, it is impossible to is interpreted as to limitation of the present utility model, one of ordinary skill in the art is of the present utility model
In the range of above-mentioned embodiment can be changed, change, replace and modification, the scope of the utility model by claim and
Its equivalent limits.
Claims (10)
- A kind of 1. ultrasonic sensor, it is characterised in that including：Base material, the base material include visible area and non-visible area；Multiple pixel electrodes, multiple pixel electrodes are produced on the visible area and are in array distribution；Piezoelectric element, the piezoelectric element set on the substrate and cover multiple pixel electrodes, the piezoelectric element For launching ultrasonic wave and producing electric signal after the ultrasonic wave of thing reflection to be detected is received, multiple pixel electrodes are used for Receive the electric signal；Conductive electrode, the conductive electrode are arranged on the piezoelectric element, the piezoelectric element be located at the base material with it is described Between conductive electrode；AndThe process chip being connected with multiple pixel electrodes, the process chip are described to be formed for handling the electric signal The ultrasonograph of thing to be detected.
- 2. ultrasonic sensor according to claim 1, it is characterised in that the piezoelectric element is made of piezoelectric Overall layer structure；OrThe piezoelectric element includes multiple piezo columns, and multiple piezo columns are set on the substrate and be in array distribution, more The individual piezo column is corresponding with multiple pixel electrodes, the pixel electrode corresponding to each piezo column covering.
- 3. ultrasonic sensor according to claim 1, it is characterised in that formed with array distribution on the base material Multiple image element circuits and a plurality of wire corresponding with multiple image element circuits, multiple image element circuits and multiple pixels Electrode pair is answered, and each image element circuit and the corresponding pixel electrode connect, and the every wire is corresponding for connecting The image element circuit and the process chip.
- 4. ultrasonic sensor according to claim 1, it is characterised in that the ultrasonic sensor also includes：Connection electrode, the connection electrode be arranged on the side of remote multiple pixel electrodes of the base material and with the place Manage chip connection；AndLead, the pixel electrode are connected to the connection electrode by the lead, and the conductive electrode passes through the lead It is connected to the connection electrode.
- 5. ultrasonic sensor according to claim 1, it is characterised in that the conductive electrode is overall stratiform knot Structure；OrThe conductive electrode includes layer structure and the extended structure each extended over from the both ends of layered structure, layered Structure wraps the piezoelectric element jointly with the extended structure；OrThe conductive electrode includes multiple spaced list structures, the conductive electrode of each list structure and a line or The pixel electrode on one row is corresponding.
- 6. ultrasonic sensor according to claim 1, it is characterised in that the light transmittance of the conductive electrode is more than 90%.
- 7. ultrasonic sensor according to claim 1, it is characterised in that the ultrasonic sensor also includes circuit Plate, multiple pixel electrodes, the conductive electrode and the process chip are electrically connected with the circuit board.
- 8. a kind of electronic installation, it is characterised in that the electronic installation includes：Housing；AndUltrasonic sensor described in claim 1-7 any one, the ultrasonic sensor set on the housing or It is housed in the housing.
- 9. electronic installation according to claim 8, it is characterised in that the electronic installation also includes display screen, described super When sonic sensor is arranged in the housing, the ultrasonic sensor is corresponding with the display screen.
- 10. electronic installation according to claim 8, it is characterised in that the electronic installation also include display screen, bonnet and Side frame, the display screen are located at the opposite both sides of the electronic installation with the bonnet, and the side frame connects the display Screen and the bonnet, the ultrasonic sensor are arranged in the housing and covered on the side frame or after described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721167430.8U CN207182324U (en) | 2017-09-12 | 2017-09-12 | Ultrasonic sensor and electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721167430.8U CN207182324U (en) | 2017-09-12 | 2017-09-12 | Ultrasonic sensor and electronic installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207182324U true CN207182324U (en) | 2018-04-03 |
Family
ID=61747298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721167430.8U Expired - Fee Related CN207182324U (en) | 2017-09-12 | 2017-09-12 | Ultrasonic sensor and electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207182324U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108985280A (en) * | 2018-08-31 | 2018-12-11 | 东莞新科技术研究开发有限公司深圳分公司 | Ultrasonic fingerprint sensor and preparation method thereof, application |
| CN109116202A (en) * | 2018-10-17 | 2019-01-01 | 江苏方天电力技术有限公司 | A kind of PVDF ultrasound array sensor and its array signal denoising method |
-
2017
- 2017-09-12 CN CN201721167430.8U patent/CN207182324U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108985280A (en) * | 2018-08-31 | 2018-12-11 | 东莞新科技术研究开发有限公司深圳分公司 | Ultrasonic fingerprint sensor and preparation method thereof, application |
| CN109116202A (en) * | 2018-10-17 | 2019-01-01 | 江苏方天电力技术有限公司 | A kind of PVDF ultrasound array sensor and its array signal denoising method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207182314U (en) | Display module and electronic installation | |
| US9430068B2 (en) | Touch screen | |
| CN109492456A (en) | Ultrasonic sensor and electronic device | |
| CN207182324U (en) | Ultrasonic sensor and electronic installation | |
| CN107832665A (en) | Display module and electronic equipment | |
| CN109492457A (en) | Display module and its manufacturing method and electronic device | |
| JP2021159917A (en) | Vibration generating device and display apparatus including the same | |
| CN109492470A (en) | Ultrasonic sensor and electronic device | |
| CN109492468A (en) | Display module and its manufacturing method and electronic device | |
| CN109492483A (en) | Ultrasonic sensor and electronic device | |
| CN207182323U (en) | Display module and electronic installation | |
| CN207557959U (en) | Display module and electronic device | |
| CN207516966U (en) | Display module and electronic equipment | |
| CN109492459A (en) | Display module and electronic device | |
| CN109492462A (en) | Display module and electronic device | |
| CN109492481A (en) | Ultrasonic sensor and electronic device | |
| CN207182321U (en) | Ultrasonic sensor and electronic installation | |
| CN207182315U (en) | Display module and electronic installation | |
| CN207182327U (en) | Ultrasonic sensor and electronic installation | |
| CN109496085A (en) | Cover plate assembly and its manufacturing method and electronic device | |
| CN109492458A (en) | Display module and its manufacturing method and electronic device | |
| CN207182325U (en) | Display module and electronic installation | |
| CN207557967U (en) | Display module and electronic device | |
| CN207557966U (en) | Display module and electronic device | |
| CN207182322U (en) | Ultrasonic sensor and electronic installation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 330013 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180403 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |