CN210833851U

CN210833851U - Intelligent audio sensor and monitoring system

Info

Publication number: CN210833851U
Application number: CN201921611774.2U
Authority: CN
Inventors: 田陆; 何涛焘
Original assignee: Hunan Ramon Science and Technology Co Ltd
Current assignee: Hunan Ramon Science and Technology Co Ltd
Priority date: 2019-09-25
Filing date: 2019-09-25
Publication date: 2020-06-23
Anticipated expiration: 2029-09-25

Abstract

The application discloses intelligence audio sensor and monitored control system includes: the acquisition circuit is used for acquiring a target signal; the signal conditioning circuit is connected with the acquisition circuit; the fault detection circuit is connected with the signal conditioning circuit; the slave station communication module is respectively connected with the upper computer and the microprocessor; and the microprocessor is respectively connected with the signal conditioning circuit and the fault detection circuit. This application can accomplish the collection to audio signal, temperature signal and humidity signal simultaneously through acquisition circuit, and only need a cable can connect the instrument, and the wiring is simple. Meanwhile, the fault detection circuit carries out AD acquisition through audio signals, and the microprocessor judges the equipment state according to the acquired audio signals. And the collected target signal and the equipment state signal are transmitted to the upper computer through the communication module, so that the overhaul time can be saved, and the fault data is accumulated to provide data support for later upgrading and reconstruction.

Description

Intelligent audio sensor and monitoring system

Technical Field

The application relates to the field of detection, in particular to an intelligent audio sensor and a monitoring system.

Background

The audio sensor is an indispensable signal acquisition device in the monitoring system, and an important use environment of the audio sensor is considered to be near a converter mouth, so the temperature and humidity sensor is required to be configured to detect the temperature and humidity of the environment where the audio sensor is located, and whether the use environment of the audio sensor is abnormal or not is judged. The existing audio sensor needs 1 cable with 3 cores to be connected to a signal conditioning module, the cable with 1 core and 3 cores is needed from the signal conditioning module to an instrument, the cable with 1 core and 4 cores is needed from a temperature and humidity sensor to the instrument, 3 cables are needed totally, wiring is complex, the failure rate is high, and the maintenance difficulty is high. Moreover, the existing audio sensor and the existing temperature and humidity sensor can only detect three physical quantities of audio, temperature and humidity, and cannot judge whether the audio sensor has faults or not, so that the maintenance time is long.

Therefore, how to provide a solution to the above technical problem is a problem that needs to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The intelligent audio sensor can simultaneously acquire audio signals, temperature signals and humidity signals, save maintenance time and accumulate fault data to provide data support for later upgrading and reconstruction; it is another object of the present application to provide a monitoring system comprising the above-mentioned intelligent audio sensor.

In order to solve the above technical problem, the present application provides an intelligent audio sensor, including:

the device comprises an acquisition circuit for acquiring a target signal, wherein the target signal comprises an audio signal, a temperature signal and a humidity signal;

the signal conditioning circuit is connected with the acquisition circuit and is used for conditioning the target signal;

the fault detection circuit is connected with the signal conditioning circuit and is used for carrying out analog-to-digital conversion on the audio signal;

the slave station communication module is respectively connected with the upper computer and the microprocessor;

and the microprocessor is respectively connected with the signal conditioning circuit and the fault detection circuit and used for obtaining an equipment state signal according to the audio signal after analog-to-digital conversion and transmitting the target signal and the equipment state signal to the upper computer through the slave station communication module.

Preferably, the acquisition circuit comprises:

the audio acquisition circuit is used for acquiring the audio signal;

the temperature acquisition circuit is used for acquiring the temperature signal;

and the humidity acquisition circuit is used for acquiring the humidity signal.

Preferably, the audio acquisition circuit comprises three parallel electret microphones.

Preferably, the temperature acquisition circuit is a bridge balancing circuit built by a temperature sensitive resistor;

correspondingly, the humidity acquisition circuit is specifically a bridge full-bridge circuit built through a humidity sensitive resistor.

Preferably, the microprocessor is embodied as STM 32.

Preferably, the slave station communication module comprises an IO-LINK communication slave station circuit.

Preferably, the interface of the intelligent audio sensor is a 5-core M12 connector.

In order to solve the above technical problem, the present application further provides a monitoring system, including the intelligent audio sensor as described in any one of the above;

further comprising:

the master station communication module is connected with the communication module;

and the upper computer is connected with the master station communication module.

Preferably, the master station communication module comprises an IO-LINK communication master station circuit.

Preferably, the master station communication module further includes:

and the input end of the RS485 communication circuit and/or the ZigBee communication circuit is connected with the output end of the IO-LINK master station circuit, and the output end of the RS485 communication circuit and/or the ZigBee communication circuit is connected with the upper computer.

The application provides an intelligent audio sensor, including acquisition circuit, signal conditioning circuit, fault detection circuit, microprocessor and communication module, wherein, acquisition circuit can accomplish the collection to audio signal, temperature signal and humidity signal simultaneously, and the intelligent audio sensor that this application provided only needs a cable can the connecting instrument, and the wiring is simple. Meanwhile, the fault detection circuit carries out AD acquisition through the audio signal, judges the equipment state through the microprocessor according to the acquired audio signal, and transmits the acquired target signal and the equipment state signal to the upper computer through the communication module, so that the overhaul time can be saved, and the accumulated fault data provides data support for later upgrading and reconstruction. The application also provides a monitoring system which has the same beneficial effect as the intelligent audio sensor.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the prior art and the embodiments are briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an intelligent audio sensor provided in the present application;

fig. 2 is a schematic diagram of wiring interfaces of circuit boards inside an intelligent audio sensor provided in the present application;

fig. 3 is a schematic structural diagram of an intelligent audio sensor provided in the present application;

fig. 4 is a schematic structural diagram of an audio acquisition circuit provided in the present application;

fig. 5 is a schematic structural diagram of a temperature acquisition circuit provided in the present application;

fig. 6 is a schematic structural diagram of a humidity acquisition circuit provided in the present application;

fig. 7 is a schematic structural diagram of an audio signal conditioning circuit provided in the present application;

fig. 8 is a schematic structural diagram of a temperature signal conditioning circuit provided in the present application;

fig. 9 is a schematic structural diagram of a humidity signal conditioning circuit provided in the present application;

fig. 10 is a schematic structural diagram of a fault detection circuit provided in the present application;

fig. 11 is a circuit structure diagram of an IO-LINK communication hardware provided in the present application;

fig. 12 is a schematic structural diagram of an IO-LINK communication slave station provided in the present application;

fig. 13 is a schematic structural diagram of a hardware interface of an intelligent audio sensor provided in the present application;

fig. 14 is a schematic structural diagram of a monitoring system provided in the present application;

fig. 15 is a schematic structural diagram of an IO-LINK communication master station provided in the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The audio sensor is an indispensable signal acquisition device in the monitoring system, and the existing audio sensor needs 1 cable with 3 cores to be connected to the signal conditioning module, the signal conditioning module needs 1 cable with 3 cores to the instrument, the temperature and humidity sensor needs 1 cable with 4 cores to the instrument, 3 cables are needed totally, the wiring is complex, the fault rate is high, and the maintenance difficulty is large. The prior art can only detect three physical quantities of audio frequency, temperature and humidity, and can not judge whether the audio frequency sensor has faults or not, so that the overhaul time is long. Based on the problems of the related technologies, the new intelligent audio sensor provided by the following embodiments of the present application can achieve the purposes of simultaneously completing the acquisition of audio signals, temperature signals and humidity signals, saving the maintenance time, and accumulating fault data to provide data support for later upgrading and reconstruction.

Referring to fig. 1, the intelligent audio sensor provided by the present application uses three circuit boards, which are a collection circuit board 01, a signal conditioning circuit board 02 and a communication circuit board, the collection circuit board 01 is installed at the front end of the intelligent audio sensor, and is provided with a collection circuit, the collection circuit includes an audio collection circuit for collecting audio signals, a temperature collection circuit for collecting temperature signals and a humidity collection circuit for collecting humidity signals, the signal conditioning circuit board 02 is installed in the middle of the intelligent audio sensor, and is provided with a signal conditioning circuit for conditioning and amplifying target signals, the communication circuit board is installed at the rear end of the intelligent audio sensor, and is provided with a fault detection circuit and a slave station communication module, and the wiring interfaces of the circuit boards are shown in fig. 2. In addition, the intelligent audio sensor is also provided with a sensor cover 03, an aviation socket 04, a sensor shell 05, a sensor dust cover 06 and the like.

The following describes an intelligent audio sensor provided by the present application in detail.

Referring to fig. 3, fig. 3 is a schematic structural diagram of an intelligent audio sensor provided in the present application, where the intelligent audio sensor includes:

the acquisition circuit 1 is used for acquiring a target signal, wherein the target signal comprises an audio signal, a temperature signal and a humidity signal;

it can be understood that the acquisition circuit 1 includes an audio acquisition circuit for acquiring audio signals, a temperature acquisition circuit for acquiring temperature signals, and a humidity acquisition circuit for acquiring humidity signals, wherein the audio signals are acquired by an electret microphone, and the temperature and the humidity are acquired by a temperature sensitive resistor and a humidity sensitive resistor, respectively. Adopt behind the acquisition circuit 1 that this application provided, simplified the mounting means, originally need two sensors of gathering usefulness, only need a sensor now to realize the collection to the three physical quantity of audio frequency, temperature, humidity, the acquisition circuit of temperature and humidity more is close to audio frequency acquisition circuit simultaneously, and the temperature and the humidity of gathering have more representativeness, are convenient for judge whether intelligent audio sensor's service environment is unusual.

Specifically, referring to fig. 4, fig. 4 is a schematic structural diagram of an audio capturing circuit provided in the present application, where the audio capturing circuit includes a first electret microphone M1, a second electret microphone M2, a third electret microphone M3, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a first voltage regulator U1, a first capacitor C1, a second capacitor C2, a third capacitor C3, and a fourth capacitor C4, where: a first end of the first resistor R1 is connected to the power module VCC, a second end of the first resistor R1 is connected to a first end of the first regulator tube U1, a third end of the first regulator tube U1, a first end of the first capacitor C1, a first end of the second resistor R2, a first end of the third resistor R3, and a first end of the fourth resistor R4, a second end of the first diode D1 is connected to a second end of the first capacitor C1, a second end of the first electret microphone M1, a second end of the second electret microphone M2, and a second end of the third electret microphone M3 are all grounded, a second end of the second resistor R2 is connected to a first end of the first electret microphone M1 and a first end of the second capacitor C2, a second end of the third resistor R3 is connected to a first end of the second electret microphone M2 and a first end of the third capacitor C3, a second end of the first resistor R3 is connected to a first end of the first electret microphone M4 and a first end of the fourth capacitor R57323, the second end of the second capacitor C2 is connected to the second end of the third capacitor C3 and the second end of the fourth capacitor C4, respectively, to serve as the output terminal OUT of the acquisition circuit 1. The three electret microphones are connected in parallel to acquire audio signals, the acquisition frequency range is 50-2000Hz, a first resistor R1 and a first voltage regulator tube U1 (a TL431 voltage regulator tube can be adopted) provide 2.5V direct current power for the three electret microphones, a second resistor R2, a third resistor R3 and a fourth resistor R4 respectively provide direct current bias for the three electret microphones and adjust the sensitivity of the microphones, and a second capacitor C2, a third capacitor C3 and a fourth capacitor C4 are used for blocking direct current and only allow alternating current analog quantity signals to be output.

Specifically, referring to fig. 5, fig. 5 is a schematic structural diagram of a temperature acquisition circuit provided in the present application, in which a bridge balancing circuit is built by a temperature sensitive resistor RT to serve as the temperature acquisition circuit, and the temperature acquisition range is-20-80 ℃. The temperature acquisition circuit comprises a temperature sensitive resistor RT, a fifth resistor R5, a sixth resistor R6 and a seventh resistor R7, wherein: the first end of the fifth resistor R5 is connected with the first end of the sixth resistor R6 and the power module, the second end of the fifth resistor R5 is connected with the first end of the temperature sensitive resistor RT to serve as the first output end TN of the temperature acquisition circuit, the second end of the sixth resistor R6 is connected with the first end of the seventh resistor R7 to serve as the second output end TP of the temperature acquisition circuit, and the second end of the temperature sensitive resistor RT and the second end of the seventh resistor R7 are both grounded.

Specifically, referring to fig. 6, fig. 6 is a schematic structural diagram of a humidity acquisition circuit provided in the present application, in which a bridge balance circuit is built through a humidity-sensitive resistor RH as the humidity acquisition circuit, and a humidity acquisition range is 0-100% RH. The humidity acquisition circuit comprises a humidity sensitive resistor RH, an eighth resistor R8, a ninth resistor R9 and a tenth resistor R10, wherein: the first end of the eighth resistor R8 is connected to the first end of the ninth resistor R9 and the power module, the second end of the eighth resistor R8 is connected to the first end of the humidity-sensitive resistor RH as the first output HN of the humidity acquisition circuit, the second end of the sixth resistor R6 is connected to the first end of the tenth resistor R10 as the second output HP of the temperature acquisition circuit, and the second ends of the humidity-sensitive resistor RH and the tenth resistor R10 are both grounded.

A signal conditioning circuit 2 connected with the acquisition circuit 1 and used for conditioning a target signal;

the signal conditioning circuit 2 comprises an audio signal conditioning circuit, a temperature signal conditioning circuit and a humidity signal conditioning circuit.

Specifically, the audio signal conditioning circuit realizes the operational amplification of the audio signal, and because the audio signal is an alternating current signal, a 4.5V direct current bias power supply is added in the single-power-supply operational amplification circuit, and meanwhile, the long-distance transmission of the audio signal can be realized. Referring to fig. 7, the audio signal conditioning circuit may include: a first electrolytic capacitor C11, a second electrolytic capacitor C12, an eleventh resistor R11, a twelfth resistor R12, a thirteenth resistor R13, a fourteenth resistor R14, a fifteenth resistor R15, a sixteenth resistor R16, a seventeenth resistor R17, an eighteenth resistor R18, a first operational amplifier a1, a fifth capacitor C5, a first diode D1 and a second diode D2, wherein: the cathode of the first electrolytic capacitor C11 is grounded, the anode of the first electrolytic capacitor C11 is connected with the first end of an eleventh resistor R11, the second end of the eleventh resistor R11 is respectively connected with the cathode of a first diode D1, the first end of a sixteenth resistor R16 of a second diode D2 and the inverting input end of a first operational amplifier A1, the first end of a fifth capacitor C5 is used as the input end of an audio signal conditioning circuit and is connected with the output end of an audio acquisition circuit, the second end of a fifth capacitor C5 is connected with the first end of a twelfth resistor R12, the second end of a twelfth resistor R12 is respectively connected with the anode of the first diode D1, the cathode of a second diode D2, the first end of a fourteenth resistor R14 and the non-inverting input end of the first operational amplifier A1, the first end of the thirteenth resistor R13 is connected with a +9V power supply, the second end of the thirteenth resistor R13 is respectively connected with the first end of a fifteenth resistor R15, the anode of the fourteenth resistor R14 and the anode of the second resistor R12, the second end of the fifteenth resistor R15 and the cathode of the second electrolytic capacitor C12 are both grounded, the output end of the first operational amplifier A1 is respectively connected with the second end of the sixteenth resistor R16 and the first end of the seventeenth resistor R17, the second end of the seventeenth resistor R17 is respectively connected with the first end of the eighteenth resistor R18 to serve as the output end MIC _ TP of the audio signal conditioning circuit, and the second end of the eighteenth resistor R18 is grounded.

Specifically, the temperature signal conditioning circuit operates and amplifies the temperature signal to a range of 0-3.3V through the differential signal amplifying circuit, and the microprocessor 4 (STM32 or other chips can be adopted) performs AD acquisition. Referring to fig. 8, the temperature signal conditioning circuit may include a nineteenth resistor R19, a twentieth resistor R20, a twenty-first resistor R21, a twenty-second resistor R22, and a second operational amplifier a2, wherein: a first end of a twentieth resistor R20 is connected to a first output terminal TN of the temperature signal conditioning circuit as a first input terminal of the temperature signal conditioning circuit, a first end of a nineteenth resistor R19 is connected to a second output terminal TP of the audio signal conditioning circuit as a second input terminal of the temperature signal conditioning circuit, a second end of a nineteenth resistor R19 is connected to an inverting input terminal of the second operational amplifier a2 and a first end of a twenty-second resistor R22, a second end of a twentieth resistor R20 is connected to a non-inverting input terminal of the second operational amplifier a2 and a first end of a twenty-first resistor R21, a second end of the twenty-first resistor R21 is grounded, and an output terminal of the second operational amplifier a2 is connected to a second end of the twenty-second resistor R22 as an output terminal of the temperature signal conditioning circuit.

Specifically, the humidity signal conditioning circuit operates and amplifies the humidity signal to a range of 0-3.3V through the differential signal amplifying circuit, and the humidity signal conditioning circuit is used for the microprocessor 4 to carry out AD acquisition. Referring to fig. 9, the humidity signal conditioning circuit may include a twenty-third resistor R23, a twenty-fourth resistor R24, a twenty-fifth resistor R25, a twenty-sixth resistor R26, and a third operational amplifier A3, wherein: a first end of a twenty-fourth resistor R24 is connected to a first output end HN of the audio signal conditioning circuit as a first input end of the humidity signal conditioning circuit, a first end of a twenty-third resistor R23 is connected to a second output end HP of the humidity signal conditioning circuit as a second input end of the humidity signal conditioning circuit, a second end of a twenty-third resistor R23 is connected to an inverting input end of a third operational amplifier A3 and a first end of a twenty-sixth resistor R26, a second end of a twenty-fourth resistor R24 is connected to a non-inverting input end of a third operational amplifier A3 and a first end of a twenty-fifth resistor R25, a second end of the twenty-fifth resistor R25 is grounded, and an output end of the third operational amplifier A3 is connected to a second end of the twenty-sixth resistor R26 as an output end of the humidity signal conditioning circuit.

A fault detection circuit 3 connected to the signal conditioning circuit 2 and used for performing analog-to-digital conversion on the audio signal;

specifically, the input end of the fault detection circuit 3 is connected with the audio signal conditioning circuit, the output end of the fault detection circuit 3 is connected with the microprocessor 4, the fault detection circuit 3 respectively carries out AD acquisition on the audio signals of the three channels and the total audio signal, and the audio signals after analog-to-digital conversion are sent to the microprocessor 4.

Specifically, referring to fig. 10, fig. 10 is a schematic structural diagram of a fault detection circuit 3 provided in the present application, where the fault detection circuit 3 includes: a twenty-seventh resistor R27, a twenty-eighth resistor R28, a twenty-ninth resistor R29, a thirty-third resistor R30, a thirty-first resistor R31, a sixth capacitor C6 and a fourth operational amplifier A4, wherein: a first end of the twenty-seventh resistor R27 is grounded, a second end of the twenty-seventh resistor R27 is connected to the inverting input terminal of the fourth operational amplifier a4 and the first end of the twenty-ninth resistor R29, respectively, a first end of the sixth capacitor C6 is connected to the output terminal MIC _ TP of the audio signal conditioning circuit as the input terminal of the fault detection circuit 3, a second end of the sixth capacitor C6 is connected to the first end of the twenty-eighth resistor R28 and the non-inverting input terminal of the fourth operational amplifier a4, a second end of the twenty-eighth resistor R28 is grounded, an output terminal of the fourth operational amplifier a4 is connected to the second end of the twenty-ninth resistor R29 and the first end of the thirty-fifth resistor R30, a second end of the thirty-fifth resistor R30 is connected to the first end of the thirty-eleventh resistor R31 as the output terminal of the fault detection circuit 3, and a second end of the thirty-fifth resistor R31 is grounded.

A slave station communication module 5 respectively connected with the upper computer and the microprocessor 4;

and the microprocessor 4 is respectively connected with the signal conditioning circuit 2 and the fault detection circuit 3 and used for obtaining an equipment state signal according to the audio signal after analog-to-digital conversion and transmitting a target signal and the equipment state signal to an upper computer through a slave station communication module 5.

Specifically, the input end of the microprocessor 4 is respectively connected with the output end of the signal conditioning circuit 2 and the output end of the fault detection circuit 3, and the output end of the microprocessor 4 is connected with the slave station communication module 5, so that the audio signal, the temperature signal, the humidity signal and the equipment state signal which are collected and processed by the audio sensor are sent to the upper computer through the slave station communication module 5.

Specifically, the microprocessor 4 determines whether the audio sensor has a problem of open circuit (audio signal output of about 2.5V), short circuit (audio signal output of 0V), or the like according to each audio signal output by the fault detection circuit 3, thereby obtaining an apparatus status signal. Meanwhile, communication faults of the intelligent audio sensor can be detected by matching with the slave station communication module 5, corresponding equipment states are sent to the upper computer, the upper computer can judge the equipment states according to the received state data, and the table 1 is a corresponding relation table of equipment state signals and the equipment states.

TABLE 1 correspondence table of device status signals and device status

Status data	Device status
		0	The equipment operates normally
1	Short circuit of equipment
		2	Equipment break
3	Equipment communication failure

The application provides an intelligent audio sensor, including acquisition circuit, signal conditioning circuit, fault detection circuit, microprocessor and communication module, wherein, acquisition circuit can accomplish the collection to audio signal, humidity signal and humidity signal simultaneously, and the intelligent audio sensor that this application provided only needs a cable can the connecting instrument, and the wiring is simple. Meanwhile, the fault detection circuit carries out AD acquisition through audio signals, and the microprocessor judges the equipment state according to the acquired audio signals. And the collected target signal and the equipment state signal are transmitted to the upper computer through the communication module, so that the overhaul time can be saved, and the fault data is accumulated to provide data support for later upgrading and reconstruction. The application also provides a monitoring system which has the same beneficial effect as the intelligent audio sensor.

On the basis of the above-described embodiment:

as a preferred embodiment the slave communication module 5 comprises an IO-LINK communication slave circuit.

Specifically, the IO-LINK is a serial bidirectional point-to-point communication protocol, and the transmitted signal is a 24V digital quantity signal, and a standard M12 connector is adopted. The structure of the IO-LINK communication hardware circuit is shown in figure 11. The IO-LINK communication is composed of an IO-LINK communication slave station (namely, the slave station communication module 5) and an IO-LINK communication master station, wherein L6360 is an IO-LINK communication master station chip, and L6362A is an IO-LINK communication slave station chip.

Specifically, as shown in the right side of fig. 11, the IO-LINK communication slave station is composed of an L6362A chip and a slave station microcontroller, and the slave station microcontroller is an STM32 processor. L6362A is an IO-LINK and SIO (standard IO) mode transceiver compliant with PHY2 (3-wire connection) specification, supporting COM1(4.8kBd), COM2(38.4kBd) and COM3(230.4kBd) modes. The chip allows high side, low side or push-and-slip output configurations, and can drive any type of load (capacitive, resistive or inductive). The interface is an ideal interface of an industrial sensor operating in a 24V environment and can be connected to a PLC, an industrial IO module or an IO-LINK main equipment terminal. Meanwhile, the chip has a set of protection measures of VCC, GND, OUTH, OUTL and I/Q pins with reversed polarity, and also comprises output short circuit, overvoltage and fast transient condition (+/-1 KV, 500 omega and 18uF coupling) protection measures.

Referring to fig. 12, VDD, IN1, IN2, EN, OL, OUTIQ pins of the slave chip for IO-LINK communication are connected to a microprocessor (STM32), wherein VDD outputs a voltage of 3.3V through an L6362A internal linear voltage regulator to supply power to an STM32 processor, IN1 and IN2 pins can input collected digital signals and fault diagnosis signals to the slave chip for IO-LINK communication through the STM32 processor, the OUTIQ pin is used for outputting control commands to the STM32 processor, and the OL pin outputs an overload detection state to an STM32 processor. The L, CQ and GND ports of the L6362A chip are connected with an IO-LINK communication master station chip L6360, wherein the L + generally adopts a 24V power supply, and the CQ is used as an IO-LINK communication transmission port, can be used as a standard switching value IO port and can also be used as an IO-LINK communication port, and can transmit sensor data, fault diagnosis data, monitoring and configuration data.

As a preferred embodiment, the interface of the intelligent audio sensor is a 5-core M12 connector.

Specifically, the intelligent audio sensor interface is a 5-core M12 connector, a standard IOLINK communication connector, and a schematic diagram of a hardware interface structure is shown in fig. 13. L + is the positive end of a 24V power supply, L-is the negative end of the 24V power supply, and C/Q is an IOLINK signal, and can be used as a standard IO signal and also can be used for IOLINK signal communication.

Referring to fig. 14, fig. 14 is a schematic structural diagram of a monitoring system provided in the present application, including an intelligent audio sensor 100 as described in any one of the above paragraphs;

further comprising:

a master station communication module 200 connected to the communication module;

and an upper computer 300 connected with the master station communication module 200.

As shown in the left side of fig. 11, the IO-LINK communication master station (i.e., master station communication module 200) is composed of an L6360 chip and a microcontroller, and the microcontroller selects an STM32 processor. L6360 is an IO-LINK main port conforming to PHY2 (3-wire connection) specification, and supports COM1(4.8kBd), COM2(38.4kBd), and COM3(230.4kBd) modes. The programmability of the C/Q output pins is very flexible because high side, low side or push-and-slip configurations are allowed. Overload and short circuit problems are taken into account by the programmable cutoff current, cutoff current delay time and restart delay time values, in addition to the over-temperature protection and automatic restart functions. L6360 through Standard 2-line I²The C interface communicates with the microcontroller, stores and monitors IC status and fault conditions (e.g., L + line, over-temperature, C/Q overload, linear regulator under-voltage, and parity check) via 9 registers.

As shown in FIG. 15, the SCL and SDL pins of the IO-LINK communication master station chip and the I of the STM32 processor of the master control terminal²The C bus is connected for serial communication, can monitor the state and fault condition of IC, and the INC/Q, OUTC/Q, OUTI/Q is connected with the USART of STM32 processor, and can transmit the data obtained from the IO-LINK communication slave station to the STM32 processor, IRQ, EThe NL +, ENC/Q, RST ports are connected with the IO port of the STM32 processor, and VDD outputs 3.3V voltage through the L6360 internal linear voltage regulator to supply power to the STM 32. The L +, CQ and GND ports of the L6360 chip are connected with the IO-LINK communication slave chip L6362A, wherein the L + generally adopts a 24V power supply, and the CQ is used as an IO-LINK communication transmission port, can be used as a standard switching value IO port and can also be used as an IO-LINK communication port, and can transmit sensor data, fault diagnosis data, monitoring and configuration data.

In a preferred embodiment, the master communication module 200 includes an IO-LINK communication master circuit 2001.

As a preferred embodiment, the master station communication module 200 further includes:

and the RS485 communication circuit 2002 and/or the ZigBee communication circuit 2003, the input end of which is connected with the output end of the IO-LINK master station circuit, and the output end of which is connected with the upper computer 300.

Specifically, the data and the fault diagnosis data collected by the intelligent audio sensor 100 can be transmitted to the upper computer 300 through the RS485 communication circuit 2002, and meanwhile, the upper computer 300 can send an instruction to the IO-LINK communication module through the RS 485. Of course, the data and the fault diagnosis data collected by the intelligent audio sensor 100 may also be transmitted to the upper computer 300 through the ZigBee communication circuit 2003, and meanwhile, the upper computer 300 may send an instruction to the IO-LINK communication module through the ZigBee communication circuit 2003. The ZigBee communication circuit 2003 adopts CC2530 of TI company to carry out wireless communication, and the chip has low power consumption and the transmission rate of 250 kbp/s.

It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, article, or apparatus that comprises the element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An intelligent audio sensor, comprising:

2. The intelligent audio sensor of claim 1, wherein the acquisition circuit comprises:

the audio acquisition circuit is used for acquiring the audio signal;

and the humidity acquisition circuit is used for acquiring the humidity signal.

3. The smart audio sensor of claim 2, wherein the audio acquisition circuit comprises three parallel electret microphones.

4. The intelligent audio sensor according to claim 2, wherein the temperature acquisition circuit is specifically a bridge balancing circuit built by a temperature sensitive resistor;

5. The intelligent audio sensor according to claim 1, wherein the microprocessor is embodied as STM 32.

6. The intelligent audio sensor of claim 1, wherein the slave communication module comprises an IO-LINK communication slave circuit.

7. The intelligent audio sensor according to claim 1, wherein the interface of the intelligent audio sensor is a 5-core M12 connector.

8. A monitoring system comprising the intelligent audio sensor of any one of claims 1-7;

further comprising:

9. The monitoring system of claim 8, wherein the master communication module comprises an IO-LINK communication master circuit.

10. The monitoring system of claim 9, wherein the master station communication module further comprises:

and the input end of the RS485 communication circuit and/or the ZigBee communication circuit is connected with the output end of the IO-LINK communication master station circuit, and the output end of the RS485 communication circuit and/or the ZigBee communication circuit is connected with the upper computer.