CN210805717U - Chip packaging mechanism - Google Patents
Chip packaging mechanism Download PDFInfo
- Publication number
- CN210805717U CN210805717U CN201922158665.6U CN201922158665U CN210805717U CN 210805717 U CN210805717 U CN 210805717U CN 201922158665 U CN201922158665 U CN 201922158665U CN 210805717 U CN210805717 U CN 210805717U
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- Prior art keywords
- mounting
- chip
- packaging base
- packaging
- joint
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Abstract
A chip packaging mechanism comprises a mounting cylinder, a packaging base, a mounting joint and a first glass blank; a packaging base is arranged on one side of the mounting cylinder; the mounting joint is welded on one side of the packaging base, which is far away from the mounting cylinder; an inwards-concave mounting cavity is arranged at the middle position of the side surface of the mounting joint; the side surface of the packaging base covers the opening of the mounting cavity; welding the joint of the mounting joint and the packaging base, and sealing the mounting cavity; the chip is arranged in the mounting cavity; the chip is arranged on the packaging base; a first glass blank is arranged around the ceramic plate; the contact pin is arranged in the first glass blank; the first glass blank and the contact pin penetrate through the packaging base and extend into the mounting cylinder; a lead is arranged in the contact pin; the chip is connected with the wires in the contact pins; the utility model provides a chip packaging mechanism adopts glass sintering technology and welding to satisfy very high leakproofness requirement.
Description
Technical Field
The utility model relates to a packaging mechanism field, concretely relates to chip packaging mechanism.
Background
The chip is applied to and detects gas, and ordinary encapsulation form adopts circuit board encapsulation form, and the chip pastes on the circuit board, adopts the fixed back injecting glue of fastener, and external seal circle is sealed. However, with the rapid development of electronic technology, the performance of the chip is higher and higher, and meanwhile, the requirement of the chip on the installation environment is higher and higher, and the common packaging form cannot meet the current requirement of high sealing performance.
SUMMERY OF THE UTILITY MODEL
To prior art not enough, the utility model provides a chip packaging mechanism adopts glass sintering technology and welding to satisfy very high leakproofness requirement.
The utility model provides a following technical scheme:
a chip packaging mechanism comprises a mounting cylinder, a packaging base, a mounting joint and a first glass blank; a packaging base is arranged on one axial side of the mounting cylinder; the mounting joint is arranged on the packaging base and is far away from the mounting cylinder; an inwards-concave mounting cavity is arranged at the middle position of the side surface of the mounting joint; the side surface of the packaging base covers the opening of the mounting cavity; welding the joint of the mounting joint and the packaging base, and sealing the mounting cavity; the chip is arranged in the mounting cavity; the chip is arranged on the packaging base; a first glass blank is arranged around the chip; the first glass blank is arranged on the packaging base by adopting a glass sintering process; the contact pin is arranged in the first glass blank; the first glass blank and the contact pin penetrate through the packaging base and extend into the mounting cylinder; a lead is arranged in the contact pin; the chip is connected to an external power supply by wires in the pins.
Preferably, the chip is connected to the ceramic sheet; the ceramic wafer is arranged on the packaging base.
Preferably, the middle of the installation joint is provided with a polygon prism; and an external thread is arranged on one side of the mounting joint, which is far away from the mounting cylinder.
Preferably, the mounting joint is provided with a connecting hole; the connecting hole axially penetrates through the mounting joint along the mounting cylinder; the connecting hole is communicated with the mounting cavity.
Preferably, a connecting port is arranged on one side of the mounting cylinder, which is far away from the packaging base; the connecting port is arranged on the axis of the mounting cylinder.
Preferably, one side of the ceramic wafer, which is far away from the chip, is arranged in the packaging base; a second glass blank is arranged between the ceramic plate and the packaging base; the second glass blank is arranged on the outer side of the ceramic plate in a surrounding mode.
Compared with the prior art, the utility model has the advantages of it is following and effect:
the utility model discloses well erection joint weld in the packaging base, first glass base adopts glass sintering process to set up the contact pin on the packaging base, through adopting glass sintering process and welding to guarantee the leakproofness of high strength in the installation cavity.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a front view of a chip packaging mechanism according to the present invention.
Fig. 2 is a cross-sectional view of the present invention in the direction of fig. 1A-a.
Fig. 3 is a partially enlarged view of the point B in fig. 1 according to the present invention.
In the figure: the packaging structure comprises a connecting cylinder 1, a screw 2, a mounting joint 3, a hexagonal prism 31, a connecting block 32, a connecting hole 33, a packaging base 4, a connecting port 5, a first glass blank 6, a chip 7, a pin 8, a wire 9, a ceramic chip 10, a second glass blank 11 and a mounting cavity 12.
Detailed Description
The utility model discloses a concrete implementation way does:
referring to fig. 1-3, a chip packaging mechanism includes a mounting tube 1, a packaging base 4, a mounting connector 3, and a first glass blank 6; a packaging base 4 is arranged on one side of the mounting cylinder 1, and the packaging base 4 covers one axial side of the mounting cylinder 1; the connecting cylinder 1 is connected with the packaging base 4 through a screw 2; a connecting port 5 is arranged on one side of the mounting cylinder 1, which is far away from the packaging base 4; the connecting port 5 is arranged on the axis of the mounting cylinder 1; the lead 9 in the contact pin 8 is connected with an external power supply through the connecting port 5; the mounting joint 3 is welded on one side of the packaging base 4 far away from the mounting cylinder 1; an inwards concave mounting cavity 12 is arranged in the middle of the side surface of the mounting joint 3; the packaging base 4 covers the opening of the mounting cavity 12; the joint of the installation joint 3 and the packaging base 4 is welded, and an installation cavity 12 is sealed; a boss is arranged on one side of the packaging base 4 close to the mounting connector 3; the boss of the packaging base 4 is arranged in the mounting cavity 12, the shape and the size of the boss of the packaging base 4 correspond to those of the mounting cavity 12, and the mounting and the positioning of the mounting connector 3 are facilitated by the matching of the boss of the packaging base 4 and the mounting cavity 12; the middle of one side of the packaging base 4 far away from the installation connector 3 is concave, so that the first glass blank 6 and the contact pin 8 can penetrate through the packaging base 4.
The middle of the mounting joint 3 is provided with a hexagonal prism 31; the sealing mechanism is convenient to rotate by using a spanner through the hexagonal prism 31; a connecting block 32 is arranged on one side of the mounting joint 3 away from the connecting cylinder 1; the connecting block 32 is cylindrical; the axis of the connecting block 32 coincides with the axis of the connecting cylinder 1; the sealing mechanism is arranged on corresponding equipment through the connecting block 32 by virtue of external threads on the side wall of the connecting block 32; the mounting joint 3 is provided with a connecting hole 33; the connecting hole 33 axially penetrates through the mounting joint 3 along the mounting cylinder 1; one side of the connecting hole 33 is communicated with the mounting cavity 12; the axis of the connecting hole 33 is coincident with the axis of the connecting cylinder 1; the external device feeds corresponding gas into the installation cavity 12 through the connection hole 33.
The chip 7 is arranged in the mounting cavity 12; the chip 7 is connected to the ceramic plate 10; the ceramic plate 10 is arranged on a boss of the packaging base 4; the ceramic chip 10 is used as a carrier of the chip 7, so that the power consumption of the chip 7 can be well reduced, and the performance of the chip 7 is improved to the greatest extent; a first glass blank 6 is arranged around the ceramic plate 10; the first glass blank 6 is arranged on the packaging base 4 by adopting a glass sintering process, so that the sealing performance of the sealing mechanism is ensured; the contact pin 8 is arranged in the first glass blank 6; the first glass blank 6 and the contact pin 8 penetrate through the packaging base 4 and extend into the mounting cylinder 1; a lead 9 is arranged in the contact pin 8; the chip 7 is connected with a lead 9 in the contact pin 8, and the chip 7 is connected with an external power supply through the lead 9 in the contact pin 8.
The ceramic plate 10 is rectangular; one side of the ceramic chip 10, which is far away from the chip 7, is arranged in the packaging base 4; a second glass blank 11 is arranged between the ceramic plate 10 and the packaging base 4; the second glass blank 11 is arranged around the outer side of the ceramic plate 10; fixing the ceramic plate 10 on the packaging base 4 through a second glass blank 11; two pins 8 are arranged on each side of the ceramic plate 10.
The working principle is as follows: the worker fixes the ceramic plate 10 on the packaging base 4 by using the second glass blank 11 and fixes the contact pin 8 on the packaging base 4 by using the first glass blank 6 through a glass sintering process; the packaging base 4 is arranged on the connecting cylinder 1 through a screw 2; the worker pastes the chip 7 on the ceramic plate 10 by using glue; after waiting for 24 hours, connecting the lead 9 in the contact pin 8 with the chip 7; the mounting tabs 3 are attached to the package base 4 by laser welding; the external thread of the connecting block 32 connects the compact packaging mechanism to corresponding external equipment, the external equipment injects related gas into the installation cavity 12 through the connecting hole 33, and the chip 7 detects the introduced gas.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A chip packaging mechanism is characterized in that: the device comprises an installation cylinder, a packaging base, an installation joint and a first glass blank; a packaging base is arranged on one axial side of the mounting cylinder; the mounting joint is arranged on the packaging base and is far away from the mounting cylinder; an inwards-concave mounting cavity is arranged at the middle position of the side surface of the mounting joint; the side surface of the packaging base covers the opening of the mounting cavity; welding the joint of the mounting joint and the packaging base, and sealing the mounting cavity; the chip is arranged in the mounting cavity; the chip is arranged on the packaging base; a first glass blank is arranged around the chip; the first glass blank is arranged on the packaging base by adopting a glass sintering process; the contact pin is arranged in the first glass blank; the first glass blank and the contact pin penetrate through the packaging base and extend into the mounting cylinder; a lead is arranged in the contact pin; the chip is connected to an external power supply by wires in the pins.
2. The chip packaging mechanism according to claim 1, wherein: the chip is connected to the ceramic chip; the ceramic wafer is arranged on the packaging base.
3. The chip packaging mechanism according to claim 2, wherein: one side of the ceramic wafer, which is far away from the chip, is arranged in the packaging base; a second glass blank is arranged between the ceramic plate and the packaging base; the second glass blank is arranged on the outer side of the ceramic plate in a surrounding mode.
4. The chip packaging mechanism according to claim 1, wherein: the middle of the mounting joint is provided with a polygonal column; and an external thread is arranged on one side of the mounting joint, which is far away from the mounting cylinder.
5. The chip packaging mechanism according to claim 4, wherein: the mounting joint is provided with a connecting hole; the connecting hole penetrates through the mounting joint along the axial direction of the polygonal column; the connecting hole is communicated with the mounting cavity.
6. The chip packaging mechanism according to claim 1, wherein: a connecting port is formed in one side, far away from the packaging base, of the mounting cylinder; the connecting port is arranged on the axis of the mounting cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922158665.6U CN210805717U (en) | 2019-12-05 | 2019-12-05 | Chip packaging mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922158665.6U CN210805717U (en) | 2019-12-05 | 2019-12-05 | Chip packaging mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210805717U true CN210805717U (en) | 2020-06-19 |
Family
ID=71228662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922158665.6U Expired - Fee Related CN210805717U (en) | 2019-12-05 | 2019-12-05 | Chip packaging mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210805717U (en) |
-
2019
- 2019-12-05 CN CN201922158665.6U patent/CN210805717U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200619 Termination date: 20201205 |