CN210804465U - Fingerprint identification module and terminal equipment - Google Patents
Fingerprint identification module and terminal equipment Download PDFInfo
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- CN210804465U CN210804465U CN201922404628.9U CN201922404628U CN210804465U CN 210804465 U CN210804465 U CN 210804465U CN 201922404628 U CN201922404628 U CN 201922404628U CN 210804465 U CN210804465 U CN 210804465U
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Abstract
The embodiment of the utility model discloses fingerprint identification module and terminal equipment. The fingerprint identification module comprises a sensor chip, a micro-mirror head structure and a circuit board; the sensor chip comprises a substrate, a cofferdam and a plurality of first welding pads, wherein the cofferdam is positioned on the substrate, and the substrate comprises an optical sensing area; the cofferdam surrounds the optical sensing area; the first welding pads are positioned on the substrate and positioned outside the cofferdam surrounding area; the micro-mirror head structure is positioned on one side of the cofferdam departing from the substrate; the circuit board is positioned on one side of the substrate, which is far away from the micro-mirror head structure; the plurality of first welding pads are electrically connected with the circuit board. The utility model discloses technical scheme to the realization reduces the whole thickness of fingerprint identification module.
Description
Technical Field
The embodiment of the utility model provides a relate to and show technical field, especially relate to a fingerprint identification module and terminal equipment.
Background
With the rapid development of communication technology, various electronic devices are widely used in daily life and work of people, such as mobile phones, tablet computers, and the like.
At present, electronic equipment can adopt the fingerprint identification module of integrated in the below of electronic equipment screen, through gathering the light of finger reflection and discerning in order to obtain fingerprint image information the reflection light of gathering, wherein, fingerprint image information mainly is through discerning the light of each characteristic point (the crest and the trough of fingerprint) reflection to the fingerprint and obtains. However, the thickness of current fingerprint identification module all exceeds 0.8mm, and thickness is thick partially, influences the inside design and the overall arrangement of intelligent terminal, for example the overall arrangement of battery, can lead to the position of fingerprint identification module can only be put in the below position on the side of screen, influences user experience.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a fingerprint identification module and terminal equipment to the whole thickness that the realization reduced the fingerprint identification module.
In a first aspect, an embodiment of the present invention provides a fingerprint identification module, this fingerprint identification module includes:
the sensor comprises a sensor chip, a micro-mirror head structure and a circuit board;
the sensor chip comprises a substrate, a cofferdam and a plurality of first welding pads, wherein the cofferdam is positioned on the substrate, and the substrate comprises an optical sensing area; the cofferdam surrounds the optical sensing area; the first welding pads are positioned on the substrate and positioned outside the cofferdam surrounding area; the micro-mirror head structure is positioned on one side of the cofferdam departing from the substrate;
the circuit board is positioned on one side of the substrate, which is far away from the micro-mirror head structure; the plurality of first welding pads are electrically connected with the circuit board.
Optionally, the vertical distance range from the top of the micro-mirror head structure to the bottom of the circuit board is 50-300 um.
Optionally, the cofferdam comprises at least one concentric ring-shaped sub-cofferdam.
Optionally, the height of the cofferdam ranges from 5um to 300um, and the width ranges from 30 um to 1000 um.
Optionally, the micro-lens structure includes a substrate, a light-shielding layer, and a plurality of micro-lenses;
the light shielding layer is positioned on one side of the substrate, which is far away from the cofferdam; the light shielding layer is provided with a plurality of openings; the micro lenses are arranged at the openings in a one-to-one correspondence mode.
Optionally, the circuit board includes a plurality of second pads;
the second welding pads are positioned on the circuit board and outside the attaching area of the sensor chip and the circuit board, and the plurality of first welding pads are electrically connected with the second welding pads.
In a second aspect, the embodiment of the present invention further provides a terminal device, including: terminal equipment includes the fingerprint identification module of any of the above-mentioned embodiments.
In a third aspect, the embodiment of the present invention further provides a method for manufacturing a fingerprint identification module, where the method includes:
providing a substrate master, wherein the substrate master comprises a plurality of optical sensing areas;
forming a plurality of cofferdams and a plurality of first welding pads on the substrate mother board; the cofferdam surrounds one optical sensing area; the first welding pads are positioned on the substrate master mask and positioned outside the cofferdam surrounding area;
providing a plurality of micro-mirror head structures, and correspondingly attaching the micro-mirror head structures to one side of the cofferdams away from the substrate mother plate;
cutting to form a plurality of fingerprint identification units;
and electrically connecting the plurality of first welding pads of the fingerprint identification unit with the circuit board to form a fingerprint identification module.
Optionally, before cutting and forming the plurality of fingerprint identification units, the method further includes:
and thinning the substrate master mask.
Optionally, before thinning the substrate master, the method further includes:
forming a protective film on one side of the micro-lens structure, which is far away from the substrate;
before cutting and forming a plurality of fingerprint identification units, the method further comprises the following steps:
and removing the protective film.
According to the technical scheme of the embodiment of the utility model, the fingerprint identification module comprises a sensor chip, a micro-mirror head structure and a circuit board; the sensor chip comprises a substrate, a cofferdam and a plurality of first welding pads, wherein the cofferdam is positioned on the substrate, and the substrate comprises an optical sensing area; the cofferdam surrounds the optical sensing area; the first welding pads are positioned on the substrate and positioned outside the cofferdam surrounding area; the micro-mirror head structure is positioned on one side of the cofferdam departing from the substrate; the circuit board is positioned on one side of the substrate, which is far away from the micro-mirror head structure; the plurality of first welding pads are electrically connected with the circuit board. The problem of fingerprint identification module's thickness thick partially in the prior art, influence the inside design and overall arrangement of intelligent terminal and user experience is solved. In order to realize reducing the whole thickness of fingerprint identification module.
Drawings
Fig. 1 is a schematic cross-sectional view of a fingerprint identification module according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a sensor chip 100 according to an embodiment of the present invention;
fig. 3 is a schematic top view of a sensor chip 100 according to an embodiment of the present invention;
fig. 4 is a flowchart of a method for manufacturing a fingerprint identification module according to an embodiment of the present invention;
fig. 5-7 are flowcharts of the fingerprint recognition module formed in the steps of the method for manufacturing a fingerprint recognition module according to the embodiment of the present invention;
fig. 8 is a flowchart of a method for manufacturing a fingerprint identification module according to an embodiment of the present invention;
fig. 9 is a flowchart of a fingerprint recognition module formed in one step of a manufacturing method of the fingerprint recognition module according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
The embodiment of the utility model provides a fingerprint identification module, applicable optical fingerprint identification in electronic equipment. Fig. 1 is a schematic cross-sectional view of a fingerprint identification module according to an embodiment of the present invention. Referring to fig. 1, the fingerprint recognition module includes:
a sensor chip 100, a micro-lens structure 200, and a circuit board 300;
the sensor chip 100 comprises a substrate 104, a cofferdam 103 on the substrate 104 and a plurality of first pads 101, wherein the substrate 104 comprises an optical sensing area 102; said cofferdam 103 surrounds said optical sensing area 102; a plurality of the first pads 101 are located on the substrate 104 and outside the surrounding area of the dam 103; the micro-mirror head structure 200 is located on a side of the cofferdam 103 away from the substrate 104;
the circuit board 300 is located on a side of the substrate 104 away from the micro-mirror head structure 200; the plurality of first pads 101 are electrically connected to the circuit board 300.
Wherein the substrate 104 provides support and electrical support for the sensor chip 100. Alternatively, the substrate 104 may be a wafer.
The optical sensing area 102 is disposed on one side of the substrate 104 and used for receiving light received by the micro-mirror head structure 200, and the optical sensing area 102 corresponds to the micro-mirror head structure 200, so as to ensure the accuracy of detection and identification of the fingerprint identification module. The optical sensing area 102 can be an optical sensor chip in the prior art, and the size and dimension of the optical sensing area 102 are determined by the size and dimension of the optical sensor chip receiving the light, which is only explained in this example.
The dam 103 is disposed between the optical sensing region 102 and the first pad 101, surrounding the optical sensing region 102, for protecting the optical sensing region 102 from being contaminated by the outside, and also serving as a supporting connector between the micro-lens structure 200 and the circuit board 300.
The material selected for the dam 103 is self-adhesive and has good thermal and chemical stability. The material of cofferdam 103 can be screen printing organic material, photosensitive material of photoetching or metal material, the utility model discloses do not restrict the material of cofferdam 103.
On the basis of the above embodiment, the circuit board 300 includes a plurality of second pads 101; the second pads 101 are located on the circuit board 300 and outside the region where the sensor chip 100 is attached to the circuit board 300, and the plurality of first pads 101 are electrically connected to the second pads 101. The second bonding pads 101 are disposed on the side of the circuit board 300 attached to the sensor chip 100, and the bonding pads on the circuit board 300 are electrically connected to the plurality of first bonding pads 101 on the sensor chip 100 by a wire bonding method, wherein the number of the second bonding pads 101 on the circuit board 300 is the same as the number of the first bonding pads 101. The circuit board 300 further includes a control chip 401, a passive device 402, a connector 403, and other related circuit devices (not shown in fig. 1), and after the sensor chip 100 is electrically connected to the circuit board 300, the chip 401, the passive device 402, the connector 403, and the other related circuit devices can be controlled on the circuit board 300, so as to electrically connect and assemble the entire fingerprint identification module.
With continued reference to fig. 1, based on the above embodiments, the vertical distance from the top of the micro mirror head structure to the bottom of the circuit board is in the range of 50-300 um.
According to the technical scheme of the embodiment of the utility model, the fingerprint identification module comprises a sensor chip, a micro mirror head structure and a circuit board; the sensor chip comprises a substrate, a cofferdam and a plurality of first welding pads, wherein the cofferdam is positioned on the substrate, and the substrate comprises an optical sensing area; the cofferdam surrounds the optical sensing area; the first welding pads are positioned on the substrate and positioned outside the cofferdam surrounding area; the micro-mirror head structure is positioned on one side of the cofferdam departing from the substrate; the circuit board is positioned on one side of the substrate, which is far away from the micro-mirror head structure; the plurality of first welding pads are electrically connected with the circuit board. In prior art, the thickness of present fingerprint identification module all exceeds 0.8mm, and thickness is thick on the contrary, adopts highly lower micro mirror head structure in this embodiment, and attenuate sensor chip's thickness simultaneously to the realization reduces the whole thickness of fingerprint identification module. In addition, thick fingerprint identification module influences the inside design and the overall arrangement of intelligent terminal, for example the overall arrangement of battery, can lead to the position of fingerprint identification module to put in the below position on the left of screen, influences user experience, has reduced the thickness of fingerprint identification module in this embodiment, more is favorable to the intelligent terminal screen to design the overall arrangement space, promotes the fingerprint identification that the user used the fingerprint identification module and experiences the impression.
Fig. 2 is a schematic cross-sectional view of a sensor chip 100 provided in an embodiment of the present invention, and fig. 3 is a schematic top view of the sensor chip 100 provided in an embodiment of the present invention. In this embodiment, with reference to fig. 2 and 3, a further embodiment is provided, optionally, the cofferdam 103 comprises at least one concentric ring-shaped sub-cofferdam.
It is understood that the dam 103 is arranged in a ring shape on a single sensor chip 100, and may have a different ring shape. Can be a single circle or a plurality of circles. The utility model discloses not limiting to the concrete quantity of cofferdam 103, cofferdam 103 is more, glue infiltration sensor chip 100's photosensitive area 102 in the follow-up technology of avoiding that can be better.
Optionally, the height of the cofferdam ranges from 5um to 300um, and the width ranges from 30 um to 1000 um. The specific height range and width range are defined according to the space size of the sensor chip 100, the relative position relationship between the sensor chip 100 and the first pad 101, and the overall thickness design of the dam 103.
With continued reference to fig. 1, in one embodiment of the present disclosure, optionally, the micro-mirror head structure 200 includes a substrate 204, a light shielding layer 203, and a plurality of micro-lenses 202;
the substrate 204 provides support for the microlens structure 200, and the substrate 204 may be a large piece of optical glass, or other organic thin film or substrate material that can transmit a specified wavelength. Wherein, the thickness range of substrate 204 can be between 0.05-1.5mm, and the shape of substrate 204 can be circular, can be square, also can be other shapes, the embodiment of the utility model provides a do not restrict the shape of substrate 204.
The light-shielding layer 203 is disposed on a side of the substrate 204 receiving the light, and is used for shielding the light in a certain wavelength range from being transmitted. Optionally, the material of the light shielding layer 203 may be an organic film or a metal film (e.g., black chrome), and the utility model does not specifically limit the material of the light shielding layer 203. The thickness of the light-shielding layer 203 may range from 0.1um to 20 um.
The light-shielding layer 203 is provided with a plurality of openings, and the openings on the light-shielding layer 203 are used for manufacturing the micro lens 202. The number of the openings on the light-shielding layer 203 can be set by those skilled in the art according to actual needs, the shape of the openings can be ensured to be consistent with the shape of the bottom of the micro lens 202, and the arrangement of the openings on the light-shielding layer 204 can be set by those skilled in the art according to actual needs. Optionally, the plurality of openings are arranged in an array on the light-shielding layer 203.
The substrate 204 designed as described above transmits light in a specific wavelength range, and the light-shielding layer 203 may shield light in a certain wavelength range from infrared rays of 600 nm or more.
The micro-lens 202 may be implemented by imprinting, photolithography of organic optical materials, thermal reflow, dry etching, and gray-scale mask. The height range of the micro-lenses 202 can be 1-100 um, the diameter range can be 3-1000 um, the distance range between the micro-lenses 202 can be 0.5-10000 um, and in a specific embodiment, the size of the micro-lenses can be adjusted according to the specific size of the fingerprint identification module. The traditional lens is composed of a multilayer optical filter, the whole thickness is thick, and the whole thickness of the optical fingerprint identification module can be reduced by selecting the micro lens 202 as a light-gathering receiving signal of the optical fingerprint identification module.
It should be noted that the arrangement of the micro lens 202 according to the embodiment of the present invention may be an array type, and there may also be different arrangements, the bottom shape of the micro lens 202 may be a circle or a square, and fig. 1 exemplarily shows that the bottom of the micro lens 202 is a circle, and the embodiment of the present invention does not limit the arrangement and the bottom shape of the micro lens 202.
It is understood that the micro lenses 202 correspond to the openings of the light-shielding layer 203 one by one, and the number of the openings and the shape of the openings on the light-shielding layer 204 can be determined by the number of the micro lenses 202 and the shape of the bottom.
With continued reference to fig. 1, in one embodiment of the present embodiment, optionally, the light shielding layer 203 is located on a side of the substrate 204 away from the bank 103; the light shielding layer 203 is provided with a plurality of openings; the micro lenses 202 are correspondingly arranged at the openings.
The light shielding layer 203 is provided with the opening in the connecting area of the micro lens 202 and the substrate 204, so that the micro lens 202 can be manufactured on one side of the substrate 204 close to the terminal of the screen, and the micro lens 202 is prevented from being invalid because the light shielding layer 203 is fully distributed on the whole substrate 204. The light-shielding layer 203 can be formed by a single process or a combination of processes, such as evaporation, screen printing, spin coating, spraying, and semiconductor lithography.
Through the one side preparation micro lens structure 200 that is close to the intelligent terminal screen at circuit board 300, sensor chip 100 is through forming cofferdam 103 and the laminating of micro lens structure 200, be connected with circuit board 300 electricity through a plurality of first pads 101, thereby form the fingerprint identification module in the embodiment, replace in the traditional handicraft that optical fingerprint identification module needs sensor chip, PCB board and camera lens equipment are made, optical fingerprint identification module thickness is thicker, the technology is complicated, can effectively reduce the thickness of optical fingerprint identification module.
On the basis of the above-mentioned embodiment, the embodiment of the utility model provides a pair of terminal equipment, terminal equipment can include the utility model discloses arbitrary embodiment fingerprint identification module. It should be noted that the embodiment of the present invention provides a terminal device which can be a computer, a television or an intelligent wearable device, and the embodiment of the present invention does not specially limit this.
Fig. 4 is a flowchart of a method for manufacturing a fingerprint identification module according to an embodiment of the present invention, and fig. 5-7 are flowcharts of a fingerprint identification module formed in steps of a method for manufacturing a fingerprint identification module according to an embodiment of the present invention. The embodiment is applicable to the situation of optical fingerprint identification of electronic equipment, and the preparation method specifically comprises the following steps:
s410, providing a substrate master, wherein the substrate master comprises a plurality of optical sensing areas;
referring to fig. 5, a substrate master, which may be a monolithic wafer, is provided that includes a plurality of optically sensitive regions.
S420, forming a plurality of cofferdams and a plurality of first welding pads on the substrate mother board; the cofferdam surrounds one optical sensing area; the first welding pads are positioned on the substrate master mask and positioned outside the cofferdam surrounding area;
with continued reference to fig. 5, the cofferdam fabrication technique may be performed by photolithography of organic photosensitive material, or 3D printing, screen printing, etc.
The manufacturing position of the cofferdam is that the cofferdam (103) is manufactured on the surface of the wafer on which the substrate master is positioned according to the positions of the first bonding pad (101) at the periphery of the optical sensing area and the optical sensing area (102).
S430, providing a plurality of micro-mirror head structures, and correspondingly attaching the micro-mirror head structures to one side of the cofferdams away from the substrate mother plate;
referring to fig. 6, a micro-lens structure is provided, and with reference to fig. 7, the micro-lens structure is correspondingly attached to one side of the cofferdam departing from the substrate master.
And (4) attaching the micro-mirror head structure of the single small piece qualified by screening to the substrate master mask with the cofferdam. The process of specific laminating can adopt the equipment of similar flip-chip bonding to realize, and the laminating precision can reach within 5 um.
Because the material for manufacturing the cofferdam is sticky, the structure of the single small micro-mirror head can be well adhered with the cofferdam. In addition, according to the characteristics of the material for manufacturing the cofferdam, in order to obtain better bonding strength, special wafer-level pressing machine equipment can be used, and the whole piece pressing can be carried out on the cofferdam by means of equipment parameters such as temperature, vacuum or pressure.
After the large-scale processing is finished, the micro lens structure can be cut into a single small micro lens structure, and during subsequent use, a good product is selected, so that the yield and the cost are favorably controlled, and the requirements of batch production are met.
S440, cutting to form a plurality of fingerprint identification units;
with continued reference to fig. 5, a plurality of fingerprint identification units are cut to form a single finished product as shown in fig. 5.
The cutting mode can adopt laser cutting, cutter wheel cutting or CNC machining and the like.
S450, electrically connecting the first welding pads of the fingerprint identification unit with a circuit board to form a fingerprint identification module.
Will a plurality of fingerprint identification unit first weld pad is connected with the circuit board electricity, realizes the electric connection and the equipment of whole fingerprint identification module, forms the fingerprint identification module.
Fig. 8 is a flowchart of a method for manufacturing a fingerprint identification module according to an embodiment of the present invention, and fig. 5-7 and 9 are flowcharts of a fingerprint identification module formed in steps of a method for manufacturing a fingerprint identification module according to an embodiment of the present invention. On the basis of the embodiment, the optimization is carried out, and the preparation method comprises the following steps:
s810, providing a substrate master, wherein the substrate master comprises a plurality of optical sensing areas;
referring to fig. 5, a substrate master, which may be a monolithic wafer, is provided that includes a plurality of optically sensitive regions.
S820, forming a plurality of cofferdams and a plurality of first welding pads on the substrate mother matrix; the cofferdam surrounds one optical sensing area; the first welding pads are positioned on the substrate master mask and positioned outside the cofferdam surrounding area;
with continued reference to fig. 5, the cofferdam fabrication technique may be performed by photolithography of organic photosensitive material, or 3D printing, screen printing, etc.
The manufacturing position of the cofferdam is that the cofferdam (103) is manufactured on the surface of the wafer on which the substrate master is positioned according to the positions of the first bonding pad (101) at the periphery of the optical sensing area and the optical sensing area (102).
S830, providing a plurality of micro-mirror head structures, and correspondingly attaching the micro-mirror head structures to one side of the cofferdams away from the substrate mother plate;
referring to fig. 6, a micro-lens structure is provided, and with reference to fig. 7, the micro-lens structure is correspondingly attached to one side of the cofferdam departing from the substrate master.
And (4) attaching the micro-mirror head structure of the single small piece qualified by screening to the substrate master mask with the cofferdam. The process of specific laminating can adopt the equipment of similar flip-chip bonding to realize, and the laminating precision can reach within 5 um.
Because the material for manufacturing the cofferdam is sticky, the structure of the single small micro-mirror head can be well adhered with the cofferdam. In addition, according to the characteristics of the material for manufacturing the cofferdam, in order to obtain better bonding strength, special wafer-level pressing machine equipment can be used, and the whole piece pressing can be carried out on the cofferdam by means of equipment parameters such as temperature, vacuum or pressure.
S840, forming a protective film on one side of the micro-lens structure, which is far away from the substrate master mask;
referring to fig. 9, in order to protect the microlens from the pressure, a protective film 301 is adhered to a side of the microlens structure facing away from the substrate master, and the protective film 301 can be detackified by using an ultraviolet irradiation mode, so as to facilitate subsequent removal.
S850, thinning the substrate master mask;
after the protective film is formed on the micro-mirror head structure, the silicon surface of the substrate mother plate is thinned by adopting a mechanical grinding method, the specific thinning thickness can be set according to actual needs, and in order to ensure the reliability of the substrate mother plate, the thickness range of the finally formed fingerprint identification module is controlled to be 50-300 um.
S860, removing the protective film;
s870, cutting to form a plurality of fingerprint identification units;
with continued reference to fig. 5, a plurality of fingerprint identification units are cut to form a single finished product as shown in fig. 5.
The cutting mode can adopt laser cutting, cutter wheel cutting or CNC machining and the like.
S880, electrically connecting the first welding pads of the fingerprint identification unit with the circuit board to form a fingerprint identification module.
Will a plurality of fingerprint identification unit first weld pad is connected with the circuit board electricity, realizes the electric connection and the equipment of whole fingerprint identification module, forms the fingerprint identification module.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (7)
1. The utility model provides a fingerprint identification module which characterized in that includes:
the sensor comprises a sensor chip, a micro-mirror head structure and a circuit board;
the sensor chip comprises a substrate, a cofferdam and a plurality of first welding pads, wherein the cofferdam is positioned on the substrate, and the substrate comprises an optical sensing area; the cofferdam surrounds the optical sensing area; the first welding pads are positioned on the substrate and positioned outside the cofferdam surrounding area; the micro-mirror head structure is positioned on one side of the cofferdam departing from the substrate;
the circuit board is positioned on one side of the substrate, which is far away from the micro-mirror head structure; the plurality of first welding pads are electrically connected with the circuit board.
2. The fingerprint identification module of claim 1, wherein a vertical distance from a top of the micro mirror head structure to a bottom of the circuit board is in a range of 50-300 um.
3. The fingerprint identification module of claim 1, wherein the cofferdam comprises at least one concentric ring-shaped sub-cofferdam.
4. The fingerprint identification module of claim 1, wherein the height of the dam ranges from 5 to 300um and the width ranges from 30 to 1000 um.
5. The fingerprint identification module of claim 1, wherein the micro-mirror structure comprises a substrate, a light-shielding layer, and a plurality of micro-lenses;
the light shielding layer is positioned on one side of the substrate, which is far away from the cofferdam; the light shielding layer is provided with a plurality of openings; the micro lenses are arranged at the openings in a one-to-one correspondence mode.
6. The fingerprint identification module of claim 1, wherein the circuit board comprises a plurality of second pads;
the second welding pads are positioned on the circuit board and outside the attaching area of the sensor chip and the circuit board, and the plurality of first welding pads are electrically connected with the second welding pads.
7. A terminal device, characterized in that the terminal device comprises the fingerprint identification module of any one of claims 1 to 6.
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| CN201922404628.9U CN210804465U (en) | 2019-12-27 | 2019-12-27 | Fingerprint identification module and terminal equipment |
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| CN201922404628.9U CN210804465U (en) | 2019-12-27 | 2019-12-27 | Fingerprint identification module and terminal equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110956163A (en) * | 2019-12-27 | 2020-04-03 | 苏州科阳光电科技有限公司 | Fingerprint identification module, terminal equipment and preparation method of fingerprint identification module |
| CN112670192A (en) * | 2020-12-25 | 2021-04-16 | 苏州科阳半导体有限公司 | Wafer level packaging process and wafer level packaging structure |
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2019
- 2019-12-27 CN CN201922404628.9U patent/CN210804465U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110956163A (en) * | 2019-12-27 | 2020-04-03 | 苏州科阳光电科技有限公司 | Fingerprint identification module, terminal equipment and preparation method of fingerprint identification module |
| CN112670192A (en) * | 2020-12-25 | 2021-04-16 | 苏州科阳半导体有限公司 | Wafer level packaging process and wafer level packaging structure |
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Address after: No.568, Fangqiao Road, Caohu Industrial Park, Xiangcheng economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Keyang Semiconductor Co.,Ltd. Address before: No.568, Fangqiao Road, Caohu Industrial Park, Xiangcheng economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU KEYANG PHOTOELECTRIC SCIENCE & TECHNOLOGY Co.,Ltd. |