CN210800743U - Matrix type LED lamp source - Google Patents
Matrix type LED lamp source Download PDFInfo
- Publication number
- CN210800743U CN210800743U CN201921761322.2U CN201921761322U CN210800743U CN 210800743 U CN210800743 U CN 210800743U CN 201921761322 U CN201921761322 U CN 201921761322U CN 210800743 U CN210800743 U CN 210800743U
- Authority
- CN
- China
- Prior art keywords
- circuit
- light source
- heat sink
- power supply
- supply line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011159 matrix material Substances 0.000 title claims abstract description 25
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000010931 gold Substances 0.000 claims abstract description 10
- 229910052737 gold Inorganic materials 0.000 claims abstract description 10
- 238000009434 installation Methods 0.000 claims description 18
- 230000001174 ascending effect Effects 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000005253 cladding Methods 0.000 abstract 1
- 239000003292 glue Substances 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000009413 insulation Methods 0.000 description 6
- 238000005286 illumination Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
Images
Abstract
The utility model provides a matrix LED lamp source, including circuit board and LED chip, circuit five gold plates are equipped with first power supply line and second power supply line, first power supply line and second power supply line are located the both sides on the width direction of circuit five gold plates respectively, be equipped with a plurality of light source installing zones that are MXN matrix arrangement between first power supply line and the second power supply line, the periphery of every light source installing zone is connected with closed loop circuit, be equipped with the pre-breaking district on the closed loop circuit, closed loop circuit forms the cluster parallel circuit who is used for connecting each light source installing zone after the disconnection of pre-breaking district, insulating support cladding is on circuit five gold plates, insulating support forms the lamp cup in light source installing zone, be equipped with two pins that expose in the lamp cup on the light source installing zone, the pin is connected with closed loop circuit, the LED chip pastes the front of dress at the pin, the lamp cup intussuseption is filled with the fluorescent glue. From this, adopt the utility model has the advantages of need not printed circuit, pollute less and with low costs.
Description
Technical Field
The utility model relates to a lighting apparatus field especially relates to a matrix LED lamp source.
Background
The lamp is a device capable of transmitting light, distributing and changing light distribution of a light source, the lamp is used as a daily consumable, with the progress of the economic society of China, the appearance of novel light sources such as fluorescent lamps, energy-saving lamps and LED lamps makes the lamp strive towards more energy-saving, more green and environment-friendly, wherein the LED lamp has the characteristics of energy conservation, low carbon, long service life, good color rendering property, high response speed, pure light emitting color and the like, and is widely applied to various illumination places such as indoor illumination, outdoor illumination, portable illumination and the like Drilling, dry film pasting, alignment, exposure, development, etching, demoulding, surface treatment, covering film pasting, pressing, curing, surface treatment, nickel gold immersion, character printing, shearing, electrical measurement, punching and other processes, and has the advantages of multiple manufacturing steps, complex production flow and high cost.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a need not printed circuit, pollute less and with low costs matrix LED lamp source is provided.
In order to solve the above technical problem, the utility model provides a matrix type LED lamp source, it includes circuit board and LED chip, the circuit board includes circuit five gold plate and insulating support, circuit five gold plate is equipped with first power supply line and second power supply line, first power supply line with the second power supply line is parallel to each other and is located respectively the width direction's of circuit five gold plate both sides, be equipped with a plurality of light source installation areas between first power supply line and the second power supply line, a plurality of the light source installation area is M N matrix arrangement, M is greater than or equal to 2, N is greater than or equal to 2, the periphery of every light source installation area is connected with closed loop circuit, be equipped with the pre-breaking area on the closed loop circuit, closed loop circuit forms the series-parallel circuit who is used for connecting each the light source installation area after the pre-breaking area breaks, the circuit hardware board comprises a circuit hardware board, an insulating support, a light source installation area, a closed-loop circuit, an LED chip and a light cup, wherein the circuit hardware board is arranged on the circuit hardware board, the insulating support is coated on the circuit hardware board, the insulating support forms a concave light cup in the light source installation area, two pins exposed out of the light cup are arranged on the light source installation area, the pins are connected with the closed-loop circuit, the LED chip is attached to the front faces of the pins.
As the utility model discloses preferred scheme, insulating support integrative injection moulding on the basis of five golden plates on the circuit.
As a preferred aspect of the present invention, the light source mounting region includes a first heat dissipation portion and a second heat dissipation portion, the first heat dissipation portion is separated from the second heat dissipation portion, and the first heat dissipation portion is connected with the heat conduction bridge between the second heat dissipation portion.
As a preferred aspect of the present invention, the pins are located between the first heat sink and the second heat sink, and are not in contact with each other with the first heat sink, the second heat sink, and the heat conduction bridge.
As the preferred scheme of the utility model, the front of heat conduction bridge expose in the lamp cup.
As the utility model discloses preferred scheme, first heat dissipation part with the second heat dissipation part all outstanding in the plane at circuit hardware board place.
As a preferred embodiment of the present invention, the back surface of the first heat sink portion and the back surface of the second heat sink portion are exposed to the insulating support.
As the preferred scheme of the utility model, first power supply line with second power supply line expose in insulating support.
As the utility model discloses preferred scheme, insulating support corresponds first power supply line's position is equipped with first power connection hole, insulating support corresponds second power supply line's position is equipped with second power connection hole.
Implement the utility model discloses a matrix LED lamp source compares with prior art, has following beneficial effect:
1. the circuit board of the utility model adopts integral punch forming to replace the traditional printing production of the circuit board, the integral circuit layout is accurate and stable, the production process is less, the printed circuit is not needed, the waste material is easy to be recovered, the environmental pollution is less, the production automation or semi-automation is easy to be realized, the production efficiency is improved, the labor intensity of workers is reduced, and the cost is saved; moreover, the light source mounting areas are arranged in an M multiplied by N matrix, so that the realization of modular production is facilitated;
2. because there are more pre-breaking areas on the closed-loop circuit between the light source installing areas, the surface insulation support of the circuit hardware board can ensure that the pre-breaking areas are not easy to loosen between the light source installing areas after being broken, the structure is more stable, and meanwhile, the circuit can be hidden in the insulation support, so that the insulation protection effect is achieved, and the circuit is more stable.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings of the embodiments will be briefly described below.
Fig. 1 is a structural diagram of a matrix LED lamp source provided by the present invention;
fig. 2 is a cross-sectional view of a matrix LED lamp source provided by the present invention;
FIG. 3 is a front view of a circuit hardware board;
FIG. 4 is a schematic diagram of the pre-cut region of the circuit hardware board before it is cut;
FIG. 5 is a schematic diagram of the structure of the circuit hardware board after the pre-breaking region is broken;
the labels in the figure are: the LED lamp comprises a circuit hardware board 1, a first power circuit 2, a second power circuit 3, a light source installation area 4, a closed loop circuit 5, a pre-breaking area 6, a first heat dissipation part 7, a second heat dissipation part 8, a heat conduction bridge 9, pins 10, an insulating support 11, a lamp cup 12 and an LED chip 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1 to 5, the present invention provides a preferred embodiment of a matrix LED lamp source, which includes a circuit board and an LED chip 13, wherein the circuit board includes a circuit hardware board 1 and an insulating support 11, the circuit hardware board 1 is provided with a first power circuit 2 and a second power circuit 3, the first power circuit 2 and the second power circuit 3 are parallel to each other and are respectively located at two sides of the circuit hardware board 1 in a width direction, a plurality of light source installation areas 4 are provided between the first power circuit 2 and the second power circuit 3, the plurality of light source installation areas 4 are arranged in an M × N matrix, M is greater than or equal to 2, N is greater than or equal to 2, a closed loop circuit 5 is connected to an outer periphery of each light source installation area 4, a pre-cut area 6 is provided on the closed loop circuit 5, the closed loop circuit 5 forms a series-parallel circuit for connecting each light source installation area 4 after the pre-cut area 6 is cut, the circuit hardware board comprises a circuit hardware board 1, an insulating support 11, a light source installation area 4 and a lamp cup 12, wherein the circuit hardware board 1 is provided with a stamping hole formed after the circuit hardware board 1 is stamped, the insulating support 11 is coated on the circuit hardware board 1, namely the insulating support 11 is coated on the surface of the circuit hardware board 1 body and the stamping hole formed after the circuit hardware board 1 is stamped, the insulating support 11 is arranged in the light source installation area 4 to form the concave lamp cup 12, the light source installation area 4 is provided with two pins 10 exposed in the lamp cup 12, the pins 10 are connected with a closed-loop circuit 5, the pins of an LED chip 13 are welded on the.
Therefore, the circuit board of the utility model adopts integral punch forming to replace the traditional printing production of the circuit board, the integral circuit layout is accurate and stable, the production process is less, no printed circuit is needed, the waste material is easy to recover, the environmental pollution is less, the production automation or semi-automation is easy to realize, the production efficiency is improved, the labor intensity of workers is reduced, and the cost is saved; moreover, the light source mounting areas are arranged in an M multiplied by N matrix, so that the realization of modular production is facilitated; in addition, because there are more pre-breaking areas 6 on the closed-loop circuit between the light source installing areas, at the surface insulation support 11 of circuit hardware board 1, can guarantee that pre-breaking areas 6 are difficult to loose between the light source installing areas 4 after being broken off, and the structure is more firm, simultaneously because can hide the circuit in insulation support 11, play the insulation protection effect, the circuit is more stable.
Illustratively, the insulating support 11 is integrally formed on the basis of the circuit hardware board 1 by injection molding, and is convenient to process.
Exemplarily, the light source mounting region 4 includes a first heat sink portion 7 and a second heat sink portion 8, the first heat sink portion 7 and the second heat sink portion 8 are separated from each other, a heat conduction bridge 9 is connected between the first heat sink portion 7 and the second heat sink portion 8, the heat conduction bridge 9 provides a space for mounting the LED chip 13, and simultaneously, heat generated by the LED chip 13 during operation can be transferred to the heat sink portions on both sides, so as to achieve a better heat dissipation purpose.
For example, in order to better realize the connection of the LED chip 13, the pins 10 are located between the first heat sink member 7 and the second heat sink member 8, and are not in contact with the first heat sink member 7, the second heat sink member 8, and the heat conductive bridge 9.
Illustratively, the front surface of the heat conducting bridge 9 is exposed in the lamp cup 12, that is, the insulating support 11 is not coated on the front surface of the heat conducting bridge 9, so as to facilitate mounting the LED chip 13, and the LED chip 13 is in direct contact with the heat conducting bridge 9, so that heat generated by the LED chip 13 during operation can be transferred to the heat conducting bridge 9, thereby accelerating heat dissipation.
Exemplarily, the first heat dissipation part 7 and the second heat dissipation part 8 protrude out of the plane where the circuit hardware board 1 is located, so that the plane where the first heat dissipation part 7 and the second heat dissipation part 8 are located and the plane where the lamp bead is located are staggered, the short circuit phenomenon caused by interference with a circuit is avoided, and the back surface of the first heat dissipation part 7 and the back surface of the second heat dissipation part 8 are located on the same plane as the back surface of the insulating support 11, so that the smoothness of a product is improved, and subsequent assembly is facilitated.
For example, the back surface of the first heat sink member 7 and the back surface of the second heat sink member 8 are both exposed out of the insulating support 11, that is, the insulating support 11 is not coated on the back surface of the first heat sink member 7 and the back surface of the second heat sink member 8, a part of the front surface of the first heat sink member 7 and a part of the front surface of the second heat sink member 8 are exposed out of the insulating support 11, that is, the insulating support 11 is not coated on a part of the front surface of the first heat sink member 7 and a part of the front surface of the second heat sink member 8, so that the back surface and a part of the front surface of the first heat sink member 7 and the back surface and a part of the front surface of the second heat sink member 8 are exposed to the air, thereby further accelerating heat.
Illustratively, the first power circuit 2 and the second power circuit 3 are exposed out of the insulating bracket 11, so as to facilitate external power supply.
Illustratively, a first power supply connecting hole is formed in a position, corresponding to the first power supply circuit 2, of the insulating support 11, and a second power supply connecting hole is formed in a position, corresponding to the second power supply circuit 3, of the insulating support 11, so that the power supply connecting holes can be matched and connected with a conversion connector, and the power supply circuit is led out and is externally connected with a power supply.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, therefore, the invention is not limited thereto.
Claims (9)
1. The utility model provides a matrix LED lamp source, its characterized in that, includes circuit board and LED chip, the circuit board includes circuit five gold plates and insulating support, circuit five gold plates is by the whole stamping forming of conductive metal slab band, circuit five gold plates are equipped with first power supply line and second power supply line, first power supply line with second power supply line is parallel to each other and is located respectively the ascending both sides of width direction of circuit five gold plates, first power supply line with be equipped with a plurality of light source installing zones between the second power supply line, it is a plurality of the light source installing zone is MXN matrix arrangement, M is greater than or equals 2, and N is greater than or equal to 2, every the periphery of light source installing zone is connected with closed loop circuit, be equipped with the pre-breaking district on the closed loop circuit, closed loop circuit is in form the series parallel circuit who is used for connecting each after the pre-breaking district breaks off the light source installing zone, the circuit hardware board comprises a circuit hardware board, an insulating support, a light source installation area, a closed-loop circuit, an LED chip and a light cup, wherein the circuit hardware board is arranged on the circuit hardware board, the insulating support is coated on the circuit hardware board, the insulating support forms a concave light cup in the light source installation area, two pins exposed out of the light cup are arranged on the light source installation area, the pins are connected with the closed-loop circuit, the LED chip is attached to the front faces of the pins.
2. The matrix LED light source of claim 1 wherein said dielectric support is injection molded integrally on the basis of a circuit hardware board.
3. The matrix LED light source of claim 1 wherein said light source mounting region comprises a first heat sink portion and a second heat sink portion, said first heat sink portion and said second heat sink portion being spaced apart, a thermally conductive bridge being connected between said first heat sink portion and said second heat sink portion.
4. The matrix LED light source of claim 3 wherein said pins are located between said first heat sink portion and said second heat sink portion and are not in contact with said first heat sink portion, said second heat sink portion and said thermal bridge.
5. A matrix LED light source in accordance with claim 3 in which the front face of said thermal bridge is exposed to said cup.
6. The matrix LED light source of claim 3 wherein said first heat sink portion and said second heat sink portion each protrude above the plane of said circuit hardware board.
7. The matrix LED light source of claim 3 wherein a back surface of said first heat sink portion and a back surface of said second heat sink portion are exposed to said insulating support.
8. A matrix LED light source in accordance with claim 1 in which said first power supply line and said second power supply line are exposed to said insulative support.
9. The matrix LED light source of claim 8 wherein said insulative support has a first power connection hole at a location corresponding to said first power line and a second power connection hole at a location corresponding to said second power line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921761322.2U CN210800743U (en) | 2019-10-18 | 2019-10-18 | Matrix type LED lamp source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921761322.2U CN210800743U (en) | 2019-10-18 | 2019-10-18 | Matrix type LED lamp source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210800743U true CN210800743U (en) | 2020-06-19 |
Family
ID=71240693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921761322.2U Expired - Fee Related CN210800743U (en) | 2019-10-18 | 2019-10-18 | Matrix type LED lamp source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210800743U (en) |
-
2019
- 2019-10-18 CN CN201921761322.2U patent/CN210800743U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201130 Address after: Shop 108, 121 Changxing Road, Tianhe District, Guangzhou City, Guangdong Province Patentee after: South China Semiconductor (Guangdong) Co.,Ltd. Address before: 528400, No. thirteen, Lane 5, dragon First Street, Cao two town, Guzhen Town, Guangdong, Zhongshan Patentee before: Wu Shaojian |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200619 |