CN110645487A - Matrix type LED lamp source - Google Patents

Matrix type LED lamp source Download PDF

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Publication number
CN110645487A
CN110645487A CN201910994953.7A CN201910994953A CN110645487A CN 110645487 A CN110645487 A CN 110645487A CN 201910994953 A CN201910994953 A CN 201910994953A CN 110645487 A CN110645487 A CN 110645487A
Authority
CN
China
Prior art keywords
circuit
light source
heat sink
power supply
sink portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910994953.7A
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Chinese (zh)
Inventor
吴少健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
South China Semiconductor (Guangdong) Co., Ltd
Original Assignee
吴少健
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 吴少健 filed Critical 吴少健
Priority to CN201910994953.7A priority Critical patent/CN110645487A/en
Publication of CN110645487A publication Critical patent/CN110645487A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The invention provides a matrix type LED lamp source which comprises a circuit board and an LED chip, wherein a circuit hardware board is provided with a first power supply circuit and a second power supply circuit, the first power supply circuit and the second power supply circuit are respectively positioned on two sides of the width direction of the circuit hardware board, a plurality of light source installation areas arranged in an M multiplied by N matrix are arranged between the first power supply circuit and the second power supply circuit, the periphery of each light source installation area is connected with a closed loop circuit, a pre-breaking area is arranged on the closed loop circuit, the closed loop circuit forms a series-parallel circuit for connecting each light source installation area after being broken in the pre-breaking area, an insulating bracket covers the circuit hardware board, the insulating bracket forms a lamp cup in the light source installation areas, two pins exposed in the lamp cup are arranged on the light source installation areas, the pins are connected with the closed loop circuit, the LED chip is attached to the front side of the pins, and the lamp cup is filled with fluorescent glue. Therefore, the invention has the advantages of no need of printed circuit, less pollution and low cost.

Description

Matrix type LED lamp source
Technical Field
The invention relates to the field of lighting equipment, in particular to a matrix type LED lamp source.
Background
The lamp is a device capable of transmitting light, distributing and changing light distribution of a light source, the lamp is used as a daily consumable, with the progress of the economic society of China, the appearance of novel light sources such as fluorescent lamps, energy-saving lamps and LED lamps makes the lamp strive towards more energy-saving, more green and environment-friendly, wherein the LED lamp has the characteristics of energy conservation, low carbon, long service life, good color rendering property, high response speed, pure light emitting color and the like, and is widely applied to various illumination places such as indoor illumination, outdoor illumination, portable illumination and the like Drilling, dry film pasting, alignment, exposure, development, etching, demoulding, surface treatment, covering film pasting, pressing, curing, surface treatment, nickel gold immersion, character printing, shearing, electrical measurement, punching and other processes, and has the advantages of multiple manufacturing steps, complex production flow and high cost.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a matrix type LED lamp source which does not need a printed circuit, has less pollution and low cost.
In order to solve the technical problem, the matrix type LED lamp source provided by the present invention comprises a circuit board and an LED chip, wherein the circuit board comprises a circuit hardware board and an insulating support, the circuit hardware board is provided with a first power circuit and a second power circuit, the first power circuit and the second power circuit are parallel to each other and are respectively located on two sides of the circuit hardware board in the width direction, a plurality of light source installation areas are arranged between the first power circuit and the second power circuit, the plurality of light source installation areas are arranged in an mxn matrix, M is greater than or equal to 2, N is greater than or equal to 2, the periphery of each light source installation area is connected with a closed loop circuit, a pre-disconnection area is arranged on the closed loop circuit, and the closed loop circuit forms a series-parallel circuit for connecting each light source installation area after the pre-disconnection area is disconnected, the circuit hardware board comprises a circuit hardware board, an insulating support, a light source installation area, a closed-loop circuit, an LED chip and a light cup, wherein the circuit hardware board is arranged on the circuit hardware board, the insulating support is coated on the circuit hardware board, the insulating support forms a concave light cup in the light source installation area, two pins exposed out of the light cup are arranged on the light source installation area, the pins are connected with the closed-loop circuit, the LED chip is attached to the front faces of the pins.
As a preferable scheme of the present invention, the insulating support is integrally injection-molded on the basis of the circuit hardware board.
In a preferred aspect of the present invention, the light source mounting region includes a first heat sink member and a second heat sink member, the first heat sink member and the second heat sink member are separated from each other, and a heat conductive bridge is connected between the first heat sink member and the second heat sink member.
In a preferred embodiment of the present invention, the pins are located between the first heat sink member and the second heat sink member, and do not contact with the first heat sink member, the second heat sink member, and the heat conductive bridge.
In a preferred embodiment of the present invention, the front surface of the heat conducting bridge is exposed to the lamp cup.
In a preferred embodiment of the present invention, the first heat sink member and the second heat sink member are both protruded from a plane in which the circuit hardware board is located.
In a preferred embodiment of the present invention, both the back surface of the first heat sink member and the back surface of the second heat sink member are exposed to the insulating support.
As a preferable aspect of the present invention, the first power supply line and the second power supply line are exposed to the insulating support.
As a preferred aspect of the present invention, a first power connection hole is formed in a position of the insulating support corresponding to the first power line, and a second power connection hole is formed in a position of the insulating support corresponding to the second power line.
Compared with the prior art, the matrix type LED lamp source has the following beneficial effects:
1. the circuit board of the invention adopts integral punch forming to replace the traditional printing production of the circuit board, the integral circuit layout is accurate and stable, the production process is less, the printed circuit is not needed, the waste material is easy to recycle, the environmental pollution is less, the automation or semi-automation of the production is easy to realize, the production efficiency is improved, the labor intensity of workers is reduced, and the cost is saved; moreover, the light source mounting areas are arranged in an M multiplied by N matrix, so that the realization of modular production is facilitated; 2. because there are more pre-breaking areas on the closed-loop circuit between the light source installing areas, the surface insulation support of the circuit hardware board can ensure that the pre-breaking areas are not easy to loosen between the light source installing areas after being broken, the structure is more stable, and meanwhile, the circuit can be hidden in the insulation support, so that the insulation protection effect is achieved, and the circuit is more stable.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly described below.
FIG. 1 is a structural diagram of a matrix LED lamp source provided by the present invention;
FIG. 2 is a cross-sectional view of a matrix LED light source provided by the present invention;
FIG. 3 is a front view of a circuit hardware board;
FIG. 4 is a schematic diagram of the pre-cut region of the circuit hardware board before it is cut;
FIG. 5 is a schematic diagram of the structure of the circuit hardware board after the pre-breaking region is broken;
the labels in the figure are: the LED lamp comprises a circuit hardware board 1, a first power circuit 2, a second power circuit 3, a light source installation area 4, a closed loop circuit 5, a pre-breaking area 6, a first heat dissipation part 7, a second heat dissipation part 8, a heat conduction bridge 9, pins 10, an insulating support 11, a lamp cup 12 and an LED chip 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 5, a preferred embodiment of a matrix LED lamp source provided by the present invention includes a circuit board and an LED chip 13, the circuit board includes a circuit hardware board 1 and an insulating support 11, the circuit hardware board 1 is provided with a first power circuit 2 and a second power circuit 3, the first power circuit 2 and the second power circuit 3 are parallel to each other and are respectively located at two sides of the circuit hardware board 1 in a width direction, a plurality of light source installation areas 4 are provided between the first power circuit 2 and the second power circuit 3, the plurality of light source installation areas 4 are arranged in an M × N matrix, M is greater than or equal to 2, N is greater than or equal to 2, a closed loop circuit 5 is connected to an outer periphery of each light source installation area 4, a pre-breaking area 6 is provided on the closed loop circuit 5, the closed loop circuit 5 forms a series-parallel circuit for connecting each light source installation area 4 after the pre-breaking area 6 is broken, the circuit hardware board comprises a circuit hardware board 1, an insulating support 11, a light source installation area 4 and a lamp cup 12, wherein the circuit hardware board 1 is provided with a stamping hole formed after the circuit hardware board 1 is stamped, the insulating support 11 is coated on the circuit hardware board 1, namely the insulating support 11 is coated on the surface of the circuit hardware board 1 body and the stamping hole formed after the circuit hardware board 1 is stamped, the insulating support 11 is arranged in the light source installation area 4 to form the concave lamp cup 12, the light source installation area 4 is provided with two pins 10 exposed in the lamp cup 12, the pins 10 are connected with a closed-loop circuit 5, the pins of an LED chip 13 are welded on the.
Therefore, the circuit board of the invention adopts integral punch forming to replace the traditional printing production of the circuit board, the integral circuit layout is accurate and stable, the production process is less, the printed circuit is not needed, the waste material is easy to recycle, the environmental pollution is less, the automation or semi-automation of the production is easy to realize, the production efficiency is improved, the labor intensity of workers is reduced, and the cost is saved; moreover, the light source mounting areas are arranged in an M multiplied by N matrix, so that the realization of modular production is facilitated; in addition, because there are more pre-breaking areas 6 on the closed-loop circuit between the light source installing areas, at the surface insulation support 11 of circuit hardware board 1, can guarantee that pre-breaking areas 6 are difficult to loose between the light source installing areas 4 after being broken off, and the structure is more firm, simultaneously because can hide the circuit in insulation support 11, play the insulation protection effect, the circuit is more stable.
Illustratively, the insulating support 11 is integrally formed on the basis of the circuit hardware board 1 by injection molding, and is convenient to process.
Exemplarily, the light source mounting region 4 includes a first heat sink portion 7 and a second heat sink portion 8, the first heat sink portion 7 and the second heat sink portion 8 are separated from each other, a heat conduction bridge 9 is connected between the first heat sink portion 7 and the second heat sink portion 8, the heat conduction bridge 9 provides a space for mounting the LED chip 13, and simultaneously, heat generated by the LED chip 13 during operation can be transferred to the heat sink portions on both sides, so as to achieve a better heat dissipation purpose.
Illustratively, the pins 10 are located between the first heat sink member 7 and the second heat sink member 8, and are not in contact with the first heat sink member 7, the second heat sink member 8 and the heat conductive bridge 9, further, in order to better realize the connection of the LED chip 13.
Illustratively, the front surface of the heat conducting bridge 9 is exposed in the lamp cup 12, that is, the insulating support 11 is not coated on the front surface of the heat conducting bridge 9, so as to facilitate mounting the LED chip 13, and the LED chip 13 is in direct contact with the heat conducting bridge 9, so that heat generated by the LED chip 13 during operation can be transferred to the heat conducting bridge 9, thereby accelerating heat dissipation.
Exemplarily, the first heat dissipation part 7 and the second heat dissipation part 8 protrude out of the plane where the circuit hardware board 1 is located, so that the plane where the first heat dissipation part 7 and the second heat dissipation part 8 are located and the plane where the lamp bead is located are staggered, the short circuit phenomenon caused by interference with a circuit is avoided, and the back surface of the first heat dissipation part 7 and the back surface of the second heat dissipation part 8 are located on the same plane as the back surface of the insulating support 11, so that the smoothness of a product is improved, and subsequent assembly is facilitated.
For example, the back surface of the first heat sink member 7 and the back surface of the second heat sink member 8 are both exposed out of the insulating support 11, that is, the insulating support 11 is not coated on the back surface of the first heat sink member 7 and the back surface of the second heat sink member 8, a part of the front surface of the first heat sink member 7 and a part of the front surface of the second heat sink member 8 are exposed out of the insulating support 11, that is, the insulating support 11 is not coated on a part of the front surface of the first heat sink member 7 and a part of the front surface of the second heat sink member 8, so that the back surface and a part of the front surface of the first heat sink member 7 and the back surface and a part of the front surface of the second heat sink member 8 are exposed to the air, thereby further accelerating heat.
Illustratively, the first power circuit 2 and the second power circuit 3 are exposed out of the insulating bracket 11, so as to facilitate external power supply.
Illustratively, a first power supply connecting hole is formed in a position, corresponding to the first power supply circuit 2, of the insulating support 11, and a second power supply connecting hole is formed in a position, corresponding to the second power supply circuit 3, of the insulating support 11, so that the power supply connecting holes can be matched and connected with a conversion connector, and the power supply circuit is led out and is externally connected with a power supply.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention, and it is therefore to be understood that the invention is not limited by the scope of the appended claims.

Claims (9)

1. The utility model provides a matrix LED lamp source, its characterized in that, includes circuit board and LED chip, the circuit board includes circuit five gold plates and insulating support, circuit five gold plates is by the whole stamping forming of conductive metal slab band, circuit five gold plates are equipped with first power supply line and second power supply line, first power supply line with second power supply line is parallel to each other and is located respectively the ascending both sides of width direction of circuit five gold plates, first power supply line with be equipped with a plurality of light source installing zones between the second power supply line, it is a plurality of the light source installing zone is MXN matrix arrangement, M is greater than or equals 2, and N is greater than or equal to 2, every the periphery of light source installing zone is connected with closed loop circuit, be equipped with the pre-breaking district on the closed loop circuit, closed loop circuit is in form the series parallel circuit who is used for connecting each after the pre-breaking district breaks off the light source installing zone, the circuit hardware board comprises a circuit hardware board, an insulating support, a light source installation area, a closed-loop circuit, an LED chip and a light cup, wherein the circuit hardware board is arranged on the circuit hardware board, the insulating support is coated on the circuit hardware board, the insulating support forms a concave light cup in the light source installation area, two pins exposed out of the light cup are arranged on the light source installation area, the pins are connected with the closed-loop circuit, the LED chip is attached to the front faces of the pins.
2. The matrix LED circuit board of claim 1, wherein said insulating support is injection molded on the basis of a circuit hardware board.
3. The matrix LED light source of claim 1 wherein said light source mounting region comprises a first heat sink portion and a second heat sink portion, said first heat sink portion and said second heat sink portion being spaced apart, a thermally conductive bridge being connected between said first heat sink portion and said second heat sink portion.
4. The matrix LED light source of claim 3 wherein said pins are located between said first heat sink portion and said second heat sink portion and are not in contact with said first heat sink portion, said second heat sink portion and said thermal bridge.
5. A matrix LED light source in accordance with claim 3 in which the front face of said thermal bridge is exposed to said cup.
6. The matrix LED light source of claim 3 wherein said first heat sink portion and said second heat sink portion each protrude above the plane of said circuit hardware board.
7. The matrix LED light source of claim 3 wherein a back surface of said first heat sink portion and a back surface of said second heat sink portion are exposed to said insulating support.
8. A matrix LED light source in accordance with claim 1 in which said first power supply line and said second power supply line are exposed to said insulative support.
9. The matrix LED light source of claim 9 wherein said insulative support has a first power connection hole at a location corresponding to said first power line and a second power connection hole at a location corresponding to said second power line.
CN201910994953.7A 2019-10-18 2019-10-18 Matrix type LED lamp source Pending CN110645487A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910994953.7A CN110645487A (en) 2019-10-18 2019-10-18 Matrix type LED lamp source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910994953.7A CN110645487A (en) 2019-10-18 2019-10-18 Matrix type LED lamp source

Publications (1)

Publication Number Publication Date
CN110645487A true CN110645487A (en) 2020-01-03

Family

ID=68994397

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910994953.7A Pending CN110645487A (en) 2019-10-18 2019-10-18 Matrix type LED lamp source

Country Status (1)

Country Link
CN (1) CN110645487A (en)

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TA01 Transfer of patent application right

Effective date of registration: 20210104

Address after: Shop 108, 121 Changxing Road, Tianhe District, Guangzhou City, Guangdong Province

Applicant after: South China Semiconductor (Guangdong) Co., Ltd

Address before: No. 5, No. 13 lane, No. 1 Street, Cao Er Shou, Guzhen Town, Zhongshan City, Guangdong Province, 528400

Applicant before: Wu Shaojian

TA01 Transfer of patent application right