CN210778516U - Wafer bearing device in wet process - Google Patents

Abstract

The utility model discloses a wafer among wet process technology bears device belongs to the semiconductor manufacturing field, because of bearing the device and only can the monolithic handle the wafer, shelter from the problem of increase man-hour, extravagant material, reduction product yield that the part is big, the device is complicated or bulky defect such as lead to when wafer washs in solving traditional wet process technology. The wafer bearing device comprises two side plates, a plurality of connecting rods and a cross-shaped bottom plate, wherein the two side plates are arranged in parallel, a plurality of side plate clamping grooves are symmetrically distributed on the inner side of each side plate, the two side plates are connected through the connecting rods and the cross-shaped bottom plate, and a plurality of bottom plate clamping openings are correspondingly distributed in the cross-shaped bottom plate parallel to the side plates; the supporting handle is vertically fixed in the center of the cross-shaped bottom plate, and the height of the supporting handle is higher than that of the side plate. The utility model discloses simple structure, convenient to use to can wash the multi-disc wafer simultaneously, effectively reduce the situation that wet process in-process wafer was sheltered from by the bearing device.

Description

Wafer bearing device in wet process

Technical Field

The utility model relates to a semiconductor manufacturing field, concretely relates to wafer among wet process technology bears device.

Background

In the information age, chips have been widely used in various electronic products and systems such as computers, mobile phones, automobiles, high-speed rails, power grids, medical instruments, robots, industrial control and the like, and are core cornerstones in high-end manufacturing industries. The manufacturing process of the chip can be roughly divided into key steps of chip design, epitaxial growth, wafer processing, test packaging and the like. In the wafer processing process, the basic steps are to clean the wafer properly, then to perform oxidation and chemical vapor deposition on the wafer surface, and then to perform the repeated steps of coating, exposure, development, wet etching, metal sputtering, etc. In the above wet process steps, the wafer needs to be placed in a suitable carrier for cleaning, etching, and other processes. Therefore, it is important to select a proper wafer wet cleaning carrying device.

Most of the traditional wafer wet cleaning bearing devices are single, some bearing devices can only carry out single-chip operation, some bearing devices can influence the uniformity of wet corrosion or influence the cleaning degree of a cleaning process because a shielding part is too large or a wafer clamping groove is too large, and even some bearing devices influence the actual operation because the bearing devices are too complex or huge because the wafer bearing devices are too conscious of the functions of the devices. However, when mass production is performed, the single piece processing and shielding are too much, the load-bearing device is complex or the volume is too large, which increases working hours, wastes materials and reduces the yield of products. Therefore, there is a need to improve the wafer cleaning and supporting apparatus in the wet process to improve the efficiency and yield of the wet process.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem solve traditional wet process in the wafer bear the device because of can only the monolithic handle the wafer, shelter from the part big, bear the device complicacy or the problem that the increase man-hour that the too big defect of volume leads to, extravagant material, reduction product yield.

In order to solve the technical problem, the utility model provides a technical scheme does: the utility model provides a wafer among wet process technology bears device, includes two curb plates, a plurality of connecting rods and cross bottom plate, two curb plate parallel arrangement, a plurality of curb plate draw-in grooves of the equal symmetry arrangement in inboard of every curb plate, two curb plates pass through a plurality of connecting rods and the connection of cross bottom plate, correspond in the cross bottom plate with the parallel part of curb plate and arrange a plurality of bottom plate bayonets.

Furthermore, the support handle is also included and is vertically fixed at the center of the cross-shaped bottom plate.

Further, the height of the supporting handle is higher than that of the side plate.

Further, the support handle is a cylinder.

Further, two curb plates are the cuboid and connect through four connecting rods.

Furthermore, the cross-shaped bottom plate is connected with the connecting rod through a buckle.

Further, the connecting rod is a cylinder, and the cross section of the connecting rod is circular or polygonal.

Further, the materials of the side plates, the connecting rods and the cross-shaped bottom plate are PFA.

The utility model has the advantages that: the utility model has the advantages that the plurality of side plate clamping grooves which are symmetrically arranged and the corresponding bottom plate clamping openings are mutually matched, so that a plurality of wafers are clamped, a plurality of wafers can be simultaneously cleaned, the structure is simple, the use is convenient, and the wafer cleaning efficiency can be greatly improved; the two side plates are connected through the connecting rod instead of a whole plate, the bottom plate is in a cross shape, and the problem that the surface of the wafer is not uniformly cleaned due to the fact that the wafer is too much shielded by the bearing device in the wet process is solved to a great extent.

Further, the supporting handle is vertically fixed in the center of the cross-shaped bottom plate and higher than the side plates, and the influence of the speed generated by rotation or shaking in the wet process can be relieved to the greatest extent by arranging the central supporting handle.

Furthermore, the cross-shaped bottom plate is connected with the connecting rod through the buckles, so that the stability of the bottom plate is enhanced, the wafer can be clamped better, and the product yield of the wafer is improved.

Furthermore, PFA is selected as the material of the side plates, the connecting rods and the cross-shaped bottom plate, and the material has good chemical corrosion resistance, high temperature resistance, oxidation resistance, weather resistance and strong ray radiation resistance; the wafer protection device has the advantages of high rigidity and strength, accurate overall dimension and strict product weight, is not deformed after long-term use, does not pollute cleaning fluid, has a smooth and burr-free surface, and can better protect wafers.

Drawings

Fig. 1 is a schematic structural diagram of a wafer carrying device in a wet process according to the present invention.

In the figure: the novel connecting rod comprises a 1-side plate, a 2-connecting rod, a 3-cross-shaped bottom plate, a part perpendicular to the side plate in the 31-cross-shaped bottom plate, a part parallel to the side plate in the 32-cross-shaped bottom plate, a 4-supporting handle, a 5-screw, a 6-side plate clamping groove and a 7-bottom plate clamping opening.

Detailed Description

The embodiments and principles of the present invention will be further explained with reference to the accompanying drawings:

the utility model has the advantages that the plurality of side plate clamping grooves which are symmetrically arranged and the corresponding bottom plate clamping openings are mutually matched, so that a plurality of wafers are clamped, a plurality of wafers can be simultaneously cleaned, the structure is simple, the use is convenient, and the wafer cleaning efficiency can be greatly improved; the two side plates are connected through the connecting rod instead of a whole plate, the bottom plate is in a cross shape, and the problem that the surface of the wafer is not uniformly cleaned due to the fact that the wafer is excessively shielded by the bearing device in the wet process is solved to a great extent.

The utility model discloses a wafer among wet process technology bears device, as shown in figure 1, including two curb plates 1, a plurality of connecting rods 2 and cross bottom plate 3, two curb plate 1 parallel arrangement, a plurality of curb plate draw-in grooves 6 of having arranged of the equal symmetry of inboard of every curb plate 1, two curb plates 1 are connected through a plurality of connecting rods 2 and cross bottom plate, correspond a plurality of bottom plate bayonets 7 of having arranged with the parallel part 32 of curb plate in the cross bottom plate.

The number of curb plate draw-in groove and bottom plate bayonet socket can be confirmed according to actual conditions, can be 4, 6 or 8 and so on, and the number of curb plate draw-in groove is 8 totally in this embodiment to the inboard centre of curb plate is the benchmark symmetry and sets up, and corresponding bottom plate bayonet socket is 8, cooperatees with the curb plate draw-in groove, is used for cliping the abluent wafer of needs. Therefore, the wet process of 8 wafers can be simultaneously carried out, the structure is simple, the use is convenient, and the cleaning efficiency is high. Meanwhile, the two side plates are connected through the connecting rod, and the cross-shaped bottom plate both reduce the problem of uneven wafer surfaces caused by too much blocking of the wafer by the bearing device in the wet process to the greatest extent. The width of each side plate and 8 clamping grooves and bayonets which correspond to the bottom plate one by one is only slightly thicker than the thickness of the wafer, so that the problem that small-area corrosion is slow or cleaning is not in place due to blocking of the clamping grooves or the bayonets is solved. The cross-shaped bottom plate can be formed by hollowing out a large area to be a cross-shaped structure, wherein both ends of the part 31 vertical to the side plate and each side plate 1 in the cross-shaped bottom plate are provided with screw holes, and the side plate 1 and the cross-shaped bottom plate 3 can be connected in such a way.

Further, a supporting handle 4 is also included, as shown in fig. 1, the supporting handle 4 is vertically fixed at the center of the cross-shaped bottom plate 3, and the height of the supporting handle 4 is higher than that of the side plate 1. Besides the main function of the supporting handle for fixing the wafer cleaning bearing device, the top of the supporting handle can become an operation part of an operator, for example, in some wet processes, the operator can operate the top of the supporting handle to enable the wafer bearing device to rotate at a constant speed or slightly shake, so that the operation of the wafer bearing device is more convenient. The supporting handle 4 and the center of the cross-shaped bottom plate 3 can be connected through threads; the middle of the bottom plate can also be provided with 1 screw hole for fixing a supporting handle, so that the supporting handle 4 is connected with the center of the cross-shaped bottom plate 3. The support handle 4 is preferably a cylinder. The central supporting handle is arranged, so that the influence of the speed caused by rotation or shaking in the wet process can be relieved to the greatest extent.

Further, this load-bearing device includes four connecting rods 2, and the most commonly used rectangle can be selected for use to curb plate 1, and two curb plates pass through four connecting rods to be connected. As shown in fig. 1, the connection mode can be selected by using screws, for example, 4 screw holes are symmetrically arranged on the two side plates 1, and the connecting rod 2 is connected with the two side plates through the screws in the screw holes. The connecting rod is a cylinder, and the cross section of the connecting rod is circular or polygonal, preferably a cylinder. The cross-shaped bottom plate and the connecting rods can be connected through buckles, for example, the two ends of the part 32 parallel to the side plates in the cross-shaped bottom plate are respectively connected with the two connecting rods below in a buckle mode, and the stability of the cross-shaped bottom plate is further enhanced.

Furthermore, the side plates, the connecting rods and the cross-shaped bottom plate can be made of imported PFA materials which have good chemical corrosion resistance, high temperature resistance, oxidation resistance, weather resistance and strong ray radiation resistance; the high-strength stainless steel wire has the advantages of high rigidity, high strength, accurate overall dimension, strict product weight, no deformation after long-term use, no pollution to cleaning fluid, smooth surface and no burr, and can better protect wafers.

Taking the cleaning of the 2-inch wafer as an example, the wafer carrying device is that the size of the cleaning basket body is basically matched with that of the 2-inch wafer (slightly larger than the 2-inch wafer), the bayonets on the two sides and the bottom are the same in width, and the width is slightly thicker than the thickness of the 2-inch wafer, so that the wafer can be well clamped, and meanwhile, the part of the wafer blocked by the basket is reduced.

It will be understood by those skilled in the art that the foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

Claims (8)

1. The utility model provides a wafer among wet process technology bears device, its characterized in that, includes two curb plates, a plurality of connecting rods and cross bottom plate, two curb plate parallel arrangement, a plurality of curb plate draw-in grooves of the inboard equal symmetry of every curb plate having arranged, two curb plates pass through a plurality of connecting rods and the cross bottom plate is connected, in the cross bottom plate with the parallel part of curb plate corresponds a plurality of bottom plate bayonets of having arranged.

2. The wafer carrier device in a wet process according to claim 1, wherein: the supporting handle is vertically fixed in the center of the cross-shaped bottom plate.

3. The wafer carrier device in a wet process according to claim 2, wherein: the supporting handle is higher than the side plates.

4. The wafer carrier device in a wet process according to claim 2, wherein: the supporting handle is a cylinder.

5. The wafer carrier device in a wet process according to claim 1, wherein: two curb plates are the cuboid and connect through four connecting rods.

6. The wafer carrier device in a wet process according to claim 1, wherein: the cross-shaped bottom plate is connected with the connecting rod through a buckle.

7. The wafer carrier device in a wet process according to claim 1, wherein: the connecting rod is a cylinder, and the cross section of the connecting rod is circular or polygonal.

8. The wafer carrier device in a wet process according to any one of claims 1 to 7, wherein: the side plates, the connecting rods and the cross-shaped bottom plate are made of PFA.

Images