CN210778515U - Wafer wax pasting device - Google Patents
Wafer wax pasting device Download PDFInfo
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- CN210778515U CN210778515U CN201922304846.5U CN201922304846U CN210778515U CN 210778515 U CN210778515 U CN 210778515U CN 201922304846 U CN201922304846 U CN 201922304846U CN 210778515 U CN210778515 U CN 210778515U
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- wafer
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Abstract
The utility model provides a wafer wax sticking device, which comprises a pressing part, a connecting part and a handheld part, wherein one end of the connecting part is connected to the middle part of the pressing part, the other end of the connecting part is connected to the middle part of the handheld part, and the whole device is in an I-shaped structure; the pressing part is cylindrical. The device of the utility model can evenly apply pressure to the surface of the wafer under manual operation, simply and quickly obtain even wax-pasting surface, and effectively avoid the problem of wafer breakage caused by insecure wax-pasting or overlarge pressure; the device has simple structure and flexible and simple operation, can effectively improve the success rate of wax sticking on the wafer, and is particularly suitable for small-scale preparation of the wafer or emergency use when a machine fails.
Description
Technical Field
The utility model belongs to the technical field of the wafer is made, a wafer pastes wax device is related to.
Background
In the semiconductor production process, wax pasting on a wafer is an important process, and has an important influence on the chemical mechanical polishing and scribing processes of the wafer. The wafer wax pasting process mainly comprises three steps of heating before wax pasting, wax pasting on a wax sheet and wax dropping, wherein in the wafer wax pasting process, wax is firstly coated on a ceramic disc to be melted, then the wafer is pasted with the wax, and pressure cooling is carried out, so that the wafer wax pasting is realized.
The wafer wax pasting process is usually completed by a wax pasting machine, a pressurized cooling wax pasting mode is adopted, in the process, the wafer is placed on melted wax, bubbles are often generated, the larger the wafer size is, the more the bubbles are, the flatness is affected, the wax pasting is not firm, and the problems of wafer breakage and difficulty in flatness control are easily caused if the wafer is directly pressurized and cooled; in addition, a mode of pasting wax on an air bag is adopted, the air bag is arranged at the upper part of the wafer, the air bag slowly compacts the wafer under the action of the thrust of an air cylinder, but the air bag is hemispherical, firstly, the bottommost part of the air bag contacts the wafer firstly, and the stress of the central part of the wafer is the largest, so that the wafer is easy to break; after the wax is melted, when the air bag is pushed by the air cylinder pressure to compact the wafer, wax bubbles are easily caused by air around the wafer, and the bubbles are generated on the surface of the wafer in the process of compacting the wafer, so that the yield of the wafer wax sticking is influenced.
CN 110400771A discloses a method for sticking wax on a three-inch wafer, which comprises the steps of firstly placing a ceramic disc on a constant-temperature heating table, heating to a set temperature of 60 ℃, and then coating wax on the ceramic disc by using a wax rod; placing the wafer on a wax layer, heating to 80 ℃, pressing the wafer by dust-free paper rolls and moving the wafer in four directions of up, down, left and right; pressing the circle center position of the wafer by using a dust-free paper group and looping around the circle center by taking the circle center as a center point; repeating the pressing step until the diameter of the bubbles is less than 1 mm; and pumping residual bubbles by using a vacuumizing device, and then cooling and pressurizing by using a wax pasting machine to obtain wax pasting crystal balls. Although the patent can paste wax on a wafer with a larger size, the patent still adopts a pressure cooling mode, and has the problem of cracking caused by overlarge pressure.
CN 104332432A discloses a novel wax pasting device and a processing method thereof, the device comprises a rotatable ceramic disc, a movable flat rubber pad is arranged above the ceramic disc, a vacuum sealing ring is fixedly arranged below the flat rubber pad, a plurality of vacuum holes are arranged on the side edge of the vacuum sealing ring, the vacuum holes are connected with one end of a vacuum tube, the other end of the vacuum tube is connected with a vacuum pump, and a valve is also arranged on the vacuum tube; the device mainly removes bubbles through the mode of evacuation, but its required control operation is comparatively meticulous, and device and operating cost are higher, and liquid wax adheres to on the flat rubber pad easily moreover.
In summary, a simple device can be designed for small-batch use or emergency use for controlling the pressure and the uniformity of the wax layer in the process of sticking the wax on the wafer.
SUMMERY OF THE UTILITY MODEL
Problem to prior art existence, the utility model aims to provide a wafer pastes wax device, the device can evenly exert pressure to the wafer surface, simply obtains even wax face of pasting fast, device simple structure, the flexible operation is simple and convenient, can effectively improve the success rate that the wafer pasted the wax.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a wafer wax sticking device, which comprises a pressing part, a connecting part and a handheld part, wherein one end of the connecting part is connected to the middle part of the pressing part, the other end of the connecting part is connected to the middle part of the handheld part, and the whole device is in an I-shaped structure; the pressing part is cylindrical.
In the utility model, the device is mainly used in the process of the wafer waxing technology, and can evenly apply pressure to the wafer in multiple directions, so that the wax-sticking surface has even thickness and firm sticking; the main functional component is a pressing part which is cylindrical, the wafer surface is uniformly stressed in the rotating process, the handheld part is controlled by an operator, the pressure is conveniently and timely adjusted, the use is convenient, and the wafer pressing device is particularly suitable for small-scale preparation of wafers or emergency use during machine failure.
Following conduct the utility model discloses preferred technical scheme, nevertheless do not conduct the utility model provides a technical scheme's restriction, through following technical scheme, can reach and realize better the utility model discloses a technical purpose and beneficial effect.
The utility model discloses in, polyvinylidene fluoride (PVDF) can be selected to the material of device, especially the material of portion of exerting pressure, has advantages such as high temperature resistant, chemical corrosion resistance, mechanical strength height, creep resistance are good, slip nature and wear resistance are good.
As the utility model discloses preferred technical scheme, connecting portion all set up perpendicularly with splenium, handheld portion, splenium and handheld portion parallel arrangement apply.
The utility model discloses in, although connecting portion are connected to the ascending middle part in the axial of exerting pressure portion, its relation of connection does not influence the rotation of exerting pressure portion main part.
In a preferred embodiment of the present invention, the length of the pressing portion is 80 to 120mm, for example, 80mm, 85mm, 90mm, 95mm, 100mm, 105mm, 110mm, or 120mm, but the present invention is not limited to the above-mentioned values, and other values not listed in the above-mentioned value range are also applicable; the diameter is 15 to 25mm, for example 15mm, 16mm, 18mm, 20mm, 22mm, 24mm or 25mm, but is not limited to the recited values, and other values not recited in the range of the values are also applicable.
In a preferred embodiment of the present invention, the connecting portion has a cylindrical structure and a length of 40 to 60mm, for example, 40mm, 45mm, 50mm, 55mm, or 60mm, but the connecting portion is not limited to the above-mentioned values, and other values not shown in the above-mentioned range are also applicable.
In a preferred embodiment of the present invention, the connecting portion has a cylindrical shape and a cross-sectional diameter of 15 to 25mm, for example, 15mm, 16mm, 18mm, 20mm, 22mm, 24mm, or 25mm, but the connecting portion is not limited to the above-mentioned values, and other values not shown in the above-mentioned range of values are also applicable.
In a preferred embodiment of the present invention, the hand-held portion has a cylindrical shape and a length of 100 to 120mm, for example, 100mm, 105mm, 110mm, 115mm, or 120mm, but the present invention is not limited to the above-mentioned values, and other values not shown in the above-mentioned range are also applicable.
In a preferred embodiment of the present invention, the structure of the handle is a quadrangular prism or a cylinder, and the length of the cross section of the quadrangular prism or the diameter of the cylindrical cross section is 10 to 20mm, for example, 10mm, 2mm, 14mm, 16mm, 18mm, or 20mm, but the present invention is not limited to the above-mentioned values, and other values not listed in the above-mentioned range of values are also applicable.
As the utility model discloses preferred technical scheme, the device still includes warm table and ceramic dish, the ceramic dish is placed on the warm table, the wafer is placed on the ceramic dish.
As the preferred technical scheme of the utility model, the ceramic dish surface scribbles the wax layer.
As the preferred technical scheme of the utility model, after the wax layer melts, the splenium of exerting pressure contacts and exerts pressure with the wafer.
The utility model discloses in, wafer wax-pasting technology mainly includes following operation content:
fixing the ceramic disc coated with wax on a tray, placing the wafer at a given position in the ceramic disc, arranging a groove template in the ceramic disc, corresponding to the size of the wafer, placing the whole body on a heating table, setting the heating temperature to heat and melt the wax, then holding the device by hand, enabling a pressure application part to be in contact with the wafer, placing the wafer into the template groove, applying pressure in multiple directions, rotating back and forth in the pressure application process to enable the whole wafer surface to be stressed uniformly, extruding the redundant wax when the wafer and the template are at the same height, enabling the thickness of the wax on the wafer surface to be uniform, closing the heating table, cooling, and completing wax pasting on the wafer.
Compared with the prior art, the utility model discloses following beneficial effect has:
(1) the device of the utility model can evenly apply pressure to the surface of the wafer under manual operation, simply and quickly obtain even wax-pasting surface, and effectively avoid the problem of wafer breakage caused by insecure wax-pasting or overlarge pressure;
(2) device simple structure, the flexible operation is simple and convenient, can effectively improve the success rate that the wafer pasted the wax, emergency use when being particularly suitable for the small-scale preparation of wafer or machine trouble.
Drawings
Fig. 1 is a schematic structural diagram of a wafer waxing device according to embodiment 1 of the present invention;
wherein, 1-the pressing part, 2-the connecting part and 3-the handheld part.
Detailed Description
To better explain the technical solution of the present invention, it is convenient to understand the technical solution of the present invention, and the following is further detailed description of the present invention, but the following embodiments are only simple examples of the present invention, and do not represent or limit the protection scope of the present invention, and the protection scope of the present invention is subject to the claims.
The utility model discloses a specific embodiment part provides a wafer pastes wax device, the device includes the splenium 1, connecting portion 2 and handheld portion 3, the one end of connecting portion 2 is connected to the middle part of splenium 1, and the other end is connected to the middle part of handheld portion 3, the whole I-shaped structure that is of device; the pressing part 1 is cylindrical.
The following are typical but non-limiting examples of the present invention:
example 1:
the embodiment provides a wafer wax-pasting device, a structural schematic diagram of the device is shown in fig. 1, the device comprises a pressure part 1, a connecting part 2 and a handheld part 3, one end of the connecting part 2 is connected to the middle part of the pressure part 1, the other end of the connecting part is connected to the middle part of the handheld part 3, and the device is integrally in an i-shaped structure; the pressing part 1 is cylindrical.
The connecting part 2 is perpendicular to the pressing part 1 and the handheld part 3, and the pressing part 1 and the handheld part 3 are parallel.
The length of the pressure part 1 is 100mm, and the diameter is 20 mm.
The connecting part 2 is cylindrical in structure, the length of the connecting part is 50mm, and the diameter of the cross section of the connecting part is 20 mm.
The structure of the handheld part 3 is cylindrical, the length is 110mm, and the diameter of the cross section is 10 mm.
The materials of the pressing part 1, the connecting part 2 and the handheld part 3 are polyvinylidene fluoride.
The device further comprises a heating table and a ceramic disc, the ceramic disc is placed on the heating table, the wafer is placed on the ceramic disc, and a wax layer is coated on the surface of the ceramic disc.
After the wax layer is melted, the pressure applying part 1 is contacted with the wafer and applies pressure, so that the thickness of the wax layer on the surface of the wafer is uniform, and no bubble exists between the wafer and the ceramic disc.
Example 2:
the embodiment provides a wafer wax pasting device, which comprises a pressing part 1, a connecting part 2 and a handheld part 3, wherein one end of the connecting part 2 is connected to the middle part of the pressing part 1, the other end of the connecting part is connected to the middle part of the handheld part 3, and the device is integrally in an I-shaped structure; the pressing part 1 is cylindrical.
The connecting part 2 is perpendicular to the pressing part 1 and the handheld part 3, and the pressing part 1 and the handheld part 3 are parallel.
The length of the pressure part 1 is 120mm, and the diameter is 25 mm.
The connecting part 2 is of a quadrangular prism shape, the length of the connecting part is 60mm, and the side length of the section of the connecting part is 25 mm.
The structure of the handheld part 3 is a quadrangular prism with polished edges and corners, the length of the handheld part is 120mm, and the side length of the cross section of the handheld part is 20 mm.
The materials of the pressing part 1, the connecting part 2 and the handheld part 3 are polyvinylidene fluoride.
The device further comprises a heating table and a ceramic disc, the ceramic disc is placed on the heating table, the wafer is placed on the ceramic disc, and a wax layer is coated on the surface of the ceramic disc.
After the wax layer is melted, the pressure applying part 1 is contacted with the wafer and applies pressure, so that the thickness of the wax layer on the surface of the wafer is uniform, and no bubble exists between the wafer and the ceramic disc.
Example 3:
the embodiment provides a wafer wax pasting device, which comprises a pressing part 1, a connecting part 2 and a handheld part 3, wherein one end of the connecting part 2 is connected to the middle part of the pressing part 1, the other end of the connecting part is connected to the middle part of the handheld part 3, and the device is integrally in an I-shaped structure; the pressing part 1 is cylindrical.
The connecting part 2 is perpendicular to the pressing part 1 and the handheld part 3, and the pressing part 1 and the handheld part 3 are parallel.
The length of the pressure part 1 is 80mm, and the diameter is 15 mm.
The connecting part 2 is cylindrical in structure, the length of the connecting part is 40mm, and the diameter of the cross section of the connecting part is 15 mm.
The structure of the handheld part 3 is cylindrical, the length is 100mm, and the diameter of the cross section is 15 mm.
The pressing part 1, the connecting part 2 and the handheld part 3 are made of stainless steel, and the fine polishing cloth is adhered to the stainless steel of the pressing part 1.
The device further comprises a heating table and a ceramic disc, the ceramic disc is placed on the heating table, the wafer is placed on the ceramic disc, and a wax layer is coated on the surface of the ceramic disc.
After the wax layer is melted, the pressure applying part 1 is contacted with the wafer and applies pressure, so that the thickness of the wax layer on the surface of the wafer is uniform, and no bubble exists between the wafer and the ceramic disc.
In the above embodiment, the device is used to perform wax pasting processing on a wafer, the ceramic disc after being wax-coated is fixed on the tray, the wafer is placed at a given position in the ceramic disc, the whole body is placed on the heating table, the wax is heated and melted by setting the heating temperature, then the device is held by a hand, the pressing part is in contact with the wafer, pressure is applied in multiple directions, the device rotates back and forth in the pressing process, the stress on the whole wafer surface is uniform, the wax pasting thickness on the wafer surface is uniform, the heating table is closed, and cooling is performed, so that wax pasting on the wafer is completed.
The device can uniformly apply pressure to the surface of the wafer under manual operation, so that a uniform wax-adhering surface can be simply and quickly obtained, and the problem of wafer breakage caused by insecure adhesion or overlarge pressure is effectively avoided; the device has simple structure and flexible and simple operation, and can effectively improve the success rate of wax sticking on the wafer.
The applicant states that the present invention is described in the above embodiments, but the present invention is not limited to the above detailed device, i.e. the present invention must not be implemented by relying on the above detailed device. It should be clear to those skilled in the art that any improvement of the present invention, to the addition of the equivalent replacement and auxiliary devices of the present invention, the selection of the specific mode, etc., all fall within the scope of protection and disclosure of the present invention.
Claims (10)
1. A wafer wax pasting device is characterized by comprising a pressing part, a connecting part and a handheld part, wherein one end of the connecting part is connected to the middle part of the pressing part, the other end of the connecting part is connected to the middle part of the handheld part, and the device is integrally in an I-shaped structure; the pressing part is cylindrical.
2. The wafer wax attaching device according to claim 1, wherein the connecting portion is perpendicular to both the pressing portion and the hand-held portion, and the pressing portion and the hand-held portion are parallel to each other.
3. The wafer wax pasting device as claimed in claim 1, wherein the length of the pressing portion is 80-120 mm, and the diameter is 15-25 mm.
4. The wafer wax coating device as claimed in claim 1, wherein the connecting portion has a cylindrical structure and a length of 40-60 mm.
5. The wafer wax coating device as claimed in claim 4, wherein the connecting part is cylindrical in structure and has a cross-sectional diameter of 15-25 mm.
6. The wafer waxing device according to claim 1, wherein the structure of the handle is cylindrical and the length is 100-120 mm.
7. The wafer waxing device according to claim 6, wherein the structure of the handle is a quadrangular prism or a cylinder, and the length of the section side of the quadrangular prism or the diameter of the section of the cylinder is 10-20 mm.
8. The wafer waxing device according to claim 1, further comprising a heating table and a ceramic disk, wherein the ceramic disk is placed on the heating table and the wafer is placed on the ceramic disk.
9. The wafer waxing device according to claim 8, wherein the ceramic disc has a wax layer on its surface.
10. The wafer waxing device according to claim 9, wherein the pressing portion contacts and presses the wafer after the wax layer is melted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922304846.5U CN210778515U (en) | 2019-12-18 | 2019-12-18 | Wafer wax pasting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922304846.5U CN210778515U (en) | 2019-12-18 | 2019-12-18 | Wafer wax pasting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210778515U true CN210778515U (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922304846.5U Active CN210778515U (en) | 2019-12-18 | 2019-12-18 | Wafer wax pasting device |
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| Country | Link |
|---|---|
| CN (1) | CN210778515U (en) |
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2019
- 2019-12-18 CN CN201922304846.5U patent/CN210778515U/en active Active
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Address after: 201616 No. 1-15, Lane 150, dingsong Road, Songjiang District, Shanghai Patentee after: Shanghai Chaosi Semiconductor Co.,Ltd. Patentee after: CHONGQING ADVANCED SILICON TECHNOLOGY Co.,Ltd. Address before: No.158, Lane 258, Shuangjin Road, Shihudang Town, Songjiang District, Shanghai, 201617 Patentee before: SHANGHAI ADVANCED SILICON TECHNOLOGY Co.,Ltd. Patentee before: CHONGQING ADVANCED SILICON TECHNOLOGY Co.,Ltd. |