CN210776725U - Identification module and mobile terminal - Google Patents

Abstract

The application provides a pair of identification module and mobile terminal relates to identification module technical field. The identification module comprises a circuit board, a chip and a reinforcing plate, wherein the chip is arranged on the circuit board and is electrically connected with the circuit board. The stiffening plate is arranged on one side of the circuit board far away from the chip, and at least one reinforcing rib is arranged on one side of the stiffening plate far away from the circuit board. The position of strengthening rib is corresponding with the position of chip, and the chip installation back is relatively poor because glue solidification produces stress makes the module warp and leads to the roughness, and the strengthening rib can improve the tensile strength of discernment module, improves the roughness of discernment module.

Description

Identification module and mobile terminal

Technical Field

The utility model relates to an identification module technical field particularly, relates to an identification module and mobile terminal.

Background

With the rapid development of the era of mobile internet, the information interaction between mobile terminal users is also multiplied, the biometric identification technology is becoming a new interactive technology which is gradually accepted by the public under the introduction of the era, and the fingerprint identification technology is also becoming a standard configuration on mobile phones at present.

The inventor finds that after the chip is combined with the reinforcing steel sheet, the integral flatness of the identification module is poor, and the object distance of the whole machine assembly is affected.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an identification module and mobile terminal, it can offset the stress that produces in the glue curing process to avoid identification module because the warp that the stress action arouses, improve identification module's roughness and the object distance precision of complete machine assembly.

The embodiment of the utility model is realized like this:

in a first aspect, the present embodiment provides an identification module, including a circuit board, a chip and a stiffener, where the chip is disposed on the circuit board and electrically connected to the circuit board; the reinforcing plate is arranged on one side of the chip far away from the circuit board, at least one reinforcing rib is arranged on one side of the circuit board far away from the reinforcing plate, and the position of the reinforcing rib corresponds to the position of the chip.

In an alternative embodiment, the bead is integrally formed with the stiffener.

In an alternative embodiment, the number of the beads is plural, and plural beads are provided at intervals.

In an alternative embodiment, the reinforcing rib comprises a first reinforcing rib and a second reinforcing rib which are arranged in parallel, the chip comprises a first end and a second end, and the distance between the first end and the second end is the length of the chip;

the distance between the first reinforcing rib and the perpendicular line between the second reinforcing ribs is not greater than the length of the chip.

In an optional embodiment, an orthogonal projection of the first reinforcing rib on a plane where the chip is located is away from the first end by a distance of one sixth to one third of a length of the chip, and an orthogonal projection of the second reinforcing rib on a plane where the chip is located is away from the second end by a distance of one sixth to one third of the length of the chip.

In an optional embodiment, a distance from an orthogonal projection of the first reinforcing rib on a plane where the chip is located to the first end is one fifth of a length of the chip, and a distance from an orthogonal projection of the second reinforcing rib on a plane where the chip is located to the first end is one fifth of the length of the chip.

In an alternative embodiment, each of the reinforcing ribs includes a plurality of reinforcing sections disposed at intervals, and each of the reinforcing sections corresponds to one of the chips.

In an alternative embodiment, the thickness of the reinforcement plate is 0.1 mm to 0.15 mm, and the width of the bead is 0.5 mm to 1.5 mm.

In an alternative embodiment, the thickness of the reinforcement plate is 0.1 mm to 0.15 mm, and the depth of the bead is 0.05 mm to 0.15 mm.

In a second aspect, the present embodiment provides a mobile terminal, including the identification module according to any one of the foregoing embodiments.

The embodiment of the utility model provides an identification module and mobile terminal, its beneficial effect includes:

the utility model provides an identification module, chip bond and set up on the circuit board, and the circuit board passes through stiffening plate lifting strength, plays better supporting role. Because the chip bonds the back, receives the stress influence that the glue curing process produced, makes whole discernment module produce warpage, deformation, this application through set up the strengthening rib on the stiffening plate, can improve the tensile strength of stiffening plate, offsets the stress that produces in the glue curing process to effectively prevent discernment module deformation, improve the roughness of whole discernment module.

The utility model provides a mobile terminal has adopted foretell identification module, because in the identification module, has set up the strengthening rib on the stiffening plate, can offset the stress that produces in the glue curing process to improve the roughness of whole identification module, make the object distance of identification module after the assembly more accurate, be favorable to improving the imaging quality of whole identification module.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic view of a prior art identification module;

FIG. 2 is a schematic view of another prior art identification module;

FIG. 3 is a schematic side view of an identification module in the prior art;

fig. 4 is a schematic view of a viewing angle of the identification module according to this embodiment;

fig. 5 is a schematic structural diagram of another view angle of the identification module provided in this embodiment;

fig. 6 is a schematic view of a bidirectional forced deformation structure of a reinforcing plate of the identification module provided in this embodiment;

FIG. 7 is a schematic diagram illustrating a position layout of a reinforcement bar of the identification module according to the present embodiment;

fig. 8 is a schematic side view of the identification module provided in this embodiment;

FIG. 9 is a schematic view illustrating another structural layout of a reinforcement bar of the identification module in this embodiment;

fig. 10 is a schematic view of another structural layout of a reinforcement bar of the identification module provided in this embodiment.

Icon: 10-a circuit board; 20-chip; 30-a reinforcing sheet; 100-an identification module; 110-chip; 111-a first end; 113-a second end; 120-a circuit board; 130-a stiffening plate; 131-reinforcing ribs; 132-a first reinforcing rib; 133-a second stiffener; 134-a third reinforcing rib; 135-a fourth reinforcing rib; 136-reinforcement section; 140-board to board connector; 150-external device.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Fig. 1 is a schematic view of a prior art identification module from one viewing angle, and fig. 2 is a schematic view of a prior art identification module from another viewing angle. The chip 20 is disposed on the circuit board 10, and a side of the circuit board 10 away from the chip 20 is provided with a reinforcing sheet 30. The inventor of the invention has found that, as a result of long-term research, when the chip 20 is adhered to the circuit board 10, the chip 20, the circuit board 10 and the reinforcing sheet 30 connected to the circuit board 10 are deformed due to stress generated during the curing process of the glue, and the reinforcing sheet 30 deforms in the same direction as the chip 20, as shown in fig. 3, that is, one side of the chip 20 of the identification module is in an outward arched shape, one side of the reinforcing sheet 30 of the identification module is in an inward concave shape, an arrow in fig. 3 indicates a deformation direction, and the deformation depth of the inward concave is about 80 to 100 micrometers, which seriously affects the flatness of the entire identification module, and the bending deformation is serious, which results in inaccurate object distance and poor imaging quality after the whole machine is assembled.

In order to overcome the defects in the prior art, the present application provides an identification module 100, which can improve the flatness of the entire identification module 100, and overcome the phenomena of deformation and bending of the chip 110, the circuit board 120 and the stiffener 130, thereby improving the imaging quality of the entire identification module 100.

First embodiment

Fig. 4 is a schematic structural diagram of a viewing angle of the identification module 100 provided in this embodiment, and fig. 5 is a schematic structural diagram of another viewing angle of the identification module 100 provided in this embodiment.

Referring to fig. 4 and 5, an identification module 100 according to the present embodiment includes a circuit board 120, a chip 110 and a stiffener 130, wherein the chip 110 is disposed on the circuit board 120 and electrically connected to the circuit board 120. Optionally, the chip 110 is adhered to the circuit board 120 by the chip 110 adhesive glue, and the circuit board 120 may be any one of a flexible circuit board 120, a printed circuit board 120, or a rigid-flex board. In this embodiment, the circuit board 120 is a flexible circuit board 120; the identification module 100 may be a fingerprint identification module 100, or may be an identification module 100 for other purposes, and it should be understood that if the fingerprint identification module 100 is used, the chip 110 in this embodiment may be a fingerprint chip 110. In order to improve the strength of the flexible circuit board 120, the identification module 100 is added with a reinforcing plate 130, and further, the reinforcing plate 130 is disposed on a side of the circuit board 120 away from the chip 110, so as to improve the strength of the flexible circuit board 120 and better support the chip 110. At least one stiffener 131 is disposed on a side of the stiffener 130 away from the circuit board 120, and a position of the stiffener 131 corresponds to a position of the chip 110. The reinforcing ribs 131 are used to improve the tensile strength of the reinforcing plate 130, offset the stress generated in the glue curing process, so as to reduce or prevent the warpage of the identification module 100, and improve the flatness of the entire identification module 100. Easily understand, owing to improved the roughness of whole discernment module 100, after discernment module 100 assembles, discernment module 100's object distance is more accurate, is favorable to improving the imaging quality of discernment module 100 when using.

Alternatively, the stiffening plate 130 is made of steel sheet, but the stiffening plate 130 may be made of other materials, such as FR4, PET or PI, and the like, and is not limited herein. In this embodiment, the reinforcing plate 130 is made of a steel sheet, and the reinforcing ribs 131 and the reinforcing plate 130 are integrally formed by an integral forming process, so that the process is simple, the manufacturing is convenient, and the production cost is relatively low. In addition, by adopting the integral forming process, the stress of the whole reinforcing plate 130 is relatively uniform, and a stress concentration part is not easy to exist, so that the effect of offsetting the stress generated in the glue curing process is better. Of course, the present invention is not limited thereto, and in other alternative embodiments, the reinforcing plate 130 and the reinforcing bar 131 may be connected together by other means, such as welding, screwing, snapping, heat melting, etc., and are not limited thereto.

The number of the beads 131 may be one or more, and in this embodiment, the number of the beads 131 is multiple, and the multiple beads 131 are disposed at intervals. The position of the stiffener 131 is set corresponding to the position of the chip 110 so as to better offset the deformation of the bonding portion of the chip 110. Since the reinforcing plate 130 and the chip 110 are deformed in the same direction before the reinforcing ribs 131 are not provided, the reinforcing ribs 131 can improve the tensile strength of the reinforcing plate 130 by adding the reinforcing ribs 131 in this embodiment, and prevent the reinforcing plate 130 from being deformed. Meanwhile, the bead 131 generates a stress opposite to the deformation direction of the reinforcing plate 130 to appropriately counteract and neutralize the stress of the reinforcing plate 130, thereby preventing the deformation of the reinforcing plate 130.

Further, as shown in fig. 4, the circuit board 120 is provided with a plurality of chips 110 arranged side by side, and the number of the chips 110 is four in the figure. Since the chip 110 is disposed along the lateral direction of the circuit board 120, the stress generated by the chip is mainly distributed along the lateral direction, and in order to offset the stress generated by the curing of the glue, the stiffener 131 is also disposed along the lateral direction. Alternatively, the number of the beads 131 may be one or more. As shown in fig. 5, the number of the beads 131 in this embodiment is two. Such as: the reinforcing ribs 131 include a first reinforcing rib 132 and a second reinforcing rib 133 arranged in parallel, the chip 110 includes a first end 111 and a second end 113, and a distance between the first end 111 and the second end 113 is a length of the chip 110. The first reinforcing ribs 132 and the second reinforcing ribs 133 are arranged in parallel, and the distance of the perpendicular line between the first reinforcing ribs 132 and the second reinforcing ribs 133 is not greater than the length L of the chip 110.

As shown in fig. 6, the first reinforcing rib 132 and the second reinforcing rib 133 are disposed in parallel, and the stress directions generated by the two reinforcing ribs are along the same direction and are opposite to the deformation direction of the reinforcing plate 130, so that the reinforcing plate 130 can better resist the deformation of the reinforcing plate 130, and the effect of offsetting the stress generated by the glue curing of the reinforcing plate 130 is better. In fig. 6, the straight line arrows indicate the bending deformation direction, the curve a indicates the deformation direction of the reinforcing plate 130 due to the stress generated by the curing of the glue, and the curve b indicates the deformation direction of the reinforcing plate 130 due to the action of the reinforcing bead 131.

Further, the distance from the orthographic projection of the first reinforcing rib 132 on the plane of the chip 110 to the first end 111 of the chip 110 is one sixth to one third of the length of the chip 110, and the distance from the orthographic projection of the second reinforcing rib 133 on the plane of the chip 110 to the second end 113 of the chip 110 is one sixth to one third of the length of the chip 110. Therefore, the stress on the reinforcing plate 130 corresponding to the chip 110 is more uniform, and the tensile effect is better.

Further, in the present embodiment, the distance from the orthogonal projection of the first rib 132 on the plane of the chip 110 to the first end 111 of the chip 110 is one fifth of the length of the chip 110, and the distance from the orthogonal projection of the second rib 133 on the plane of the chip 110 to the first end 111 of the chip 110 is one fifth of the length of the chip 110. As shown in fig. 7 and 8, in fig. 7, the length of the scale marks indicates the entire length of the chip 110, the first reinforcing rib 132 is provided at a point c which is about one fifth from the first end 111, and the second reinforcing rib 133 is provided at a point d which is about one fifth from the second end 113. Through experimental verification, the first reinforcing ribs 132 are arranged at the positions, where the orthographic projection of the first reinforcing ribs 132 on the plane where the chip 110 is located is about one fifth of the length of the whole chip 110 from the first end 111, and the second reinforcing ribs 133 are arranged at the positions, where the orthographic projection of the second reinforcing ribs 133 on the plane where the chip 110 is located is about one fifth of the length of the whole chip 110 from the second end 113, so that the inward concave depth of the identification module 100 on one side of the reinforcing plate 130 can be greatly reduced, and is about reduced to 30 micrometers to 50 micrometers, as shown in fig. 8, compared with the existing inward concave depth of 80 micrometers to 100 micrometers, the identification module 100 provided in the embodiment has greatly improved deformation resistance.

It is easy to understand that the size of the reinforcing rib 131 is too large, which affects the overall volume and quality of the identification module 100, and the installation flatness may be affected; if the reinforcement 131 is undersized, the stresses that may be generated are not sufficient to resist the stresses of the stiffener 130 caused by the curing of the glue. Optionally, the thickness of the reinforcing plate 130 is about 0.1 mm to 0.15 mm, and the width e of the reinforcing rib 131 is about 0.5 mm to 1.5 mm; the bead 131 may have a depth of about 0.05 mm to about 0.15 mm. It should be understood that the depth of the bead 131 is the height of the bead 131 protruding from the surface of the reinforcing plate 130, and in this embodiment, the thickness of the reinforcing plate 130 is about 0.15 mm, the width of the bead 131 is about 1 mm, and the depth of the bead 131 is about 0.1 mm, which can achieve a good effect of counteracting the neutral stress.

Alternatively, in other alternative embodiments, the arrangement of the reinforcing beads 131 may be adjusted as appropriate, for example, the first reinforcing beads 132 and the second reinforcing beads 133 are diagonally arranged and arranged to cross each other. As shown in fig. 9, the first reinforcing beads 132 and the second reinforcing beads 133 can also resist the stress generated by the curing of the glue on the reinforcing plate 130, thereby improving the strength and deformation resistance of the reinforcing plate 130. Of course, the present invention is not limited thereto, and other arrangements of the bead 131 are possible. For example, a stiffener 131 may be disposed on the stiffener 130, and the stiffener 131 is disposed at a position corresponding to one-half of the length of the chip 110 and can also resist the stress generated by the curing of the glue on the stiffener 130. Alternatively, the number of the stiffeners 131 is three, and the three stiffeners 131 are arranged in parallel at intervals and are respectively arranged at a fifth of the orthogonal projection of the stiffeners 131 on the plane where the chip 110 is located from the first end 111 of the chip 110, at a half of the orthogonal projection of the stiffeners 131 from the first end 111 of the chip 110, and at a fifth of the orthogonal projection of the stiffeners 131 from the second end 113 of the chip 110, which is not specifically limited herein.

Second embodiment

As shown in fig. 10, a plurality of chips 110, for example, four chips, are disposed on the circuit board 120. The four chips 110 are arranged along the horizontal direction of the circuit board 120, a reinforcing plate 130 is arranged on one side of the circuit board 120 away from the chips 110, reinforcing ribs 131 are arranged on one side of the reinforcing plate 130 away from the circuit board 120, and the number of the reinforcing ribs 131 can be one or more. Further, each reinforcement rib 131 includes a plurality of reinforcement segments 136 disposed at intervals, and each reinforcement segment 136 corresponds to one chip 110. That is, in this embodiment, the reinforcing bead 131 includes the third reinforcing bead 134 and the fourth reinforcing bead 135, and each of the third reinforcing bead 134 and the fourth reinforcing bead 135 includes a plurality of reinforcing sections 136. The four reinforcing sections 136 of the third reinforcing rib 134 are arranged along the same straight line and are arranged at a position where the orthogonal projection of the third reinforcing rib 134 on the plane where the chip 110 is located is about one fifth of the whole length of the chip 110 from the first end 111 of the chip 110; the length of each reinforcement segment 136 is approximately three-quarters to one-half of the width of the chip 110, such as the length of each reinforcement segment 136 is approximately two-thirds of the width of the chip 110. Similarly, the four reinforcing sections 136 of the fourth reinforcing rib 135 are arranged along the same straight line, and are arranged at a position where the orthogonal projection of the fourth reinforcing rib 135 on the plane where the chip 110 is located is about one fifth of the whole length of the chip 110 from the second end 113 of the chip 110; the third reinforcing bead 134 and the fourth reinforcing bead 135 are arranged in parallel. Like this every chip 110 all is equipped with a reinforcement section 136 in the corresponding position department of stiffening plate 130, is favorable to offsetting the neutralization to the stress of the stiffening plate 130 that every chip 110 corresponds, and the position is more accurate, and the stress offset effect is better.

Optionally, the width e of the reinforcing section 136 is about 0.5 mm to 1.5 mm; the bead 131 may have a depth of about 0.05 mm to about 0.15 mm. Of course, without limitation, each reinforcement rib 131 includes a plurality of reinforcement segments 136 disposed at intervals, the number of reinforcement segments 136 may be two, three, five or more, and the number of reinforcement segments 136 may be equal to or different from the number of chips 110. The number of the beads 131 may be one, three, or more, and the arrangement of the plurality of beads 131 on the reinforcing plate 130 may be similar to that of the first embodiment, and is not particularly limited herein.

The contents of other parts not mentioned in this embodiment are similar to those in the first embodiment, and are not described again here.

Referring to fig. 4, the present embodiment further provides a mobile terminal including the identification module 100 according to any one of the foregoing embodiments. The circuit Board 120 of the identification module 100 is further provided with a Board-to-Board connector 140 (BTB) and an external device 150. The board-to-board connector 140 is used for connecting with other hardware, and the external device 150 includes, but is not limited to, a capacitor, a resistor, an inductor, and the like, and is not limited herein. The mobile terminal may be a mobile phone, an IPAD, a notebook computer, etc., and is not limited herein.

In summary, the identification module 100 and the mobile terminal provided in this embodiment have the following beneficial effects:

the identification module 100 provided by the embodiment is provided with the reinforcing ribs 131 on the reinforcing plate 130, and is used for offsetting the stress generated in the process of curing the glue on the reinforcing plate 130, namely, the tensile strength and the deformation resistance of the reinforcing plate 130 are improved by utilizing the mutual offsetting principle of the two-way deformation, so that the overall deformation of the lines of the identification module 100 is reduced, the flatness of the identification module 100 is improved, and the object distance value of the identification module 100 is stabilized. The identification module 100 has the advantages of simple structure, convenient process, easy manufacture, lower production cost and strong practicability.

The mobile terminal provided by the embodiment comprises the identification module 100, and the identification module 100 is provided with the reinforcing ribs 131, so that the flatness of the identification module 100 can be improved, the deformation is reduced, the object distance value of the identification module 100 is stabilized, the imaging quality of the identification module 100 of the mobile terminal is improved, and the product quality is better.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. An identification module is characterized by comprising a circuit board, a chip and a reinforcing plate, wherein the chip is arranged on the circuit board and is electrically connected with the circuit board; the reinforcing plate is arranged on one side of the chip far away from the circuit board, at least one reinforcing rib is arranged on one side of the circuit board far away from the reinforcing plate, and the position of the reinforcing rib corresponds to the position of the chip.

2. The identification module of claim 1, wherein the reinforcement bar is integrally formed with the reinforcement plate.

3. The identification module of claim 1, wherein the number of the stiffeners is plural, and the plural stiffeners are spaced apart from each other.

4. The identification module of claim 3, wherein the stiffener includes a first stiffener and a second stiffener arranged in parallel, the chip includes a first end and a second end, and a distance between the first end and the second end is a length of the chip;

the distance between the first reinforcing rib and the perpendicular line between the second reinforcing ribs is not greater than the length of the chip.

5. The identification module according to claim 4, wherein an orthographic projection of the first ribs on a plane of the chip is a distance from the first end of one sixth to one third of a length of the chip, and an orthographic projection of the second ribs on a plane of the chip is a distance from the second end of one sixth to one third of the length of the chip.

6. The identification module according to claim 4, wherein the distance between the orthographic projection of the first reinforcing rib on the plane of the chip and the first end is one fifth of the length of the chip, and the distance between the orthographic projection of the second reinforcing rib on the plane of the chip and the first end is one fifth of the length of the chip.

7. The identification module of claim 1, wherein each reinforcement bar includes a plurality of spaced apart reinforcement segments, each reinforcement segment corresponding to one of the chips.

8. The identification module according to any one of claims 1 to 7, wherein the thickness of the reinforcement plate is 0.1 mm to 0.15 mm, and the width of the reinforcement bar is 0.5 mm to 1.5 mm.

9. The identification module according to any one of claims 1 to 7, wherein the thickness of the reinforcement plate is 0.1 mm to 0.15 mm, and the depth of the reinforcement bar is 0.05 mm to 0.15 mm.

10. A mobile terminal characterized in that it comprises an identification module according to any one of claims 1 to 9.

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