CN112752389A - Copper-embedded printed circuit board and manufacturing method thereof - Google Patents
Copper-embedded printed circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN112752389A CN112752389A CN201911047664.2A CN201911047664A CN112752389A CN 112752389 A CN112752389 A CN 112752389A CN 201911047664 A CN201911047664 A CN 201911047664A CN 112752389 A CN112752389 A CN 112752389A
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- Prior art keywords
- groove
- copper
- copper block
- corner
- circuit board
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 141
- 229910052802 copper Inorganic materials 0.000 claims abstract description 139
- 239000010949 copper Substances 0.000 claims abstract description 139
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 abstract description 17
- 239000000945 filler Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 11
- 238000003825 pressing Methods 0.000 description 9
- 239000003292 glue Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000004744 fabric Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application provides a copper-embedded printed circuit board and a manufacturing method thereof, wherein the printed circuit board comprises a core board and a copper block; the core plate is provided with a groove for accommodating the copper block; there is the gap in order to be used for filling the adhesive between the inside wall of recess and the copper billet, wherein, the corner of copper billet corresponds with the corner of recess, and the perpendicular distance of the corner of copper billet to the corner of recess is less than the perpendicular distance of the inside wall of recess to the lateral wall of copper billet to reduce the skew of copper billet in the recess. Thereby effectively improved the problem that the copper billet squinted towards a direction at the fixed in-process copper billet of pressfitting, and then improved the not enough condition of filler appears in the gap between copper billet and the recess.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a copper-embedded printed circuit board and a manufacturing method thereof.
Background
In the production process of the copper-embedded printed circuit board, a groove with the same size as the copper block is generally formed on the core board, and then the copper block is pressed and embedded into the groove to play a certain role in heat dissipation.
Referring to fig. 1, fig. 1 is a top view of a copper-embedded printed circuit board in the prior art, in order to facilitate placing a copper block into a slot, the size of the slot is usually designed to be slightly larger than that of the copper block, so that a certain gap is left between the copper block and the slot, and then the copper block is fixed by glue overflow through a PP bonding sheet. However, during the copper-embedded pressing process, the copper block may be shifted in one direction due to the flow extrusion of the PP bonding sheet, so that the gap is too large on one side and too small on the other side, and therefore, insufficient gap filling may be caused.
Disclosure of Invention
The copper-embedded printed circuit board and the manufacturing method thereof can effectively solve the problem that the gap between the copper block and the groove is not filled with enough glue in the pressing process of the copper block.
In order to solve the technical problem, the application adopts a technical scheme that:
a copper-embedded printed circuit board comprises a core board and a copper block;
the core board is provided with a groove for accommodating the copper block; and a gap is formed between the inner side wall of the groove and the copper block for filling an adhesive, wherein the corner of the copper block corresponds to the corner of the groove, and the vertical distance from the corner of the copper block to the corner of the groove is smaller than the vertical distance from the side wall of the copper block to the inner side wall of the groove, so that the offset of the copper block in the groove is reduced.
According to the copper-embedded printed circuit board, the groove is formed in the core board, and the copper block is accommodated in the groove to play a certain heat dissipation role; meanwhile, the copper block is fixed in the groove by filling adhesive in the gap between the groove and the copper block, so that shaking is prevented; in addition, because the corner of the copper block corresponds to the corner of the groove, and the vertical distance from the corner of the copper block to the corner of the groove is smaller than the vertical distance from the side wall of the copper block to the inner side wall of the groove, the offset of the copper block in the groove is reduced, so that the problem that the copper block is offset towards one direction in the process of pressing and fixing the copper block is effectively solved, and the condition that the gap between the copper block and the groove is not filled with glue is further improved.
The transverse cross section of the groove is a polygon, and the vertical distance from at least three nonadjacent corners of the polygon to the corner of the copper block is smaller than the vertical distance from other positions of the polygon to the inner side wall of the groove.
The transverse section of the copper block is a first rectangle, and the corner of the first rectangle is an arc bending towards the groove.
Set the corner of copper billet to arc, can prevent effectively that the corner of copper billet at the pressfitting in-process copper billet from causing the damage to the lateral wall of recess.
The transverse section of the groove is a second rectangle, the corner of the second rectangle is an oblique angle, and the arc is opposite to the oblique angle.
Wherein the arc length of the arc is 0.2-0.5 mm.
Wherein the vertical distance between the vertex of the arc and the oblique angle is 20-100 microns.
Wherein the vertical distance between the side wall of the copper block and the inner side wall of the groove is 0.05-0.25 mm.
Wherein the adhesive is a prepreg.
In order to solve the above technical problem, another technical solution adopted by the present application is:
a manufacturing method of a copper-embedded printed circuit board comprises the following steps: providing a core plate;
a preset groove is formed in a preset position of the core plate;
embedding a copper block in the groove; a gap is formed between the inner side wall of the groove and the copper block, the corner of the copper block corresponds to the corner of the groove, and the vertical distance from the corner of the copper block to the corner of the groove is smaller than the vertical distance from the side wall of the copper block to the inner side wall of the groove, so that the offset of the copper block in the groove is reduced;
and filling adhesive in the gap to fix the copper block.
According to the manufacturing method of the copper-embedded printed circuit board, the core board is provided, the preset groove is formed in the preset position of the core board, and the copper block is accommodated in the groove to play a certain heat dissipation role; meanwhile, the copper block is fixed in the groove by filling adhesive in a gap between the groove and the copper block, so that shaking is prevented; in addition, because the corner of the copper block corresponds to the corner of the groove, the vertical distance from the corner of the copper block to the corner of the groove is smaller than the vertical distance from the side wall of the copper block to the inner side wall of the groove, and the offset of the copper block in the groove is reduced, so that the problem that the copper block is offset towards one direction in the process of pressing and fixing the copper block is effectively solved, and the condition that the gap between the copper block and the groove is not filled with glue is further improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a top view of a prior art copper-clad printed circuit board;
FIG. 2 is a top view of a copper-embedded PCB according to an embodiment of the present application;
FIG. 3 is a top view of a copper-embedded printed circuit board according to another embodiment of the present application;
fig. 4 is a schematic flow chart illustrating a method for manufacturing a copper-embedded printed circuit board according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The present application will be described in detail with reference to the accompanying drawings and examples.
Fig. 2 is a top view of a copper-embedded printed circuit board according to an embodiment of the present application.
In the present embodiment, there is provided a copper-embedded printed circuit board 1, the copper-embedded printed circuit board 1 including a core board 10 and a copper block 11; the core plate 10 is provided with a groove 100, and the copper block 11 is accommodated in the groove 100 to play a certain role in heat dissipation.
Specifically, the cross-sectional dimension of the groove 100 is slightly larger than the cross-sectional dimension of the copper block 11, so as to facilitate the insertion of the copper block 11.
Wherein, there is the gap between the inside wall of recess 100 and copper billet 11, and the packing has the adhesive in the gap to fix copper billet 11.
Specifically, the corner of the copper block 11 corresponds to the corner of the groove 100, and the vertical distance from the corner of the copper block 11 to the corner of the groove 100 is smaller than the vertical distance from the side wall of the copper block 11 to the inner side wall of the groove 100, so that the offset of the copper block 11 in the groove 100 is reduced, and the problem that the gap between the groove 100 and the copper block 11 is short of glue due to the fact that the copper block 11 is offset towards one direction in the pressing process of the copper block 11 is solved.
In a specific implementation process, the core board 10 specifically includes a substrate and at least one metal layer disposed on at least one surface of the substrate; specifically, the upper and lower surfaces of the substrate are provided with metal layers, and the groove 100 extends into the substrate through the metal layers.
The core board 10 may be a copper clad board, which is a base material for manufacturing a circuit board, and includes a base material board and a copper foil covered on the base material board, wherein the base material board is made by impregnating materials such as a paper substrate, a glass fiber fabric substrate, a synthetic fiber fabric substrate, a non-woven fabric substrate, a composite substrate, etc. with resin to make a bonding sheet, and is made by combining a plurality of bonding sheets, and the single side or double sides of the manufactured base material board are covered with the copper foil, and then are hot-pressed and cured to make the copper clad board.
Specifically, the groove 100 is a blind hole structure, the copper block 11 is accommodated in the blind hole, and the upper surface of the copper block 11 is flush with the upper surface of the core plate 10.
In the copper-embedded printed circuit board 1 provided by the embodiment, the groove 100 is formed in the core board 10, and the copper block 11 is accommodated in the groove 100 to play a certain role in heat dissipation; meanwhile, adhesive is filled in the gap between the groove 100 and the copper block 11 to fix the copper block 11 in the groove 100, so that shaking is prevented; in addition, because the corner of the copper block 11 corresponds to the corner of the groove 100, the vertical distance from the corner of the copper block 11 to the corner of the groove 100 is smaller than the vertical distance from the side wall of the copper block 11 to the inner side wall of the groove 100, and the offset of the copper block 11 in the groove 100 is reduced, so that the problem that the copper block 11 is offset towards one direction in the pressing and fixing process of the copper block 11 is effectively solved, and the condition that the gap between the copper block 11 and the groove 100 is not filled with enough glue is improved.
It will be appreciated that when the copper block 11 is received in the groove 100, the side walls of the copper block 11 correspond to the inner side walls of the groove 100, and the corners of the copper block 11 correspond to the corners of the groove 100.
Specifically, the transverse cross section of the groove 100 is polygonal, and the vertical distance from at least three non-adjacent corners of the polygon to the corner of the copper block 11 is smaller than the vertical distance from other positions of the polygon to the inner side wall of the groove 100, so that the copper block 11 is clamped from three different angles, and the offset of the copper block 11 in the groove 100 is reduced.
Specifically, the side lengths of two opposite sides of the polygon are parallel and equal.
It should be noted that the corner specifically refers to a position where two sides of the polygon are connected; in the specific implementation process, two sides of the multi-deformation may be connected by a curve bending toward the direction of the copper block 11, specifically as shown in fig. 3, fig. 3 is a top view of a copper-embedded printed circuit board provided in another embodiment of the present application, and may also be connected by an oblique line, specifically as shown in fig. 2. The length of the oblique line and the arc of the arc may be determined according to actual conditions, but this embodiment is not limited thereto, as long as the copper block 11 can enter the groove 100 and the offset of the copper block in the groove 100 can be reduced.
Referring to fig. 2, in one embodiment, the transverse cross-section of the copper block 11 is a first rectangle, and the corners of the first rectangle are arcs curved toward the grooves 100; the transverse section of the groove 100 is a second rectangle, and the corner of the second rectangle is an oblique angle, that is, two sides of the second rectangle are connected by oblique lines; the arc is opposite to the bevel angle, so that the groove 100 stops the position of the arc in the copper block 11 through the position of the bevel angle, and the problem that the copper block 11 deviates in one direction in the groove 100 is solved.
It can be understood that, each corner of the copper block 11 is transited through an arc, and the arc is outwards bent towards the side wall of the groove 100, so that the corner of the copper block 11 can be effectively prevented from damaging the inner side wall of the groove 100 in the pressing process of the copper block 11.
Further, in the above embodiment, when two sides of the second rectangle are connected by oblique lines, the transverse cross section of the groove 100 is actually an octagon, and the sides of two opposite sides of the octagon are parallel and equal.
Specifically, the arc length of the arc is 0.2-0.5 mm; the vertical distance between the side wall of the copper block 11 and the side wall of the groove 100 is 0.05-0.25 mm; the perpendicular distance between the apex of the arc and the oblique angle of the groove 100 is 20-100 microns.
It should be noted that, referring to fig. 2, the range of the vertical distance between the side wall of the copper block 11 and the inner side wall of the groove 100 is specifically the range of the distance m, and the range of the vertical distance between the vertex of the arc and the oblique angle of the groove 100 is specifically the range of n.
In one embodiment, the adhesive is a prepreg.
The prepreg mainly comprises resin and a reinforcing material, when the multilayer circuit board is manufactured, glass fiber cloth is usually used as the reinforcing material, the glass fiber cloth is soaked in resin glue solution and is subjected to heat treatment and pre-drying to be manufactured into a sheet, the sheet is softened under heating and pressurization and is solidified after cooling, the sheet has viscosity, and two adjacent layers can be bonded in a high-temperature pressing process.
Referring to fig. 4, a schematic flow chart of a method for manufacturing a copper-embedded printed circuit board according to an embodiment of the present application is shown; in this embodiment, a method for manufacturing a copper-embedded printed circuit board is provided, which includes:
step S101: a core board is provided.
The core board 10 includes a substrate and at least one metal layer disposed on at least one surface of the substrate.
Step S102: and a preset groove is formed in a preset position of the core plate.
The transverse cross section of the groove 100 may be a polygon, and the vertical distance from at least three non-adjacent corners of the polygon to the corner of the copper block 11 is less than the vertical distance from other positions of the polygon to the inner side wall of the groove 100.
Step S103: embedding a copper block in the groove; and a gap is formed between the inner side wall of the groove and the copper block, the corner of the copper block corresponds to the corner of the groove, and the vertical distance from the corner of the copper block to the corner of the groove is smaller than the vertical distance from the side wall of the copper block to the inner side wall of the groove, so that the offset of the copper block in the groove is reduced.
The transverse cross section of the copper block 11 is a first rectangle, and the corner of the first rectangle is an arc bending towards the groove 100.
Step S104: and filling adhesive in the gap to fix the copper block.
Specifically, the adhesive is a prepreg.
In the manufacturing method of the copper-embedded printed circuit board provided by the embodiment, the core board 10 is provided, the preset groove 100 is formed in the preset position of the core board 10, and the copper block 11 is accommodated in the groove 100 to play a certain role in heat dissipation; meanwhile, adhesive is filled in the gap between the groove 100 and the copper block 11 to fix the copper block 11 in the groove 100, so that shaking is prevented; in addition, because the corner of the copper block 11 corresponds to the corner of the groove 100, the vertical distance from the corner of the copper block 11 to the corner of the groove 100 is smaller than the vertical distance from the side wall of the copper block 11 to the inner side wall of the groove 100, and the offset of the copper block 11 in the groove 100 is reduced, so that the problem that the copper block 11 is offset towards one direction in the pressing and fixing process of the copper block 11 is effectively solved, and the condition that the gap between the copper block 11 and the groove 100 is not filled with enough glue is improved.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (9)
1. A copper-embedded printed circuit board is characterized by comprising a core board and a copper block;
the core board is provided with a groove for accommodating the copper block; and a gap is formed between the inner side wall of the groove and the copper block for filling an adhesive, wherein the corner of the copper block corresponds to the corner of the groove, and the vertical distance from the corner of the copper block to the corner of the groove is smaller than the vertical distance from the side wall of the copper block to the inner side wall of the groove, so that the offset of the copper block in the groove is reduced.
2. The copper-embedded printed circuit board of claim 1, wherein the transverse cross section of the groove is a polygon, and the vertical distance from at least three non-adjacent corners of the polygon to the corners of the copper block is smaller than the vertical distance from other positions of the polygon to the inner side wall of the groove.
3. The copper-embedded printed circuit board of claim 2, wherein the transverse cross section of the copper block is a first rectangle, and the corners of the first rectangle are arcs bent toward the direction of the groove.
4. The copper-embedded printed circuit board of claim 3, wherein the transverse cross section of the groove is a second rectangle, the corner of the second rectangle is an oblique angle, and the circular arc is opposite to the oblique angle.
5. The copper-clad printed circuit board of claim 3, wherein the arc length of the arc is 0.2-0.5 mm.
6. The copper-clad printed circuit board of claim 4, wherein the perpendicular distance between the vertex of the arc and the bevel is 20-100 μm.
7. The copper-embedded printed circuit board of claim 2 or 3, wherein a vertical distance between a side wall of the copper block and an inner side wall of the groove is 0.05-0.25 mm.
8. The copper-clad printed circuit board according to claim 1, wherein the adhesive is a prepreg.
9. A manufacturing method of a copper-embedded printed circuit board is characterized by comprising the following steps: providing a core plate;
a preset groove is formed in a preset position of the core plate;
embedding a copper block in the groove; a gap is formed between the inner side wall of the groove and the copper block, the corner of the copper block corresponds to the corner of the groove, and the vertical distance from the corner of the copper block to the corner of the groove is smaller than the vertical distance from the side wall of the copper block to the inner side wall of the groove, so that the offset of the copper block in the groove is reduced;
and filling adhesive in the gap to fix the copper block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911047664.2A CN112752389A (en) | 2019-10-30 | 2019-10-30 | Copper-embedded printed circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911047664.2A CN112752389A (en) | 2019-10-30 | 2019-10-30 | Copper-embedded printed circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN112752389A true CN112752389A (en) | 2021-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911047664.2A Pending CN112752389A (en) | 2019-10-30 | 2019-10-30 | Copper-embedded printed circuit board and manufacturing method thereof |
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| CN (1) | CN112752389A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114867186A (en) * | 2022-03-22 | 2022-08-05 | 胜宏科技（惠州）股份有限公司 | Method for avoiding surface salient points of copper block embedding plate |
| TWI774631B (en) * | 2022-01-07 | 2022-08-11 | 健鼎科技股份有限公司 | Manufacturing method of heat-dissipation circuit board structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430922A (en) * | 2015-12-18 | 2016-03-23 | 景旺电子科技(龙川)有限公司 | Manufacturing method for embedding metal matrix into printed board |
| CN105472869A (en) * | 2015-12-14 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Printed circuit board with semi-embedded type embedded heat conductive block |
| CN211019412U (en) * | 2019-10-30 | 2020-07-14 | 无锡深南电路有限公司 | Copper-embedded printed circuit board |
-
2019
- 2019-10-30 CN CN201911047664.2A patent/CN112752389A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472869A (en) * | 2015-12-14 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Printed circuit board with semi-embedded type embedded heat conductive block |
| CN105430922A (en) * | 2015-12-18 | 2016-03-23 | 景旺电子科技(龙川)有限公司 | Manufacturing method for embedding metal matrix into printed board |
| CN211019412U (en) * | 2019-10-30 | 2020-07-14 | 无锡深南电路有限公司 | Copper-embedded printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI774631B (en) * | 2022-01-07 | 2022-08-11 | 健鼎科技股份有限公司 | Manufacturing method of heat-dissipation circuit board structure |
| CN114867186A (en) * | 2022-03-22 | 2022-08-05 | 胜宏科技（惠州）股份有限公司 | Method for avoiding surface salient points of copper block embedding plate |
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