CN210773487U

CN210773487U - High-temperature-resistant low-deformation ceramic rack

Info

Publication number: CN210773487U
Application number: CN201921698576.4U
Authority: CN
Inventors: 管怀春
Original assignee: HEFEI CHUNYANG ELECTROMECHANICAL TECHNOLOGY CO LTD
Current assignee: HEFEI CHUNYANG ELECTROMECHANICAL TECHNOLOGY CO LTD
Priority date: 2019-10-11
Filing date: 2019-10-11
Publication date: 2020-06-16
Anticipated expiration: 2029-10-11

Abstract

The utility model provides a high temperature resistant low-deformation's ceramic frame relates to ceramic frame technical field for metal normalizing, including the base plate, the mounting hole has been seted up to the inside of base plate, and the mounting hole is four, and four mounting hole evenly distributed are on two diagonal lines on the substrate surface, and the inner wall of four mounting holes is all inserted and is equipped with the bracing piece, and four bracing piece surfaces are for the position fixedly connected with spacing ring of base plate bottom, the one end fixedly connected with buffer of four bracing pieces. The utility model discloses, to place the metal that takes out in the heating furnace on the board is placed to the pottery, the ceramic plate oppresses the connection pad and makes the first spring of connection pad oppression, utilizes the elasticity of first spring self to cushion the metal to placing the board power of exerting oneself, and the bracing piece is further cushioned through second spring self elasticity in the inside slip of pad, has avoided ceramic frame high temperature condition to place the metal in-process and take place violent collision easily and cause deformation to reduce the problem in the life-span of ceramic frame.

Description

High-temperature-resistant low-deformation ceramic rack

Technical Field

The utility model relates to a ceramic frame technical field for the metal normalizing especially relates to a high temperature resistant low-deformation's ceramic frame.

Background

The metal heat treatment is a process method of heating, insulating and cooling a metal workpiece in a certain medium and controlling the performance of the metal workpiece by changing the structure of the surface or the interior of the metal material, and the metal heat treatment can be divided into the working procedures of annealing, normalizing and the like.

The metal normalizing treatment process is a metal heat treatment process of heating the workpiece to 30-50 ℃ above Ac3 or Accm, preserving heat for a period of time, and taking out the workpiece from the furnace to be cooled in air or by water spraying, spraying or air blowing. The purpose is to refine the grains and homogenize the carbide distribution.

The process that the heating furnace is taken out to the metal of heating in the present metal normalizing treatment process and naturally cools in the air is placed on ceramic frame, and the ceramic frame is placed under the high temperature condition and is easy to be violently collided to cause deformation in the metal placing process, thereby reducing the service life of ceramic frame.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a high temperature resistant low deformation ceramic frame.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a high-temperature-resistant low-deformation ceramic frame comprises a substrate, wherein mounting holes are formed in the substrate, the number of the mounting holes is four, the four mounting holes are uniformly distributed on two diagonal lines on the surface of the substrate, supporting rods are inserted into the inner walls of the four mounting holes, a limiting ring is fixedly connected to the surface of each supporting rod relative to the bottom end of the substrate, a buffer device is fixedly connected to one end of each supporting rod, a connecting device is arranged at the upper end of the substrate, a placing plate is fixedly connected to one end, away from the substrate, of each connecting device, the connecting device comprises a sleeve, the inner wall of each sleeve is sleeved on the surface of each supporting rod, the outer wall of each sleeve is inserted into the corresponding mounting hole, the sleeve is slidably connected with the mounting holes and the supporting rods, a connecting pad is fixedly connected to one end, away from the substrate, of each sleeve is, the bottom end of the connecting pad is fixedly connected with a first spring, the other end of the first spring is fixedly connected with the substrate, and the first spring is sleeved on the surface of the sleeve.

Preferably, the bottom end of the substrate is provided with a groove matched with the limiting ring relative to the position of the mounting hole, the limiting ring is of a cross-shaped structure, and the support rod is clamped inside the groove and connected with the substrate through the limiting ring.

Preferably, the surfaces of the placing plate and the base plate are vertically penetrated and provided with hole grooves, and the hole grooves of the placing plate and the base plate are not distributed on the same heavy hammer line in a staggered mode.

Preferably, the surfaces of the four support rods are fixedly connected with connecting rods, the connecting rods are formed by two rods which are arranged in a crossed mode, and a heat dissipation groove is formed in one end, close to the substrate, of each connecting rod, and corresponds to the position, provided with the hole groove, in the substrate.

Preferably, the buffer device comprises a mounting pad, the mounting pad is sleeved on the surface of the support rod, the inner part of the mounting pad is fixedly connected with the support rod, one end of the mounting pad, which is far away from the base plate, is fixedly connected with a second spring, and the second spring is sleeved on the surface of the support rod.

Preferably, the other end fixedly connected with base of second spring, vertical hole has been run through to the inside of base, the base is with the help of hole and bracing piece sliding connection.

Advantageous effects

1. The utility model discloses in, the metal that will take out from the heating furnace is placed on the board is placed to the pottery, when the board is placed to the pottery receives pressure, the ceramic plate oppresses the connection pad and makes the connection pad oppress first spring, make the sleeve pipe slide in the gap between the mounting hole and the bracing piece two, utilize the elasticity of first spring self to cushion the metal to placing the board power of exerting oneself, the bracing piece slides through second spring self elasticity further buffering inside the base pad, it causes deformation to have avoided ceramic frame to place the metal in-process and take place violent collision easily under the high temperature condition, thereby reduce the problem of the life-span of ceramic frame.

2. The utility model discloses in, utilize the inside crisscross hole groove that sets up of board and base plate of placing for place the area of contact between high temperature metal and the air on the board, thereby accelerate the heat dissipation, utilize the spacing ring of cross structure to increase the stability between bracing piece and the base plate, utilize the radiating groove of seting up on the connecting rod to avoid the connecting rod to block the hole groove that the base plate was seted up.

Drawings

Fig. 1 is a schematic axial side structure diagram of a high temperature resistant and low deformation ceramic rack provided by the present invention;

fig. 2 is a schematic diagram of the explosion of the three-dimensional structure of the high temperature resistant and low deformation ceramic rack provided by the present invention;

fig. 3 is a schematic view of a three-dimensional structure of a high temperature resistant and low deformation ceramic frame according to the present invention;

fig. 4 is a schematic diagram of a structure at a position a in fig. 1 in the ceramic rack with high temperature resistance and low deformation.

Illustration of the drawings: 1. a substrate; 2. mounting holes; 3. a support bar; 4. a limiting ring; 5. a connecting rod; 6. a heat sink; 7. a connecting device; 701. a sleeve; 702. a first spring; 703. a connecting pad; 8. placing the plate; 9. a buffer device; 901. a mounting mat; 902. a second spring; 903. a cushion seat.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings, but the following embodiments are only the preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.

Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

The specific embodiment is as follows:

referring to fig. 1-4, a high temperature resistant low deformation ceramic frame comprises a substrate 1, mounting holes 2 are formed in the substrate 1, four mounting holes 2 are formed in the substrate 1, the four mounting holes 2 are uniformly distributed on two diagonal lines on the surface of the substrate 1, a groove matched with a limiting ring 4 is formed in the bottom end of the substrate 1 corresponding to the mounting holes 2, the limiting ring 4 is in a cross-shaped structure, a support rod 3 is clamped in the groove through the limiting ring 4 and is clamped with the substrate 1, support rods 3 are inserted into the inner walls of the four mounting holes 2, connecting rods 5 are fixedly connected to the surfaces of the four support rods 3, the connecting rods 5 are formed by two rods arranged in a crossed manner, a heat dissipation groove 6 is formed in one end of each connecting rod 5, which is close to the substrate 1, corresponding to the position of the hole in the substrate 1, the positions of the surfaces of the four support rods 3 corresponding to the bottom end of, the upper end of base plate 1 is equipped with connecting device 7, connecting device 7 keeps away from the one end fixedly connected with of base plate 1 and places board 8, the equal vertical hole groove that has seted up that runs through in surface of placing board 8 and base plate 1, and the hole groove of placing board 8 and base plate 1 is crisscross distribution on same weight line not, connecting device 7 includes sleeve 701, the inner wall cover of sleeve 701 is on the surface of bracing piece 3, the outer wall of sleeve 701 is inserted inside mounting hole 2, sleeve 701 and mounting hole 2, bracing piece 3 is equal sliding connection, the one end fixedly connected with connection pad 703 that base plate 1 was kept away from to sleeve 701, the one end that base plate 1 was kept away from to connection pad 703 with place board 8 fixed connection, the first spring 702 of bottom fixedly connected with of connection pad 703, the other end and the base plate 1 fixed connection of first spring 702, and first spring 702 cover.

Buffer 9 includes mounting pad 901, and mounting pad 901 covers on the surface of bracing piece 3, the inside and bracing piece 3 fixed connection of mounting pad 901, and the one end fixedly connected with second spring 902 of base plate 1 is kept away from to mounting pad 901, and second spring 902 covers on the surface of bracing piece 3, and the other end fixedly connected with base pad 903 of second spring 902, the inside of base pad 903 runs through and has seted up vertical hole, and base pad 903 is with the help of hole and bracing piece 3 sliding connection.

The utility model discloses a theory of operation: the metal taken out of the heating furnace is placed on the ceramic placing plate 8, when the ceramic placing plate 8 is stressed, the ceramic plate presses the connecting pad 703 to press the first spring 702, so that the sleeve 701 slides in a gap between the mounting hole 2 and the support rod 3, the self elasticity of the first spring 702 is utilized to buffer the force applied by the metal to the placing plate 8, the support rod 3 slides in the pad 903 and is further buffered by the self elasticity of the second spring 902, the problem that the ceramic frame is easy to deform due to severe collision in the process of placing the metal under the high-temperature condition is solved, the service life of the ceramic frame is shortened, the contact area between the high-temperature metal on the placing plate 8 and the air is increased by utilizing the hole grooves which are staggered in the placing plate 8 and the substrate 1, the heat dissipation is accelerated, the stability between the support rod 3 and the substrate 1 is increased by utilizing the limiting ring 4 with, the connecting rod 5 is prevented from blocking the hole groove formed on the substrate 1 by the heat dissipation groove 6 formed on the connecting rod 5.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a high temperature resistant low ceramic frame that warp, includes base plate (1), its characterized in that: the novel LED display panel is characterized in that mounting holes (2) are formed in the base plate (1), the number of the mounting holes (2) is four, the four mounting holes (2) are uniformly distributed on two diagonal lines on the surface of the base plate (1), supporting rods (3) are inserted into the inner walls of the four mounting holes (2), a limiting ring (4) is fixedly connected to the positions, corresponding to the bottom end of the base plate (1), of the surfaces of the four supporting rods (3), a buffer device (9) is fixedly connected to one end of each of the four supporting rods (3), a connecting device (7) is arranged at the upper end of the base plate (1), a placing plate (8) is fixedly connected to one end, away from the base plate (1), of each connecting device (7) comprises a sleeve (701), the inner wall of each sleeve (701) is sleeved on the surface of each supporting rod (3), and the outer wall of each sleeve (701), the utility model discloses a support structure for a display screen, including sleeve pipe (701), mounting hole (2), bracing piece (3) equal sliding connection, the one end fixedly connected with connection pad (703) of base plate (1) are kept away from in sleeve pipe (701), the one end of base plate (1) is kept away from in connection pad (703) and place board (8) fixed connection, the bottom fixedly connected with first spring (702) of connection pad (703), the other end and base plate (1) fixed connection of first spring (702), and first spring (702) cover is on the surface of sleeve pipe (701).

2. The ceramic rack of claim 1, wherein the ceramic rack is characterized in that: the utility model discloses a spacing structure, including base plate (1), spacing ring (4), bracing piece (3), base plate (1) bottom is seted up for the position of mounting hole (2) with the recess of spacing ring (4) looks adaptation, spacing ring (4) are the cross column structure, bracing piece (3) are blocked inside and base plate (1) joint through spacing ring (4).

3. The ceramic rack of claim 1, wherein the ceramic rack is characterized in that: the surface of the placing plate (8) and the surface of the base plate (1) are both vertically penetrated and provided with hole grooves, and the hole grooves of the placing plate (8) and the base plate (1) are not distributed on the same heavy hammer line in a staggered mode.

4. The ceramic rack of claim 1, wherein the ceramic rack is characterized in that: the surface of the four support rods (3) is fixedly connected with connecting rods (5), the connecting rods (5) are formed by two rods which are arranged in a crossed mode, and heat dissipation grooves (6) are formed in positions, close to one end of the base plate (1), of the connecting rods (5) and opposite to the positions, provided with the hole grooves, of the inner portion of the base plate (1).

5. The ceramic rack of claim 1, wherein the ceramic rack is characterized in that: the buffer device (9) comprises a mounting pad (901), the mounting pad (901) is sleeved on the surface of the support rod (3), the inside of the mounting pad (901) is fixedly connected with the support rod (3), one end, far away from the base plate (1), of the mounting pad (901) is fixedly connected with a second spring (902), and the second spring (902) is sleeved on the surface of the support rod (3).

6. The ceramic rack of claim 5, wherein the ceramic rack has high temperature resistance and low deformation resistance: the other end fixedly connected with base (903) of second spring (902), vertical hole has been seted up in the inside run-through of base (903), base (903) with the help of hole and bracing piece (3) sliding connection.