CN210750888U

CN210750888U - Metal-covered microneedle wafer structure

Info

Publication number: CN210750888U
Application number: CN201920596387.XU
Authority: CN
Inventors: 于大全; 姜峰; 王阳红
Original assignee: Xiamen Yun Tian Semiconductor Technology Co ltd
Current assignee: Xiamen Yun Tian Semiconductor Technology Co ltd
Priority date: 2019-04-28
Filing date: 2019-04-28
Publication date: 2020-06-16
Anticipated expiration: 2029-04-28

Abstract

The utility model provides a microneedle wafer structure that metal cover, include: a wafer and needle-like projections arranged in an array on an upper surface of the wafer; the surfaces of the needle-shaped protrusions and the upper surface of the wafer are respectively covered with an adhesive metal layer and a metal layer, and the adhesive metal layers are respectively arranged between the surfaces of the needle-shaped protrusions and the metal layer and between the upper surface of the wafer and the metal layer. The utility model provides a microneedle chip structure with metal covering, which has good biocompatibility and is easy to produce.

Description

Metal-covered microneedle wafer structure

Technical Field

The utility model relates to a micropin wafer structure.

Background

The structure of the skin is divided into an epidermal layer and a dermal layer from the outside to the inside. Wherein the outermost stratum corneum layer of the epidermis layer is about 10-40 μm thick, is composed of dead cells, and has no blood vessels or nerves. The stratum corneum is the first barrier of the human body against the outside world, but also becomes the biggest barrier to transdermal drug absorption. The other layers of the epidermis, below the stratum corneum, are about 50-100 μm thick and contain a small amount of living cells and nervous tissue, but no blood vessels. The thickness of the dermis layer below the epidermis layer is 1-4mm, and the main component of the dermis layer is collagen fiber and contains a large amount of living cells, tissue fluid, capillaries and nerve tissue. Because of containing living cells, tissue fluid and capillary blood vessels, the height of the microneedle of other layers of the epidermis and the dermis layer which are positioned below the stratum corneum is the most important absorption place of the transdermal medicament, is more than 30 microns and is between 50 and 250 microns, and is favorable for penetrating the stratum corneum and the epidermis. For scars, however, a taller needle is required, the channel is opened, and the medication is applied.

The stratum corneum, although it is a layer of dead tissue, without blood vessels and nerves, is a controlled release layer for the percutaneous absorption of nutrients. The effective components in the skin care products or medicines applied on the skin can not penetrate through the horny layer, or only a few parts of the effective components can penetrate through the horny layer, so that the effect of skin care or medicines is seriously influenced. To this end, researchers have investigated increasing the penetration of drugs by microneedles through the stratum corneum. The micro-needle with the height less than 300 microns can form a transmission channel on the horny layer of the skin of a human body on the premise of not damaging the dermis, improves the transdermal permeation efficiency of skin care products or medicaments, has no pain in the using process and can achieve good permeation promoting effect. Practice proves that the microneedle is a safe and reliable cosmetic and medical administration mode.

At present, the microneedle products on the market mainly comprise three types, namely metal microneedles, silicon microneedles and polymer microneedles. The metal micro-needle is generally in the form of a roller or a needle head, has a large size, and can generate pain and even hemorrhage when being penetrated into the skin in the using process. The silicon microneedle prepared by the microelectronic process has better cost performance. However, silicon itself is easy to adhere to protein due to poor biocompatibility, and an over-stimulation reaction is generated.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the main technical problem of providing a microneedle chip architecture that metal covers, has good biocompatibility to easily production.

In order to solve the above technical problem, the present invention provides a metal-covered microneedle wafer structure, including: a wafer and needle-like projections arranged in an array on an upper surface of the wafer; the surface of the needle-shaped protrusion and the upper surface of the wafer are respectively covered with a first metal layer and a second metal layer, and the second metal layer is arranged between the surface of the needle-shaped protrusion and the first metal layer and between the upper surface of the wafer and the first metal layer.

In a preferred embodiment: the needle-shaped protrusions are vertebral bodies.

In a preferred embodiment: the height of the needle-shaped bulge is 30-500um, and the diameter of the upper end of the needle-shaped bulge is less than 5 um.

In a preferred embodiment: the needle-shaped bulge is a cylinder or a combination of the cylinder and a cone.

In a preferred embodiment: the combined body has a total height of 30-500um, wherein the height of the vertebral body is greater than 1um, and the diameter of the upper end of the vertebral body is less than 5 um.

In a preferred embodiment: the thickness of the first metal layer is greater than 1 nm.

In a preferred embodiment: the thickness of the second metal layer is greater than 1 nm.

In a preferred embodiment: the outer surface of the second metal layer is covered with at least one third metal layer.

Compared with the prior art, the technical scheme of the utility model possess following beneficial effect:

1. the utility model provides a pair of microneedle wafer structure that metal covers, the needle is protruding mainly to have adopted the silicon micropin, and has covered metal level and bonding metal level on silicon micropin surface for the needle is protruding to have one deck metal on the surface. Thus, on one hand, the advantage that the silicon micro-needle is easy to produce is utilized, and on the other hand, the advantage that the metal material has good biocompatibility with the human epidermis is also utilized. Therefore, the microneedle chip has the advantages of high safety (gold is antioxidant and has good antibacterial property) and good biocompatibility.

2. The utility model provides a microneedle chip structure covered by metal, which makes full use of the effect of gold on skin, and the friction between the nano gold layer and skin accelerates the absorption of skin care product nutrition by skin and skin metabolism;

3. the utility model provides a pair of microneedle chip architecture of metal covering, preparation method are ripe, stable, reliable, and the technology details that adopt are particularly suitable for the preparation microneedle chip. And the gold layer is deposited into a thin layer by evaporation, so that the material is saved, and the cost is reduced.

Drawings

Fig. 1-2 are flow charts of microneedle wafer fabrication in a preferred embodiment of the present invention.

Detailed Description

In order to make the technical solution of the present invention clearer, the present invention will now be further described with reference to the accompanying drawings and embodiments.

Referring to fig. 1-2, a process for preparing a metal-covered microneedle wafer structure includes the steps of:

1) manufacturing an array of needle-like protrusions 2 on a wafer 1; specifically, the method comprises the following steps:

① providing a metal mask ③ formed by depositing a seed layer on the silicon wafer ②, photolithography, developing, electroplating, removing photoresist, etching, etc., and etching the silicon wafer ④ with a K (OH) solution to remove the metal mask;

the material of the wafer 1 may be glass or ceramic, and the material of the needle-like protrusions 2 may be silicon, glass, ceramic or polymer glue, and may or may not be the same as that of the wafer 1.

2) Depositing and bonding a first metal layer 3 and a second metal layer 4 on the surfaces of the wafer 1 and the needle-shaped protrusions 2 by an evaporation method; specifically, the method comprises the following steps:

⑤ vapor deposition of the second metal layer 4 ⑥ vapor deposited metal layer 5.

After the above steps, a metal-covered microneedle wafer structure is obtained, comprising: a wafer 1 and needle-like projections 2 arrayed on the upper surface of the wafer 1; the surfaces of the needle-shaped protrusions 2 and the upper surface of the wafer 1 are covered with a first metal layer 3 and a second metal layer 4 respectively, and the first metal layer 3 is arranged between the surfaces of the needle-shaped protrusions 2 and the second metal layer 4 and between the upper surface of the wafer 1 and the second metal layer 4 respectively. As a simple alternative to this embodiment, the outer surface of the second metal layer 4 may be further covered with one or more third metal layers.

In addition, the needle-like protrusions 2 in this embodiment are cone-shaped, can be cone-shaped or pyramid-shaped, and have a height of 30-500um, and the diameter of the upper end thereof is smaller than 5 um.

As a simple alternative to this embodiment, the needle-like protrusions 2 may also be cylindrical or a combination of cylindrical and conical bodies. When a combined body structure is adopted, the total height of the combined body is 30-500um, wherein the height of a vertebral body is more than 1um, and the diameter of the upper end of the vertebral body is less than 5 um.

In this embodiment, the thickness of the first metal layer 3 is greater than 5nm, and the thickness of the second metal layer 4 is greater than 1 nm.

In the structure of the microneedle chip covered with the metal, the needle-shaped protrusions 2 mainly adopt the silicon microneedles, and the surface of the silicon microneedles is covered with the metal layer and the bonding metal layer, so that the surface of the needle-shaped protrusions 2 is provided with a layer of metal. Thus, on one hand, the advantage that the silicon micro-needle is easy to produce is utilized, and on the other hand, the advantage that the metal material has good biocompatibility with the human epidermis is also utilized. Therefore, the microneedle chip has the advantages of high safety (gold is antioxidant and has good antibacterial property) and good biocompatibility.

The microneedle chip structure fully utilizes the effect of gold on the skin, and the nano gold layer rubs with the skin, so that the skin is accelerated to absorb the nutrition of the skin care product, and the skin metabolism is accelerated; the compendium of materia Medica has cloud: ' Huangjin Anshen, beautifies face, activates blood and strengthens body. The gold fine particles added into the skin care product can permeate into the skin, create a good introduction environment and enable the skin to better absorb nutrition, thereby achieving the effects of beautifying and tightening. Modern researches show that the gold foil particles have strong surface adsorption and carrying effects and can be used for purifying skin. The gold can release negative ions after contacting the skin, and the negative ions correspond to positive ions in the human body, so that the skin metabolism is effectively accelerated.

The preparation method of the metal-covered microneedle chip structure is mature, stable and reliable, and the adopted process details are particularly suitable for preparing the microneedle chip. And the gold layer is deposited into a thin layer by evaporation, so that the material is saved, and the cost is reduced.

The above is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and variations or technical scopes of the present invention can be easily conceived by those skilled in the art. Alternatives are intended to be within the scope of the invention. Therefore, the protection scope of the present invention should be determined by the scope of the claims.

Claims

1. A metal-capped microneedle wafer structure, comprising: a wafer and needle-like projections arranged in an array on an upper surface of the wafer; the surface of the needle-shaped protrusion and the upper surface of the wafer are respectively covered with a first metal layer and a second metal layer, and the second metal layer is arranged between the surface of the needle-shaped protrusion and the first metal layer and between the upper surface of the wafer and the first metal layer.

2. A metal-covered microneedle wafer structure according to claim 1, wherein: the needle-shaped protrusions are vertebral bodies.

3. A metal-covered microneedle wafer structure according to claim 2, wherein: the height of the needle-shaped bulge is 30-500um, and the diameter of the upper end of the needle-shaped bulge is less than 5 um.

4. A metal-covered microneedle wafer structure according to claim 1, wherein: the needle-shaped bulge is a cylinder or a combination of the cylinder and a cone.

5. A metal-covered microneedle wafer structure according to claim 4, wherein: the combined body has a total height of 30-500um, wherein the height of the vertebral body is greater than 1um, and the diameter of the upper end of the vertebral body is less than 5 um.

6. A metal-covered microneedle wafer structure according to claim 1, wherein: the thickness of the first metal layer is greater than 1 nm.

7. A metal-covered microneedle wafer structure according to claim 6, wherein: the thickness of the second metal layer is greater than 1 nm.

8. A metal-covered microneedle wafer structure according to claim 1, wherein: the outer surface of the second metal layer is covered with at least one third metal layer.