CN210740519U - Graphene heating wallboard capable of achieving indoor rapid heating - Google Patents
Graphene heating wallboard capable of achieving indoor rapid heating Download PDFInfo
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- CN210740519U CN210740519U CN201921131331.3U CN201921131331U CN210740519U CN 210740519 U CN210740519 U CN 210740519U CN 201921131331 U CN201921131331 U CN 201921131331U CN 210740519 U CN210740519 U CN 210740519U
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Abstract
The utility model provides a graphene heating wallboard for realizing indoor rapid temperature rise, which comprises a heat insulation layer, an interlayer, a heat transfer layer and a surface layer from bottom to top; the insulating layer is the polyurethane heat insulating board, the intermediate layer is graphite alkene chip that generates heat, the heat transfer layer is alloy honeycomb core, has quick heat dissipation function, top layer alloy decorative layer, the utility model provides a graphite alkene intermediate layer wallboard has heat-conduction efficiency height, and rate of heating is fast characteristics.
Description
Technical Field
The utility model relates to a building material field, in particular to graphite alkene wallboard that generates heat that realizes indoor rapid heating up.
Background
The traditional heating system comprises a radiator, an air conditioner, a point heating system represented by a radiator and a line heating system represented by a heating cable, and the traditional heating mode has the defects of large energy consumption, large occupied space, low heat energy utilization rate and the like.
At present, heating chip heating is developed as a novel heating mode, and the heating chip is made of conductive special printing ink and metal current carrying strips which are processed and hot-pressed between insulating polyester films. The electrothermal film is used as a heating body during working, heat is sent into a space in a radiation mode, and the comprehensive effect of the electrothermal film is superior to that of the traditional convection heating mode. The power supply is communicated with the chip through a lead to convert electric energy into heat energy. Because the heating chip is a pure resistance circuit, the conversion efficiency is high, and except a small loss (1%, the most (99%) is converted into heat energy.
The heating chip has great development potential and accords with the development trend of low-carbon economy. The heating chip heating mode is water-saving, land-occupied, automatic switching, energy-saving and material-saving, but the problems of the floor and the wallboard using the heating chip at present are that the heat dissipation effect is not ideal, and the heated space can not be rapidly heated.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a graphite alkene wallboard that generates heat that realizes indoor rapid heating up has avoided the radiating effect not good, heats the slow condition.
In order to achieve the purpose, the utility model provides a graphene heating wallboard, which comprises a heat insulation layer, a graphene heating layer, a heat transfer layer and a surface layer from bottom to top in sequence;
the heat insulation layer is a polyurethane heat insulation plate, the graphene heating layer is a graphene heating chip, the heat transfer layer is an alloy honeycomb core plate, a high-heat-conductivity filler is filled in a honeycomb cavity of the alloy honeycomb core plate, a heat conduction film formed by the high-heat-conductivity filler is coated between the alloy honeycomb core plate and the graphene heating chip, and the surface layer is an alloy decoration layer.
Preferably, the alloy honeycomb core plate comprises an upper-layer high-thermal-conductivity carbon fiber panel, an alloy honeycomb core and a lower-layer high-thermal-conductivity carbon fiber panel, and the alloy honeycomb core is hollow to form the honeycomb cavity.
Preferably, the alloy honeycomb cores are bonded into an intermediate layer, the high-thermal-conductivity carbon fiber panel is bonded with the intermediate layer through a normal-temperature curing structural adhesive, and the low-thermal-conductivity carbon fiber panel is bonded with the intermediate layer through a normal-temperature curing structural adhesive.
Preferably, the honeycomb cavity of the alloy honeycomb core is in a regular hexagon shape;
the alloy honeycomb core has a pore size of one of 8mm, 16mm and 32 mm.
Preferably, the thickness of the polyurethane heat insulation plate is 3-6 cm;
the thickness of the graphene heating chip is 28-35 μm;
the thickness of the alloy honeycomb plate with the high-performance coating is 0.8-2.0 cm;
the thickness of the high-performance coating is 0.01-0.05 mm.
The utility model also provides a preparation method of graphite alkene wallboard that generates heat that realizes indoor rapid heating up, the method includes following step:
1) cutting the polyurethane board according to the size of the heating wallboard, and taking the cut board as a heat insulation layer;
2) processing an alloy honeycomb core through a honeycomb core die, and bonding a plurality of alloy honeycomb cores through an adhesive;
3) filling a high-thermal-conductivity filler in a honeycomb cavity of the alloy honeycomb core, and solidifying for 24 hours to form an intermediate layer of the alloy honeycomb core plate;
bonding an upper-layer high-thermal-conductivity carbon fiber panel on the upper surface of the middle layer, and bonding a lower-layer high-thermal-conductivity carbon fiber panel on the lower surface of the middle layer;
4) coating a high-thermal-conductivity filler on the lower surface of the alloy honeycomb core plate, cooling to form a thermal-conductivity film, and adhering the lower surface of the alloy honeycomb core plate to the upper surface of the graphene heating layer;
5) and attaching the lower surface of the graphene heating layer to the heat insulation layer.
The utility model provides a pair of realize indoor rapid heating up's graphite alkene wallboard that generates heat has beneficial effect is, this graphite alkene intermediate layer wallboard's graphite alkene generate heat the upper surface of chip and cover alloy honeycomb core, the two surfaces are high heat conduction fiber panel about the core, for having alloy honeycomb core between the two panels, high heat conduction filler is filled to the honeycomb intracavity of alloy honeycomb core, this makes the heat energy that graphite alkene generates heat the chip and can be quick transmit the room by alloy honeycomb core for the low temperature room rapid heating up.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
Drawings
Further objects, functions and advantages of the present invention will become apparent from the following description of embodiments of the present invention, with reference to the accompanying drawings, in which:
fig. 1 shows a cross-sectional structure view of a graphene sandwich wall panel in an embodiment of the present invention;
fig. 2 shows a structural diagram of an alloy honeycomb core plate in an embodiment of the present invention.
Reference numerals:
1-a surface layer; 2-heat transfer layer, alloy honeycomb core plate; 201-alloy honeycomb core; 202-upper high thermal conductivity fiber panel; 203-lower high thermal conductivity fiber panel; 3-interlayer, graphene heating chip; 4-heat insulation layer and polyurethane heat insulation board.
Detailed Description
The objects and functions of the present invention and methods for accomplishing the same will be apparent by reference to the exemplary embodiments. However, the present invention is not limited to the exemplary embodiments disclosed below; it can be implemented in different forms. The nature of the description is merely to assist those skilled in the relevant art in a comprehensive understanding of the specific details of the invention.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, the same reference numerals denote the same or similar parts, or the same or similar steps.
The utility model provides a realize indoor rapid heating up's graphite alkene wallboard that generates heat, this graphite alkene wallboard that generates heat by the bottom-up includes the insulating layer in proper order, graphite alkene generates heat the layer, heat transfer layer and top layer, the insulating layer is the polyurethane heat insulating board, graphite alkene generates heat the layer and generates heat the chip for graphite alkene, the heat transfer layer is alloy honeycomb core, fill high heat conduction filler in the honeycomb intracavity of alloy honeycomb core, paint the heat conduction film that is formed by high heat conduction filler between alloy honeycomb core and the graphite alkene chip that generates heat, the top layer is the alloy decorative layer.
As shown in fig. 1, is a cross-sectional structure diagram of the graphene heating wall board in the embodiment of the present invention. The embodiment provides a graphene heating wallboard which sequentially comprises a heat insulation layer-polyurethane heat insulation board 4, a graphene heating layer-graphene heating chip 3, a heat transfer layer-alloy honeycomb core board 2 and a surface layer-alloy decorative surface 1 from bottom to top.
The lower surface of polyurethane heat insulating board 4 is through gluing and wall body surface laminating, the upper surface of polyurethane heat insulating board 4 is through gluing and the lower surface laminating of graphite alkene chip 3 that generates heat, the upper surface of graphite alkene chip 3 that generates heat is coated with the heat conduction film that a layer thickness is 0.02mm by high heat conduction filler formation, then through the bonding mode with 2 lower surface bonding of alloy honeycomb core, the upper surface of alloy honeycomb core 2 is in the same place with alloy decorative cover 1 veneer, the wall panel that generates heat of graphite alkene in this embodiment is become in the combination of four-layer structure, wall panel thickness is 5 cm.
As shown in fig. 2, which is a structural diagram of the alloy honeycomb core plate in this embodiment, the alloy honeycomb core plate 2 includes an upper high thermal conductivity carbon fiber panel 202, an intermediate layer 201, and a lower high thermal conductivity carbon fiber panel 203, the intermediate layer 201 is bonded by a plurality of alloy honeycomb cores 204, the alloy honeycomb cores 204 are hollow regular hexahedrons, a honeycomb cavity is formed in the cavity, the pore diameter of the honeycomb cavity is 8mm, and a high thermal conductivity filler is filled in the cavity. The upper-layer high-thermal-conductivity carbon fiber panel 202 is bonded with the middle layer 201 through a normal-temperature curing structural adhesive, and the lower-layer high-thermal-conductivity carbon fiber panel 203 is bonded with the middle layer 201 through a normal-temperature curing structural adhesive.
According to the embodiment of the present invention, the high thermal conductivity filler filled in the honeycomb cavity of the alloy honeycomb core 204 comprises a first mixture of RSN silicone resin, silanol resin and butane oxyl intermediate according to a certain ratio, and a second mixture of zirconia toughened alumina powder and carbon nanotube reinforced powder according to a ratio of 1: 1. In some embodiments, the first mixture ratio is mixed according to the following ratio: the composite material is prepared by melting a first mixing agent and a second mixing agent in a ratio of 3-4: 1, wherein the ratio of RSN organic silicon resin, silanol resin and a butane oxyl intermediate is 5-6: 2-2.5: 1-1.3, and filling the honeycomb cavity with the composite material.
According to the embodiment of the utility model, the heat conduction film that the upper surface of graphite alkene chip 3 that generates heat was paintd is high heat conduction filler, and high heat conduction filler includes the first mixture that RSN organic silicon resin, silanol acid resin and butane oxygen base midbody according to certain ratio are constituteed to and by the second mixture that zirconia toughened alumina powder and carbon nanotube reinforcing powder mix according to 1:1 proportion. In some embodiments, the first mixture ratio is mixed according to the following ratio: the ratio of the RSN organic silicon resin, the silanol resin and the butane oxyl intermediate is 5-6: 2-2.5: 1-1.3, the first mixing agent and the second mixing agent are mixed and melted according to the ratio of 3-4: 1, and then the mixture is coated on the upper surface of the graphene chip 3 to form the heat-conducting film.
It will be understood by those skilled in the art that other suitable thermal conductive agents can be selected for the highly thermally conductive filler and the thermally conductive film, and the preparation of the thermal conductive agent described above in the embodiments of the present application is preferred as the thermally conductive material.
The embodiment also provides a preparation method of the graphene heating wallboard for realizing indoor rapid heating, which comprises the following steps:
1) cutting the polyurethane board according to the size of the heating wallboard, and taking the cut board as a heat insulation layer;
2) processing an alloy honeycomb core through a honeycomb core die, and bonding a plurality of alloy honeycomb cores through an adhesive;
3) filling a high-thermal-conductivity filler in a honeycomb cavity of the alloy honeycomb core, and solidifying for 24 hours to form an intermediate layer of the alloy honeycomb core plate;
4) coating metal glue on the lower-layer high-thermal-conductivity carbon fiber panel, adhering the lower-layer high-thermal-conductivity carbon fiber panel to the lower surface of the solidified and molded middle layer, coating metal glue on the upper-layer high-thermal-conductivity carbon fiber panel, and adhering the upper-layer high-thermal-conductivity carbon fiber panel to the upper surface of the middle layer to form an alloy honeycomb core plate;
5) coating a high-thermal-conductivity filler on the lower surface of the alloy honeycomb core plate, cooling to form a thermal-conductive film, and then adhering the lower surface of the alloy honeycomb core plate to the upper surface of the graphene heating layer;
6) attaching the lower surface of the graphene heating layer to the heat insulation layer;
7) and finally, adhering the alloy decorative layer to the upper surface of the alloy honeycomb core plate.
And (4) mutually sticking the four-layer structure together according to the operation of the steps to prepare the graphene heating wallboard.
In the using process, after the graphene heating wall board in the embodiment is electrified, the graphene heating layer rapidly heats up to 50 ℃, the combination of the two layers of high-thermal-conductivity fiber panels in the alloy honeycomb core board and the high-thermal-conductivity filler in the honeycomb cavity rapidly conducts heat to the alloy decorative layer, and the heat is diffused indoors through the alloy decorative layer, so that the indoor temperature is rapidly raised, and the purpose of rapid heating is achieved.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
Claims (5)
1. A graphene heating wallboard for realizing indoor rapid heating is characterized by comprising a heat insulation layer, a graphene heating layer, a heat transfer layer and a surface layer from bottom to top in sequence;
the heat insulation layer is a polyurethane heat insulation plate, the graphene heating layer is a graphene heating chip, and the heat transfer layer is an alloy honeycomb core plate; and filling a high-thermal-conductivity filler in a honeycomb cavity of the alloy honeycomb core plate, smearing a thermal-conductive film formed by the high-thermal-conductivity filler between the alloy honeycomb core plate and the graphene heating chip, and enabling the surface layer to be an alloy decorative layer.
2. The graphene heating wall plate according to claim 1, wherein the alloy honeycomb core plate comprises an upper high-thermal-conductivity carbon fiber panel, an alloy honeycomb core and a lower high-thermal-conductivity carbon fiber panel, and the alloy honeycomb core is hollow to form the honeycomb cavity.
3. The graphene heating wallboard according to claim 2, wherein the plurality of alloy honeycomb cores are bonded into an intermediate layer, the upper-layer high-thermal-conductivity carbon fiber panel is bonded with the intermediate layer through a normal-temperature curing structural adhesive, and the lower-layer high-thermal-conductivity carbon fiber panel is bonded with the intermediate layer through a normal-temperature curing structural adhesive.
4. The graphene heating wall plate according to claim 3, wherein the honeycomb cavities of the alloy honeycomb core are regular hexagons;
the alloy honeycomb core has a pore size of one of 8mm, 16mm and 32 mm.
5. The graphene heat-generating wallboard of any one of claims 1-4, wherein the thickness of the polyurethane thermal insulation board is 3-6 cm;
the thickness of the graphene heating chip is 28-35 μm;
the thickness of the alloy honeycomb plate with the high-performance coating is 0.8-2.0 cm;
the thickness of the high-performance coating is 0.01-0.05 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201921131331.3U CN210740519U (en) | 2019-07-18 | 2019-07-18 | Graphene heating wallboard capable of achieving indoor rapid heating |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921131331.3U CN210740519U (en) | 2019-07-18 | 2019-07-18 | Graphene heating wallboard capable of achieving indoor rapid heating |
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| CN210740519U true CN210740519U (en) | 2020-06-12 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110332589A (en) * | 2019-07-18 | 2019-10-15 | 北京优意适科技有限公司 | It is a kind of to realize the indoor graphene fever wallboard being rapidly heated and its preparation process |
| CN115265280A (en) * | 2022-04-13 | 2022-11-01 | 杭州巨力绝缘材料有限公司 | Carbon fiber bulletproof heating wallboard and manufacturing method |
-
2019
- 2019-07-18 CN CN201921131331.3U patent/CN210740519U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110332589A (en) * | 2019-07-18 | 2019-10-15 | 北京优意适科技有限公司 | It is a kind of to realize the indoor graphene fever wallboard being rapidly heated and its preparation process |
| CN115265280A (en) * | 2022-04-13 | 2022-11-01 | 杭州巨力绝缘材料有限公司 | Carbon fiber bulletproof heating wallboard and manufacturing method |
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