CN210725808U - High-ductility easy-heat-conducting silica gel pad - Google Patents
High-ductility easy-heat-conducting silica gel pad Download PDFInfo
- Publication number
- CN210725808U CN210725808U CN201921341016.3U CN201921341016U CN210725808U CN 210725808 U CN210725808 U CN 210725808U CN 201921341016 U CN201921341016 U CN 201921341016U CN 210725808 U CN210725808 U CN 210725808U
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- silica gel
- heat
- pad body
- conduction block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 239000000741 silica gel Substances 0.000 title claims abstract description 47
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 37
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- 238000005253 cladding Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 210000003934 vacuole Anatomy 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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- Mattresses And Other Support Structures For Chairs And Beds (AREA)
Abstract
The utility model discloses a high ductility easy heat conduction silica gel pad, it includes the upper padding body and fills up the body down, with the upper padding body with fill up body connection and vertically down be provided with the spliced pole, fill up the body and fill up the middle zone vacuole formation of the body down at the upper padding body. A plurality of first heat conduction blocks and second heat conduction blocks which are arranged in a staggered mode are arranged in the cavity in the middle of the upper cushion body and the lower cushion body, and each of the first heat conduction blocks and the second heat conduction blocks consists of a metal plate layer arranged inside the first heat conduction blocks and a heat conduction silicon adhesive layer coated outside the metal plate layer. The metal plate layer in the first heat conduction block is arranged in parallel with the upper cushion body, the metal plate layer in the second heat conduction block is arranged perpendicular to the upper cushion body, and the height of the second heat conduction block is larger than that of the first heat conduction block. The utility model discloses a heat conduction silica gel pad is through setting up a plurality of first heat conduction pieces and the second heat conduction piece between the upper padding body and the lower padding body for when it receives pressure or tensile force and is extended, each heat conduction piece does not influence each other, therefore can adapt to the deformation of silica gel pad, does not influence its ductility.
Description
Technical Field
The utility model relates to a composite silica gel material technical field, concretely relates to high ductility easily leads heat silica gel pad.
Background
The electrical components generate heat during operation, and usually a heat sink or a heat dissipation connecting seat is required to be additionally installed for cooling. However, it is difficult to completely contact the heat sink or the heat dissipating connector with the heating element, and a certain space gap is formed, thereby seriously affecting the cooling efficiency. Therefore, an elastic heat-conducting gasket is usually disposed in the gap between the heat generating device and the heat sink or the metal connecting seat to achieve the effect of increasing the cooling speed.
Through compound metal level can improve its heat conduction efficiency by a wide margin in heat conduction silica gel pad, however, there is ductility difference or the poor scheduling problem of compatibility with the silica gel pad body in the metal level usually, therefore sets up the user demand that one deck metal heat-conducting layer is difficult to satisfy silica gel pad through simple in silica gel pad, can appear often that silica gel pad ductility is poor or silica gel pad easy fracture scheduling problem.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above disadvantages, an object of the present invention is to provide a highly ductile and easily heat-conductive silicone pad.
The utility model discloses a high ductility easy heat conduction silica gel pad includes the last pad body and the lower pad body of mutual parallel arrangement, go up the pad body with the lower pad body through with go up the pad body with the spliced pole that lower pad body coupling and perpendicular set up is connected go up the pad body with the centre of the lower pad body is provided with a plurality of heat conduction pieces, the heat conduction piece including set up in its middle part sheet metal layer and cladding in the outside heat conduction silica gel layer of sheet metal layer, adjacent two inside the heat conduction piece sheet metal layer mutually perpendicular sets up. Set up a plurality of heat conduction pieces between the upper padding body and the lower padding body, make the utility model discloses a silica gel pad receives pressure or tensile force when being extended, and each heat conduction piece does not influence each other, therefore can adapt to the deformation of silica gel pad, can not cause negative effects to the ductility of silica gel pad, can ensure the quick transmission to the heat through the sheet metal layer at the inside setting of every heat conduction piece.
Furthermore, the heat conduction block comprises a first heat conduction block and a second heat conduction block, a metal plate layer in the first heat conduction block is arranged in parallel with the upper cushion body, a metal plate layer in the second heat conduction block is arranged perpendicular to the upper cushion body, and the height of the second heat conduction block is larger than that of the first heat conduction block. Therefore, the second heat conducting block can provide enough supporting force for the silica gel pad and can quickly transfer heat between the upper pad body and the lower pad body.
Furthermore, the upper edge and the lower edge of the metal plate layer of the second heat conduction block are bent towards the transverse central axis of the metal plate layer. Therefore, when the silica gel pad is pressed, the metal plate layer can not cut off or damage the heat conduction silica gel layer arranged outside the metal plate layer.
Further, the easily heat conduction silica gel pad of high ductility still include the heat conduction piece bayonet socket, be provided with a plurality of plug connectors on the heat conduction piece bayonet socket, all be provided with on the heat conduction silica gel layer of first heat conduction piece and second heat conduction piece with plug connector shape assorted inserting groove, the width of the inserted tongue of plug connector is followed and is close to the inserting groove is to keeping away from the inserting groove increases gradually. Therefore, the plug connector can be firmly connected in the plug groove, so that the first heat-conducting block and the second heat-conducting block are firmly connected on the heat-conducting block plug seat in a clamped mode.
Furthermore, a plurality of elastic fixing columns are arranged on the side surface of the lower cushion body close to the upper cushion body, fixing grooves matched with the fixing columns are arranged on the heat conduction block insertion seats, and the fixing columns and the fixing grooves are in interference fit. Therefore, the heat conducting block inserting seat can be firmly connected with the lower cushion body.
Furthermore, release film layers are respectively arranged on the upper surface of the upper cushion body and the lower surface of the lower cushion body. Therefore, multiplicable the utility model discloses a mechanical strength of silica gel pad prolongs its life.
Drawings
FIG. 1 is a schematic structural diagram of a preferred embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a first heat-conducting block according to a preferred embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of a second heat-conducting block according to a preferred embodiment of the present invention;
fig. 4 is a schematic structural view of a heat-conducting block socket according to a preferred embodiment of the present invention.
In the figure:
1-upper pad body, 2-lower pad body, 3-connecting column, 41-first heat conducting block, 411-first metal plate layer, 412-first heat conducting silica gel layer, 413-first inserting groove, 42-second heat conducting block, 421-second metal plate layer, 422-second heat conducting silica gel layer, 423-second inserting groove, 5-heat conducting block inserting seat, 51-inserting piece, 511-inserting tongue, 52-fixing groove, 6-fixing column and 7-release film layer.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
Referring to fig. 1, the utility model discloses an easy heat conduction silica gel pad of high ductility includes the upper padding body 1 and the lower padding body 2 of mutual parallel arrangement, is close to in the centre of the upper padding body 1 and the lower padding body 2 the utility model discloses a silica gel pad's edge is provided with four and is connected and vertically spliced pole 3 with the upper padding body 1 or the lower padding body 2 respectively, from this, forms the cavity in the middle zone of the upper padding body 1 and the lower padding body 2. A plurality of first heat-conducting blocks 41 and second heat-conducting blocks 42 which are arranged in a staggered mode are arranged in the cavity in the middle of the upper cushion body 1 and the lower cushion body 2. The upper cushion body 1 and the lower cushion body 2 of the utility model are both made of heat-conducting silica gel materials compounded with metal oxides.
As shown in fig. 2, the first heat conduction block 41 includes a first metal plate layer 411 disposed in a middle portion thereof and a first heat conduction silica gel layer 412 coated outside the metal plate layer 411, and the first metal plate layer 411 is parallel to the upper pad body 1 or the lower pad body 2. As shown in fig. 3, the second heat conduction block 42 includes a second metal plate layer 421 disposed at the middle portion thereof and a second heat conduction silica gel layer 422 wrapped outside the second metal plate layer 421, and the second metal plate layer 421 is perpendicular to the upper pad body 1 or the lower pad body 2. The upper and lower edge of second sheet metal layer 421 of second heat conduction piece 42 is buckled to its horizontal axis direction, therefore avoids the utility model discloses a second sheet metal layer 421 destroys second heat conduction silica gel layer 422 when the silica gel pad receives the extrusion. The utility model discloses a second heat conduction piece 42 highly is greater than the height of first heat conduction piece 41, therefore when the gasket received the extrusion rather than the vertical direction's power, second heat conduction piece 42 can provide sufficient holding power to it.
The first heat-conducting block 41 and the second heat-conducting block 42 of the present invention are fixed on the heat-conducting block socket 5 and then placed in the cavity between the upper cushion body 1 and the lower cushion body 2. As shown in fig. 4, the heat conduction block socket 5 is provided with a plurality of plug connectors 51, the longitudinal section of the insertion tongue 511 of each plug connector 51 is triangular, and the top end of the insertion tongue 511 is arranged towards the direction far away from the body of the heat conduction block socket 5, and the insertion tongue 511 can be in any other shape, and it is only necessary to ensure that the width of the insertion tongue 511 gradually increases from the direction far away from the body of the heat conduction block socket 5 to the direction close to the body of the heat conduction block socket 5. The bottom of each of the first heat conduction block 41 and the second heat conduction block 42 is provided with a first insertion groove 413 and a second insertion groove 423 which are matched with the insertion tongue 511, and the first insertion groove 413 and the second insertion groove 423 are in interference fit with the insertion piece 51. Therefore, a plurality of first heat conduction blocks 41 and second heat conduction blocks 42 can be arranged between the upper pad body 1 and the lower pad body 2 through the heat conduction block inserting seats 5 at one time. The area of the heat conduction block inserting seat 5 can be the same as or smaller than the area of the upper cushion body 1 or the lower cushion body 2, and the first heat conduction blocks 41 and the second heat conduction blocks 42 can be fully distributed between the upper cushion body 1 and the lower cushion body 2 by arranging a plurality of heat conduction block inserting seats 5 between the upper cushion body 1 and the lower cushion body 2.
A plurality of fixing columns 6 which are integrally formed with the lower cushion body 2 are arranged on the side surface of the lower cushion body 2 close to the upper cushion body 1, fixing grooves 52 matched with the fixing columns 6 are arranged on the heat conducting block inserting seats 5, and the fixing columns 6 are in interference fit with the fixing grooves 52. The heat conducting block inserting seat 5 can be fixed on the lower cushion body 2 through the fixing column 6.
As an optimized embodiment of the present invention, the upper surface of the upper cushion body 1 and the lower surface of the lower cushion body 2 can be respectively provided with a release film layer 7 to increase the puncture resistance of the silica gel cushion of the present invention.
When the silica gel pad of the utility model is used, the first heat conduction block 41 and the second heat conduction block 42 are fixed on the heat conduction block inserting seat 5 in a staggered manner, and then the heat conduction block inserting seat 5 is inserted into the fixing column 6 of the lower pad body 2. Therefore, the utility model discloses a when the silica gel pad received rather than the pressure of vertical direction, the upper and lower side of second heat conduction piece 42 leaned on tightly with the upper padding body 1 and lower bolster body 2 respectively, and the inside second sheet metal layer 421 of second heat conduction piece 42 makes heat conduction efficiency higher, and when the pressure that receives on the silica gel pad continued to increase, the upper and lower side of first heat conduction piece 41 also was close to with the upper padding body 1 and lower bolster body 2 respectively mutually, and first sheet metal layer 411 has further increased heat conduction efficiency. Because the utility model discloses a first heat conduction piece 41 and second heat conduction piece 42 in the silica gel pad are independent setting, consequently, when the silica gel pad received and dragged the power, still can ensure that it has good ductility, the fracture can not appear or the relatively poor problem of extension elasticity.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (6)
1. The utility model provides a high ductility easy heat conduction silica gel pad, includes the last pad body and the lower pad body that parallel arrangement each other, its characterized in that, go up the pad body with the lower pad body through with go up the pad body with the spliced pole that the lower pad body was connected and was set up perpendicularly go up the pad body with the centre of the lower pad body is provided with a plurality of heat conduction pieces, the heat conduction piece including set up in its middle part the metal sheet layer with the cladding in the outside heat conduction silica gel layer of metal sheet layer, adjacent two inside the heat conduction piece the metal sheet layer mutually perpendicular sets up.
2. The silica gel pad of claim 1, wherein the heat conduction block comprises a first heat conduction block and a second heat conduction block, a metal plate layer inside the first heat conduction block is parallel to the upper pad body, a metal plate layer inside the second heat conduction block is perpendicular to the upper pad body, and the height of the second heat conduction block is greater than that of the first heat conduction block.
3. The high-ductility easy-heat-conduction silica gel pad according to claim 2, wherein the upper and lower edges of the metal plate layer of the second heat-conduction block are bent toward the transverse central axis of the metal plate layer.
4. The silica gel pad of claim 3, further comprising a heat conduction block socket, wherein the heat conduction block socket is provided with a plurality of connectors, the heat conduction silica gel layers of the first heat conduction block and the second heat conduction block are provided with sockets matched with the shapes of the connectors, and the width of the plug tongue of each connector gradually increases from being close to the socket to being far away from the socket.
5. The silica gel pad with high ductility and easy heat conduction according to claim 4, wherein a plurality of elastic fixing columns are arranged on the side surface of the lower pad body close to the upper pad body, fixing grooves matched with the fixing columns are arranged on the heat conduction block insertion base, and the fixing columns and the fixing grooves are in interference fit.
6. The high-ductility easy-heat-conduction silica gel pad according to any one of claims 1 to 3, wherein release film layers are respectively arranged on the upper surface of the upper pad body and the lower surface of the lower pad body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921341016.3U CN210725808U (en) | 2019-08-19 | 2019-08-19 | High-ductility easy-heat-conducting silica gel pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921341016.3U CN210725808U (en) | 2019-08-19 | 2019-08-19 | High-ductility easy-heat-conducting silica gel pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210725808U true CN210725808U (en) | 2020-06-09 |
Family
ID=70937107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921341016.3U Expired - Fee Related CN210725808U (en) | 2019-08-19 | 2019-08-19 | High-ductility easy-heat-conducting silica gel pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210725808U (en) |
-
2019
- 2019-08-19 CN CN201921341016.3U patent/CN210725808U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200609 |