CN210722711U - Inductance assembly with down-leading type electrode - Google Patents
Inductance assembly with down-leading type electrode Download PDFInfo
- Publication number
- CN210722711U CN210722711U CN201922117789.XU CN201922117789U CN210722711U CN 210722711 U CN210722711 U CN 210722711U CN 201922117789 U CN201922117789 U CN 201922117789U CN 210722711 U CN210722711 U CN 210722711U
- Authority
- CN
- China
- Prior art keywords
- layer
- insulating substrate
- insulating
- hole
- electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to an inductance subassembly with draw formula electrode down, including insulating substrate one, insulating substrate two, electric property layer, first insulating layer, electric property enhancement layer, second insulating layer and termination electrode, insulating substrate one with it has to fill between the insulating substrate two the electric property layer, insulating substrate one with insulating substrate two includes a through-hole one and through-hole two respectively, insulating substrate one upper and lower surface with the upper and lower surface of insulating substrate two is equipped with the electric property layer, surface and inner wall are equipped with the first insulating layer about the electric property layer, be equipped with the electric property enhancement layer in surface and through-hole one and the through-hole two about the first insulating layer, be equipped with the second insulating layer outside the electric property enhancement layer. The utility model discloses a with the welding of termination electrode in the below of inductance assembly's circuit board, reduced inductance assembly's volume, do benefit to inductance assembly's miniaturization.
Description
Technical Field
The utility model relates to an inductance subassembly with draw formula electrode down.
Background
With the progress of technology, the development of electronic products toward being light, thin, small and small has been driven by the trend. Therefore, the size of the resistor, capacitor or inductor mounted on the printed circuit board of the electronic product is also reduced. In terms of integrally formed micro inductor, the structure is manufactured by forming an internal circuit through a winding method, packaging and forming, and forming terminal electrodes for external electrical connection on the left and right sides.
However, since the terminal electrodes of the conventional integrally formed micro inductor are located at the left and right sides of the component, the overall size of the component cannot be effectively reduced, and when the inductor is soldered on an external printed integrated circuit board through the terminal electrodes, the problem of solder paste leakage is likely to reduce the integration of the printed integrated circuit board.
SUMMERY OF THE UTILITY MODEL
In view of the above prior art's shortcoming, the utility model aims to provide an inductance subassembly with drop formula electrode, this utility model will hold the electrode welding in the below of inductance subassembly's circuit board, reduced the volume of inductance subassembly, do benefit to the miniaturization of inductance subassembly.
In order to achieve the above and other related objects, the present invention provides an inductor assembly with down-leading electrodes, comprising a first insulating substrate, a second insulating substrate, an electrical layer, a first insulating layer, an electrical enhancement layer, a second insulating layer and end electrodes, wherein the electrical layer is filled between the first insulating substrate and the second insulating substrate, the first insulating substrate and the second insulating substrate respectively comprise a first through hole and a second through hole, the upper and lower surfaces of the first insulating substrate and the upper and lower surfaces of the second insulating substrate are provided with the electrical layer, the upper and lower surfaces and the inner wall of the electrical layer are provided with the first insulating layer, the upper and lower surfaces of the first insulating layer and the first through hole and the second through hole are provided with the electrical enhancement layer, the electrical enhancement layer is provided with the second insulating layer, the end electrodes are respectively located below the first insulating substrate and the second insulating substrate, and sequentially pass through the second insulating layer, The electrical enhancement layer and the first insulating layer are connected with the electrical layer.
Preferably, the terminal electrode comprises a tin layer, a nickel layer and a copper layer, the tin layer is exposed outside, the inside of the tin layer is connected with the nickel layer, the inside of the nickel layer is connected with the copper layer, and the inside of the copper layer is connected with the electric layer.
Preferably, the electrical enhancement layer is made of a magnetic material.
Preferably, the first insulating layer and the second insulating layer have the same thickness, which is 0.05-0.2 mm.
Preferably, the thickness of the copper layer and the nickel layer is the same.
The utility model discloses an inductance component with draw formula electrode down has following beneficial effect: the end electrode is arranged at the lower end of the inductance assembly, so that the high-efficiency inductance assembly with the down-leading electrode is formed, the size of the inductance assembly is effectively reduced, and the problem of solder climbing and glue leakage is effectively solved.
Drawings
Fig. 1 is a longitudinal sectional view of an inductor assembly having down-leading electrodes.
1. A first insulating substrate; 2. a second insulating substrate; 3. an electrical layer; 4. a first insulating layer; 5. an electrical enhancement layer; 6. a terminal electrode; 7. a first through hole; 8. a second through hole; 9. a second insulating layer; 61. a copper layer; 62. a nickel layer; 63. and a tin layer.
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Please refer to fig. 1. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
As shown in fig. 1, the present invention relates to an inductor assembly with down-leading electrodes, comprising a first insulating substrate 1, a second insulating substrate 2, an electrical layer 3, a first insulating layer 4, an electrical enhancement layer 5, a second insulating layer 9 and end electrodes 6, wherein the electrical layer 3 is filled between the first insulating substrate 1 and the second insulating substrate 2, the first insulating substrate 1 and the second insulating substrate 2 respectively comprise a first through hole 7 and a second through hole 8, the electrical layer 3 is disposed on the upper and lower surfaces of the first insulating substrate 1 and the upper and lower surfaces of the second insulating substrate 2, the first insulating layer 4 is disposed on the upper and lower surfaces and the inner wall of the electrical layer 3, the electrical enhancement layer 5 is disposed in the upper and lower surfaces of the first insulating layer 4, the first through hole 7 and the second through hole 8, the second insulating layer 9 is disposed outside the electrical enhancement layer 5, the end electrodes 6 are respectively disposed below the first insulating substrate 1 and the second insulating substrate 2, and sequentially penetrates through the second insulating layer 9, the electrical property enhancement layer 5 and the first insulating layer 4 to be connected with the electrical property layer 3.
In this embodiment, the terminal electrode 6 includes a tin layer 63, a nickel layer 62 and a copper layer 61, the tin layer 63 is exposed, the inside of the tin layer is connected to the nickel layer 62, the inside of the nickel layer 62 is connected to the copper layer 61, and the copper layer 61 is connected to the electrical layer 3.
In the present embodiment, the electrical enhancement layer 5 is made of a magnetic material.
In the present embodiment, the thickness of the first insulating layer 4 is the same as that of the second insulating layer 9, and is 0.05 to 0.2 mm.
In the present embodiment, the copper layer 61 and the nickel layer 62 have the same thickness.
As described above, the inductance assembly with the down-lead electrode of the present invention has the following advantages: the end electrode is arranged at the lower end of the inductance assembly, so that the high-efficiency inductance assembly with the down-leading electrode is formed, the size of the inductance assembly is effectively reduced, and the problem of solder climbing and glue leakage is effectively solved. Therefore, the utility model overcomes the defects of the prior art and has high industrial utilization value and practical value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (5)
1. An inductor assembly having a down-lead electrode, comprising: the insulating substrate I and the insulating substrate II are filled with the electric layer, the insulating substrate I and the insulating substrate II respectively comprise a first through hole and a second through hole, the upper surface and the lower surface of the insulating substrate I and the upper surface and the lower surface of the insulating substrate II are provided with the electric layer, the upper surface and the lower surface of the electric layer and the inner wall of the electric layer are provided with the first insulating layer, the electric enhancement layers are arranged on the upper surface and the lower surface of the first insulating layer and in the first through hole and the second through hole, the second insulating layer is arranged outside the electric enhancement layers, and the end electrodes are respectively positioned below the insulating substrate I and the insulating substrate II and sequentially penetrate through the second insulating layer, the electric enhancement layers and the first insulating layer and are connected with the electric layer.
2. An inductor assembly having a down-lead electrode as claimed in claim 1, wherein: the terminal electrode comprises a tin layer, a nickel layer and a copper layer, wherein the tin layer is exposed outside, the inside of the tin layer is connected with the nickel layer, the inside of the nickel layer is connected with the copper layer, and the inside of the copper layer is connected with the electric layer.
3. An inductor assembly having a down-lead electrode as claimed in claim 1, wherein: the electrical enhancement layer is made of a magnetic material.
4. An inductor assembly having a down-lead electrode as claimed in claim 1, wherein: the first insulating layer and the second insulating layer are the same in thickness and are 0.05-0.2 mm.
5. An inductor assembly having a down-lead electrode as claimed in claim 2, wherein: the copper layer and the nickel layer have the same thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922117789.XU CN210722711U (en) | 2019-12-02 | 2019-12-02 | Inductance assembly with down-leading type electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922117789.XU CN210722711U (en) | 2019-12-02 | 2019-12-02 | Inductance assembly with down-leading type electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210722711U true CN210722711U (en) | 2020-06-09 |
Family
ID=70926474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922117789.XU Active CN210722711U (en) | 2019-12-02 | 2019-12-02 | Inductance assembly with down-leading type electrode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210722711U (en) |
-
2019
- 2019-12-02 CN CN201922117789.XU patent/CN210722711U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11769621B2 (en) | Inductor with an electrode structure | |
| US6292351B1 (en) | Multilayer ceramic capacitor for three-dimensional mounting | |
| US8878339B2 (en) | Chip-component structure and method of producing same | |
| US8050015B2 (en) | Composite electric element | |
| JP2009099913A (en) | Multi terminal type solid-state electrolytic capacitor | |
| TWI436380B (en) | Magnetic assembly having base | |
| US20150325364A1 (en) | Electrode structure and the corresponding electrical component using the same and the fabrication merhod thereof | |
| JP2006190929A (en) | Solid electrolytic capacitor and its manufacturing method | |
| CN210722711U (en) | Inductance assembly with down-leading type electrode | |
| TW201432754A (en) | Solid electrolytic capacitor package structure for decreasing equivalent series resistance and method of manufacturing the same | |
| JP2017011142A (en) | Ceramic electronic component | |
| US9330852B2 (en) | Tantalum capacitor and method of manufacturing the same | |
| CN110808150A (en) | Inductance assembly with down-leading type electrode and processing method thereof | |
| JP2007013043A (en) | Electrode assembly for mounting electric element, electric component employing the same, and solid electrolytic capacitor | |
| CN207731288U (en) | Radio frequency identification module | |
| CN206524233U (en) | A kind of inductor | |
| CN210640242U (en) | Inductance element without substrate | |
| KR20150049920A (en) | Tantalum capacitor and method of preparing the same | |
| CN210722701U (en) | Inductance element | |
| CN103972203A (en) | Circuit board structure with embedded electronic components and manufacture method thereof | |
| CN219800669U (en) | Mica capacitor capable of being surface-mounted | |
| KR102306715B1 (en) | Tantalum capacitor | |
| CN207895844U (en) | A kind of active SMD electromagnetic buzzers | |
| JPH03252193A (en) | Wiring board | |
| CN207895843U (en) | A kind of active SMD piezo buzzers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |