CN210721165U - Novel temperature regulating system of die carrier - Google Patents
Novel temperature regulating system of die carrier Download PDFInfo
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- CN210721165U CN210721165U CN201921938073.XU CN201921938073U CN210721165U CN 210721165 U CN210721165 U CN 210721165U CN 201921938073 U CN201921938073 U CN 201921938073U CN 210721165 U CN210721165 U CN 210721165U
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- 230000001105 regulatory effect Effects 0.000 title claims description 4
- 238000001816 cooling Methods 0.000 claims abstract description 43
- 239000007788 liquid Substances 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000003756 stirring Methods 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims description 22
- 238000007664 blowing Methods 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 5
- 230000001276 controlling effect Effects 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 10
- 238000013461 design Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010792 warming Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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Abstract
The embodiment of the utility model discloses temperature regulation system of novel die carrier, concretely relates to water heater field, including the microprocessor module, the input of microprocessor module is connected with operating module, temperature-sensing module and power module respectively, the output of microprocessor module is connected with temperature display module, information backup module, temperature regulation module and supplementary cooling module respectively. The utility model discloses an overall design utilizes the semiconductor refrigeration piece to transmit the surface with the heat in the die carrier, uses the thermantidote to blow to quick reduce the temperature around the die carrier, and utilize the inside liquid of storage water tank to conduct the heat on the die carrier out, make to cool down the die carrier replacement for cooling down to liquid, adopt agitator motor stirring liquid, the effectual area of contact who has increased heat and air, cooling that can be quick has possessed higher practicality.
Description
Technical Field
The embodiment of the utility model provides a relate to the water heater field, concretely relates to novel temperature regulation system of die carrier.
Background
The mould frame is a whole set of mould for producing specific powder products by pressing or re-pressing. The other support of the die set is also called the die set, for example, the die is assembled and fixed according to a certain rule and position on a die casting machine, the part which enables the die to be installed on the die casting machine to work is called the die set, and the die set consists of a push-out mechanism, a guide mechanism, a pre-reset mechanism die foot cushion block and a seat plate, and the temperature of the die set needs to be adjusted in the processing process.
The prior art has the following defects: in the processing process of a common die carrier, temperature adjustment needs to be carried out, and the integral temperature cooling speed is not fast enough, so that the waiting time is prolonged, and the working efficiency is greatly reduced.
SUMMERY OF THE UTILITY MODEL
Therefore, the embodiment of the utility model provides a novel temperature regulation system of die carrier, through the global design, utilize the semiconductor refrigeration piece with the surface of heat transfer in the die carrier, use the thermantidote to blow, thereby quick with the temperature reduction around the die carrier, and utilize the inside liquid of storage water tank to conduct out the heat on the die carrier, make to cool down the die carrier replacement for cooling down to liquid, adopt agitator motor stirring liquid, the effectual area of contact that has increased heat and air, can be quick cool down, higher practicality has been possessed, with the problem of solving among the prior art because the cooling rate leads to at a slow pace.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: a novel temperature adjusting system of a die carrier comprises a microprocessor module, wherein the input end of the microprocessor module is respectively connected with an operation module, a temperature sensing module and a power supply module, the output end of the microprocessor module is respectively connected with a temperature display module, an information backup module, a temperature adjusting module and an auxiliary cooling module, the output end of the microprocessor module is also connected with a timing unit, the output end of the timing unit is connected with an alarm unit, the microprocessor module is specifically a microprocessor, the temperature adjusting module comprises a cooling unit and a warming unit, the cooling unit comprises a cooling fan and a semiconductor refrigerating sheet, the warming unit comprises a heating coil, and the auxiliary cooling module specifically comprises a water storage tank and a stirring motor;
the temperature adjusting module is used for transferring heat in the die carrier to the outer surface through the semiconductor refrigerating sheet, and blowing heat outside the die carrier by using a cooling fan, so that the temperature around the die carrier is rapidly reduced, and the heating coil generates heat by controlling the heating coil in the heating unit to work, so that the temperature of the die carrier is raised;
the auxiliary cooling module is used for conducting the temperature on the die carrier out through the water storage tank surrounding the die carrier, and stirring the liquid in the water storage tank with the aid of the stirring motor to dissipate the heat in the liquid.
Further, the operation module is specifically an operation keyboard, and the operation module is used for inputting a temperature threshold value through the operation keyboard, so that the whole system can automatically adjust the temperature of the die carrier under the control of the microprocessor module.
Further, the power supply module is specifically an external power supply, and the power supply module is used for supplying power to the whole temperature regulation system through the external power supply, so that stable operation of the whole system is ensured.
Further, the temperature display module is specifically a display screen, and the temperature display module is used for directly displaying the temperature value during system adjustment through the display screen.
Further, the information backup module is specifically an information memory, and the information backup module is used for storing and backing up the temperature information adjusted each time through the information memory.
Furthermore, the temperature sensing module specifically is multiunit temperature sensor, and multiunit temperature sensor arranges in around the die carrier respectively, and the temperature sensing module is used for carrying out comprehensive monitoring to the temperature of die carrier through multiunit temperature sensor.
Furthermore, the timing unit is specifically a timer, the alarm unit is specifically a voice prompt, the timing unit is used for recording the running time of the whole system through the timer, when the time is reached in each work, a signal is transmitted to the alarm unit, and the voice prompt gives a voice prompt to people.
The embodiment of the utility model provides a have following advantage:
1. the utility model discloses an overall design utilizes the semiconductor refrigeration piece to transmit the heat in the die carrier to the surface, uses the thermantidote to blow to quick with the temperature reduction around the die carrier, and utilizes the liquid in the storage water tank to conduct the heat on the die carrier out, makes and cools down the die carrier and replaces for cooling down to liquid, adopts agitator motor stirring liquid, the effectual area of contact who increases heat and air, can quick cool down, has possessed higher practicality;
2. the utility model discloses a set up the timing module, can carry out the record to the single process time of die carrier, avoided the long-time overload operation of equipment to lead to the phenomenon of damage, provided certain guard action, the effectual life who prolongs equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.
Fig. 1 is an overall topology diagram provided in embodiment 1 of the present invention;
fig. 2 is a schematic block diagram provided in embodiment 1 of the present invention;
fig. 3 is a schematic diagram of a unit provided in embodiment 1 of the present invention;
in the figure: 1 microprocessor module, 2 operation modules, 21 operation keyboard, 3 temperature sensing module, 31 temperature sensor, 4 power supply modules, 41 external power supply, 5 temperature display module, 51 display screen, 6 information backup module, 61 information memory, 7 temperature regulation module, 8 auxiliary cooling module, 81 water storage tank, 82 stirring motor, 9 cooling unit, 91 cooling fan, 92 semiconductor refrigeration piece, 10 heating unit, 101 heating coil, 11 timing unit, 111 timer, 12 alarm unit, 121 voice prompt.
Detailed Description
The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 3 of the specification, the novel temperature regulation system for the die carrier of this embodiment includes a microprocessor module 1, an operation module 2, an operation keyboard 21, a temperature sensing module 3, a temperature sensor 31, a power supply module 4, an external power supply 41, a temperature display module 5, a display screen 51, an information backup module 6, an information memory 61, a temperature regulation module 7, an auxiliary cooling module 8, a water storage tank 81, a stirring motor 82, a cooling unit 9, a cooling fan 91, a semiconductor refrigeration sheet 92, a warming unit 10, a heating coil 101, a timing unit 11, a timer 111, an alarm unit 12, and a voice prompt 121, wherein an input end of the microprocessor module 1 is connected with the operation module 2, the temperature sensing module 3, and the power supply module 4, and an output end of the microprocessor module 1 is connected with the temperature display module 5, the temperature display, The temperature control system comprises an information backup module 6, a temperature regulation module 7 and an auxiliary cooling module 8, wherein the output end of a microprocessor module 1 is further connected with a timing unit 11, the output end of the timing unit 11 is connected with an alarm unit 12, the microprocessor module 1 is specifically a microprocessor, the temperature regulation module 7 comprises a cooling unit 9 and a heating unit 10, the cooling unit 9 comprises a cooling fan 91 and a semiconductor refrigerating sheet 92, the heating unit 10 comprises a heating coil 101, and the auxiliary cooling module 8 is specifically composed of a water storage tank 81 and a stirring motor 82;
the temperature adjusting module 7 is used for transferring heat in the die carrier to the outer surface through the semiconductor refrigerating sheet 92, and blowing heat outside the die carrier by using the cooling fan 91, so that the temperature around the die carrier is rapidly reduced, and the heating coil 101 generates heat by controlling the heating coil 101 in the heating unit 10 to work, so that the temperature of the die carrier is increased;
the auxiliary cooling module 8 is used for conducting the temperature on the die carrier out through a water storage tank 81 surrounding the die carrier, and stirring the liquid in the water storage tank 81 with the stirring motor 82 in an accelerating manner, so that the heat in the liquid is dissipated.
Further, the operation module 2 is specifically an operation keyboard 21, and the operation module 2 is used for inputting a temperature threshold value through the operation keyboard 21, so that the whole system can automatically adjust the temperature of the mold frame under the control of the microprocessor module 1, and a worker can conveniently operate through the operation module 2.
Further, the power supply module 4 is specifically an external power supply 41, and the power supply module 4 is configured to supply power to the entire temperature adjustment system through the external power supply 41, so as to ensure stable operation of the entire system and facilitate power supply to the entire system.
Further, the temperature display module 5 is specifically a display screen 51, and the temperature display module 5 is configured to directly display a temperature value during system adjustment through the display screen 51, so that a worker can directly view the temperature value conveniently.
Further, the information backup module 6 is specifically an information memory 61, and the information backup module 6 is configured to store and backup the temperature information adjusted each time through the information memory 61, so as to facilitate backup of the adjusted temperature information.
Further, temperature-sensing module 3 specifically is multiunit temperature sensor 31, and multiunit temperature sensor 31 arranges the die carrier in respectively around, and temperature-sensing module 3 is used for carrying out comprehensive monitoring through multiunit temperature sensor 31 to the temperature of die carrier, is convenient for carry out comprehensive monitoring to the die carrier, guarantees temperature monitoring's accuracy.
The implementation scenario is specifically as follows: when the utility model is implemented, the semiconductor refrigeration sheet 92 is inserted into the die carrier, the temperature regulation module 7 is used for transferring the heat in the die carrier to the outer surface through the semiconductor refrigeration sheet 92, the cooling fan 91 is used for blowing the heat outside the die carrier, thereby rapidly reducing the temperature around the die carrier, the heating coil 101 in the heating unit 10 is controlled to work, the heating coil 101 generates heat, thereby warming the die carrier, in addition, the auxiliary cooling module 8 is used for transferring the heat on the die carrier through the water storage tank 81 enclosed around the die carrier, the liquid in the water storage tank 81 transfers the heat on the die carrier, the stirring motor 82 is used for accelerating the stirring of the liquid in the water storage tank 81, thereby dissipating the heat in the liquid, the design utilizes the semiconductor refrigeration sheet 92 to transfer the heat in the die carrier to the outer surface, the cooling fan 91 is used for blowing, thereby rapidly reducing the temperature around the die carrier, and utilize the inside liquid conduction of storage water tank 81 on with the die carrier out for cooling down the die carrier and replacing for cooling down to liquid, adopt agitator motor 82 stirring liquid, the effectual area of contact who increases heat and air, cooling down that can be quick has possessed higher practicality.
Referring to fig. 1 to 3 in the specification, the novel temperature adjustment system for the mold frame further includes a timing unit 11, the timing unit 11 is specifically a timer 111, the alarm unit 12 is specifically a voice prompt 121, the timing unit 11 is configured to record the operation time of the whole system through the timer 111, and when the time is reached in each work, a signal is transmitted to the alarm unit 12, and the voice prompt 121 gives a voice prompt to people.
The implementation scenario is specifically as follows: the utility model discloses when implementing, timing unit 11 specifically is time-recorder 111, alarm unit 12 specifically is voice prompt 121, timing unit 11 is used for coming to record whole system's operating duration through time-recorder 111, after work reaches the time at every turn, will give alarm unit 12 with signal transmission, carry out voice prompt to people by voice prompt 121, such design can be taken notes the single process time of die carrier, avoided the long-time overload operation of equipment to lead to the phenomenon of damage, certain guard action is provided, the effectual life who prolongs equipment.
The working principle is as follows: firstly, a semiconductor refrigeration sheet 92 is inserted into a mold base, a temperature regulation module 7 is used for transferring heat in the mold base to the outer surface through the semiconductor refrigeration sheet 92, a cooling fan 91 is used for blowing heat outside the mold base, so that the temperature around the mold base is rapidly reduced, in addition, an auxiliary cooling module 8 is used for conducting heat on the mold base through a water storage tank 81 surrounding the mold base, liquid in the water storage tank 81 conducts out the heat on the mold base, and a stirring motor 82 is used for accelerating stirring of the liquid in the water storage tank 81, so that the heat in the liquid is dissipated, and the cooling operation of the mold base is completed;
secondly, the timing unit 11 is specifically a timer 111, the alarm unit 12 is specifically a voice prompt 121, the timing unit 11 is configured to record the operation time of the whole system through the timer 111, when the time of each operation reaches, a signal is transmitted to the alarm unit 12, and the voice prompt 121 gives a voice prompt to people.
Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (7)
1. The utility model provides a temperature governing system of novel die carrier, includes microprocessor module (1), its characterized in that: the input end of the microprocessor module (1) is respectively connected with an operation module (2), a temperature sensing module (3) and a power supply module (4), the output end of the microprocessor module (1) is respectively connected with a temperature display module (5), an information backup module (6), a temperature regulation module (7) and an auxiliary cooling module (8), the output end of the microprocessor module (1) is also connected with a timing unit (11), the output end of the timing unit (11) is connected with an alarm unit (12), the microprocessor module (1) is particularly a microprocessor, the temperature regulation module (7) comprises a cooling unit (9) and a heating unit (10), the cooling unit (9) comprises a cooling fan (91) and a semiconductor refrigerating sheet (92), and the heating unit (10) comprises a heating coil (101), the auxiliary cooling module (8) specifically comprises a water storage tank (81) and a stirring motor (82);
the temperature adjusting module (7) is used for transferring heat in the die carrier to the outer surface through the semiconductor refrigerating sheet (92), and blowing heat outside the die carrier by using a cooling fan (91), so that the temperature around the die carrier is rapidly reduced, and the heating coil (101) generates heat by controlling the heating coil (101) in the heating unit (10) to work, so that the temperature of the die carrier is raised;
the auxiliary cooling module (8) is used for conducting the temperature on the die carrier out through a water storage tank (81) surrounding the die carrier, and stirring the liquid in the water storage tank (81) with the aid of a stirring motor (82) in an accelerated mode, so that heat in the liquid is dissipated.
2. The novel temperature regulation system of the mold frame as claimed in claim 1, wherein: the operation module (2) is specifically an operation keyboard (21), and the operation module (2) is used for inputting a temperature threshold value through the operation keyboard (21), so that the whole system can automatically adjust the temperature of the die carrier under the control of the microprocessor module (1).
3. The novel temperature regulation system of the mold frame as claimed in claim 1, wherein: the power supply module (4) is specifically an external power supply (41), and the power supply module (4) is used for supplying power to the whole temperature regulating system through the external power supply (41), so that the stable operation of the whole system is ensured.
4. The novel temperature regulation system of the mold frame as claimed in claim 1, wherein: the temperature display module (5) is specifically a display screen (51), and the temperature display module (5) is used for directly displaying a temperature value during system adjustment through the display screen (51).
5. The novel temperature regulation system of the mold frame as claimed in claim 1, wherein: the information backup module (6) is specifically an information memory (61), and the information backup module (6) is used for storing and backing up the temperature information regulated each time through the information memory (61).
6. The novel temperature regulation system of the mold frame as claimed in claim 1, wherein: the temperature sensing module (3) is specifically a plurality of groups of temperature sensors (31), the plurality of groups of temperature sensors (31) are respectively arranged around the die carrier, and the temperature sensing module (3) is used for comprehensively monitoring the temperature of the die carrier through the plurality of groups of temperature sensors (31).
7. The novel temperature regulation system of the mold frame as claimed in claim 1, wherein: the timing unit (11) is specifically a timer (111), the alarm unit (12) is specifically a voice prompt (121), the timing unit (11) is used for recording the running time of the whole system through the timer (111), when the time is reached in each work, a signal is transmitted to the alarm unit (12), and the voice prompt (121) gives a voice prompt to people.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921938073.XU CN210721165U (en) | 2019-11-12 | 2019-11-12 | Novel temperature regulating system of die carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921938073.XU CN210721165U (en) | 2019-11-12 | 2019-11-12 | Novel temperature regulating system of die carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210721165U true CN210721165U (en) | 2020-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921938073.XU Expired - Fee Related CN210721165U (en) | 2019-11-12 | 2019-11-12 | Novel temperature regulating system of die carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210721165U (en) |
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2019
- 2019-11-12 CN CN201921938073.XU patent/CN210721165U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220919 Address after: No. 98, Xianglu Road, Yangchenghu Town, Xiangcheng District, Suzhou City, Jiangsu Province 215000 Patentee after: Suzhou Hangzhichen Precision Machinery Co.,Ltd. Address before: 215316 No. 395, Chengbei Yucheng Middle Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Kunshan lishija precision mould Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200609 |
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| CF01 | Termination of patent right due to non-payment of annual fee |