CN202111974U - Device temperature controlling apparatus - Google Patents
Device temperature controlling apparatus Download PDFInfo
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- CN202111974U CN202111974U CN2011201461859U CN201120146185U CN202111974U CN 202111974 U CN202111974 U CN 202111974U CN 2011201461859 U CN2011201461859 U CN 2011201461859U CN 201120146185 U CN201120146185 U CN 201120146185U CN 202111974 U CN202111974 U CN 202111974U
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- temperature
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- heat
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- control chip
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Abstract
The utility model discloses a device temperature controlling apparatus, including the following: a temperature sensor, which is positioned around a device on a single board requiring heat radiation to obtain the temperature of the device; a control chip, which is positioned on the single board for reading the device temperature, determining whether to heat or cool the device according to the device temperature, and sending corresponding control signals; a temperature-control apparatus, which is fixedly arranged on the surface of the device for heating or cooling the device according to the control signals sending by the control chip; and a radiator, which is connected with the temperature-control apparatus for radiating the heat of the device. With the technology scheme provided in the utility model, the temperature of the device can be guaranteed in the work temperature range without being influenced by the environment temperature; the chip life is raised; the problem is solved that the local heat radiation effect is unsatisfying; the noise caused by the base station fan running is eliminated; the volume of the device frame is minimized; and the application scenes of the base station equipment are expanded.
Description
Technical field
The utility model relates to communication apparatus temperature control field, particularly relates to a kind of device temperature control device.
Background technology
In the prior art; Base station system generally is made up of veneer, and veneer is concentrated and is placed in a casing or the machine frame, and the veneer heat radiation relies on fan to carry out; For example; A kind of novel air-cooled energy-saving device of base station self-cleaning of the prior art mainly comprises central controller, air-intake device and goes out wind apparatus, efficiently solves the heat radiation of the heat of communication base station room.
At present, along with the veneer function is on the increase, the device density of each veneer and power density all increase to some extent, and, the demanding device of temperature stability constantly is added on the veneer uses, thereby the temperature control of device is had higher requirement.But; Use the technical scheme that fan dispels the heat to the device on the veneer can only carry out the part heat radiation in the prior art, and can not freeze, in addition; When fan moves, also huge power consumption and noise can be produced, device can not be satisfied the high application requirements of ambient temperature stability.
Summary of the invention
The utility model provides a kind of device temperature control device, can not satisfy the problem of device to the requirement of ambient temperature high stable to use fan to dispel the heat in the solution prior art.
The utility model provides a kind of device temperature control device, comprising:
Temperature sensor, be positioned on the veneer device that needs heat radiation around, be used for the device temperature of acquisition device;
Control chip is positioned on the veneer, is used for the reading device temperature, and determines whether to heat or freeze for device according to device temperature, and sends control signal corresponding;
The temperature control device is fixed in the surface of device, is used for the control signal of sending according to control chip, for device heats or freezes;
Radiator is connected in the temperature control device, is used for the heat of device is distributed.
The utility model beneficial effect is following:
Through the temperature control device being affixed on the package surface of the device that needs heat radiation; Control chip sends control signal control temperature control device and device is heated or freezes according to the temperature of device surface; Solved in the prior art and to have used fan to dispel the heat can not to satisfy the problem of device to the requirement of ambient temperature high stable, the temperature that can guarantee device has improved the chip life-span in the working temperature of requirement on devices and not influenced by ambient temperature; Solved the not good problem of the local radiating effect of fan; And can eliminate the noise of base station fan running, reduce the machine frame volume, the application scenarios of extended base station equipment.
Description of drawings
Fig. 1 is the structural representation of the device temperature control device of the utility model embodiment;
Fig. 2 is each device mounting position view in the device temperature control device of the utility model embodiment;
Fig. 3 is the control sketch map that the device temperature control device of the utility model embodiment heats device or freezes;
Fig. 4 is the process chart of the device temperature control device of the utility model embodiment.
Embodiment
Use fan to dispel the heat to satisfy the problem of device in order to solve in the prior art to the requirement of ambient temperature high stable; The utility model provides a kind of device temperature control device; The device temperature control method of the utility model embodiment and device do not need fan, can the device on the veneer be dispelled the heat targetedly.Particularly, big or to power consumption on the veneer of base station system to the device that ambient temperature is had relatively high expectations, adopt the temperature control device to be affixed on the device package surface, to its active heat removal or heating.The temperature control device is controlled by the control chip on the veneer.Control chip sends control signal control temperature control device and device is heated or dispels the heat according to the temperature of device surface, the temperature that guarantees this device is in the working temperature of requirement on devices and not influenced by ambient temperature.Below in conjunction with accompanying drawing and embodiment, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, does not limit the utility model.
Device embodiment
Embodiment according to the utility model; A kind of device temperature control device is provided; Fig. 1 is the structural representation of the device temperature control device of the utility model embodiment; As shown in Figure 1, comprise according to the device temperature control device of the utility model embodiment: temperature sensor 10, control chip 11, temperature control device 12 and radiator 13.Below each module of the utility model embodiment is carried out detailed explanation.
Preferably, above-mentioned control signal can be pulse-width modulation (Pulse Width Modulation abbreviates PWM as) waveform, forward signal or negative-going signal;
In practical application, need on the base station system veneer to select heat radiation or the device higher to ambient temperature, mounting temperature sensor and reading device temperature near it are close to its surface placement or the TEC device are installed, and on the TEC device, adhere to fin.By control chip reading device temperature; And need to judge whether heating or refrigeration, and sending a control signal to power supply subsequently to the power supply of TEC device, power supply output control signal is given the TEC device; Heating or refrigeration; Regularly after a period of time, judge once more, circulate consistent device temperature in suitable controlled scope.
Preferably, also comprise according to the device temperature control device of the utility model embodiment: power supply, be connected to control chip 11 and temperature control device 12, be used to receive the control signal that control chip 11 sends, and transmit control signals to temperature control device 12.
In practical application, in base station system, the TEC that to need can select on area and the veneer plate surface size of the big device of power consumption, the key chip of heat radiation to be more or less the same is affixed on the device package surface with heat-conducting glue.Key chip can comprise: thermostatic control crystal oscillator (Oven Controlled Crystal Oscillator; Abbreviate OCXO as), central processing unit (Central Processing Unit; Abbreviate CPU as), field programmable gate array (Field-Programmable Gate Array abbreviates FPGA as) etc.And TEC is controlled by the control chip on the veneer.Control chip sends control signal control TEC to device heats or heat radiation according to the temperature of chip surface, under the environment that ambient temperature constantly changes, the temperature that guarantees this device is in the working temperature of requirement on devices.
In the utility model embodiment, essence is to chip heating or heat radiation on the system single board, with device temperature on the regulating system veneer through control chip control heating and cooling device.TEC can control only heating or refrigeration, also can replace with other devices with similar functions, needs the device of heat radiation to include but not limited to OCXO, CPU, FPGA, power module etc.The control signal of exporting to TEC can be the PWM waveform, also can be the signal that positive negative direction can change.Fin can the base station system shell, also can be special-purpose fin.In controlling unit, also can save power supply, directly control TEC by chip.The technical scheme of the utility model embodiment also can be used on same veneer with the fan heat dissipating method.
Can find out that from above-mentioned processing the utility model embodiment can more accurate control device temperature than conventional fan heat radiation, both can dispel the heat to device, also can heat, and can solve the not good problem of the local radiating effect of fan.Do not have noise, the TEC device does not need full-time work, reduces base station power consumption, has saved the space of machine frame.
Below in conjunction with accompanying drawing, the technical scheme of the utility model embodiment is illustrated.Fig. 2 is each device mounting position view in the device temperature control device of the utility model embodiment; Fig. 3 is the control sketch map that the device temperature control device of the utility model embodiment heats device or freezes; As shown in Figures 2 and 3, the device that relates to comprises: carry in the base station needs heat radiation on the veneer 20, veneer of device device 21, TEC 22, fin 23, be carried on the control chip 30 that is used to read temperature on the veneer and controls power supply output, export adjustable power supply 31 and temperature sensor 32.
Particularly, the demanding device 21 of ambient temperature to working on the veneer 20 is fixed in TEC 22 usefulness heat-conducting glues and so on material on the veneer 20 according to shown in Figure 2 in the selection base station system.Fin 23 is fixed on the TEC 22 with heat-conducting glue equally.Temperature sensor 32 is installed near the TEC 22 that needs radiating element.
Temperature sensor 32 detects the temperature of device 21 and reports control chip 30; The temperature of in control chip 30, judging current device is higher or on the low side, and control chip 30 can heat still heat radiation to power supply 31 output control signals with 22 pairs of devices of decision TEC 21 according to judged result.
If control chip 30 judged results are that the ambient temperature of device 21 is higher, control chip 30 output control signals are given power supply 31, and power supply 31 output PWM waveforms are to TEC 22, and TEC 22 is operated in radiating state, and heat rejects heat in the air through fin 23.Control chip 30 is regularly judged from the ambient temperature entering next round of temperature sensor 32 reading devices 21 after a period of time.
If control chip 30 judged results are that the ambient temperature of device 21 is on the low side, control chip 30 output control signals are given power supply 31, and power supply 31 output reverse voltages are to TEC 22, and TEC 22 is operated in heated condition.Control chip 30 is regularly judged from the ambient temperature entering next round of temperature sensor 32 reading devices 21 after a period of time.
If control chip 30 reads device 21 from temperature sensor 32 ambient temperature is in proper range, then control chip 30 does not send any order, and control chip 30 is not worked to reduce system power dissipation.
Can find out from above-mentioned processing; The chip that can be used for working temperature is had relatively high expectations according to the device temperature control device of the utility model embodiment, power consumption dispel the heat than large chip, veneer that power density is big or heat, and have solved the not good problem of the local radiating effect of fan.With respect to the fan heat radiation, can dispel the heat, also can heat, for main chip provides more stable operational environment, improve the chip life-span.In base station system, the device temperature control device can reduce base station noise, reduces the machine frame volume, expands the application scenarios of base station equipment.
Fig. 4 is the process chart of the device temperature control device of the utility model embodiment, as shown in Figure 4ly comprises following processing:
Step 401, the temperature of control chip reading device;
Step 402, control chip judge whether the temperature of device is normal, if be judged as is, then finish, otherwise, execution in step 403;
Step 403 judges whether and need heat that if be judged as be, then execution in step 404, otherwise, execution in step 407;
Step 404, control chip control power supply output forward voltage, power supply is exported forward voltage to TEC;
Step 405, TEC gives device heats;
Step 406, control chip judge whether to arrive timing, if be judged as are, then execution in step 501;
Step 407, control chip control power supply output negative voltage, power supply is exported negative voltage to TEC;
Step 408, TEC freezes to device;
Step 409, control chip judge whether to arrive timing, if be judged as are, then execution in step 401.
In sum; The utility model is implemented through the temperature control device being affixed on the package surface of the device that needs heat radiation, and control chip sends control signal control temperature control device and device is heated or freeze according to the temperature of device surface, has solved in the prior art use fan and has dispelled the heat and can not satisfy the problem of device to the requirement of ambient temperature high stable; The temperature that can guarantee device is in the working temperature of requirement on devices and not influenced by ambient temperature; Improve the chip life-span, solved the not good problem of the local radiating effect of fan, and can eliminate the noise of base station fan running; Reduce the machine frame volume, the application scenarios of extended base station equipment.
In a word, those skilled in the art can carry out various changes and modification to the utility model and not break away from the spirit and the scope of the utility model.Like this, belong within the scope of the utility model claim and equivalent technologies thereof if these of the utility model are revised with modification, the utility model also comprises these changes and modification interior.
Although be the example purpose, the preferred embodiment of the utility model is disclosed, it also is possible those skilled in the art will recognize various improvement, increase and replacement, therefore, the scope of the utility model should be not limited to the foregoing description.
Claims (8)
1. a device temperature control device is characterized in that, comprising:
Temperature sensor, be positioned on the veneer device that needs heat radiation around, be used to obtain the device temperature of said device;
Control chip is positioned on the said veneer, is used to read said device temperature, and determines whether to heat or freeze for said device according to said device temperature, and sends control signal corresponding;
The temperature control device is fixed in the surface of said device, is used for the said control signal of sending according to said control chip, for said device heats or freezes;
Radiator is connected in said temperature control device, is used for the heat of said device is distributed.
2. device as claimed in claim 1 is characterized in that, said device also comprises:
Power supply is connected to said control chip and said temperature control device, is used to receive the said control signal that said control chip sends, and transmits said control signal to said temperature control device.
3. device as claimed in claim 1; It is characterized in that; Said control chip is further used for: judge whether to arrive the scheduled time, if judge the said scheduled time of arrival, then read said device temperature from said temperature sensor once more; And determine whether to continue as said device according to said device temperature and heat or freeze, and send control signal corresponding.
4. device as claimed in claim 1 is characterized in that, said temperature control device comprises: electrothermal refrigeration device TEC.
5. device as claimed in claim 1 is characterized in that, said control signal comprises: pulse-width modulation PWM waveform, forward signal or negative-going signal.
6. device as claimed in claim 1 is characterized in that, said temperature control device passes through adhesive in the surface of said device.
7. device as claimed in claim 6 is characterized in that said adhesive comprises: heat-conducting glue.
8. device as claimed in claim 1 is characterized in that, said radiator for through the special-purpose fin of adhesive on said temperature control device, perhaps, said radiator is the base station system shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201461859U CN202111974U (en) | 2011-05-10 | 2011-05-10 | Device temperature controlling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201461859U CN202111974U (en) | 2011-05-10 | 2011-05-10 | Device temperature controlling apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN202111974U true CN202111974U (en) | 2012-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011201461859U Expired - Lifetime CN202111974U (en) | 2011-05-10 | 2011-05-10 | Device temperature controlling apparatus |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103033932A (en) * | 2012-12-21 | 2013-04-10 | 潍坊路加精工有限公司 | Self-cooled laser scanning galvanometer and method restraining temperature drift of self-cooled laser scanning galvanometer |
| CN105282272A (en) * | 2014-06-30 | 2016-01-27 | 宇龙计算机通信科技(深圳)有限公司 | Temperature adjusting device, method and mobile terminal |
| CN105446390A (en) * | 2014-09-25 | 2016-03-30 | 大陆汽车电子(长春)有限公司 | Device and method for providing suitable work environment for ECU |
| CN114326851A (en) * | 2021-11-17 | 2022-04-12 | 苏州浪潮智能科技有限公司 | Edge intelligent temperature control method and system based on TEC |
-
2011
- 2011-05-10 CN CN2011201461859U patent/CN202111974U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103033932A (en) * | 2012-12-21 | 2013-04-10 | 潍坊路加精工有限公司 | Self-cooled laser scanning galvanometer and method restraining temperature drift of self-cooled laser scanning galvanometer |
| CN103033932B (en) * | 2012-12-21 | 2015-07-22 | 潍坊路加精工有限公司 | Self-cooled laser scanning galvanometer and method restraining temperature drift of self-cooled laser scanning galvanometer |
| CN105282272A (en) * | 2014-06-30 | 2016-01-27 | 宇龙计算机通信科技(深圳)有限公司 | Temperature adjusting device, method and mobile terminal |
| CN105446390A (en) * | 2014-09-25 | 2016-03-30 | 大陆汽车电子(长春)有限公司 | Device and method for providing suitable work environment for ECU |
| CN114326851A (en) * | 2021-11-17 | 2022-04-12 | 苏州浪潮智能科技有限公司 | Edge intelligent temperature control method and system based on TEC |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120111 |
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| CX01 | Expiry of patent term |