CN210706393U - High-cleanliness antistatic chip packaging film - Google Patents
High-cleanliness antistatic chip packaging film Download PDFInfo
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- CN210706393U CN210706393U CN201921554951.8U CN201921554951U CN210706393U CN 210706393 U CN210706393 U CN 210706393U CN 201921554951 U CN201921554951 U CN 201921554951U CN 210706393 U CN210706393 U CN 210706393U
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- film
- antistatic
- cleanliness
- chip packaging
- packaging film
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Abstract
The utility model discloses an antistatic chip packaging film of high cleanliness, including protection film and antiseized antistatic layer, the protection film includes a substrate film and coating adhesive layer on the substrate film, antiseized antistatic layer bond in just on the protection film antiseized antistatic in situ has a plurality of conductive particles. The utility model discloses a packaging film has increased conductive particle in polymer film, and this conductive particle can in time release produced static, and then reduces static and produce, still can improve work efficiency when preventing that the chip is destroyed.
Description
Technical Field
The utility model relates to an antistatic chip packaging film of high cleanliness.
Background
With the rapid development of the semiconductor industry, various chips are introduced into the market, and the chip packaging film is produced. The packaging film which is circulated and used in the market at present mainly comprises an adhesive protective film and a layer of release paper coated with silicone oil release agent or latticed laminating paper. The packaging film with the structure can play a good role in packaging protection for the chip to a certain extent, but because the silicone oil release agent on the release paper plays an anti-sticking role and is in direct contact with the chip, the problem that the silicone oil release agent falls off and is attached to the chip can also occur, and the latticed laminating paper does not fall off the silicone oil release agent, but paper powder can be generated due to the paper material, so that the quality influence on the chip is generated, and the quality influence on a downstream packaging factory is also generated; in addition, there is also a method of using a coated paper (a release paper not coated with a silicone release agent), but because of the poor release effect of the coated paper, the static electricity generated when the adhesive protection film and the coated paper are torn off is larger, and the chip is damaged.
Disclosure of Invention
In order to solve the technical problem, an object of the utility model is to provide an antistatic chip packaging film of high cleanliness.
The utility model discloses a following technical scheme realizes: antistatic chip packaging film of high cleanliness factor, including protection film and antiseized antistatic layer, the protection film includes a substrate film and coating adhesive layer on the substrate film, antiseized antistatic layer bond in on the protection film just antiseized antistatic in situ has a plurality of conductive particles.
Preferably, the anti-adhesion and antistatic layer comprises a polymer film, and the conductive particles are dispersed in the polymer film.
Preferably, the polymer film includes a first surface and a second surface, the first surface is adhered to the protective film, wherein the first surface has a plurality of protrusions distributed at intervals, and a recess is formed between adjacent protrusions.
Preferably, the second surface of the polymer film is further provided with a support layer, and the support layer is made of plastic.
Preferably, the conductive particles are connected to each other to form a path.
Preferably, the paths are arranged in a chain.
The utility model discloses an antistatic chip packaging film of high cleanliness degree has following beneficial effect:
1) the packaging film of the utility model adds conductive particles in the polymer film, and the conductive particles can release the generated static in time, thereby reducing the generation of static, preventing the chip from being damaged and simultaneously improving the working efficiency;
2) after the anti-sticking antistatic layer is adhered to the protective film, only the raised positions are adhered to the adhesive layer, and the depressed positions are not adhered to the adhesive layer of the protective film, so that the adhesion area between the anti-sticking antistatic layer and the protective film is reduced, and the aim of easy tearing is fulfilled;
3) if bubbles are generated in the bonding process of the anti-sticking antistatic layer and the protective film, the bubbles can be transferred from the protrusions to the depressions and discharged, so that the effect of reducing the generation of the bubbles is achieved.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a sectional view of the present invention.
Fig. 2 is a cross-sectional view of another preferred embodiment of the present invention.
Fig. 3 is a cross-sectional view of an anti-adhesive and anti-static layer according to another preferred embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to the attached drawing 1 of the specification, the high-cleanliness antistatic chip packaging film comprises a protective film 1 and an anti-sticking antistatic layer 2, wherein the protective film 1 comprises a base material film 11 and an adhesive layer 12, the adhesive layer 12 is coated on one surface of the base material film 11, and the anti-sticking antistatic layer 2 is adhered to the base material film 11 through the adhesive layer 12 to form a whole. The anti-sticking antistatic layer 2 comprises a polymer film 21 and a plurality of conductive particles 22 dispersed in the polymer film 21, wherein the polymer film 21 comprises a first surface 211 and a second surface 212, the first surface 211 is adhered to the protective film 1, the first surface 211 is provided with a plurality of protrusions 21a distributed at intervals, and recesses 21b are formed between the adjacent protrusions 21 a. When the anti-static chip packaging film is used, a chip is placed on the protective film 1, the anti-static anti-sticking layer 2 covers the protective film 1, the adhesive layer 12 and the anti-static anti-sticking layer 2 are adhered to each other, the chip is fixed and protected in the chip, the chip packaging film adopting the structure has the advantages that only the convex positions are adhered to the adhesive layer after the anti-static anti-sticking layer is adhered to the protective film, and the concave positions cannot be adhered to the adhesive layer of the protective film, so that the adhesion area between the anti-static anti-sticking layer and the protective film is reduced, the aim of easy tearing is fulfilled, meanwhile, as the conductive particles are added in the polymer film, the conductive particles can release generated static in time, the generation of static is reduced, the chip is prevented from being damaged, and the working efficiency can be improved; in addition, if bubbles are generated during the bonding process, the bubbles can be transferred from the protrusions 21a to the depressions 21b and discharged, thereby achieving the effect of reducing the generation of bubbles.
Further, in another preferred embodiment, referring to fig. 2 of the specification, the second surface 212 of the polymer film is further provided with a support layer 23, the support layer 23 is made of plastic, and the support layer can support the polymer film, and meanwhile, since the support layer is made of plastic, paper powder scraps, dust and the like cannot be generated to affect the performance of the chip, so that the effect of high cleanliness can be achieved.
In another preferred embodiment, referring to fig. 3 of the specification, the conductive particles 22 are connected to each other in a contact manner to form a path, preferably, the path may be arranged in a chain-like manner, and tests show that the static electricity is greatly reduced in such a manner that the influence of the static electricity generated by tearing off the conductive particles on the chip is negligible.
While the foregoing description shows and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not intended to be exhaustive or to exclude other embodiments and may be used in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.
Claims (6)
1. Antistatic chip packaging film of high cleanliness factor, its characterized in that, including protection film and antiseized antistatic layer, the protection film includes a substrate film and coating adhesive layer on the substrate film, antiseized antistatic layer bond in on the protection film just antiseized antistatic in situ has a plurality of conductive particles.
2. The high-cleanliness antistatic chip packaging film according to claim 1, wherein the anti-sticking antistatic layer comprises a polymer film in which the conductive particles are dispersed.
3. The high-cleanliness antistatic chip packaging film according to claim 2, wherein the polymer film comprises a first surface and a second surface, the first surface is adhered to the protective film, wherein the first surface has a plurality of protrusions distributed at intervals, and a recess is formed between adjacent protrusions.
4. The high-cleanliness antistatic chip packaging film according to claim 3, wherein the second surface of the polymer film is further provided with a support layer, and the support layer is made of plastic.
5. The high-cleanliness antistatic chip packaging film according to claim 1, wherein the conductive particles are in contact with each other and connected to form a path.
6. The high-cleanliness antistatic chip packaging film according to claim 5, wherein the paths are arranged in a chain-like manner.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921554951.8U CN210706393U (en) | 2019-09-18 | 2019-09-18 | High-cleanliness antistatic chip packaging film |
| TW109208461U TWM605974U (en) | 2019-09-18 | 2020-07-02 | High cleanliness antistatic chip packaging film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921554951.8U CN210706393U (en) | 2019-09-18 | 2019-09-18 | High-cleanliness antistatic chip packaging film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210706393U true CN210706393U (en) | 2020-06-09 |
Family
ID=70967022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921554951.8U Active CN210706393U (en) | 2019-09-18 | 2019-09-18 | High-cleanliness antistatic chip packaging film |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN210706393U (en) |
| TW (1) | TWM605974U (en) |
-
2019
- 2019-09-18 CN CN201921554951.8U patent/CN210706393U/en active Active
-
2020
- 2020-07-02 TW TW109208461U patent/TWM605974U/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWM605974U (en) | 2021-01-01 |
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