CN210694479U

CN210694479U - PCB (printed circuit board) of dielectric filter

Info

Publication number: CN210694479U
Application number: CN201921134620.9U
Authority: CN
Inventors: 刘亚东
Original assignee: Suzhou Jiepin Electronic Technology Co ltd
Current assignee: Suzhou Jiepin Electronic Technology Co ltd
Priority date: 2019-07-18
Filing date: 2019-07-18
Publication date: 2020-06-05
Anticipated expiration: 2029-07-18

Abstract

The utility model discloses a dielectric filter PCB board, including the PCB base plate, be equipped with syntonizer pad area and coupling pad area on the PCB base plate, syntonizer pad area is equipped with two at least syntonizer pads, and coupling pad area is equipped with syntonizer connection pad, main coupling pad, auxiliary coupling pad and two electrode pad syntonizer pad areas and is used for welding the syntonizer; the resonator connecting bonding pads and the resonator bonding pads are configured in a one-to-one correspondence mode, a group of main coupling bonding pads are configured corresponding to each resonator connecting bonding pad, and each group of main coupling bonding pads are provided with two main welding points in conductive connection with the resonator connecting bonding pads; the auxiliary coupling bonding pads are arranged between the two adjacent main coupling bonding pads. The utility model discloses a dielectric filter PCB board, the design of rational layout pad, the increase is used for assisting the coupling pad with main coupling pad complex, can improve the flexibility of matching circuit design, and then improves dielectric filter's multiple performance index including standing-wave ratio and outband restrain.

Description

PCB (printed circuit board) of dielectric filter

Technical Field

The utility model relates to a communication equipment subassembly, concretely relates to dielectric filter PCB board.

Background

At present, there is a miniaturized filter, which uses a body made of solid dielectric material and a resonator (referred to as "solid dielectric resonator" for short) formed by metallizing (e.g. silver plating) the surface of the body, and a plurality of resonators and coupling between the resonators form a filter (referred to as "solid dielectric filter" for short). Among them, the solid dielectric filter is commonly available in two forms: the monolithic and discrete resonators forming the monolithic dielectric filter are integrated, and the coupling of the resonators is also performed in the integrated structure. The plurality of resonators forming the split dielectric filter are respectively independent resonator bodies, the coupling among the resonators is also a split element and comprises a capacitor or an inductor, and the split elements (the resonator bodies, the capacitors and the inductors) are assembled on a PCB to form the split dielectric filter.

The existing PCB board for assembling the discrete dielectric filter has poor rationality of pad design, so that the dielectric filter formed after assembly has poor performance matching, including standing-wave ratio, out-of-band rejection performance and the like.

Disclosure of Invention

The embodiment of the utility model provides a dielectric filter PCB board, reasonable layout pad design increases and is used for assisting the coupling pad with main coupling pad complex, can improve the flexibility of matching circuit design, and then improves dielectric filter's multiple performance index including standing-wave ratio and outband restrain.

In order to solve the technical problem, the utility model provides a dielectric filter PCB board, including the PCB base plate, be equipped with syntonizer pad area and coupling pad area on the PCB base plate, syntonizer pad area is used for welding the syntonizer, coupling pad area is used for welding the coupling between the syntonizer, and the coupling between at least two syntonizers and the syntonizer forms dielectric filter, syntonizer pad area is equipped with two at least syntonizer pads, coupling pad area is equipped with syntonizer connection pad, main coupling pad, supplementary coupling pad and two electrode pads, syntonizer connection pad, main coupling pad and supplementary coupling pad set up side by side in proper order, and syntonizer connection pad is close to syntonizer pad area and sets up; the resonator connecting bonding pads and the resonator bonding pads are configured in a one-to-one correspondence mode, a group of main coupling bonding pads are configured corresponding to each resonator connecting bonding pad, and each group of main coupling bonding pads are provided with two main welding points in conductive connection with the resonator connecting bonding pads; the auxiliary coupling bonding pads are arranged between the two adjacent main coupling bonding pads.

The utility model discloses a preferred embodiment, it is further including a plurality of main coupling pad is followed two electrode pad's line direction is evenly set up at the interval in proper order, and one of them main solder joint of first group main coupling pad is used for passing through coupling connection with its adjacent electrode pad, and one of them main solder joint of last group main coupling pad is used for passing through coupling connection with another electrode pad.

The utility model discloses a preferred embodiment, further include the supplementary coupling pad is used for passing through coupling connection with the respective one of them main solder joint of adjacent two sets of main coupling pads.

In a preferred embodiment of the present invention, it is further included that the coupling is one of a capacitor, an inductor or a resistor.

In a preferred embodiment of the present invention, the resonator pad area is provided with a through hole at the periphery of the resonator pad.

The utility model discloses a preferred embodiment, further include the periphery that the syntonizer pad district is located the syntonizer pad is equipped with the louvre.

The utility model has the advantages that:

the utility model discloses a dielectric filter PCB board, reasonable layout pad design, the increase is used for assisting the coupling pad with main coupling pad complex, can improve the flexibility of matching circuit design, and then improves dielectric filter's multiple performance index including standing-wave ratio and outband restrain.

Drawings

Fig. 1 is a schematic structural diagram of a dielectric filter PCB board according to an embodiment of the present invention;

fig. 2 is a first alternative of the dielectric filter PCB of fig. 1 in use;

fig. 3 is a second alternative of the dielectric filter PCB of fig. 1 in use.

The reference numbers in the figures illustrate: 2-PCB substrate, 4-resonator pad area, 6-coupling pad area, 8-resonator pad, 10-resonator connection pad, 12-main coupling pad, 14-auxiliary coupling pad, 16-electrode pad, 18-main welding point, 20-through hole and 22-radiating hole.

Detailed Description

The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.

Examples

Referring to fig. 1, the present embodiment discloses a dielectric filter PCB, which includes a PCB substrate 2, a resonator pad area 4 and a coupling pad area 6 are disposed on the PCB substrate 2, the resonator pad area 4 is disposed with at least two resonator pads 8, and a dielectric resonator forming a dielectric filter is soldered on the resonator pads 8; the coupling pad region is provided with a resonator connection pad 10, a main coupling pad 12, an auxiliary coupling pad 14, and two electrode pads 16. The coupling that forms a dielectric filter with each resonator is soldered to the main coupling pad 12 and the auxiliary coupling pad 14, where the coupling is one of an inductance, a capacitance or a resistance. The body of the resonator is soldered to the resonator pads 8 and is also conductively connected to the resonator connection pads 10 by means of pin pins. The electrode pad 16 forms an input/output port of the dielectric filter.

Specifically, the resonator connection pad 10, the main coupling pad 12, and the auxiliary coupling pad 14 are sequentially arranged side by side, and the resonator connection pad 10 is disposed close to the resonator pad region 4; the resonator connection pads 10 and the resonator pads 8 are configured in a one-to-one correspondence (the one-to-one correspondence includes the same quantity and opposite positions), a group of main coupling pads 12 is configured corresponding to each resonator connection pad 10, and each group of main coupling pads 12 is provided with two main welding points 18 which are in conductive connection with the respective resonator connection pads 10; the auxiliary coupling pads 14 are disposed between two adjacent sets of the main coupling pads 12.

The main coupling pads 12 are sequentially and uniformly arranged at intervals along the connecting line direction of the two electrode pads 16, one main welding point 18 of the first group of main coupling pads 12 is used for being connected with the adjacent electrode pad 16 through coupling, and one main welding point 18 of the last group of main coupling pads 12 is used for being connected with the other electrode pad 16 through coupling.

The auxiliary coupling pad 14 is used for coupling connection with one main welding point of each of two adjacent groups of main coupling pads 12.

The coupling is one of a capacitor, an inductor or a resistor.

The PCB of the dielectric filter disclosed by the technical scheme of the embodiment is reasonably designed with the bonding pads, the auxiliary coupling bonding pads matched with the main coupling bonding pads are added, the flexibility of the design of the matching circuit can be improved, and various performance indexes of the dielectric filter including standing-wave ratio and out-of-band suppression are further improved.

Specifically, as shown in fig. 2, a scheme for designing a dielectric filter for a PCB designed using the above structure is as follows:

as shown in fig. 2, the third-order dielectric filter includes three discrete dielectric resonators, which are soldered to three resonator pads, and are further soldered to three resonator connection pads by three pins, wherein a patch capacitor is assembled at a position labeled C1, and patch capacitors are assembled at positions labeled C3, C4, C5, and C6; the capacitor marked with the position C3 is connected with the capacitor marked with the position C4 in series, the capacitor marked with the position C5 is connected with the capacitor marked with the position C6 in series, and the equivalent capacitor formed by the two capacitors in series can solve the problem that the capacitance value is not accurate enough compared with a single equivalent capacitor, for example, the capacitor with the frequency of 0.3PF and the frequency of 0.5PF is available on the market, but the capacitor with the frequency of 0.4PF is basically not available, by adopting the PCB design of the application, the capacitance value of 0.4PF can be realized by connecting the two capacitors with the frequency of 0.8PF in series, the flexibility of circuit design is increased, and the standing-wave ratio performance of a better matched dielectric filter is facilitated.

As shown in fig. 3, in another scheme of the third-order dielectric filter, patch capacitors are assembled at positions marked by C1 and C2, a capacitor of 0 ohm is assembled at a position marked by C3, an inductor or a capacitor is assembled at a position marked by C7, and a resistor of 0 ohm is assembled at a position marked by C6. The dielectric filter assembled with the dielectric resonator can realize cross coupling and improve the out-of-band rejection characteristic of the dielectric filter.

In order to further improve the filtering performance of the dielectric filter, the resonator pad region 4 is provided with a through hole 20 and a heat dissipation hole 22 at the outer periphery of the resonator pad 8.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.

Claims

1. The utility model provides a dielectric filter PCB board, includes the PCB base plate, be equipped with resonator pad area and coupling pad area on the PCB base plate, the resonator pad area is used for welding the resonator, coupling pad area is used for welding the coupling between the resonator, and the coupling between at least two resonators and the resonator forms dielectric filter, the resonator pad area is equipped with two at least resonator pads, its characterized in that: the coupling pad area is provided with a resonator connecting pad, a main coupling pad, an auxiliary coupling pad and two electrode pads, the resonator connecting pad, the main coupling pad and the auxiliary coupling pad are sequentially arranged side by side, and the resonator connecting pad is arranged close to the resonator pad area; the resonator connecting bonding pads and the resonator bonding pads are configured in a one-to-one correspondence mode, a group of main coupling bonding pads are configured corresponding to each resonator connecting bonding pad, and each group of main coupling bonding pads are provided with two main welding points in conductive connection with the resonator connecting bonding pads; the auxiliary coupling bonding pads are arranged between the two adjacent main coupling bonding pads.

2. The dielectric filter PCB of claim 1, wherein: the plurality of main coupling pads are sequentially and uniformly arranged at intervals along the connecting line direction of the two electrode pads, one main welding point of the first group of main coupling pads is used for being connected with the adjacent electrode pad through coupling, and one main welding point of the last group of main coupling pads is used for being connected with the other electrode pad through coupling.

3. The dielectric filter PCB of claim 1, wherein: the auxiliary coupling bonding pad is used for being connected with one main welding point of each of the two adjacent groups of main coupling bonding pads through coupling.

4. A dielectric filter PCB board as claimed in claim 2 or 3, wherein: the coupling is one of a capacitor, an inductor, or a resistor.

5. The dielectric filter PCB of claim 1, wherein: the resonator welding disc area is provided with a through hole at the periphery of the resonator welding disc.

6. The dielectric filter PCB of claim 1, wherein: and the periphery of the resonator bonding pad area, which is positioned on the resonator bonding pad, is provided with heat dissipation holes.