CN210668302U

CN210668302U - Lead bonding machine anti vibration XY workstation

Info

Publication number: CN210668302U
Application number: CN201922267299.8U
Authority: CN
Inventors: 刘志坤; 种利
Original assignee: Jiangsu Aisi Semiconductor Technology Co Ltd
Current assignee: Jiangsu Aisi Semiconductor Technology Co Ltd
Priority date: 2019-12-17
Filing date: 2019-12-17
Publication date: 2020-06-02
Anticipated expiration: 2029-12-17

Abstract

The utility model discloses a vibration-proof XY workbench of a lead bonding machine, which comprises a vibration-proof base and a bonding positioning component arranged on the vibration-proof base; the anti-vibration base comprises an anti-vibration table, one end of the anti-vibration table is provided with an upwards-protruding bonding installation surface, the other end of the anti-vibration table is provided with a workbench lower than the bonding installation surface, and the horizontal surface of the bonding installation surface is provided with a first linear motor installation area and a second linear motor installation area which are arranged in parallel; and a support adjusting mechanism for adjusting the levelness of the anti-vibration table is also arranged below the anti-vibration table. The utility model discloses can ensure equipment steady operation under high-speed, improve bonding production efficiency. Different parts can be positioned by the key positioning assembly when the equipment runs, and the universality of the equipment is improved.

Description

Lead bonding machine anti vibration XY workstation

Technical Field

The utility model relates to an integrated circuit makes technical field, concretely relates to lead bonding machine anti vibration XY workstation.

Background

With the expansion of the production scale of semiconductor devices, automatic wedge bonding machines are more and more widely applied to bonding processes. The clamp of the automatic bonding equipment plays an important role in exerting the advantages of stability, high efficiency and the like of the full-automatic equipment. In the prior art, a lead bonder is generally adopted to bond an electrode of a chip and a lead of a lead frame, namely an ultrasonic generator in the lead bonder generates a high-frequency signal, and an energy conversion system converts the high-frequency signal into high-frequency mechanical vibration; in addition, most automated bonder equipment manufacturers have a single fixture design and poor manufacturing versatility. Matrix type production cannot be realized, so that the bonding fixtures cannot be applied to automatic production.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a lead bonding machine anti-vibration XY workbench which can improve the stability of lead bonding equipment; the specific scheme is as follows:

a lead bonder vibration-proof XY working table comprises a vibration-proof base and a bonding positioning assembly arranged on the vibration-proof base; the anti-vibration base comprises an anti-vibration table, wherein one end of the anti-vibration table is provided with a bonding installation surface protruding upwards, the other end of the anti-vibration table is provided with a workbench lower than the bonding installation surface, the horizontal surface of the bonding installation surface is provided with a first linear motor installation area and a second linear motor installation area which are arranged in parallel, the first linear motor installation area is arranged close to one side of the workbench, a motor installation groove is formed in the surface of the first linear motor installation area, the arrangement direction of the motor installation groove is perpendicular to the extension direction of the bonding machine installation table, and the bottom wall of the motor installation groove and the surface of the second linear motor installation area are provided with vibration absorption; a transverse linear motor and a longitudinal linear motor are respectively arranged on the bottom wall of the motor mounting groove and the second linear motor mounting area; and a support adjusting mechanism for adjusting the levelness of the anti-vibration table is also arranged below the anti-vibration table.

In the technical scheme, a transverse linear motor and a longitudinal linear motor of the bonding equipment can be mounted on a vibration-proof table of a vibration-proof XY working table of the lead bonding machine, and a vibration absorption structure layer can absorb vibration generated in the bonding process of the equipment; the whole equipment has higher vibration resistance, and the equipment can stably run at high speed. The anti-vibration base supports through supporting adjustment mechanism, and the levelness of adjustable whole anti-vibration base simultaneously can adapt to different regions and use, is favorable to the stability of whole equipment, avoids equipment to empty, and accessible bonding locating component fixes a position the part of difference when equipment is moving, improves the commonality of equipment.

Preferably, the bonding positioning assembly comprises a device bearing plate arranged on the workbench, the device bearing plate is provided with positioning holes arranged in a matrix manner, and the device bearing plate is further provided with positioning blocks capable of being inserted into the positioning holes. The bonding positioning assembly saves the design fixture and manufacturing period for different devices, saves the fixture switching operation and heating time, and improves the production efficiency; the production cost of clamp manufacture is reduced.

Preferably, the horizontal surface of workstation corresponds each side of device loading board and is equipped with fixed boss, be equipped with a plurality of notches on the fixed boss, the notch diapire is equipped with the fixed orifices, device loading board side is equipped with the fixed part of card income each notch, the pretension bolt with fixed orifices screw thread adaptation is installed to the fixed part. The device bearing plate can be assembled through the cooperation of fixed part and notch to through pretension bolt fastening, can make things convenient for the dismouting when improving installation stability.

Preferably, the locating piece includes right angle type locating piece, linear type locating piece, be equipped with two at least location portions of going into in the locating hole of card on right angle type locating piece and the linear type locating piece. The positioning block can position the bonding device, save different fixtures designed and manufacturing periods for different devices, meet the production requirements of various devices,

preferably, the vibration absorption structure layer comprises a vibration absorption pad arranged on the bottom wall of the motor installation groove and the surface of the second linear motor installation area, a plurality of positioning protrusions are arranged on the lower surface of the vibration absorption pad, and installation hole positions matched with the positioning protrusions in a clamping mode are arranged on the bottom wall of the motor installation groove and the surface of the second linear motor installation area. The vibration that the vibration pad absorption equipment operation in-process produced of shaking for whole equipment has higher vibration resistance, and the vibration pad of shaking is assembled to corresponding mounted position through the location arch, improves the convenience of parts assembly.

Preferably, support adjustment mechanism including locating the support column at each edge of anti-vibration platform below, support column upper end and anti-vibration platform spiro union, support column lower extreme swing joint has the support backing plate, it has the enhancement nut that supports and lean on the anti-vibration platform lower surface to go back the spiro union on the support column. The rotation support column can adjust the levelness of anti vibration platform, can stabilize equipment under the support of supporting adjustment mechanism, is favorable to the stability of whole board.

Preferably, an anti-slip gasket is sleeved between the support column corresponding to the reinforcing nut and the anti-vibration table, and anti-slip lines are arranged on two end faces of the anti-slip gasket. The stability after the support column adjustment can be improved to the antiskid packing ring.

The utility model has the advantages that: the vibration absorption structure layer of the lead bonding machine vibration-proof XY workbench can absorb vibration generated in the bonding process of equipment; the anti-vibration base supports through the support adjusting mechanism, the levelness of the whole anti-vibration base can be adjusted, the anti-vibration base can adapt to different areas to use, different components can be positioned through the bonding positioning assembly when the equipment runs, and the universality of the equipment is improved. The utility model discloses effectively solve the technical problem who exists among the prior art, had higher practical value.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a perspective view of an anti-vibration XY table of a wire bonding machine according to an embodiment.

The meanings indicated by the respective reference numerals are as follows; the device comprises an anti-vibration table 100, a bonding installation surface 110, a workbench 120, a fixing boss 130, a notch 131, a fixing hole 132, a longitudinal linear motor 200, a transverse linear motor 300, a first linear motor installation area 400, a second linear motor installation area 500, a device bearing plate 600, a fixing part 610, a positioning hole 620, a right-angle positioning block 700, a linear positioning block 800, a supporting column 900, a supporting base plate 1000 and a reinforcing nut 1100.

Detailed Description

Here, it is to be noted that the functions, methods, and the like related to the present invention are only conventional adaptive applications of the related art. Therefore, the present invention is an improvement of the prior art, which substantially lies in the connection relationship between hardware, not in the functions and methods themselves, that is, the present invention relates to a few functions and methods, but does not include the improvements proposed in the functions and methods themselves. The present invention is described for better illustration of the function and method for better understanding of the present invention.

As shown in fig. 1, in one embodiment, the present invention provides a vibration-resistant XY table for a wire bonding machine, comprising a vibration-resistant base; the anti-vibration base comprises an anti-vibration table 100, wherein one end of the anti-vibration table 100 is provided with a bonding installation surface 110 protruding upwards, the other end of the anti-vibration table 100 is provided with a workbench 120 lower than the bonding installation surface 110, the horizontal surface of the bonding installation surface 110 is provided with a first linear motor installation area 400 and a second linear motor installation area 500 which are arranged in parallel, the first linear motor installation area 400 is arranged close to one side of the workbench 120, the surface of the first linear motor installation area 400 is provided with a motor installation groove, the arrangement direction of the motor installation groove is vertical to the extension direction of the bonding machine installation table, and the bottom wall of the motor installation groove and the surface of the second linear motor installation area 500 are provided with; the bottom wall of the motor mounting groove and the second linear motor mounting area 500 are respectively provided with a transverse linear motor 300 and a longitudinal linear motor 200; and a support adjusting mechanism for adjusting the levelness of the anti-vibration table 100 is also arranged below the anti-vibration table 100. The transverse linear motor 300 and the longitudinal linear motor 200 of the bonding equipment can be mounted on the anti-vibration table 100 of the anti-vibration XY working table of the lead bonding machine, and the vibration absorption structure layer can absorb the vibration generated in the bonding process of the equipment; the whole equipment has higher vibration resistance, and the equipment can stably run at high speed, so that the bonding production efficiency is improved. The anti-vibration base supports through supporting adjustment mechanism, and the levelness of adjustable whole anti-vibration base simultaneously can adapt to different region uses, is favorable to the stability of whole equipment, avoids equipment to empty.

As shown in fig. 1, in this embodiment, a keying positioning assembly is further disposed on the anti-vibration base, so that different components can be positioned by the keying positioning assembly when the device is in operation, and the universality of the device is improved. Specifically, the bonding positioning assembly includes a device carrier plate 600 disposed on the worktable 120, the device carrier plate 600 is provided with positioning holes 620 arranged in a matrix, and the device carrier plate 600 is further provided with positioning blocks capable of being inserted into the positioning holes 620. The bonding positioning assembly saves the design fixture and manufacturing period for different devices, saves the fixture switching operation and heating time, and improves the production efficiency; the production cost of clamp manufacture is reduced. Further, in order to realize the installation to device bearing board 600, the horizontal surface at workstation 120 corresponds each side of device bearing board 600 and is equipped with fixed boss 130, be equipped with a plurality of notches 131 on the fixed boss 130, notch 131 diapire is equipped with fixed orifices 132, device bearing board 600 side is equipped with the fixed part 610 of card income each notch 131, the pretension bolt with fixed orifices 132 screw thread adaptation is installed to fixed part 610. The device bearing plate 600 can be assembled by matching the fixing portion 610 with the notch 131, and can be conveniently disassembled and assembled while improving the installation stability by fixing the pre-tightening bolts.

As described above, in the present embodiment, the positioning and installation of the bonding device are realized through the positioning block, the specific positioning block includes the right-angle positioning block 700 and the linear positioning block 800, and at least two positioning portions that are snapped into the positioning holes 620 are disposed on the right-angle positioning block 700 and the linear positioning block 800. The locating piece can satisfy the location to the bonding device, has saved the cycle to the different anchor clamps of different device designs and preparation, can satisfy multiple different device production, and the location portion of locating piece can cooperate the realization to the location of bonding device with locating hole 620, because has a plurality of locating holes 620 on the device loading board 600, location portion can insert and put in different locating holes 620 to form the location of bonding device. The device to be bonded of different specifications can be compatible, the application range is wide, and the working efficiency is greatly improved.

As shown in fig. 1, the vibration absorbing structure layer in this embodiment is used for absorbing the vibration generated by the operation of the equipment, and includes a vibration absorbing pad disposed on the bottom wall of the motor installation groove and the surface of the second linear motor installation area 500, the lower surface of the vibration absorbing pad is provided with a plurality of positioning protrusions, and the bottom wall of the motor installation groove and the surface of the second linear motor installation area 500 are provided with installation hole sites adapted to the positioning protrusions. The vibration that the vibration pad absorption equipment operation in-process produced of shaking for whole equipment has higher vibration resistance, and the vibration pad of shaking is assembled to corresponding mounted position through the location arch, improves the convenience of parts assembly.

Further, in order to realize the adjustment of the levelness of the anti-vibration workbench, the support adjusting mechanism in the embodiment includes a support column 900 disposed at each edge below the anti-vibration workbench 100, the upper end of the support column 900 is screwed with the anti-vibration workbench 100, the lower end of the support column 900 is movably connected with a support base plate 1000, and the support column 900 is further screwed with a reinforcing nut 1100 abutted against the lower surface of the anti-vibration workbench 100. The rotation support column 900 can adjust the levelness of the anti-vibration table 100, the equipment can be stabilized under the support of the support adjusting mechanism, the support column 900 is further pre-tightened through the reinforcing nut 1100, and the stability of the whole machine table is further facilitated. Further, an anti-slip washer is sleeved between the reinforcing nut 1100 corresponding to the support column 900 and the anti-vibration table 100, and anti-slip lines are arranged on two end faces of the anti-slip washer. The anti-slip washer can prevent the pre-tightening nut from loosening, and can improve the stability of the support column 900 after adjustment.

In the specification of the present invention, a large number of specific details are explained. It can be understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, systems, and techniques have not been shown in detail in order not to obscure an understanding of this description.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments can be modified, or some or all of the technical features can be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims

1. A lead bonding machine vibration-proof XY working table is characterized in that; the device comprises an anti-vibration base and a bonding positioning assembly arranged on the anti-vibration base;

the anti-vibration base comprises an anti-vibration table (100), one end of the anti-vibration table (100) is provided with a bonding installation surface (110) protruding upwards, the other end of the anti-vibration table is provided with a workbench (120) lower than the bonding installation surface (110), a first linear motor installation area (400) and a second linear motor installation area (500) are arranged on the horizontal surface of the bonding installation surface (110) in parallel, the first linear motor installation area (400) is arranged close to one side of the workbench (120), a motor installation groove is formed in the surface of the first linear motor installation area (400), the arrangement direction of the motor installation groove is perpendicular to the extension direction of the bonding machine installation table, and vibration absorption structure layers are arranged on the bottom wall of the motor installation groove and the surface of the second linear motor installation area (500); the bottom wall of the motor mounting groove and the second linear motor mounting area (500) are respectively provided with a transverse linear motor (300) and a longitudinal linear motor (200); and a support adjusting mechanism for adjusting the levelness of the anti-vibration table (100) is also arranged below the anti-vibration table (100).

2. The wire bonder anti-vibration XY table of claim 1, wherein:

the bonding positioning assembly comprises a device bearing plate (600) arranged on the workbench (120), positioning holes (620) arranged in a matrix mode are formed in the device bearing plate (600), and positioning blocks capable of being inserted into the positioning holes (620) are further arranged on the device bearing plate (600).

3. The wire bonder anti-vibration XY table of claim 2, wherein:

the horizontal surface of workstation (120) corresponds each side of device loading board (600) and is equipped with fixed boss (130), be equipped with a plurality of notches (131) on fixed boss (130), notch (131) diapire is equipped with fixed orifices (132), device loading board (600) side is equipped with fixed part (610) of card income each notch (131), the pretension bolt with fixed orifices (132) screw thread adaptation is installed in fixed part (610).

4. The wire bonder anti-vibration XY table of claim 2, wherein:

the locating piece includes right angle type locating piece (700) and linear type locating piece (800), be equipped with the location portion that two at least cards go into in locating hole (620) on right angle type locating piece (700) and linear type locating piece (800).

5. The wire bonder anti-vibration XY table of claim 1, wherein:

the vibration absorption structure layer comprises vibration absorption pads arranged on the surfaces of the bottom wall of the motor installation groove and the second linear motor installation area (500), a plurality of positioning bulges are arranged on the lower surfaces of the vibration absorption pads, and installation hole positions matched with the positioning bulges in a clamping mode are arranged on the surfaces of the bottom wall of the motor installation groove and the second linear motor installation area (500).

6. The wire bonder anti-vibration XY table of claim 1, wherein:

support adjustment mechanism including locating support column (900) at each edge in anti vibration platform (100) below, support column (900) upper end and anti vibration platform (100) spiro union, support column (900) lower extreme swing joint has supporting backing plate (1000), it has enhancement nut (1100) that support and lean on at anti vibration platform (100) lower surface still to have the spiro union on support column (900).

7. The wire bonder anti-vibration XY table of claim 6, wherein:

an anti-slip gasket is sleeved between the corresponding reinforcing nut (1100) of the supporting column (900) and the anti-vibration table (100), and anti-slip lines are arranged on two end faces of the anti-slip gasket.