CN210666647U

CN210666647U - Soaking structure and terminal equipment

Info

Publication number: CN210666647U
Application number: CN201921666309.9U
Authority: CN
Inventors: 汪庆财; 易奇炎
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2019-09-29
Filing date: 2019-09-29
Publication date: 2020-06-02
Anticipated expiration: 2029-09-29

Abstract

The present disclosure relates to a soaking structure and terminal equipment, the soaking structure includes: a chamber for holding a soaking fluid; the cavity includes: a first cavity wall and a second cavity wall disposed opposite the first cavity wall; wherein the first and second cavity walls each comprise: the first structural layer faces the inside of the cavity and the second structural layer faces the outside of the cavity; the strength of the first structural layer is lower than that of the second structural layer, and the heat dissipation coefficient of the first structural layer is higher than that of the second structural layer.

Description

Soaking structure and terminal equipment

Technical Field

The present disclosure relates to a soaking technical field, and in particular, to a soaking structure and a terminal device.

Background

A Vapor Chamber (VC) is used to dissipate heat from the heat generating module. VC is generally made of a material such as alloy copper or stainless steel. However, for the VC made of the alloy copper material, since the alloy copper is softened in a high-temperature environment, a thinner or larger VC cannot be made, which limits the use scene of the VC; for VC made of stainless steel material, due to the fact that stainless steel has high melting point and is easy to generate precipitation reaction, the manufacturing cost of VC is high, and the thermal property is unstable.

Disclosure of Invention

The present disclosure provides a soaking structure and a terminal device.

According to the soaking structure that this disclosed embodiment provided, the soaking structure includes:

a chamber for holding a soaking fluid;

the cavity includes: a first cavity wall and a second cavity wall disposed opposite the first cavity wall;

wherein the first and second cavity walls each comprise: the first structural layer faces the inside of the cavity and the second structural layer faces the outside of the cavity; the strength of the first structural layer is lower than that of the second structural layer, and the heat dissipation coefficient of the first structural layer is higher than that of the second structural layer.

In one embodiment, the first structural layer is an inner layer of a copper alloy structure and the second structural layer is an outer layer of a stainless steel structure.

In one embodiment, the heat soaking structure further comprises:

the flow guide body is positioned in the cavity, the first end of the flow guide body is fixedly arranged on the first structural layer of the first cavity wall, the second end of the flow guide body is arranged in a gap with the first structural layer of the second cavity wall, and the second end is the opposite end of the first end.

In one embodiment, the flow conductor is provided in a mesh shape.

In one embodiment, the current carrier is a capillary structure in the shape of a copper material.

In one embodiment, the heat soaking structure further comprises:

and the bottom of the at least one support body is connected with the first structural layer of the wall of the second cavity, and the top of the at least one support body is arranged in a gap with the flow guide body.

In one embodiment, the thickness of the second structural layer of the first cavity wall and the thickness of the second structural layer of the second cavity wall are each in the range of 0.05 mm to 0.1 mm.

In one embodiment, the first structural layer of the first cavity wall has a thickness in a range of 0.1 millimeters to 0.15 millimeters; the first structural layer of the second cavity wall has a thickness in a range of 0.2 millimeters to 0.25 millimeters.

In one embodiment, the chamber is a sealed chamber;

the first cavity wall and the second cavity wall are oppositely arranged in the cavity;

the cavity includes: an upper cavity comprising the first cavity wall and a lower cavity comprising the second cavity wall;

the upper cavity is connected with the lower cavity in a welding mode.

According to a second aspect of the embodiments of the present disclosure, there is provided a terminal device, the terminal device at least comprising:

a heat generating module;

the heat equalizing structure of one or more embodiments as described above, wherein the first cavity wall of the heat equalizing structure is located on the same side as the heat generating module.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

the second layer structure outside the first layer structure can enhance the strength of the soaking structure, and the first layer structure in the second layer structure is in contact with soaking fluid, so that the heat dissipation coefficient is better, and the heat dissipation effect can be enhanced. So, the soaking structure of this disclosed embodiment can possess the advantage of first floor structure and second floor structure simultaneously, on the one hand, has ensured the radiating effect of soaking structure, and on the other hand has improved the intensity of soaking structure, and then has enlarged the application scene of soaking structure.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a first schematic diagram illustrating a heat soak configuration according to an exemplary embodiment.

Fig. 2 is a second schematic diagram of a heat soak configuration, according to an example embodiment.

Fig. 3 is a third schematic diagram illustrating a heat soak configuration, according to an example embodiment.

FIG. 4 is a schematic diagram illustrating a substrate structure according to an exemplary embodiment.

FIG. 5 is a first schematic view of a substrate structure process shown in accordance with one exemplary embodiment.

FIG. 6 is a second schematic view of a substrate structure process according to one exemplary embodiment.

Fig. 7 is a block diagram illustrating a structure of a terminal device according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with embodiments of the present disclosure. Rather, they are merely examples of apparatus consistent with certain aspects of the embodiments of the present disclosure, as detailed in the appended claims.

The disclosed embodiment provides a soaking structure. Fig. 1 is a first schematic diagram illustrating a heat soak configuration according to an exemplary embodiment. As shown in fig. 1, the heat equalizing structure includes:

a chamber for holding a soaking fluid;

the cavity includes: a first chamber wall and a second chamber wall disposed opposite the first chamber wall;

wherein the first cavity wall 11 and the second cavity wall 12 each comprise: a first structural layer 101 facing the inside of the cavity and a second structural layer 102 facing the outside of the cavity; the strength of the first structural layer 101 is lower than that of the second structural layer 102, and the heat dissipation coefficient of the first structural layer 101 is higher than that of the second structural layer 102.

In the embodiment of the disclosure, the soaking structure is used for radiating heat for the heat-generating module. Because the interior calorifacient heat production module of terminal equipment has small and the high performance characteristics of consumption, and the high meeting of consumption can produce a large amount of heats, consequently, in order to reduce phenomenons such as the shut down that heat production module self heat production leads to, the high temperature condition of burning out that can reduce heat production module through setting up of soaking structure. In the embodiment of the present application, the heat generating module includes, but is not limited to, a functional structure for performing various predetermined functions in the terminal device, such as a Central Processing Unit (CPU), an image processor, a power supply module, a memory, and the like.

The cavity is a vacuum cavity, and in the process of manufacturing the cavity, the cavity can be pumped by the air pumping assembly to obtain the vacuum cavity.

The heat-equalizing fluid is located in the cavity and is a heat-equalizing and flowing substance which can comprise liquid and/or gas. For example, when the soaking fluid comprises a soaking liquid, the soaking fluid can vaporize at a first temperature and condense into a liquid at a second temperature, the first temperature being higher than the second temperature.

It should be noted that the specific heat capacity of the soaking fluid is higher, and more heat can be absorbed by the soaking fluid than a substance with a lower specific heat capacity under the same volume, so that the heat dissipation of the heat-generating module can be realized through the absorption and the dissipation of the heat of the soaking fluid.

Illustratively, the soaking fluid includes water, methanol, alcohol, or acetone, and embodiments of the present disclosure are not limited.

In an embodiment of the disclosure, the cavity includes a first cavity wall and a second cavity wall disposed opposite the first cavity wall.

It should be noted that the shape of this cavity can be set up according to the cooling surface of heat production module, and when the cooling surface of heat production module was the rectangle, can set up this cavity and be the cuboid, when the cooling surface of heat production module was the rhombus, can set up this cavity and be the square, and this disclosed embodiment does not do the restriction.

In embodiments of the present disclosure, the first cavity wall and the second cavity wall are both formed from a first structural layer and a second structural layer. The strength of the first structural layer is lower than that of the second structural layer, and the heat dissipation coefficient of the first structural layer is higher than that of the second structural layer.

Illustratively, the first structural layer may be formed of a copper material, a copper alloy material; the second structural layer may be formed of a stainless steel material.

In another embodiment, the first structural layer is processed at a temperature and for a time period less than the processing temperature of the second structural layer.

It can be understood that the processing difficulty of the first structural layer is lower than that of the second structural layer, so that the processing difficulty of the soaking structure can be reduced by processing the first structural layer, and the processing efficiency can be improved.

It should be noted that the strength of the first structural layer is lower than that of the second structural layer, for example, the strength of the first structural layer under high temperature environment will be HV70-90 from HV 150. In this case, the strength of the first structural layer is greatly reduced and the first structural layer is easily deformed. In consideration of the problem that the first structural layer is easy to deform, the second structural layer is arranged on the first structural layer, and the strength of the heat equalizing structure can be enhanced through the second structural layer, so that the heat equalizing structure can be made large and thin.

The heat dissipation coefficient of the first structural layer is higher than that of the second structural layer, the second structural layer is arranged to be the cavity-outward part, the first structural layer is arranged to be the cavity-inward part, the condition that the second structural layer is subjected to precipitation reaction with soaking fluid in the aging process can be reduced, and the vacuum degree of the cavity can be improved to improve the heat dissipation performance.

Furthermore, the brazing temperature of the first structural layer is 700 to 750 degrees celsius, which corresponds to a welding time period of 1 to 2 hours; the diffusion welding temperature of the second structural layer is 1100-1200 ℃, the corresponding welding time is 10-12 hours, and the second structural layer needs to be subjected to diffusion welding in a vacuum environment. Therefore, the first structural layer is processed, so that the difficulty of manufacturing the soaking structure can be greatly reduced, the efficiency can be improved, and the application range is expanded. Among them, diffusion welding is a solid state welding method in which pressure is applied at a high temperature without generating visible deformation and relative movement.

It can be understood that the first structural layer facing the inside of the cavity is made of copper alloy material, and the second structural layer facing the outside of the cavity is made of stainless steel material, so that on one hand, a soaking structure with high strength can be obtained based on the characteristic of high strength of stainless steel; on the other hand, the manufacturing difficulty of the soaking structure can be reduced based on the characteristics of high heat dissipation coefficient and easiness in processing of the copper alloy; and then when designing soaking structure, can be towards the direction of large size design to bring stronger radiating effect.

In one embodiment, as shown in fig. 2, the heat soaking structure further comprises:

the flow guiding body 13 is located inside the cavity, a first end of the flow guiding body 13 is fixedly arranged on the first structural layer 101 of the first cavity wall 11, a second end of the flow guiding body 13 is arranged in a gap with the first structural layer 101 of the second cavity wall 12, and the second end is the opposite end of the first end.

It should be noted that the gap between the second end of the current carrier and the first structural layer of the second cavity wall is used for accommodating the soaking fluid and providing a movement space for the soaking fluid.

In the embodiment of the disclosure, the heat conducting body is used for conducting the soaking fluid at the second temperature from the second cavity wall to the position of the first cavity wall contacted with the heat generating module, and conducting the soaking fluid at the first temperature from the first cavity wall to the second cavity wall, and the second temperature is lower than the first temperature. Wherein, first temperature can be the temperature of the position that cavity and heat production module contacted, and the second temperature can be the temperature of the position that the cavity does not contact with heat production module, and the temperature of the position that first cavity wall and heat production module contacted is higher than the temperature of the position that the cavity does not contact with heat production module.

The soaking fluid at the position where the first cavity wall is in contact with the heat-generating module can be gasified to form gaseous soaking fluid based on the heat generated by the heat-generating module, so that a large amount of heat is taken away; when the gaseous soaking fluid contacts the position where the cavity is not in contact with the heat generating module, the gaseous soaking fluid can be condensed into the liquid soaking fluid; the flow guiding body absorbs the liquid soaking fluid to the position where the cavity is contacted with the heat generating module, so that a circulating system with coexistence of liquid and gas is formed. In one embodiment, the flow conductor is brazed to the first structural layer of the first cavity wall.

In one embodiment, the flow conductor is arranged as a mesh.

It should be noted that the mesh-like flow conductor covers part or all of the surface of the first structural layer of the first chamber wall.

In one embodiment, the current carrier is a capillary structure made of copper.

It should be noted that the flow conductor of the copper capillary structure can generate capillary force to guide the soaking fluid in the cavity to the position where the first cavity wall contacts with the heat generating module.

In one embodiment, as shown in fig. 3, the heat soaking structure further comprises:

at least one support 14, connected at the bottom to the first structural layer 101 of the second cavity wall 12 and at the top to the flow conductor 13 with a gap.

In the embodiment of the disclosure, the at least one support body is used for supporting the flow guiding body to realize the support of the first cavity wall when the first cavity wall where the flow guiding body is located deforms towards the direction of the second cavity wall.

It should be noted that, in the setting process, the flow conductor is installed on the first structural layer of the first cavity wall, and considering that there is a processing error in the thickness of the first cavity wall and a processing error in the thickness of the flow conductor, therefore, the embodiment of the present disclosure can reduce the situation that the support body abuts against the flow conductor due to the processing error by arranging the support body and the flow conductor at an interval.

Illustratively, the gap may be set with an error range, for example, the gap may be set to 0.02 mm or 0.03 mm, and the disclosed embodiment is not limited.

It can be understood that the support body supports the first cavity wall through supporting the flow guide body when contacting with the flow guide body, so that the situation that the support body props against the flow guide body due to machining errors can be reduced, the first cavity wall can be supported on the other hand, and the probability that the first cavity wall is sunken can be reduced.

In one embodiment, the thickness of the first structural layer of the first cavity wall is in a range of 0.1 mm to 0.15 mm; the thickness of the first structural layer of the second cavity wall is in the range of 0.2 mm to 0.25 mm.

It can be understood that the thickness of the first cavity wall is smaller than that of the second cavity wall, and the support body supports the first cavity wall through the support flow guide body, so that the probability of the first cavity wall sinking can be effectively reduced.

In one embodiment, the chamber is a sealed chamber;

the cavity includes: an upper cavity comprising a first cavity wall and a lower cavity comprising a second cavity wall;

the upper cavity is connected with the lower cavity in a welding way.

It should be noted that the shape of the cavity may be designed according to actual needs, for example, the shape of the cavity may include a rectangular parallelepiped, a square, or any other irregular shape, and the embodiments of the present disclosure are not limited.

In another embodiment, the upper cavity and the lower cavity are connected by brazing and sintering.

In another embodiment, the upper cavity and the lower cavity are formed by etching the same substrate.

Illustratively, the substrate may be a stainless steel-copper alloy double-layer composite.

As shown in fig. 4, one layer of the substrate is stainless steel 1001 and the other layer is copper alloy 1002.

It should be noted that the forming process of the cavity includes: the upper cavity is obtained by etching the copper alloy in the stainless steel-copper alloy double-layer composite material, the lower cavity is obtained by etching the copper alloy in the stainless steel-copper alloy double-layer composite material, and the upper cavity and the lower cavity are connected by brazing and sintering to form the cavity.

As shown in fig. 5, the upper cavity 15 can be obtained by etching the copper alloy in the stainless steel-copper alloy double-layer composite material.

As shown in fig. 6, the lower cavity 16 can be obtained by etching the copper alloy in the stainless steel-copper alloy double-layer composite material.

It is understood that the soaking structure of the disclosed embodiment is obtained by etching the copper alloy in the stainless steel-copper alloy double-layer composite material. Because the chamber of the embodiment of the present disclosure is made of stainless steel and copper alloy is etched, the soaking structure provided by the embodiment of the present disclosure is superior to the soaking structure made of stainless steel in terms of low processing difficulty; the high strength is superior to the soaking structure made of copper alloy.

It should be noted that the soaking structure provided by the embodiment of the present disclosure has the characteristics of high strength and simple processing, and can be adapted to the development of the soaking structure towards the large-size design direction, so that the soaking structure can radiate heat for a plurality of heat-generating modules at the same time.

An embodiment of the present disclosure further provides a terminal device, where the terminal device at least includes:

a heat generating module;

the heat spreader structure of one or more embodiments described above, wherein the first cavity wall of the heat spreader structure is on the same side as the heat generating module.

In the embodiment of the disclosure, the terminal device at least comprises a heat generating module and a heat soaking structure, and the heat soaking structure is used for taking away heat generated by the heat generating module.

The terminal devices can be wearable electronic devices and mobile terminals; the mobile terminal comprises a mobile phone, a notebook computer and a tablet computer; this wearable electronic equipment includes intelligent wrist-watch, and this disclosed embodiment does not put a limit to.

In the embodiment of the present disclosure, the heat generating module includes, but is not limited to, various processing chips, antenna modules, or power modules in the mobile terminal.

In one embodiment, the heat-generating module is at least one and the soaking structure is used for dissipating heat of the at least one heat-generating module.

It should be noted that the soaking structure not only can radiate for a heat-generating module, but also can radiate for a plurality of heat-generating modules at the same time. When the soaking structure radiates heat for the plurality of heat-generating modules, the first cavity wall of the soaking structure is in contact with the heat-radiating surfaces of the plurality of heat-generating modules.

For example, if the soaking structure is installed in a mobile terminal of the fourth generation mobile communication technology (4G), the corresponding heat generating module may be one, such as a CPU; if the soaking structure is installed in a fifth generation mobile communication technology (5G) mobile terminal, the number of corresponding heat generating modules may be 2 or more, such as a CPU, an antenna module, and a power supply module.

It should be noted that the heat generating module and the current carrier in the soaking structure are on the same side, and the heat generated by the heat generating module can evaporate the soaking fluid at the position where the heat generating module contacts with the first cavity wall to take away a part of the heat, so as to achieve the purpose of heat dissipation of the soaking structure. It can be understood that when setting up the soaking structure, can set the soaking structure to can cover one or more heat production module, so, give a plurality of heat production module heat dissipations through a soaking structure, can reduce the figure of soaking structure among the terminal equipment, and then improve terminal equipment's space utilization.

It should be noted that the terms "first" and "second" in the above embodiments of the present disclosure are merely used for convenience of description and distinction, and have no other specific meanings.

Fig. 7 is a block diagram illustrating a structure of a terminal device according to an exemplary embodiment. For example, the terminal device may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.

Referring to fig. 7, the terminal device may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communications component 816.

The processing component 802 generally controls overall operation of the terminal device, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

The memory 804 is configured to store various types of data to support operations at the terminal device. Examples of such data include instructions for any application or method operating on the terminal device, contact data, phonebook data, messages, pictures, videos, etc. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.

The power component 806 provides power to various components of the terminal device. The power components 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the terminal device.

The multimedia component 808 comprises a screen providing an output interface between the terminal device and the user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. When the terminal device is in an operation mode, such as a shooting mode or a video mode, the front camera and/or the rear camera can receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the terminal device is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.

The sensor component 814 includes one or more sensors for providing various aspects of state assessment for the terminal device. For example, sensor assembly 814 may detect the open/closed status of the terminal device, the relative positioning of components, such as the display and keypad of the terminal device, the change in position of the terminal device or a component of the terminal device, the presence or absence of user contact with the terminal device, the orientation or acceleration/deceleration of the terminal device, and the change in temperature of the terminal device. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

The communication component 816 is configured to facilitate communication between the terminal device and other devices in a wired or wireless manner. The terminal device may access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

In an exemplary embodiment, the terminal device may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims

1. A heat equalizing structure, comprising:

a chamber for holding a soaking fluid;

2. The soaking structure according to claim 1, wherein the first structural layer is a copper alloy structural inner layer, and the second structural layer is a stainless steel structural outer layer.

3. The heat equalizing structure according to claim 1 or 2, characterized in that the heat equalizing structure further comprises:

4. The heat equalizing structure of claim 3, wherein the current carriers are provided in a net shape.

5. The heat equalizing structure of claim 3, wherein the current carriers are copper capillary structures.

6. The heat equalizing structure according to claim 3, characterized in that the heat equalizing structure further comprises:

7. The soaking structure according to claim 1, wherein the thickness of the second structural layer of the first cavity wall and the thickness of the second structural layer of the second cavity wall are each in the range of 0.05 mm to 0.1 mm.

8. The soaking structure according to claim 1, wherein the thickness of the first structural layer of the first cavity wall is in the range of 0.1 mm to 0.15 mm; the first structural layer of the second cavity wall has a thickness in a range of 0.2 millimeters to 0.25 millimeters.

9. The heat equalizing structure of claim 1, wherein the cavity is a sealed cavity;

the upper cavity is connected with the lower cavity in a welding mode.

10. A terminal device, characterized in that the terminal device comprises at least:

a heat generating module;

the heat equalizing structure of any one of claims 1 to 9, wherein the first cavity wall of the heat equalizing structure is located on the same side as the heat generating module.