CN210640225U - Package shell for integrated circuit - Google Patents

Package shell for integrated circuit Download PDF

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Publication number
CN210640225U
CN210640225U CN201922040235.4U CN201922040235U CN210640225U CN 210640225 U CN210640225 U CN 210640225U CN 201922040235 U CN201922040235 U CN 201922040235U CN 210640225 U CN210640225 U CN 210640225U
Authority
CN
China
Prior art keywords
integrated circuit
circuit chip
screw
mounting plate
shell main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201922040235.4U
Other languages
Chinese (zh)
Inventor
谢卫国
杨浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Gelite Electronic Ltd By Share Ltd
Original Assignee
Jiangsu Gelite Electronic Ltd By Share Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Gelite Electronic Ltd By Share Ltd filed Critical Jiangsu Gelite Electronic Ltd By Share Ltd
Priority to CN201922040235.4U priority Critical patent/CN210640225U/en
Application granted granted Critical
Publication of CN210640225U publication Critical patent/CN210640225U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to an integrated circuit technical field specifically is a packaging shell that integrated circuit used, including integrated circuit chip and packaging shell, the integrated circuit chip sets up inside packaging shell, and packaging shell includes shell main part, mounting panel and closing cap, and beneficial effect is: in the utility model, the integrated circuit chip is fixed on the second screw seat arranged on the mounting plate through screws, and the radiating fins arranged on the upper surface of the mounting plate support the integrated circuit chip, and radiating channels are reserved among the radiating fins, so that the lower surface of the integrated circuit chip can be conveniently radiated; the inner end of the pressing sleeve is tightly pressed on the elastic rubber sealing sleeve, so that the elastic rubber sealing sleeve tightly clamps the outer wall of the electric wire, and the situation that the connection part of the electric wire and the integrated circuit chip is broken due to the fact that the electric wire is pulled is avoided.

Description

Package shell for integrated circuit
Technical Field
The utility model relates to an integrated circuit technical field specifically is a packaging shell that integrated circuit used.
Background
The integrated circuit is a miniature electronic device or component, and is required to be packaged in a tube shell to form a miniature structure with the required circuit function, and the integrated circuit packaging shell is used as a carrier of a chip, so that a stable and reliable working environment is provided for the integrated circuit chip, and the integrated circuit chip is protected mechanically or environmentally. The integrated circuit chip can produce certain heat as an electric element in the working process, and when the packaging shell can not effectively dissipate heat of the integrated circuit, the working state of the integrated circuit chip can be influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a packaging shell that integrated circuit used to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a packaging shell for an integrated circuit comprises an integrated circuit chip and a packaging shell, wherein the integrated circuit chip is arranged in the packaging shell, the packaging shell comprises a shell main body, a mounting plate and a sealing cover, two pairs of first screw seats are arranged on the inner bottom surface of the shell main body, screws penetrate through the upper surfaces of four end angles of the mounting plate, the lower ends of the screws penetrating through the mounting plate are respectively in threaded connection with the first screw seats arranged on the inner bottom surface of the shell main body, two pairs of second screw seats are arranged on the upper surface of the mounting plate, the screws penetrate through the four end angles of the integrated circuit chip, the integrated circuit chip is fixedly connected with the second screw seats arranged on the mounting plate through the screws, a pair of clamping grooves in a concave shape are arranged on an opening edge above the shell main body, edges on two sides of the sealing cover are arranged in a sliding and clamping mode along the grooves of the clamping grooves, and screw lugs are arranged, a third screw seat is arranged at a position, corresponding to the screw lug, on one side of the shell main body, the screw lug is fixedly connected with the third screw seat through a screw, and a wire hole is formed in one side, far away from the third screw seat, of the shell main body.
Preferably, a distance of 3-5mm is reserved between the lower surface of the mounting plate and the upper end of the first screw seat, a damping spring is sleeved on the outer wall of the first screw seat, and the upper end and the lower end of the damping spring are respectively connected with the lower surface of the mounting plate and the inner bottom surface of the shell main body.
Preferably, the upper surface of the mounting plate is provided with radiating fins which are parallel and uniformly arranged, and the radiating fins are tightly attached to the lower surface of the integrated circuit chip.
Preferably, the two side walls of the shell main body are provided with heat dissipation grids, and the inner wall tightly attached to the heat dissipation grids is provided with a dustproof filter screen.
Preferably, the inner end of the inner wall of the wire hole is an inverted cone hole, a conical sleeve-shaped elastic rubber sealing sleeve is inserted into the inner end of the wire hole, a pressing sleeve is connected to the outer port of the wire hole through threads, and the inner end of the pressing sleeve is tightly attached to the elastic rubber sealing sleeve.
Compared with the prior art, the beneficial effects of the utility model are that:
1. in the utility model, the integrated circuit chip is fixed on the second screw seat arranged on the mounting plate through screws, and the radiating fins arranged on the upper surface of the mounting plate support the integrated circuit chip, and radiating channels are reserved among the radiating fins, so that the lower surface of the integrated circuit chip can be conveniently radiated;
2. the line hole that is used for alternating the electric wire is offered to shell main part one side, and the inside elasticity rubber seal cover that is provided with toper cover tube-shape in line hole, and the line hole has the pressure cover through threaded connection, when screwing up to the pressure cover, the inner of pressing the cover sticiss the elasticity rubber seal cover for the outer wall of elasticity rubber seal cover tight clamp electric wire can effectively press from both sides to establish fixedly to the electric wire, avoids the electric wire to be dragged and the cracked condition of electric wire and integrated circuit chip junction appears.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front sectional view of the structure of the present invention;
3 FIG. 3 3 3 is 3 a 3 cross 3- 3 sectional 3 view 3 taken 3 along 3 line 3 A 3- 3 A 3 of 3 FIG. 32 3; 3
Fig. 4 is an enlarged view at B in fig. 2.
In the figure: the heat dissipation structure comprises an integrated circuit chip 1, a shell main body 2, a first screw seat 21, a heat dissipation grid 22, a mounting plate 3, a second screw seat 31, a heat dissipation fin 32, a sealing cover 4, a clamping groove 5, a screw lug 6, a third screw seat 7, a wire hole 8, an elastic rubber sealing sleeve 9 and a pressing sleeve 10.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 4, the present invention provides a technical solution: a package housing for an integrated circuit, comprising an integrated circuit chip 1 and a package housing, characterized in that: integrated circuit chip 1 sets up inside the encapsulation shell, the encapsulation shell includes housing body 2, mounting panel 3 and closing cap 4, it is shown with fig. 2 to combine, housing body 2's inside bottom surface is equipped with two pairs of first screw seat 21, it is provided with the screw to run through along the upper surface of 3 four extreme angles departments of mounting panel, and the screw lower extreme that runs through on the mounting panel 3 respectively with housing body 2 inside bottom surface established first screw seat 21 looks spiro union, leave 3-5 mm's shock attenuation interval between mounting panel 3's lower surface and the upper end of first screw seat 21, and first screw seat 21 outer wall cover is equipped with damping spring, damping spring's upper and lower extreme is connected mounting panel 3's lower surface and housing body 2's inside bottom surface respectively, work as the utility model discloses when working under some vibrations environment, have certain cushioning effect to integrated circuit chip 1.
As shown in fig. 1 and 2, the upper surface of the mounting plate 3 is provided with two pairs of second screw seats 31, and the four end corners of the integrated circuit chip 1 are all penetrated with screws, the integrated circuit chip 1 is fixedly connected with a second screw seat 31 arranged on the mounting plate 3 through the screws, the upper surface of the mounting plate 3 is provided with heat dissipation fins 32 which are arranged in parallel and evenly, the heat dissipation fins 32 are tightly attached to the lower surface of the integrated circuit chip 1, while supporting the integrated circuit chip 1, a heat dissipation channel is left between the plurality of heat dissipation fins 32 to facilitate heat dissipation of the lower surface of the integrated circuit chip 1, the two side walls of the housing main body 2 are provided with heat dissipation grids 22, a inner wall that is used for circulation of air between the inside and external environment of shell main part 2, and hugs closely heat dissipation grid 22 is equipped with dustproof filter screen, prevents that the dust from entering into the inside of shell main part 2, causes the pollution to integrated circuit chip 1.
Referring to fig. 1 and 3, a pair of slots 5 with a concave shape is arranged at the upper opening edge of the housing main body 2, the two side edges of the sealing cover 4 slide into the slots of the slots 5, a screw ear 6 is arranged at one end of the sealing cover 4, a third screw seat 7 is arranged at a position corresponding to the screw ear 6 on one side of the housing main body 2, the screw ear 6 is fixedly connected with the third screw seat 7 through a screw, and the housing main body 2 and the sealing cover 4 can be effectively connected and fixed by only one screw.
Combine fig. 1 and fig. 4 to show, shell main part 2 keeps away from one side of third screw seat 7 and has seted up line hole 8, the electric wire that integrated circuit chip 1 is connected runs through along line hole 8, the inner of the inner wall of line hole 8 is the back taper hole, and the inner of line hole 8 is inserted and is equipped with the elastic rubber seal cover 9 of toper cover form, elastic rubber seal cover 9 registrates outside the electric wire, there is pressing sleeve 10 outer port in line hole 8 through threaded connection, after screwing up pressing sleeve 10, the inner of pressing sleeve 10 sticiss elastic rubber seal cover 9, make the outer wall of elastic rubber seal cover 9 tight clamp electric wire, can effectively press from both sides to establish fixedly the electric wire, avoid the electric wire to be dragged and appear the cracked condition of electric wire and integrated circuit chip 1 junction.
The working principle is as follows: in the utility model, the mounting plate 3 is connected with the first screw seat 21 inside the housing main body 2 through screws, and the damping spring is sleeved outside the first screw seat 21, so that the integrated circuit chip 1 has a certain damping effect when working under some vibration environments; the integrated circuit chip 1 is fixed on a second screw seat 31 arranged on the mounting plate 3 through screws, and the heat dissipation fins 32 arranged on the upper surface of the mounting plate 3 support the integrated circuit chip 1, and meanwhile, heat dissipation channels are reserved among the heat dissipation fins 32, so that the heat dissipation of the lower surface of the integrated circuit chip 1 is facilitated, and the heat dissipation grids 22 are arranged on the two side walls of the shell main body 2 and used for air circulation between the inside of the shell main body 2 and the external environment; through sliding the card into along the groove of draw-in groove 5 with the both sides edge of closing cap 4 and establishing, connect screw ear 6 and third screw seat 7 through the screw simultaneously, only need a screw can be with carrying out effectual being connected fixedly between shell main part 2 and the closing cap 4, the installation with dismantle all comparatively simple.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. A package housing for an integrated circuit comprising an integrated circuit chip (1) and a package housing, characterized in that: the integrated circuit chip (1) is arranged in a packaging shell, the packaging shell comprises a shell main body (2), a mounting plate (3) and a sealing cover (4), two pairs of first screw seats (21) are arranged on the inner bottom surface of the shell main body (2), screws penetrate through the upper surfaces of four end angles of the mounting plate (3), the lower ends of the screws penetrating through the mounting plate (3) are respectively in threaded connection with the first screw seats (21) arranged on the inner bottom surface of the shell main body (2), two pairs of second screw seats (31) are arranged on the upper surface of the mounting plate (3), screws penetrate through the four end angles of the integrated circuit chip (1), the integrated circuit chip (1) is fixedly connected with the second screw seats (31) arranged on the mounting plate (3) through the screws, a pair of clamping grooves (5) in a concave shape are arranged on an opening edge above the shell main body (2), the card is established along the groove of draw-in groove (5) to the both sides edge of closing cap (4), and the one end of closing cap (4) is equipped with screw ear (6), and shell main part (2) one side is equipped with third screw seat (7) with the corresponding position of screw ear (6), and passes through screw fixed connection between screw ear (6) and third screw seat (7), shell main part (2) keep away from one side of third screw seat (7) and seted up line hole (8).
2. A package housing for an integrated circuit according to claim 1, wherein: leave 3-5 mm's interval between the lower surface of mounting panel (3) and the upper end of first screw seat (21), and first screw seat (21) outer wall cover is equipped with damping spring, and damping spring's upper and lower end is connected the lower surface of mounting panel (3) and the inside bottom surface of shell main part (2) respectively.
3. A package housing for an integrated circuit according to claim 1, wherein: the upper surface of the mounting plate (3) is provided with radiating fins (32) which are parallel and are uniformly arranged, and the radiating fins (32) are tightly attached to the lower surface of the integrated circuit chip (1).
4. A package housing for an integrated circuit according to claim 1, wherein: the both sides wall of shell main part (2) is equipped with radiator grille (22), and hugs closely the inner wall of radiator grille (22) and is equipped with dustproof filter screen.
5. A package housing for an integrated circuit according to claim 1, wherein: the inner wall of line hole (8) the inner be the back taper hole, and the inner of line hole (8) is inserted and is equipped with toper cover tube-like elastic rubber seal cover (9), and there is pressure cover (10) outer port through threaded connection in line hole (8), and the inner and the elastic rubber seal cover (9) of pressing cover (10) closely laminate.
CN201922040235.4U 2019-11-23 2019-11-23 Package shell for integrated circuit Expired - Fee Related CN210640225U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922040235.4U CN210640225U (en) 2019-11-23 2019-11-23 Package shell for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922040235.4U CN210640225U (en) 2019-11-23 2019-11-23 Package shell for integrated circuit

Publications (1)

Publication Number Publication Date
CN210640225U true CN210640225U (en) 2020-05-29

Family

ID=70798833

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922040235.4U Expired - Fee Related CN210640225U (en) 2019-11-23 2019-11-23 Package shell for integrated circuit

Country Status (1)

Country Link
CN (1) CN210640225U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200529

Termination date: 20201123