CN210639561U - Heat dissipation control device based on CPLD - Google Patents

Heat dissipation control device based on CPLD Download PDF

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Publication number
CN210639561U
CN210639561U CN201921557458.1U CN201921557458U CN210639561U CN 210639561 U CN210639561 U CN 210639561U CN 201921557458 U CN201921557458 U CN 201921557458U CN 210639561 U CN210639561 U CN 210639561U
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module
cpld
heat dissipation
baffle
control module
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柳强
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Suzhou Inspur Intelligent Technology Co Ltd
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Suzhou Inspur Intelligent Technology Co Ltd
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Abstract

The utility model provides a heat dissipation control device based on a CPLD, which comprises a CPLD control module, wherein the CPLD control module is connected with a fan module, a temperature acquisition module and a motor drive module, and the motor drive module is connected with a baffle; the CPLD control module, the fan module, the temperature acquisition module, the motor driving module and the baffle are all arranged in the server case; the server case is also internally provided with a high-heat equipment module, and the temperature acquisition module is connected with the high-heat equipment module. The utility model discloses a CPLD control module control motor drive module to drive the position of baffle through motor drive module, thereby change server machine incasement air current direction according to the real-time adjustment of actual work scene, and CPLD control module is according to temperature acquisition module's temperature information, and driving motor high-efficiently, the processing speed is fast, thereby lets the heat dissipation regulation and control tactics nimble more and reliable, guarantees server normal operating.

Description

Heat dissipation control device based on CPLD
Technical Field
The utility model belongs to the technical field of the server heat dissipation, concretely relates to heat dissipation control device based on CPLD.
Background
BMC is an abbreviation of Baseboard Management Controller, the Baseboard Management Controller.
CPLD is an abbreviation for Complex Programmable Logic Device.
OLEDs are an abbreviation for Organic Light-Emitting Diode.
The adopted method is divided into passive heat dissipation and active heat dissipation, wherein the passive heat dissipation means that heat gathered on a chip is dissipated by heat conduction through the contact of a heat dissipation sheet and the chip under the condition of not using other auxiliary heat dissipation methods; the active heat dissipation is divided into air-cooled heat dissipation, water-cooled heat dissipation, liquid-cooled heat dissipation, heat pipe heat dissipation, semiconductor refrigeration fin heat dissipation, compressor-assisted heat dissipation, liquid nitrogen heat dissipation and the like according to the adopted heat dissipation mode. Currently, in the server machine, the most common heat dissipation method is to use a fan to realize air cooling heat dissipation.
For the heat dissipation strategy of the whole server, the current common practice is to monitor the temperatures of a plurality of areas in the server chassis through the BMC or the CPLD, and monitor the high-temperature alarm of chips such as the processor, so as to adjust the rotating speed of the fan, thereby achieving the purpose of heat dissipation. In addition, the radiating airflow channel is generally fixed, the flow direction of radiating airflow is structurally solidified through early-stage radiating simulation, and the radiating strategy is adjusted by changing the rotating speed of the fan.
The BMC or CPLD monitors the temperature in the server case by reading the register value of each temperature sensor of the server through an I2C bus and converting the register value into temperature information, and then controls the duty ratio of a PWM output signal according to the temperature value fed back by the temperature sensor through a set fan regulation strategy and the BMC or CPLD and sends the PWM signal to the fan so as to regulate the rotating speed of the fan and regulate the temperature in the case. For the design of the current heat dissipation structure, a fixed fan module is usually adopted to be installed in the whole server, so that the flow direction of airflow is fixed and unchanged, the design is usually obtained according to the result of heat dissipation simulation, extreme conditions may occur in actual work, once the heat dissipation problem is caused by the defects of the design of the heat dissipation structure, the fan cannot be controlled by changing the rotating speed of the fan, and at the moment, if the design of the heat dissipation structure is carried out again, manpower and material resources are obviously increased.
Therefore, it is very necessary to provide a heat dissipation control device based on CPLD to solve the above-mentioned drawbacks in the prior art.
Disclosure of Invention
When meeting extreme condition in the intrinsic actual work of server complete machine to the above-mentioned fixed fan module of adoption of prior art, if because the defect of heat radiation structure design causes the heat dissipation problem, singly lean on the defect that changes fan speed then uncontrollable, and if carry out heat radiation structure's design again, can obviously increase the defect of manpower and materials, the utility model provides a heat dissipation controlling means based on CPLD to solve above-mentioned technical problem.
The utility model provides a heat dissipation control device based on a CPLD, which comprises a CPLD control module, wherein the CPLD control module is connected with a fan module, a temperature acquisition module and a motor drive module, and the motor drive module is connected with a baffle;
the CPLD control module, the fan module, the temperature acquisition module, the motor driving module and the baffle are all arranged in the server case;
the server case is also internally provided with a high-heat equipment module, and the temperature acquisition module is connected with the high-heat equipment module. The CPLD control module controls the motor driving module to drive the baffle plate to change the airflow direction in the server case and change the integral heat dissipation of the server case.
Further, the high-heat equipment module comprises hard disk equipment and GPU equipment;
the shell of the server case comprises a first side surface, a second side surface, a top surface and a bottom surface, wherein the first side surface and the second side surface are oppositely arranged;
the temperature acquisition module comprises a first temperature sensor and a second temperature sensor;
the hard disk device is arranged inside the top surface of the server case shell and is fully contacted with the inner side of the top surface of the server case shell; the first temperature sensor is arranged on the surface of the hard disk device;
the fan module is arranged on the lower side of the hard disk device;
the GPU equipment is arranged on the bottom surface of the shell of the server case and is arranged on one side of the bottom surface connected with the first side surface. In an actual working scene, the hard disk device and the GPU device usually do not operate at high voltage simultaneously. When the main service is data storage, the heat dissipation pressure of the hard disk device is higher, at the moment, the CPLD control module can know that the temperature of the current hard disk device area is higher by reading the first temperature sensor of the hard disk area, and at the moment, the CPLD control module can control the motor driving module to enable the motor driving module to drive the baffle to rotate to the second side surface of the server case shell, so that more heat dissipation airflow can be used for dissipating heat of the hard disk device; when the main business is data accelerated calculation, the heat dissipation pressure of the GPU equipment is larger, the CPLD control module can read the second temperature sensor of the GPU equipment area, and when the temperature pressure of the GPU equipment area is read to be larger, the baffle is rotated to the first side face of the shell of the server case through the motor driving module to change the air flow direction, so that the heat dissipation of the GPU equipment area is better carried out.
Furthermore, the shell of the server case also comprises a front surface and a back surface, and the front surface and the back surface are oppositely arranged;
a rotating shaft is arranged at one end of the baffle, and a first fixing hole and a second fixing hole which are matched with the two ends of the rotating shaft are respectively arranged in the front and the back of the shell of the server case;
the other end of the baffle is provided with a sliding screw rod; the front and the back of the shell of the server case are respectively provided with a first sliding chute and a second sliding chute which are matched with the two ends of the sliding screw rod. The rotation axis of baffle is fixed in first fixed orifices and second fixed orifices, and the baffle can rotate in first fixed orifices and second fixed orifices along with the selection axis, and simultaneously, the slip screw rod of baffle slides in first spout and second spout, realizes the motion of baffle.
Further, the motor driving module comprises a motor and a motor power supply;
the motor is connected with a motor power supply and the CPLD control module;
the rotating shaft of the motor is connected with the rotating shaft of the baffle. The movement of the baffle is realized by driving a rotating shaft to rotate by a motor of the motor driving module.
Furthermore, the front and the back of the shell of the server case are respectively provided with a nut matched with the two ends of the sliding screw. The nut fixes the sliding screw rod and prevents the sliding screw rod from falling off from the first sliding groove and the second sliding groove.
Further, the CPLD control module is connected with the temperature acquisition module through an I2C bus;
the CPLD control module is connected with the motor driving module through a GPIO interface;
and the CPLD control module is connected with the fan module through the PWM interface. The CPLD control module realizes the rapid control of the motor driving module through the GPIO interface, and the CPLD control module realizes the control of the rotating speed of the fan module through the PWM interface.
Further, the CPLD control module is also connected with a temperature display module. The CPLD control module transmits the temperature information to the temperature display module to complete real-time display, so that testers can conveniently and quickly acquire the temperature state information in the server.
Furthermore, the temperature display module adopts an OLED display screen;
the CPLD control module is connected with the temperature display module through an I2C bus. And the CPLD control module transmits the temperature information to the OLED display screen through an I2C bus to complete real-time display.
The utility model has the advantages that,
the utility model provides a heat dissipation control device based on CPLD, through CPLD control module control motor drive module to drive the position of baffle through motor drive module, thereby adjust the interior airflow direction of change server machine incasement according to actual work scene in real time, and CPLD control module is according to the temperature information of temperature acquisition module, high-efficiently driving motor, and the processing speed is fast, thereby lets the heat dissipation regulation and control tactics nimble more and reliable, guarantees server normal operating.
Furthermore, the utility model relates to a principle is reliable, and simple structure has very extensive application prospect.
Therefore, compared with the prior art, the utility model has the substantive characteristics and the progress, and the beneficial effects of the implementation are also obvious.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the structure connection of the present invention;
FIG. 2 is a schematic view of the baffle assembly of the present invention;
in the figure, a 1-CPLD control module; 2-a fan module; 3-a temperature acquisition module; 3.1 — a first temperature sensor; 3.2-a second temperature sensor; 4-a motor driving module; 5-a baffle plate; 6-a server chassis; 6.1-first side; 6.2-second side; 6.3-Top surface; 6.4-bottom surface; 6.5-front; 6.6-posterior; 7.1-hard disk device; 7.2-GPU devices; 8-a temperature display module; 9-a rotating shaft; 10.1-first fixation hole; 10.2-second fixing hole; 11-a sliding screw; 12.1-a first runner; 12.2-second runner.
Detailed Description
In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
Example 1:
as shown in fig. 1, the utility model provides a heat dissipation control device based on CPLD, including CPLD control module 1, CPLD control module 1 is connected with fan module 2, temperature acquisition module 3, motor drive module 4 and temperature display module 8, and motor drive module 4 is connected with baffle 5; the temperature display module 8 adopts an OLED display screen;
the CPLD control module 1, the fan module 2, the temperature acquisition module 3, the motor drive module 4 and the baffle 5 are all arranged in the server case 6;
a high-heat equipment module is also arranged in the server case 6, and the temperature acquisition module 3 is connected with the high-heat equipment module;
the high-heat equipment module comprises hard disk equipment 7.1 and GPU equipment 7.2;
the shell of the server case 6 comprises a first side surface 6.1, a second side surface 6.2, a top surface 6.3 and a bottom surface 6.4, wherein the first side surface 6.1 and the second side surface 6.2 are oppositely arranged;
the temperature acquisition module 3 comprises a first temperature sensor 3.1 and a second temperature sensor 3.2;
the hard disk device 7.1 is arranged inside the top surface 6.3 of the shell of the server case 6 and is fully contacted with the inner side of the top surface 6.3 of the shell of the server case 6; the first temperature sensor 3.1 is arranged on the surface of the hard disk device 7.1;
the fan module 2 is arranged at the lower side of the hard disk device 7.1;
the GPU equipment 7.2 is arranged on the bottom surface 6.4 of the shell of the server case 6 and is arranged on one side of the bottom surface 6.4 connected with the first side surface 6.1;
the CPLD control module 1 is connected with the temperature acquisition module 3 through an I2C bus;
the CPLD control module 1 is connected with the motor driving module 4 through a GPIO interface;
the CPLD control module 1 is connected with the fan module 2 through a PWM interface;
the CPLD control module 1 is connected with the temperature display module 8 through an I2C bus.
Example 2:
as shown in fig. 1, the utility model provides a heat dissipation control device based on CPLD, including CPLD control module 1, CPLD control module 1 is connected with fan module 2, temperature acquisition module 3 and motor drive module 4, and motor drive module 4 is connected with baffle 5;
the CPLD control module 1, the fan module 2, the temperature acquisition module 3, the motor drive module 4 and the baffle 5 are all arranged in the server case 6;
a high-heat equipment module is also arranged in the server case 6, and the temperature acquisition module 3 is connected with the high-heat equipment module;
the high-heat equipment module comprises hard disk equipment 7.1 and GPU equipment 7.2;
the shell of the server case 6 comprises a first side surface 6.1, a second side surface 6.2, a top surface 6.3 and a bottom surface 6.4, wherein the first side surface 6.1 and the second side surface 6.2 are oppositely arranged;
the temperature acquisition module 3 comprises a first temperature sensor 3.1 and a second temperature sensor 3.2;
the hard disk device 7.1 is arranged inside the top surface 6.3 of the shell of the server case 6 and is fully contacted with the inner side of the top surface 6.3 of the shell of the server case 6; the first temperature sensor 3.1 is arranged on the surface of the hard disk device 7.1;
the fan module 2 is arranged at the lower side of the hard disk device 7.1;
the GPU equipment 7.2 is arranged on the bottom surface 6.4 of the shell of the server case 6 and is arranged on one side of the bottom surface 6.4 connected with the first side surface 6.1;
as shown in fig. 2, the housing of the server chassis 6 further includes a front 6.5 and a rear 6.6, and the front 6.5 and the rear 6.6 are oppositely disposed;
one end of the baffle 5 is provided with a rotating shaft 9, and the front 6.5 and the back 6.6 of the shell of the server case 6 are respectively provided with a first fixing hole 10.1 and a second fixing hole 10.2 which are matched with the two ends of the rotating shaft 9;
the motor driving module 4 comprises a motor and a motor power supply;
the motor is connected with a motor power supply and the CPLD control module 1;
the rotating shaft of the motor is connected with the rotating shaft 9 of the baffle 5;
the other end of the baffle 5 is provided with a sliding screw 11; the front 6.5 and the back 6.6 of the shell of the server case 6 are respectively provided with a first chute 12.1 and a second chute 12.2 which are matched with the two ends of the sliding screw 11;
the front 6.5 and the back 6.6 of the shell of the server case 6 are respectively provided with nuts matched with the two ends of the sliding screw 11.
Although the present invention has been described in detail by referring to the drawings in conjunction with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and substance of the present invention, and these modifications or substitutions are intended to be within the scope of the present invention/any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (8)

1. A heat dissipation control device based on a CPLD is characterized by comprising a CPLD control module (1), wherein the CPLD control module (1) is connected with a fan module (2), a temperature acquisition module (3) and a motor drive module (4), and the motor drive module (4) is connected with a baffle (5);
the CPLD control module (1), the fan module (2), the temperature acquisition module (3), the motor drive module (4) and the baffle (5) are all arranged in the server case (6);
a high-heat equipment module is further arranged in the server case (6), and the temperature acquisition module (3) is connected with the high-heat equipment module.
2. The CPLD-based heat dissipation control device according to claim 1, characterized in that the high-heat device module includes a hard disk device (7.1) and a GPU device (7.2);
the shell of the server case (6) comprises a first side surface (6.1), a second side surface (6.2), a top surface (6.3) and a bottom surface (6.4), wherein the first side surface (6.1) and the second side surface (6.2) are oppositely arranged;
the temperature acquisition module (3) comprises a first temperature sensor (3.1) and a second temperature sensor (3.2);
the hard disk device (7.1) is arranged inside the top surface (6.3) of the shell of the server case (6) and is fully contacted with the inner side of the top surface (6.3) of the shell of the server case (6); the first temperature sensor (3.1) is arranged on the surface of the hard disk device (7.1);
the fan module (2) is arranged at the lower side of the hard disk device (7.1);
the GPU equipment (7.2) is arranged on the bottom surface (6.4) of the shell of the server case (6) and is arranged on the side, connected with the first side surface (6.1), of the bottom surface (6.4).
3. The CPLD-based heat dissipation control device according to claim 2, characterized in that the housing of the server chassis (6) further comprises a front side (6.5) and a rear side (6.6), the front side (6.5) and the rear side (6.6) being disposed opposite to each other;
a rotating shaft (9) is arranged at one end of the baffle (5), and a first fixing hole (10.1) and a second fixing hole (10.2) which are matched with the two ends of the rotating shaft (9) are respectively arranged on the front surface (6.5) and the rear surface (6.6) of the shell of the server case (6);
the other end of the baffle (5) is provided with a sliding screw (11); the front (6.5) and the back (6.6) of the shell of the server case (6) are respectively provided with a first sliding chute (12.1) and a second sliding chute (12.2) which are matched with the two ends of the sliding screw rod (11).
4. The CPLD-based heat dissipation control device according to claim 3, characterized in that the motor drive module (4) includes a motor and a motor power supply;
the motor is connected with a motor power supply and the CPLD control module (1);
the rotating shaft of the motor is connected with the rotating shaft (9) of the baffle (5).
5. The CPLD-based heat dissipation control device according to claim 3, characterized in that the front (6.5) and the back (6.6) of the housing of the server chassis (6) are further provided with nuts respectively engaged with the two ends of the sliding screw (11).
6. The CPLD-based heat dissipation control device according to claim 1, characterized in that the CPLD control module (1) is connected with the temperature acquisition module (3) through an I2C bus;
the CPLD control module (1) is connected with the motor driving module (4) through a GPIO interface;
the CPLD control module (1) is connected with the fan module (2) through a PWM interface.
7. The CPLD-based heat dissipation control device according to claim 1, characterized in that the CPLD control module (1) is further connected to a temperature display module (8).
8. The CPLD-based heat dissipation control device according to claim 7, characterized in that the temperature display module (8) employs an OLED display screen;
the CPLD control module (1) is connected with the temperature display module (8) through an I2C bus.
CN201921557458.1U 2019-09-19 2019-09-19 Heat dissipation control device based on CPLD Active CN210639561U (en)

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Application Number Priority Date Filing Date Title
CN201921557458.1U CN210639561U (en) 2019-09-19 2019-09-19 Heat dissipation control device based on CPLD

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Application Number Priority Date Filing Date Title
CN201921557458.1U CN210639561U (en) 2019-09-19 2019-09-19 Heat dissipation control device based on CPLD

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112269450A (en) * 2020-10-20 2021-01-26 苏州浪潮智能科技有限公司 Server heat dissipation device and adjusting method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112269450A (en) * 2020-10-20 2021-01-26 苏州浪潮智能科技有限公司 Server heat dissipation device and adjusting method thereof

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