CN210633074U - Scaling powder dip-coating device - Google Patents
Scaling powder dip-coating device Download PDFInfo
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- CN210633074U CN210633074U CN201921397014.6U CN201921397014U CN210633074U CN 210633074 U CN210633074 U CN 210633074U CN 201921397014 U CN201921397014 U CN 201921397014U CN 210633074 U CN210633074 U CN 210633074U
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- container
- dipping
- container cover
- pressure lever
- tray
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Abstract
The utility model relates to a scaling powder dips in and scribbles device, include: the pressure rod is arranged on a container cover of the container and can penetrate through the container cover to slide up and down, the upper end of the pressure rod is positioned outside the container, and the lower end of the pressure rod is positioned inside the container; a spring is arranged between the upper end of the pressure lever and the container cover, and a tray is arranged at the lower end of the pressure lever; the container cover is also provided with a dipping port, and the dipping port corresponds to the upper position and the lower position of the tray. The utility model discloses a location design, the volume of control scaling powder, unnecessary scaling powder can flow back in the container, avoids extravagant. The utility model discloses a device can make the pencil of bundling dip in simultaneously and scribble, and dip in and scribble the degree of depth unanimously. And when not in use, the sealing cover is covered to prevent the evaporation loss of the soldering flux.
Description
Technical Field
The utility model relates to a dip in and scribble the field, a scaling powder dips in and scribbles device specifically says so.
Background
In the existing wire harness production process, the existing working procedures need to dip the soldering flux on the wire harness, the mouth of a glassware used for dipping and coating the existing wire harness soldering flux is small, and after the soldering flux is dipped and coated, the redundant soldering flux cannot be poured back into the utensil, so that waste is caused. Moreover, the existing dipping vessels are easy to cause inconsistent dipping depth.
SUMMERY OF THE UTILITY MODEL
To the defects existing in the prior art, the utility model aims to provide a
In order to achieve the above purpose, the utility model adopts the technical proposal that:
a flux dipping device comprising: the container comprises a container 1 and a pressure lever 3, wherein the pressure lever 3 is arranged on a container cover 2 of the container 1 and can penetrate through the container cover 2 to slide up and down, the upper end of the pressure lever 3 is positioned outside the container 1, and the lower end of the pressure lever 3 is positioned inside the container 1; a spring 4 is arranged between the upper end of the pressure lever 3 and the container cover 2, and a tray 6 is arranged at the lower end of the pressure lever 3; the container cover 2 is also provided with a dipping port corresponding to the upper and lower positions of the tray 6.
The pressing rod 3 is arranged at the edge of the container cover 2, the dipping port is positioned in the middle of the container cover 2, and the quantity of the dipping port and the quantity of the trays 6 are one.
The pressure lever 3 is arranged in the middle of the container cover 2, and the dip coating ports are positioned at the edge of the container cover 2 and are uniformly arranged around the pressure lever 3; the number of the dipping ports and the number of the trays 6 are at least two.
The container 1 further comprises a sealing cap 5 for sealing the dip-coating opening.
The depth of the tray 6 is the same as the depth to be dipped.
The upper end of the pressure lever 3 is provided with a pressing handle, so that the pressure lever 3 can be conveniently pressed, and the upward movement of the spring 4 can be limited.
And a mechanical pressing mechanism is arranged above the pressing rod 3 and is used for pressing the pressing rod 3.
And a mechanical dipping hand grip is arranged above the dipping port and used for gripping a product to be coated.
The utility model has the advantages that: the utility model discloses a location design, the volume of control scaling powder, unnecessary scaling powder can flow back in the container, avoids extravagant. The utility model discloses a device can make the pencil of bundling dip in simultaneously and scribble, and dip in and scribble the degree of depth unanimously. And when not in use, the sealing cover is covered to prevent the evaporation loss of the soldering flux.
Drawings
The utility model discloses there is following figure:
FIG. 1 is a schematic view of the external structure of the present invention;
fig. 2 is a schematic view of the internal structure of the present invention;
fig. 3 is a schematic diagram of the internal structure of the present invention.
1-container 2-container cover 3-pressure bar 4-spring 5-sealing cover 6-tray.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1-3, the soldering flux dipping device of the present invention comprises: the container comprises a container 1 and a pressure lever 3, wherein the pressure lever 3 is arranged on a container cover 2 of the container 1 and can penetrate through the container cover 2 to slide up and down, the upper end of the pressure lever 3 is positioned outside the container 1, and the lower end of the pressure lever 3 is positioned inside the container 1; a spring 4 is arranged between the upper end of the pressure lever 3 and the container cover 2, and a tray 6 is arranged at the lower end of the pressure lever 3; the container cover 2 is also provided with a dipping port corresponding to the upper and lower positions of the tray 6.
In one embodiment, the pressing rod 3 is disposed at the edge of the container cover 2, the dip coating port is located at the middle of the container cover 2, and the number of the dip coating ports and the number of the trays 6 are one.
In another embodiment, the pressing rod 3 is arranged in the middle of the container cover 2, and the dip coating ports are positioned at the edge of the container cover 2 and are uniformly arranged around the pressing rod 3; the number of the dipping ports and the number of the trays 6 are at least two.
The container 1 further comprises a sealing cap 5 for sealing the dip-coating opening.
The depth of the tray 6 is the same as the depth to be dipped.
The upper end of the pressure lever 3 is provided with a pressing handle, so that the pressure lever 3 can be conveniently pressed, and the upward movement of the spring 4 can be limited.
A mechanical pressing mechanism can be arranged above the pressing rod 3 and used for pressing the pressing rod 3 so as to realize the automation of pressing.
And a mechanical dipping hand grip can be arranged above the dipping port and used for gripping a product to be coated so as to realize the automation of dipping.
It is worth explaining that the soldering flux dip-coating device of the utility model is not limited to dip-coating the soldering flux, nor dip-coating the wiring harness. Any situation that is suitable for the scaling powder dip-coating device also belongs to the protection scope of the utility model.
Use pencil to dip in and scribble the scaling powder as the example, the scaling powder dip in and scribble the device working process as follows:
the pressure lever and the tray are fixed on the container cover 2 of the container 1 through a spring, and a proper amount of soldering flux is put into the container. The pressing rod 3 is pressed down, the tray 6 moves downwards along with the pressing rod, and the tray 6 is immersed in the soldering flux. The pressing lever 3 is released and the tray 6 is moved upward by the urging force of the spring 4 to be brought into contact with the container lid 2 of the container 1. Tray 6 is filled with solvent and excess solvent is returned to the interior of the vessel.
And putting the bundled wire harness into a tray, and dipping the soldering flux on the bottom of the wire harness. The flux overflowing due to the insertion of the wire harness flows back to the inside of the container. The bottom of the tray is a plane, so that the dipping depth of the wiring harness is consistent. After use, the sealing cover 5 is covered to prevent the soldering flux from evaporating.
When the number of the dipping ports and the number of the trays 6 are at least two, the use process is the same as the process. When a plurality of dipping ports and trays are arranged in one container, the dipping efficiency can be greatly improved.
Those not described in detail in this specification are within the skill of the art.
Claims (8)
1. A flux dipping device, comprising: the container comprises a container (1) and a pressure lever (3), wherein the pressure lever (3) is arranged on a container cover (2) of the container (1) and can penetrate through the container cover (2) to slide up and down, the upper end of the pressure lever (3) is positioned outside the container (1), and the lower end of the pressure lever (3) is positioned inside the container (1); a spring (4) is arranged between the upper end of the compression bar (3) and the container cover (2), and a tray (6) is arranged at the lower end of the compression bar (3); the container cover (2) is also provided with a dipping port, and the dipping port corresponds to the upper position and the lower position of the tray (6).
2. The flux dipping device as defined in claim 1 wherein: the pressing rod (3) is arranged at the edge of the container cover (2), the dipping port is positioned in the middle of the container cover (2), and the quantity of the dipping ports and the quantity of the trays (6) are one.
3. The flux dipping device as defined in claim 1 wherein: the pressure rod (3) is arranged in the middle of the container cover (2), and the dip coating ports are positioned at the edge of the container cover (2) and are uniformly arranged around the pressure rod (3); the number of the dipping ports and the number of the trays (6) are at least two.
4. The flux dipping device as defined in claim 1 wherein: the container (1) further comprises a sealing cover (5) for sealing the dipping opening.
5. The flux dipping device as defined in any one of claims 1 to 4, wherein: the depth of the tray (6) is the same as the depth of dipping.
6. The flux dipping device as defined in any one of claims 1 to 4, wherein: the upper end of the pressure lever (3) is provided with a pressing handle.
7. The flux dipping device as defined in any one of claims 1 to 4, wherein: and a mechanical pressing mechanism is also arranged above the pressing rod (3) and is used for pressing the pressing rod (3).
8. The flux dipping device as defined in any one of claims 1 to 4, wherein: and a mechanical dipping hand grip is arranged above the dipping port and used for gripping a product to be coated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921397014.6U CN210633074U (en) | 2019-08-27 | 2019-08-27 | Scaling powder dip-coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921397014.6U CN210633074U (en) | 2019-08-27 | 2019-08-27 | Scaling powder dip-coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210633074U true CN210633074U (en) | 2020-05-29 |
Family
ID=70791247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921397014.6U Active CN210633074U (en) | 2019-08-27 | 2019-08-27 | Scaling powder dip-coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210633074U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833036A (en) * | 2022-05-26 | 2022-08-02 | 佛山科学技术学院 | Gluing equipment |
-
2019
- 2019-08-27 CN CN201921397014.6U patent/CN210633074U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833036A (en) * | 2022-05-26 | 2022-08-02 | 佛山科学技术学院 | Gluing equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiangsu Xingkedi Digital Technology Co.,Ltd. Assignor: XINGKEDI TECHNOLOGY (TAIZHOU) Co.,Ltd. Contract record no.: X2023320000084 Denomination of utility model: A flux dipping device Granted publication date: 20200529 License type: Common License Record date: 20230206 |