CN210628273U - Silicon chip conveying carrier and silicon chip conveying device - Google Patents

Abstract

The utility model provides a silicon wafer conveying carrier and a silicon wafer conveying device, wherein the silicon wafer conveying carrier comprises a supporting plate, a positioning piece and a fixing piece, the positioning piece is arranged on one side of the supporting plate, the positioning piece comprises a bending part, and the bending part is suitable for being abutted with the edge of the silicon wafer facing the supporting plate and limiting the edge at the bending part; the fixing piece is arranged on one side of the supporting plate, provided with the positioning piece, and used for limiting the side edge of the silicon wafer. The utility model provides a carrier, kink can play limiting displacement to the border of orientation backup pad on the silicon chip, prevents that this border from moving for the backup pad to make the carrier can bear the silicon chip. The structure is simple, the cost is low, stable bearing of the silicon wafer can be achieved, the silicon wafer is prevented from shaking relative to the carrier, and therefore potential quality hazards of scratching, infrared EL black spots, hidden cracks and the like of the silicon wafer due to shaking are avoided.

Description

Silicon chip conveying carrier and silicon chip conveying device

Technical Field

The utility model relates to a solar cell silicon chip production technical field, more specifically relates to a carrier and silicon chip conveyer are carried to silicon chip.

Background

When an HIT (heterojunction with intrinsic thin) solar photovoltaic cell is prepared, after the conductive paste is printed on the surface of a silicon wafer, drying and curing are required.

In the related technology, the carrier is designed to be a U-shaped groove, the carrier is directly contacted with the surface of a silicon wafer, the carrier is fixed by a single small square groove, the whole device is complex in structure, and potential quality hazards such as scratch of a battery piece, infrared EL black spots (infrared defects), hidden cracks and the like are easily caused by serious shaking during production and conveying.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least.

Therefore, an aspect of the present invention is to provide a silicon wafer conveying carrier.

Another aspect of the present invention is to provide a silicon wafer conveying apparatus including the above silicon wafer conveying carrier.

In order to achieve the above object, the present invention provides a silicon wafer conveying carrier, including: a support plate; the positioning piece is arranged on one side of the supporting plate and comprises a bending part, and the bending part is suitable for abutting against the edge of the silicon wafer facing the supporting plate and limiting the edge at the bending part; and the fixing piece is arranged on one side of the positioning piece arranged on the supporting plate and used for limiting the side edge of the silicon wafer.

The utility model provides an above-mentioned technical scheme provides a carrier is carried to silicon chip sets up the setting element in backup pad one side, and the setting element includes the kink, on the silicon chip towards the border of backup pad be located kink department and with kink looks butt to the kink can play limiting displacement towards the border of backup pad on the silicon chip, prevents this border for the backup pad motion, thereby makes the carrier can bear the silicon chip. The structure is simple, the cost is low, stable bearing of the silicon wafer can be achieved, the silicon wafer is prevented from shaking relative to the carrier, and therefore potential quality hazards of scratching, infrared EL black spots, hidden cracks and the like of the silicon wafer due to shaking are avoided.

The fixing piece and the positioning piece are arranged on the same side of the supporting plate, so that the silicon wafer can be conveyed by the carrier in a side-standing mode, conveying requirements are met, working efficiency of drying and the like is effectively improved, the silicon wafer is conveyed into the furnace body, heating and drying of the front side and the back side of the silicon wafer can be achieved, process time is shortened, and drying effect and yield are improved.

Additionally, the utility model discloses above-mentioned technical scheme provides a silicon chip carries carrier still has following additional technical characteristic:

in any of the above technical solutions, the bending portion is arc-shaped or R-shaped.

The silicon chip is limited at the bent part, so that stress points of the silicon chip are increased, and the defect that a single small square groove is fixed and is easy to shake in the related technology is overcome. The positioning piece supports the edge of the bottom of the silicon wafer, and the arc shape has a certain buffering effect on the silicon wafer when the silicon wafer is fed, so that the silicon wafer is protected from being damaged. The bending part is arc-shaped, so that instantaneous pressure generated when the silicon wafer is contacted with the positioning piece is decomposed into a plurality of directions, the silicon wafer cannot be cracked due to falling of the silicon wafer, and the cracking rate is reduced.

Alternatively, the bent portion has an R shape or a shape similar to an R shape.

In any one of the above technical solutions, the positioning element includes a connecting portion, a positioning element body and a protruding portion, the connecting portion is located the positioning element body is close to one side of the supporting plate and is used for being connected with the supporting plate, the protruding portion is located the positioning element body deviates from one side of the supporting plate, and the protruding portion and the connecting portion of the positioning element body form the bending portion.

The locating piece is abutted to the bottom of the silicon wafer, the edge of the silicon wafer comprises a first edge and a second edge which are oppositely arranged at the bottom of the silicon wafer, the silicon wafer is approximately rectangular, the edge of the silicon wafer comprises two edges (a first edge and a second edge) at the bottom of the rectangular, and the first edge and the second edge are sequentially arranged along the width direction of the supporting plate. The first bending section is abutted against the first edge, and the second bending section is abutted against the second edge, so that two points of the silicon wafer are positioned and fixed by the positioning piece, stress points are increased, and the defect that the traditional single square groove is easy to shake during fixing is overcome.

The junction of bellying and setting element body forms the kink, and the border towards the backup pad on the silicon chip is spacing in the kink, can carry out stable spacing to the silicon chip through the kink, prevents that the silicon chip from moving for the carrier.

Connecting portion and bellying are located the relative both sides of setting element body respectively, and wherein, connecting portion are close to the backup pad setting, and the backup pad setting is kept away from to the bellying, like this, do not interfere each other between connecting portion and the bellying, can make to have the clearance between bellying and the backup pad moreover, in other words for bellying and backup pad are not coplane, have the clearance like this between silicon chip bottom border and the backup pad, thereby improve the drying efficiency to the silicon chip.

Further, the positioning member is S-shaped or S-like.

Furthermore, the connecting portion is close to the first side wall of the supporting plate, the protruding portion is close to the second side wall of the supporting plate, and the first side wall and the second side wall are two side edges of the supporting plate in the width direction respectively.

In any of the above technical solutions, a gap is formed between the positioning member body and the support plate.

A gap is formed between the positioning piece body and the supporting plate, so that a gap is formed between the silicon wafer and the supporting plate, the bottom of the silicon wafer can be heated, and the drying efficiency and the drying effect of the silicon wafer are improved.

Further, the positioning piece body and the supporting plate are arranged in parallel.

Further, the positioning piece is of an integrated structure.

In any one of the above technical solutions, the number of the positioning members is plural, and the plurality of the positioning members are sequentially arranged along the length direction of the supporting plate.

The number of the positioning pieces is multiple, so that the limiting and supporting effects on the silicon wafer can be enhanced, and the stability of the silicon wafer in the carrier is further improved.

In any one of the above technical solutions, the supporting plate is provided with a plurality of connecting portions, and the plurality of connecting portions are in one-to-one correspondence with and connected to the plurality of connecting matching portions on the silicon wafer conveying device.

Be equipped with a plurality of connecting portions in the backup pad, a plurality of connecting portions are used for respectively with silicon chip conveyer on a plurality of connection cooperation portion one-to-ones and connect, increased tie point and stress point between backup pad and the silicon chip conveyer, solved the fixed drawback of rocking easily of traditional single little square groove, realized bearing the weight of the stability of silicon chip, avoid the silicon chip to rock for the carrier to avoid the silicon chip because of rocking quality hidden danger such as fish tail, infrared EL black spot, latent splitting that appear.

In any one of the above technical solutions, the connecting portion includes a mounting hole for a fastener to pass through, so that the supporting plate is connected with the silicon wafer conveying device through the fastener, and the plurality of mounting holes are sequentially arranged along the length direction of the supporting plate.

The connecting part comprises a mounting hole, the connecting matching part comprises a connecting hole, and a fastener (such as a screw) penetrates through the mounting hole and the connecting hole to realize the connection between the support plate and the silicon wafer conveying device. The mode of connecting through the fastener simple structure, with low costs.

The mounting holes are sequentially arranged along the length direction of the supporting plate, so that the connection reliability between the supporting plate and the silicon wafer conveying device in the length direction of the supporting plate is enhanced.

Further, the mounting hole is located in the middle in the width direction of the support plate.

In any one of the above technical solutions, the fixing member includes a first connecting rod and a second connecting rod which are arranged oppositely, the first connecting rod and the second connecting rod are arranged on the supporting plate, the fixing member further includes an ear support portion arranged between the first connecting rod and the second connecting rod, the ear support portion is located on the first connecting rod and the second connecting rod deviates from one side of the positioning member and limits the opening direction of the opening groove of the positioning member, and the ear support portion is used for limiting the side edge of the silicon wafer.

The fixing piece stands upright at the end of the supporting plate, an ear supporting part is arranged at one end, far away from the supporting plate, of the fixing piece, the ear supporting part surrounds the corresponding side edge of the silicon wafer, the ear supporting part is in contact with the side edge of the silicon wafer, the middle of the silicon wafer is prevented from being in contact with the ear supporting part, printing on the silicon wafer is effectively protected, and the yield of products and the photoelectric efficiency are improved.

The fixing piece is of a rod body bending structure and is provided with a first connecting rod and a second connecting rod which are spaced front and back, a gap between the first connecting rod and the second connecting rod is matched with the silicon wafer to be placed in a side-standing mode, and one ends, far away from the supporting plate, of the first connecting rod and one ends, far away from the supporting plate, of the second connecting rod are connected together through the lug support portions. The structure is simple and the manufacture is easy. Furthermore, the ear support parts are in a V-shaped side wing shape, so that the width size of the silicon wafer is met, the corresponding side edges of the silicon wafer are surrounded by the ear support parts and are properly supported, the silicon wafer is conveyed in a side-standing mode, and the conveying requirement is met.

Furthermore, the supporting plate and the fixing part are combined into a concave shape, the supporting plate and the silicon wafer are transversely arranged in a crossed mode in the conveying direction, the upper side face of the supporting plate and the fixing part surround the silicon wafer to be placed on the side, the fixing part is in contact with the edge of the silicon wafer, the middle of the silicon wafer is prevented from being in contact with the fixing part, and printing on the silicon wafer is effectively protected.

The first connecting rod and the second connecting rod extend outwards towards two ends along the axial direction (length direction) of the supporting plate to form a V-shaped lug support part which is provided with a V-shaped groove so as to place a silicon wafer, and the possibility of scratching a battery wafer (silicon wafer) is reduced.

Further, the number of the fixing members is plural, for example, the number of the fixing members is two, and the two fixing members are respectively located at two ends of the supporting plate in the length direction.

In any one of the above technical solutions, the open slot and the bent portion are staggered in a vertical direction, so that the silicon wafer is obliquely placed in the carrier.

The open slot and the bending part are arranged in a staggered mode in the vertical direction, in other words, the open slot and the bending part are sequentially arranged along the width direction of the supporting plate, so that the silicon wafer can be obliquely arranged in the carrier, the stability of the silicon wafer in the carrier is improved on the one hand, and the drying efficiency of the silicon wafer can be improved on the other hand.

In any of the above technical solutions, the supporting plate is provided with at least one through hole.

The supporting plate is provided with at least one through hole (hollow), and the through hole can be in various shapes such as a circle, a rectangle and the like. Under the prerequisite of guaranteeing that carrier service function is intact, the through-hole helps hot-blast even flow, promotes the stoving solidification effect to the silicon chip, furthest has alleviateed the whole weight of carrier, reduces equipment transmission load, has also made things convenient for the installation and maintenance work.

The utility model discloses technical scheme of second aspect provides a silicon chip conveyer, include: a chain provided with a plurality of connection matching parts; and the silicon wafer conveying carrier is arranged on the chain, and a plurality of connecting parts on a supporting plate of the silicon wafer conveying carrier correspond to and are connected with a plurality of connecting matching parts one by one.

The utility model discloses the silicon chip conveyer that technical scheme of second aspect provided, because of including any one in the technical scheme of first aspect the silicon chip carry the carrier, therefore have any one in the technical scheme of first aspect the silicon chip carry whole beneficial effect of carrier, no longer describe here.

The silicon wafer conveying device comprises a chain and a chain wheel, wherein the chain is meshed with the chain wheel, and the carrier is fixed on the chain, so that the carrier moves along with the chain under the action of the chain wheel.

Furthermore, be equipped with the mount table on the chain, the mount table with the backup pad on deviate from the surface looks butt of setting element, connect cooperation portion setting on the mount table, be used for on the mount table to be planar with backup pad looks butt's surface, be used for in the backup pad with mount table looks butt's surface (the surface that deviates from the setting element in the backup pad) be planar.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a carrier according to an embodiment of the present invention;

fig. 2 is a schematic view of a matching structure of a carrier and a silicon wafer according to an embodiment of the present invention.

Wherein, the correspondence between the reference numbers and the component names in fig. 1 and fig. 2 is:

100 carriers, 10 support plates, 101 through holes, 102 mounting holes, 20 positioning pieces, 201 protrusions, 202 positioning piece bodies, 203 connecting parts, 204 bending parts, 30 fixing pieces, 301 first connecting rods, 302 second connecting rods, 303 lug supporting parts, 304 first connecting sections, 305 second connecting sections, 306 open grooves, 200 silicon wafers, 300 chains, 301 mounting tables and 302 connecting holes.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.

A silicon wafer conveying carrier and a silicon wafer conveying apparatus according to some embodiments of the present invention will be described below with reference to the accompanying drawings.

As shown in fig. 1, according to the present invention, some embodiments provide a silicon wafer conveying carrier, including: a support plate 10 and a positioning member 20.

The positioning member 20 is disposed at one side of the support plate 10, and the positioning member 20 includes a bending portion 204, the bending portion 204 is adapted to abut against an edge of the silicon wafer 200 facing the support plate 10 and limit the edge at the bending portion 204.

The utility model discloses carrier 100 is carried to silicon chip sets up setting element 20 in backup pad 10 one side, and setting element 20 includes kink 204, and the border towards backup pad 10 is located kink 204 department and cooperatees with kink 204 on the silicon chip 200 to kink 204 can play limiting displacement to the border towards backup pad 10 on the silicon chip 200, prevents that this border from moving for backup pad 10, thereby makes carrier 100 can bear silicon chip 200. The structure is simple, the cost is low, stable bearing of the silicon wafer 200 can be achieved, the silicon wafer 200 is prevented from shaking relative to the carrier 100, and therefore potential quality hazards such as scratches, infrared EL black spots and hidden cracks of the silicon wafer 200 due to shaking are avoided.

Further, as shown in fig. 1, the bent portion 204 is in the shape of a circular arc.

The silicon chip 200 is limited at the bending part 204, so that the stress point of the silicon chip 200 is increased, and the defect that a single small square groove is easy to shake during fixing in the related technology is overcome. The positioning member 20 supports the edge of the bottom of the silicon wafer 200, and the arc shape has a certain buffering effect on the silicon wafer 200 during wafer feeding, so that the silicon wafer 200 is protected from being damaged. The bending part 204 is arc-shaped, so that the instantaneous pressure generated when the silicon wafer 200 contacts the positioning member 20 is decomposed into a plurality of directions, the silicon wafer 200 is not cracked due to the falling of the silicon wafer 200, and the cracking rate is reduced.

As shown in fig. 1, the bent portion 204 is shaped like an angle R.

Further, the positioning member 20 includes a positioning member body 202 and a protruding portion 201 connected to each other, the protruding portion 201 is located one side of the positioning member body 202 away from the support plate 10, a bent portion 204 is formed at a connection portion of the protruding portion 201 and the positioning member body 202, the bent portion 204 includes a first bending section and a second bending section, the first bending section is connected to the positioning member body 202, the second bending section is connected to the protruding portion 201, the connection portion of the first bending section and the second bending section is bent, the edge of the silicon wafer 200 includes a first edge and a second edge which are oppositely arranged at the bottom of the silicon wafer 200, the first bending section is suitable for being abutted to the first edge, and the second bending section is suitable for being abutted to the second edge.

The positioning member 20 abuts against the bottom of the silicon wafer 200, the edges of the silicon wafer 200 include a first edge and a second edge that are opposite to each other at the bottom of the silicon wafer 200, taking the silicon wafer 200 as an example, the edges of the silicon wafer 200 include two edges (a first edge and a second edge) at the bottom of a rectangular parallelepiped, and the first edge and the second edge are sequentially arranged along the width direction of the supporting plate 10. The first bending section is abutted with the first edge, and the second bending section is abutted with the second edge, so that the positioning piece 20 can position and fix two points of the silicon wafer 200, stress points are increased, and the defect that the traditional single square groove is easy to shake during fixing is overcome.

Further, the positioning member 20 includes a connecting portion 203, and the connecting portion 203, the positioning member body 202 and the protruding portion 201 are sequentially disposed, wherein the connecting portion 203 is located on one side of the positioning member body 202 close to the support plate 10 and is used for being connected with the support plate 10.

The connection part of the protrusion 201 and the positioning member body forms a bending part 204, the edge of the silicon wafer 200 facing the supporting plate 10 is limited in the bending part 204, and the silicon wafer 200 can be stably limited by the bending part 204, so that the silicon wafer 200 is prevented from moving relative to the carrier 100.

The connecting portion 203 and the protruding portion 201 are respectively located at two opposite sides of the positioning member body 202, wherein the connecting portion 203 is located close to the supporting plate 10, and the protruding portion 201 is located far away from the supporting plate 10, as shown in fig. 1, the protruding portion is located above the positioning member body, and the connecting portion is located below the positioning member body, so that the connecting portion 203 and the protruding portion 201 do not interfere with each other, and a gap can be formed between the protruding portion 201 and the supporting plate 10, in other words, the protruding portion 201 and the supporting plate 10 are not coplanar, and thus a gap is formed between the bottom edge of the silicon wafer 200 and the supporting plate 10, thereby improving the drying efficiency of the silicon. As shown in fig. 1, the protrusion 201 is higher than the support plate 10, the positioning member 20 is disposed on the upper side of the support plate 10 and is disposed near the end of the support plate 10, and the protrusion 201 is higher than the support plate 10, so that a gap is left between the bottom edge of the silicon wafer 200 and the upper side of the support plate 10, which is helpful for ventilation from top to bottom and is beneficial for drying and other operations.

Further, as shown in fig. 1, the positioning member 20 has an S-shape or S-like shape.

Further, the connecting portion 203 is disposed near a first side wall of the supporting plate 10, the protruding portion 201 is disposed near a second side wall of the supporting plate 10, and the first side wall and the second side wall are two sides of the supporting plate in the width direction.

Further, a gap is provided between the positioning member body 202 and the support plate 10.

A gap is formed between the positioning piece body 202 and the supporting plate 10, so that a gap is formed between the silicon wafer 200 and the supporting plate 10, the bottom of the silicon wafer 200 can be heated, and the drying efficiency and the drying effect of the silicon wafer 200 are improved.

Further, the positioner body 202 is disposed in parallel with the support plate 10.

Further, the positioning member 20 is of an integral structure.

Further, the number of the positioning members 20 is plural, and the plurality of positioning members 20 are sequentially arranged along the length direction of the support plate 10.

The number of the positioning members 20 is plural, so that the limiting and supporting effects on the silicon wafer 200 can be enhanced, and the stability of the silicon wafer 200 in the carrier 100 can be further improved.

As shown in fig. 1, the number of the positioning members 20 is two.

Further, the silicon wafer conveying carrier comprises a fixing member 30, and the fixing member 30 is disposed at a side of the supporting plate 10 on which the positioning member 20 is disposed, and is used for limiting a side edge of the silicon wafer 200.

The fixing member 30 and the positioning member 20 are disposed on the same side of the supporting plate 10, so that the silicon wafer 200 can be conveyed by the carrier 100 in a side-by-side manner, the conveying requirement is met, the working efficiency of drying and the like is effectively improved, the silicon wafer 200 is conveyed into a furnace body, the front and back surfaces of the silicon wafer 200 can be heated and dried, the process time is shortened, and the drying effect and the yield are improved.

Further, the fixing member 30 includes a first connecting rod 301 and a second connecting rod 302 which are oppositely arranged, the first connecting rod 301 and the second connecting rod 302 are arranged on the supporting plate 10, the fixing member 30 further includes an ear support portion 303 which is arranged between the first connecting rod 301 and the second connecting rod 302, the ear support portion 303 includes a first connecting section 304 and a second connecting section 305 which are connected, the first connecting section 304 and the second connecting section 305 are respectively connected with the first connecting rod 301 and the second connecting rod 302 and are located on a side of the first connecting rod 301 and the second connecting rod 302 which are away from the positioning member 20, an open slot 306 is arranged at a connection position of the first connecting section 304 and the second connecting section 305, and the ear support portion 303 and the positioning member 20 jointly define a bearing space for limiting the silicon wafer 200.

The fixing member 30 stands on the end of the supporting plate 10, an ear supporting part 303 is arranged at one end of the fixing member 30 far away from the supporting plate 10, the corresponding side edge of the silicon wafer 200 is surrounded by the ear supporting part 303, the ear supporting part 303 is in contact with the side edge of the silicon wafer 200, the middle part of the silicon wafer 200 is prevented from being contacted, printing on the silicon wafer 200 is effectively protected, and the finished product rate and the photoelectric efficiency of products are improved.

The fixing member 30 is formed by bending a rod body, the fixing member 30 has a first connecting rod 301 and a second connecting rod 302 which are spaced front and back, a gap between the first connecting rod 301 and the second connecting rod 302 is matched with the silicon chip 200 and is vertically placed, and one ends of the first connecting rod 301 and the second connecting rod 302 far away from the supporting plate 10 are connected together by an ear support part 303. The structure is simple and the manufacture is easy. Further, the ear supporting parts 303 are in a V-shaped side wing shape, so that the width size of the silicon wafer 200 is met, the corresponding side edges of the silicon wafer 200 are ensured to be surrounded by the ear supporting parts 303 and appropriately supported, the silicon wafer 200 is conveyed in a side standing mode, and the conveying requirement is met.

Further, the supporting plate 10 and the fixing member 30 are combined into a concave shape, the conveying directions of the supporting plate 10 and the silicon wafer 200 are crossed and transversely arranged, the upper side surface of the supporting plate 10 and the fixing member 30 surround to meet the requirement that the silicon wafer 200 is placed on the side in a standing mode, the fixing member 30 is in contact with the edge of the silicon wafer 200, the middle of the silicon wafer 200 is prevented from being in contact with, and printing on the silicon wafer 200 is effectively protected.

As shown in fig. 1, after the first connecting rod 301 and the second connecting rod 302 extend outward along the axial direction (length direction) of the supporting plate 10 toward both ends, a V-shaped ear support portion 303 is formed, which has a V-shaped groove to place the silicon wafer 200, thereby reducing the possibility of scratching the battery wafer (silicon wafer 200).

Further, the number of the fixing members 30 is plural, for example, the number of the fixing members 30 is two, and two fixing members 30 are respectively located at both ends of the support plate 10 in the length direction.

Further, the opening groove 306 and the bent portion 204 are vertically staggered, so that the silicon wafer 200 is obliquely placed in the carrying space, rather than being completely vertically placed.

The opening groove 306 and the bending part 204 are staggered in the vertical direction, in other words, along the width direction of the support plate 10, the opening groove 306 and the bending part 204 are sequentially arranged, so that the silicon wafer 200 can be obliquely arranged in the bearing space, the stability of the silicon wafer 200 in the carrier 100 is improved, and the drying efficiency of the silicon wafer 200 can be improved.

Further, as shown in fig. 1, the support plate 10 is provided with at least one through hole 101.

The supporting plate 10 is provided with at least one through hole 101 (hollow), and the through hole 101 can be in various shapes such as a circle, a rectangle and the like. On the premise of ensuring that the using function of the carrier 100 is intact, the through holes 101 are beneficial to uniform flow of hot air, the drying and curing effects on the silicon wafer 200 are improved, the overall weight of the carrier 100 is reduced to the maximum extent, the transmission load of equipment is reduced, and the installation and maintenance work is facilitated.

An embodiment of the second aspect of the present invention provides a silicon wafer conveying apparatus, including: a chain 300 and a sprocket; and a silicon wafer transport carrier as in any one of the embodiments of the first aspect, the carrier being disposed on the transmission member.

The embodiment of the second aspect of the present invention provides a silicon wafer conveying device, which has all the advantages of any one of the embodiments of the first aspect of the present invention, and is not repeated herein, because of the silicon wafer conveying carrier of any one of the embodiments of the first aspect.

The chain 300 is engaged with the sprocket, and the carrier 100 is fixed on the chain 300, so that the carrier 100 moves along with the chain 300 under the action of the sprocket.

The supporting plate is provided with connecting parts which are in one-to-one correspondence with and connected with the connecting matching parts on the silicon wafer 200 conveying device.

Be equipped with connecting portion in the backup pad, connecting portion are used for respectively with the silicon chip 200 conveyer on be connected the cooperation portion one-to-one and connect, increased tie point and stress point between backup pad and the silicon chip 200 conveyer, solved the fixed drawback of rocking easily of traditional single little square trough, realized bearing silicon chip 200's stability, avoid silicon chip 200 to rock for the carrier, thereby avoid silicon chip 200 because of rocking quality hidden danger such as fish tail, infrared EL black spot, latent splitting that appear.

Further, the connecting portion includes mounting holes 102 for fasteners to pass through, so that the supporting plate and the silicon wafer 200 conveyer are connected by the fasteners, and the mounting holes 102 are sequentially arranged along the length direction of the supporting plate.

The connection part includes a mounting hole 102, and the connection fitting part includes a connection hole, and a fastener (e.g., a screw) passes through the mounting hole 102 and the connection hole to achieve connection between the support plate and the silicon wafer 200 transfer device. The mode of connecting through the fastener simple structure, with low costs.

The mounting holes 102 are sequentially formed along the length direction of the support plate, thereby enhancing the reliability of the connection between the support plate and the silicon wafer 200 transfer apparatus in the length direction of the support plate.

Further, the mounting hole 102 is located in the middle in the width direction of the support plate.

The carrier and the chain can also be clamped together except that the fastener is adopted for connection, at the moment, the connecting part comprises a clamping hole or a buckle, the connecting matching part comprises a buckle or a clamping hole, and the buckle is positioned in the clamping hole.

Further, as shown in fig. 1, the number of the connecting portions is two, the two connecting portions are sequentially arranged along the length direction of the supporting plate, and the number of the connecting matching portions is also two and is in one-to-one correspondence with the two connecting portions.

As shown in fig. 1 and fig. 2, the embodiment of the utility model provides a carrier 100 is carried to silicon chip 200, solar wafer (silicon chip 200) through upstream belt horizontal transport by two fixing piece 30 combination V type groove notch (open slot 306 department) in, through sprocket feed, turn over into vertical state by the level attitude with the battery piece, the battery piece falls on setting element 20, at first contact with setting element 20 arc angle (kink 204 department) when the battery piece contacts with setting element 20, instantaneous pressure when contacting with setting element 20 decomposes into a plurality of directions, make the battery piece can not be cracked because of self whereabouts, reduce the lobe of a leaf rate.

In the description of the present invention, the term "plurality" means two or more unless explicitly stated or limited otherwise; the terms "connected," "secured," and the like are to be construed broadly and unless otherwise stated or indicated, and for example, "connected" may be a fixed connection, a removable connection, an integral connection, or an electrical connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or unit indicated must have a specific direction, be constructed in a specific orientation, and be operated, and therefore, should not be construed as limiting the present invention.

In the description of the present specification, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A silicon wafer conveying carrier is characterized by comprising:

a support plate;

the positioning piece is arranged on one side of the supporting plate and comprises a bending part, and the bending part is suitable for abutting against the edge of the silicon wafer facing the supporting plate and limiting the edge at the bending part; and

and the fixing piece is arranged on one side of the positioning piece arranged on the supporting plate and used for limiting the side edge of the silicon wafer.

2. The silicon wafer transport carrier of claim 1,

the bending part is arc-shaped or R-shaped.

3. The silicon wafer transport carrier of claim 1,

the locating element is including connecting portion, setting element body and the bellying that sets gradually, connecting portion are located the setting element body is close to one side of backup pad and be used for with the backup pad is connected, the bellying is located the setting element body deviates from one side of backup pad, the bellying with the junction of setting element body forms the kink.

4. The silicon wafer transport carrier of claim 3,

a gap is formed between the positioning piece body and the supporting plate.

5. The silicon wafer transport carrier according to any one of claims 1 to 4,

the supporting plate is provided with a plurality of connecting parts, and the connecting parts are in one-to-one correspondence with and connected with a plurality of connecting matching parts on the silicon wafer conveying device.

6. The silicon wafer transport carrier of claim 5,

the connecting part comprises mounting holes for fasteners to pass through so that the supporting plate is connected with the silicon wafer conveying device through the fasteners, and the mounting holes are sequentially arranged along the length direction of the supporting plate.

7. The silicon wafer transport carrier according to any one of claims 1 to 4,

the mounting includes relative first connecting rod and the second connecting rod that sets up, first connecting rod with the second connecting rod sets up in the backup pad, the mounting is still including setting up first connecting rod with ear support portion between the second connecting rod, ear support portion is located first connecting rod reaches the second connecting rod deviates from one side of setting element and injects the opening orientation the open slot of setting element, ear support portion is used for spacingly the side of silicon chip.

8. The silicon wafer transport carrier of claim 7,

the open slot and the bending part are arranged in a staggered mode in the vertical direction, so that the silicon wafer is obliquely arranged in the carrier.

9. The silicon wafer transport carrier according to any one of claims 1 to 4,

the supporting plate is provided with at least one through hole.

10. A silicon wafer transfer apparatus, comprising:

a chain provided with a plurality of connection matching parts; and

the silicon wafer conveying carrier of any one of claims 1 to 9, wherein the carrier is arranged on the chain, and a plurality of connecting parts on a supporting plate of the carrier correspond to and are connected with a plurality of connecting matching parts one by one.

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