CN218868599U - Cooling device used after SMT patch welding - Google Patents
Cooling device used after SMT patch welding Download PDFInfo
- Publication number
- CN218868599U CN218868599U CN202222107136.5U CN202222107136U CN218868599U CN 218868599 U CN218868599 U CN 218868599U CN 202222107136 U CN202222107136 U CN 202222107136U CN 218868599 U CN218868599 U CN 218868599U
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- China
- Prior art keywords
- air
- air supply
- marriage
- bellows
- centrifugal fan
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000001816 cooling Methods 0.000 title claims abstract description 29
- 238000003466 welding Methods 0.000 title claims abstract description 17
- 238000009826 distribution Methods 0.000 claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 3
- 238000005304 joining Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model relates to a SMT paster technical field specifically is a heat sink for SMT paster post-welding, including the conveyer belt, this conveyer belt is used for transporting the PCB board after SMT paster welding, the conveyer belt top is equipped with forced air cooling mechanism, forced air cooling mechanism includes high-pressure centrifugal fan and joins in marriage bellows, join in marriage bellows and transversely set up for flat shape, high-pressure centrifugal fan's air supply end with join in marriage the middle part intercommunication of bellows, join in marriage the both sides that bellows is located high-pressure centrifugal fan air supply end and be equipped with a plurality of to the supply-air outlet of transfer chain air supply, join in marriage the bellows lower extreme and still be equipped with the fan housing of pressing close to the conveyer belt. The utility model discloses a device is sent to the flat air distribution box back through the high-pressure centrifugal fan of transfer chain top with wind, then distributes the amount of wind fast and carries out the forced air cooling to each supply-air outlet of both sides, because the lower extreme of air distribution box still is equipped with the fan housing, and after a large amount of wind sent out from the supply-air outlet, the fan housing can also collect partly through the wind of disturbing, has improved the efficiency of cooling.
Description
Technical Field
The utility model relates to a SMT paster technical field specifically is a heat sink that is used for SMT paster welding back.
Background
SMT paster refers to a short form of a series of process flows processed on the basis of a PCB, and the whole process comprises the flows of solder paste printing, part mounting, reflow soldering, AOI optical detection, board splitting and the like. After whole reflow soldering technology accomplished, because the PCB board temperature that the welding was accomplished is higher, need to cool down the cooling rear to PCB and can carry out the processing technology on next step, in traditional course of working, the PCB board after the reflow soldering utilizes the fan to carry out the forced air cooling usually, this kind of cooling mode is longer owing to take fan forced air cooling time, the wind-force of fan is not concentrated, need set up a large amount of fans and very long cooling circuit and cool down, be not convenient for actual production, cooling efficiency is lower.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem who provides among the prior art, the utility model provides a heat sink for after SMT paster welding.
The utility model provides a its technical problem adopt following technical scheme to realize:
the utility model provides a heat sink for after SMT paster welding, the device includes the conveyer belt, and this conveyer belt is used for transporting the PCB board after SMT paster welding, the conveyer belt top is equipped with forced air cooling mechanism, forced air cooling mechanism includes high-pressure centrifugal fan and joins in marriage bellows, join in marriage bellows and be flat shape and horizontal setting, high-pressure centrifugal fan's air supply end with join in marriage the middle part intercommunication of bellows, it is equipped with a plurality of to join in marriage the both sides that bellows is located high-pressure centrifugal fan air supply end the supply-air outlet of transfer chain air supply, join in marriage the bellows lower extreme and still be equipped with the fan housing of pressing close to the conveyer belt.
Further, according to the technical scheme, the air supply openings are uniformly distributed strip air supply openings or round hole air supply openings.
The technical scheme is that the high-pressure centrifugal fan further comprises an air supply pipe, and the air supply end of the high-pressure centrifugal fan is communicated with the air distribution box through the air supply pipe.
Further, according to the technical scheme, the number of the air cooling mechanisms is two.
According to the technical scheme, the bottom ends of the two sides of the fan cover are provided with a plurality of air outlet holes.
Through adopting foretell technical scheme, the beneficial effects of the utility model are that:
through directly setting up high-pressure centrifugal fan above the transfer chain, high-pressure centrifugal fan sends wind to flat joining in marriage behind the bellows, its high-pressure wind removes toward the both sides of joining in marriage the bellows rapidly, then distribute the amount of wind to each supply-air outlet of both sides fast, thereby carry out the forced air cooling to the material, because the lower extreme of supply-air box still is equipped with the fan housing, after a large amount of wind is seen off from the supply-air outlet, the fan housing can also collect partly through the wind of disturbing, make the amount of wind of conveyer belt top more, the efficiency of cooling has been improved, the time of cooling has been shortened.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic top view of the present invention;
FIG. 3 is a bottom view of the air distribution box of the present invention;
in the figure: the device comprises a conveyor belt 1, a high-pressure centrifugal fan 20, an air distribution box 21, an air supply pipe 23, an air supply outlet 24, an air cover 25 and an air outlet 26.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention discloses a cooling device for SMT patch welding, which comprises a conveyor belt 1, wherein the conveyor belt 1 is used for transporting PCB boards after SMT patch welding. The air cooling device is characterized in that an air cooling mechanism is arranged above the conveyor belt 1 and comprises a high-pressure centrifugal fan 20 and an air distribution box 21, the air distribution box 21 is flat and transversely arranged, the air supply end of the high-pressure centrifugal fan 20 is communicated with the middle of the air distribution box 21, the air cooling device further comprises an air supply pipe 23 in the embodiment, and the air supply end of the high-pressure centrifugal fan 20 is communicated with the air distribution box 21 through the air supply pipe 23. The two sides of the air distribution box 21, which are positioned at the air supply end of the high-pressure centrifugal fan 20, are provided with a plurality of air supply ports 24 for supplying air to the conveying line, after the high-pressure centrifugal fan 20 sends air to the flat air distribution box 21, high-pressure air rapidly moves towards the two sides of the air distribution box 21, and then the air volume is rapidly distributed to the air supply ports 24 on the two sides, so that air cooling is performed on the material. In this embodiment, the air supply ports 24 are strip air supply ports 24 distributed uniformly, and in other embodiments, the air supply ports 24 may be circular air supply ports 24 or air supply ports 24 with other shapes. The lower end of the air distribution box 21 is also provided with a fan cover 25 close to the conveyor belt 1, the fan cover 25 is arranged close to the conveyor belt 1, the fan cover 25 is not in contact with the conveyor belt 1, feeding is not affected, air in the fan cover 25 can be discharged, and in the cooling process, after a large amount of air is sent out from an air supply opening, part of disturbed air can be collected by the fan cover, so that the air quantity above the conveyor belt is more. In this embodiment, the bottom ends of the two sides of the fan housing 25 are provided with air outlet holes 26, and the air outlet holes 26 are used for adjusting the air inside the fan housing 25 to be discharged, so that the cooling efficiency is improved, and the cooling time is shortened.
In this embodiment, the number of the air cooling mechanisms is two, so that the cooling efficiency is further improved.
In the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, a first feature "on" or "under" a second feature may be directly contacting the second feature or the first and second features may be indirectly contacting the second feature through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the description of such combinations is not exhaustive in the present specification only for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (5)
1. The utility model provides a heat sink for SMT paster post welding which characterized in that: the device includes conveyer belt (1), and this conveyer belt (1) is used for transporting the PCB board after the SMT paster welding, conveyer belt (1) top is equipped with air-cooled mechanism, air-cooled mechanism includes high-pressure centrifugal fan (20) and joins in marriage bellows (21), join in marriage bellows (21) and transversely set up for flat shape, the air supply end of high-pressure centrifugal fan (20) with the middle part intercommunication of joining in marriage bellows (21), the both sides that join in marriage bellows (21) and be located high-pressure centrifugal fan (20) air supply end are equipped with supply-air outlet (24) of a plurality of to the transfer chain air supply, it still is equipped with fan housing (25) of pressing close to conveyer belt (1) to join in marriage bellows (21) lower extreme.
2. A heat sink for use after SMT patch welding as defined in claim 1, wherein: the air supply openings (24) are uniformly distributed strip air supply openings (24) or round hole air supply openings (24).
3. A heat sink for use after SMT patch welding as defined in claim 1, wherein: the high-pressure centrifugal fan is characterized by further comprising an air supply pipe (23), and the air supply end of the high-pressure centrifugal fan (20) is communicated with the air distribution box (21) through the air supply pipe (23).
4. A temperature sink for use after SMT patch welding as defined in claim 1, wherein: the number of the air cooling mechanisms is two.
5. A heat sink for use after SMT patch welding as defined in claim 1, wherein: the bottom ends of the two sides of the fan cover (25) are provided with a plurality of air outlet holes (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222107136.5U CN218868599U (en) | 2022-08-11 | 2022-08-11 | Cooling device used after SMT patch welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222107136.5U CN218868599U (en) | 2022-08-11 | 2022-08-11 | Cooling device used after SMT patch welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218868599U true CN218868599U (en) | 2023-04-14 |
Family
ID=87349918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222107136.5U Expired - Fee Related CN218868599U (en) | 2022-08-11 | 2022-08-11 | Cooling device used after SMT patch welding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218868599U (en) |
-
2022
- 2022-08-11 CN CN202222107136.5U patent/CN218868599U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20230414 |