CN210628266U

CN210628266U - Wafer bonding structure

Info

Publication number: CN210628266U
Application number: CN201921743756.XU
Authority: CN
Inventors: 何海洋; 胡健峰; 彭强
Original assignee: Wuxi Ciao Microelectronics Technology Co Ltd
Current assignee: Wuxi Ciao Microelectronics Technology Co Ltd
Priority date: 2019-10-17
Filing date: 2019-10-17
Publication date: 2020-05-26
Anticipated expiration: 2029-10-17

Abstract

The utility model belongs to the technical field of the wafer structure, especially, be a wafer bonding structure, including clear glass cover, control panel, laser range finder, anchor clamps and workstation, its characterized in that: transparent glass cover installs at the baffle upper surface, and two transparent glass cover symmetry is installed the workstation upper surface, the handle is installed transparent glass cover head end surface, the control panel is installed on the right side baffle surface intermediate position, thermodetector installs at the back baffle upper right corner internal surface, just thermodetector and thermoregulator level, thermoregulator installs behind baffle upper left corner internal surface. The utility model discloses an utilize laser range finder measuring distance, adopt the distance between two support columns of measurement that this kind of mode can be accurate, and the support column can come and go on the plane and remove, and the location is accurate, has guaranteed processingquality.

Description

Wafer bonding structure

Technical Field

The utility model relates to a wafer structure field specifically is a wafer bonding structure.

Background

Wafer bonding techniques can bond wafers of different materials together, and commonly used bonding techniques include: silicon-silicon direct bonding, silicon-glass direct bonding, metal diffusion bonding, polymer bonding, etc., which have been applied to a plurality of semiconductor fields, such as 3D-TSV (3D through silicon via technology), HB-LED (white light high brightness light emitting diode), SOI (silicon on insulator technology), MEMS (micro electro mechanical system), etc., are one of the important technologies developed in the semiconductor industry in the future. According to different application fields, the process parameters of wafer bonding are different, but the basic principles are similar, and the process mainly comprises the processes of vacuumizing, heating, applying pressure, cooling, breaking vacuum and the like.

The existing wafer bonding structure has the following defects:

1. the existing set of complete wafer bonding process mainly comprises two types of equipment, and the traditional method has high cost and low efficiency;

2. the existing wafer bonding machine needs to control the distance between two wafers when bonding the wafers, and the currently adopted method has certain difference on the measurement precision of the wafer distance.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a wafer bonding structure has solved current problem with high costs, inefficiency.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a wafer bonded structure, includes clear glass cover, control panel, laser range finder, anchor clamps and workstation, its characterized in that: the transparent glass covers are arranged on the upper surface of the baffle, two transparent glass covers are symmetrically arranged on the upper surface of the workbench, the handle is arranged on the outer surface of the head end of the transparent glass cover, the control panel is arranged on the right side, the middle position of the outer surface of the baffle is arranged, the temperature detector is arranged on the inner surface of the right upper corner of the baffle at the back, the temperature detector is horizontal to the temperature regulator, the temperature regulator is arranged on the inner surface of the left upper corner of the baffle at the back, the laser range finder is arranged on the middle position of the right end of the upper surface of the support column, the roller motor is arranged inside the lower surface of the support column, the roller motor is arranged on the right side, the middle position of the lower end of the support column is arranged on the outer surface of, anchor clamps are installed on the support column left side terminal surface, the cooling ring is installed anchor clamps surface, the heating ring is installed between cooling ring and the heat insulating disc, the workstation upper surface is provided with the recess, just the recess sets up workstation intermediate position, the slide is installed recess side surface, just the slide is inlayed recess internal surface, the supporting leg is installed workstation lower surface turning position.

As an optimal technical scheme of the utility model, pass the bearing and install the support column surface, and two pass the bearing and install about centre of a circle symmetry the support column lower extreme.

As a preferred technical scheme of the utility model, temperature regulator installs at the baffle internal surface, just temperature regulator is located the baffle upper left corner.

As a preferred technical scheme of the utility model, thermal-insulated dish is installed on the support column left side terminal surface, just thermal-insulated dish sets up inside the support column.

As a preferred technical scheme of the utility model, the gear strip is installed recess lower surface, just the gear strip position recess lower surface intermediate position.

As an optimal technical scheme of the utility model, the slipmat is installed the supporting leg lower surface.

(III) advantageous effects

Compared with the prior art, the utility model provides a wafer bonding structure possesses following beneficial effect:

1. this a wafer bonding structure utilizes laser range finder to measure the distance, adopts the distance between two support columns of measurement that this kind of mode can be accurate, and the support column can reciprocate on the plane, and the location is accurate, has guaranteed processingquality.

2. This wafer bonding structure is provided with cooling ring, heating ring and thermal-insulated dish in support column processingequipment, and is effectual to anchor clamps heat and cool off, makes things convenient for wafer bonding to become the structure, has improved work efficiency.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a partial cross-sectional structure of the processing apparatus of the present invention;

FIG. 3 is a schematic view of a partial cross-sectional structure of the support post of the present invention;

fig. 4 is a schematic view of the local cross-section structure of the working table of the present invention.

In the figure: 1. a temperature regulator; 2. a transparent glass cover; 3. a laser range finder; 4. a handle; 5. a temperature detector; 6. a baffle plate; 7. a control screen; 8. a heat insulation plate; 9. a heating ring; 10. a clamp; 11. a cooling ring; 12. gear teeth; 13. a drum motor; 14. a drive shaft; 15. a bearing; 16. a support pillar; 17. a slideway; 18. a gear rack; 19. a groove; 20. a work table; 21. supporting legs; 22. a non-slip mat.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-4, the present invention provides the following technical solutions: a wafer bonding structure comprises transparent glass covers 2, a control panel 7, a laser range finder 3, a clamp 10 and a workbench 20, wherein the transparent glass covers 2 are arranged on the upper surface of a baffle 6, the two transparent glass covers 2 are symmetrically arranged on the upper surface of the workbench 20, a handle 4 is arranged on the outer surface of the head end of the transparent glass cover 2, the control panel 7 is arranged at the middle position of the outer surface of a right baffle 6, a temperature detector 5 is arranged on the inner surface of the right upper corner of the rear baffle 6, the temperature detector 5 is horizontal to a temperature regulator 1, the temperature regulator 1 is arranged on the inner surface of the left upper corner of the rear baffle 6, the laser range finder 3 is arranged at the middle position of the right end of the upper surface of a support column 16, a roller motor 13 is arranged inside the lower surface of the support column 16, the roller motor 13 is arranged at the middle position of the, and transmission shaft 14 runs through drum motor 13 and is located support column 16 inner wall round hole, anchor clamps 10 are installed on support column 16 left side terminal surface, cooling ring 11 is installed at anchor clamps 10 surface, heating ring 9 is installed between cooling ring 11 and

hot wall dish

8, 20 upper surfaces of workstation are provided with recess 19, and recess 19 sets up at 20 intermediate positions of workstation, and slide 17 installs at 19 side surfaces of recess, and slide 17 inlays at 19 internal surfaces of recess, and supporting leg 21 installs at 20 lower surface turning positions of workstation.

In this embodiment, transparent glass cover 2 adopts toughened glass, prevents that high low temperature from making glass take place the breakage, and handle 4 sets up in the 2 head end surface right side intermediate positions of transparent glass cover, and another handle 4 sets up in the 2 left sides of transparent glass cover, conveniently opens the effect of transparent glass cover 2 like this.

Specifically, the transmission bearings 15 are installed on the outer surface of the support column 16, and the two transmission bearings 15 are symmetrically installed at the lower end of the support column 16 about the center of a circle.

In this embodiment, the bearing 15 is disposed at the lowest end of the outer surface of the supporting column 16, which facilitates the rotation of the drum motor 13.

Specifically, the temperature regulator 1 is installed on the inner surface of the baffle 6, and the temperature regulator 1 is located at the upper left corner of the baffle 6.

In this embodiment, the cooling ring 11 and the heating ring 9 in the processing apparatus are controlled by the temperature controller 1 based on the temperature fed back from the temperature detector 5.

Specifically, the heat insulating disk 8 is installed on the left end face of the support column 16, and the heat insulating disk 8 is disposed inside the support column 16.

In this embodiment, the heat insulating plate 8 is installed on the outer surface of the heating ring 9, so that the working efficiency of the heating ring 9 and the cooling ring 11 can be improved.

Specifically, the gear rack 18 is mounted on the lower surface of the groove 19, and the gear rack 18 is positioned in the middle of the lower surface of the groove 19.

In this embodiment, the gear rack 18 is disposed in the middle of the groove 19, so as to ensure the effective contact of the gear teeth 12 on the outer surface of the drum motor 13 to prevent slipping.

Specifically, the non-slip mat 22 is mounted on the lower surface of the support leg 21.

In this embodiment, the non-slip mat 22 is installed on the lower surface of the supporting leg 21 and is fixedly connected with the lower surface of the supporting leg through adhesive glue, so that the workbench 20 is prevented from shaking.

The utility model discloses a theory of operation and use flow: when the clamp works, the right supporting column 16 is firstly moved to the right end, then the transparent glass cover 2 is opened through the handle 4, then a wafer is fixed on the clamp 10, the two wafers are aligned, then the gear teeth 12 on the outer surface of the roller motor 13 move on the gear strips 18 on the lower surface of the groove 19, then the right supporting column 16 is controlled to move leftwards through the control screen 7, then the distance between the two supporting columns 16 is measured through the laser range finder 3, when the clamp 10 is pressed, then the heating ring 9 is controlled through the temperature detector 5 and the temperature regulator 1 to heat and process the wafer bonding, then after the cooling ring 11 is processed, the clamp 10 and the transparent glass cover 2 are opened under reduced pressure, and a composite is taken out.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a wafer bonded structure, includes clear glass cover (2), control panel (7), laser range finder (3), anchor clamps (10) and workstation (20), its characterized in that: transparent glass cover (2) is installed on baffle (6) upper surface, and two transparent glass cover (2) symmetry is installed workstation (20) upper surface, install handle (4) transparent glass cover (2) head end surface, control panel (7) are installed on the right side baffle (6) surface intermediate position, thermodetector (5) are installed behind baffle (6) upper right corner internal surface, just thermodetector (5) and thermoregulator (1) level, thermoregulator (1) are installed behind baffle (6) upper left corner internal surface, laser range finder (3) are installed in support column (16) upper surface right-hand member intermediate position, support column (16) lower surface internally mounted has cylinder motor (13), just motor cylinder (13) are installed on the right side support column (16) lower extreme intermediate position, the outer surface of the roller motor (13) is provided with gear teeth (12), a transmission shaft (14) is arranged inside the roller motor (13), and the transmission shaft (14) penetrates through the roller motor (13) and is positioned in a circular hole on the inner wall of the supporting column (16), the clamp (10) is arranged on the left end face of the support column (16), the cooling ring (11) is arranged on the outer surface of the clamp (10), the heating ring (9) is arranged between the cooling ring (11) and the heat insulation disc (8), the upper surface of the workbench (20) is provided with a groove (19), the groove (19) is arranged in the middle of the workbench (20), the slide way (17) is arranged on the surface of the side surface of the groove (19), the slide rails (17) are embedded in the inner surfaces of the grooves (19), and the supporting legs (21) are installed at the corner positions of the lower surface of the workbench (20).

2. The wafer bonding structure of claim 1, wherein: the transmission bearings (15) are arranged on the outer surface of the supporting column (16), and the two transmission bearings (15) are symmetrically arranged at the lower end of the supporting column (16) relative to the circle center.

3. The wafer bonding structure of claim 1, wherein: the temperature regulator (1) is arranged on the inner surface of the baffle (6), and the temperature regulator (1) is positioned at the upper left corner of the baffle (6).

4. The wafer bonding structure of claim 1, wherein: the heat insulation disc (8) is installed on the left end face of the support column (16), and the heat insulation disc (8) is arranged inside the support column (16).

5. The wafer bonding structure of claim 1, wherein: the gear rack (18) is arranged on the lower surface of the groove (19), and the gear rack (18) is arranged in the middle of the lower surface of the groove (19).

6. The wafer bonding structure of claim 1, wherein: the non-slip mat (22) is arranged on the lower surface of the supporting leg (21).