CN210605357U

CN210605357U - Lower light source exposure device

Info

Publication number: CN210605357U
Application number: CN201921807458.2U
Authority: CN
Inventors: 陈翻; 范利康; 秦键; 沙昭
Original assignee: Wuhan Zhengyuan Gaoli Optical Co ltd
Current assignee: Wuhan Zhengyuan Gaoli Optical Co ltd
Priority date: 2019-10-25
Filing date: 2019-10-25
Publication date: 2020-05-22
Anticipated expiration: 2029-10-25

Abstract

The utility model belongs to the technical field of optics, more specifically the special use of saying so relates to a lower light source exposure device, including the clean bench, be equipped with the operation panel in the clean bench, the operation panel below is equipped with the exposure machine, be equipped with the through-hole that is used for laying mask version on the mesa of operation panel, the exposure head of exposure machine faces this through-hole. The utility model discloses can realize that mask version need not remove when continuous production, only need change the substrate can, improve production efficiency by a wide margin.

Description

Lower light source exposure device

Technical Field

The utility model belongs to the technical field of optics, more specifically the special use that says so relates to a lower light source exposure device.

Background

The photoetching machine is widely applied in the modern industrial production process, is used for transferring picture and text signals to required materials, and is applied to photoetching machines of different grades in various high and low end fields such as 7nm semiconductor chip manufacturing to about 10um gun aiming reticles, TFT display screens, LED chip manufacturing and the like, and the brands and the styles of the photoetching machines are various.

However, conventional exposure machines are vertical, i.e. the uv light source irradiates from top to bottom, and during exposure, the mask is on top, the substrate is below, and a part of the substrate irradiates from front to back and in the horizontal direction. The contact modes are mainly three types:

(1) soft contact: adsorbing the substrate by a tray (similar to a substrate placing mode of a spin coater), and covering the mask plate on the substrate;

(2) hard contact: the substrate is pressed upwards by a gas pressure (nitrogen gas) to contact with the mask;

(3) vacuum contact: air is pumped between the mask and the substrate to ensure that the mask and the substrate are better attached (a quilt is supposed to be placed in a vacuum-pumping mode).

The substrate is required to be placed on the wafer bearing table for soft contact, then the substrate is moved to the position below the mask plate in a mechanical mode, then the substrate is lifted to be in contact with the mask plate, and a similar separation mode is required after exposure is finished. Compared with the traditional soft contact, the hard contact and vacuum connection are more complex in process, so that a new exposure mode which is simple and can meet the production requirement exists, and the production efficiency can be greatly improved for a part of photoetching products which do not need to be subjected to alignment.

Disclosure of Invention

The invention aims to provide a lower light source exposure device, which can realize that the mask plate does not need to be moved during continuous production and only needs to be replaced by a substrate, thereby greatly improving the production efficiency.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

the utility model provides a lower light source exposure device, includes clean bench 1 which characterized in that: an operation table 3 is arranged in the purification table 1, an exposure machine 6 is arranged below the operation table 3, a through hole for placing a mask 8 is formed in the table top of the operation table 3, and an exposure head 7 of the exposure machine 6 faces the through hole.

Further, a plurality of purified air outlet holes 2 are uniformly arranged on the back plate of the purification platform 1 and used for blowing horizontal purified air into the purification platform 1.

Further, the through hole is a counter bore, and the mask 8 is installed in the counter bore.

Further, a first counter bore 12 is arranged on the table top of the operating table 3, a mask plate bearing plate 4 is placed in the first counter bore 12, and a second counter bore 13 matched with the mask plate 8 is formed in the mask plate bearing plate 4.

Further, the second counterbore 13 is polygonal, circular or elliptical.

Further, the exposure machine 6 is fixedly mounted on a fixing bracket 5, placed below the operation table 3.

The invention has the beneficial effects that: the utility model discloses lower light source exposure device is applied to the photoetching class product that the optics field has meticulous pattern to reticle, code wheel and most specially, can realize that mask version need not remove when continuous production, only need change the substrate can, improve production efficiency by a wide margin. And the result is simple, the product precision and the requirement are not influenced, the cleaning times of the mask can be greatly reduced, and the service life of the mask is prolonged. The utility model discloses mask plate and substrate are soft contact in the exposure process, reduce the damage of exposure in-process to mask plate by a wide margin, tak away the product that has exposed simultaneously at every turn after, still can just slightly inspect the clean condition on mask plate surface. From the statistics of the actual situation, the exposure production efficiency can be improved by more than 1 time, and the service life of the master mask can be prolonged by more than 3 times.

Drawings

FIG. 1 is a schematic view of a clean bench in the example.

Fig. 2 is a schematic view of an exposure machine in the embodiment.

FIG. 3 is a schematic diagram of an exemplary embodiment of a stage and reticle carrier.

FIG. 4 is a schematic view of the lower light source exposure apparatus in the embodiment in use.

FIG. 5 is a flow chart illustrating the process of exposing a substrate using the novel underlight exposure apparatus according to the present invention.

In the figure: the device comprises a purification platform 1, a purified air outlet hole 2, an operation platform 3, a mask plate bearing plate 4, a fixing support 5, an exposure machine 6, an exposure head 7, a mask plate 8, a substrate 9, a shading film 10, a photoresist layer 11, a first counter bore 12 and a second counter bore 13.

Detailed Description

For a better understanding of the present invention, the technical solutions of the present invention will be further described below with reference to the following examples and accompanying drawings.

As shown in fig. 1-4, a lower light source exposure device comprises a purification table 1, wherein a plurality of purified air outlet holes 2 are uniformly arranged on the back plate of the purification table 1 and used for blowing horizontal purified air into the purification table 1.

An operation table 3 is arranged in the purification table 1, an exposure machine 6 is arranged below the operation table 3, and the exposure machine 6 is fixedly arranged on a fixed support 5 and is placed below the operation table 3. The light source of the exposure machine 6 is a mercury lamp light source and consists of a light path part and a controller, and ultraviolet light emits from bottom to top. The height difference of the exposure head 7 from the stage surface of the stage 3 is about 10 cm, and even if dust is present on the glass of the exposure head 7, ultraviolet light can pass through its light diffraction characteristic and is not projected onto the substrate 9.

A first counter bore 12 is arranged on the table top of the operating table 3, and a mask plate bearing plate 4 is placed in the first counter bore 12.

The mask plate bearing plate 4 is provided with a second counter bore 13 matched with the mask plate 8 and used for placing the mask plate 8; the shape of the second counter bore 13 is matched with that of the mask 8, such as a polygon, a circle, an ellipse and the like. The exposure head 7 of the exposure machine 6 faces the second counter bore 13.

The process flow of exposing the substrate 9 by using the novel underlight exposure apparatus is shown in fig. 5.

The exposure process is, as shown in fig. 4, (1) rotating the corresponding mask 8 according to the product of the lot, and selecting the mask plate bearing plate 4 with the second counter bore 13 of the corresponding shape according to the mask 8; (2) mounting the mask plate bearing plate 4 in a first counter bore 12 on the operating platform 3, and then placing the mask plate 8 in a second counter bore 13 of the mask plate bearing plate 4; (3) then a shading film 10 and a substrate 9 with a photoresist layer 11 are sequentially arranged on the mask plate bearing plate 4, and the exposure machine 6 is opened to start exposure.

The above description is only an application example of the present invention, and certainly, the present invention should not be limited by this application, and therefore, the present invention is still within the protection scope of the present invention by equivalent changes made in the claims of the present invention.

Claims

1. The utility model provides a lower light source exposure device, includes clean bench (1), its characterized in that: an operation table (3) is arranged in the purification table (1), an exposure machine (6) is arranged below the operation table (3), a through hole for placing a mask (8) is formed in the table top of the operation table (3), and an exposure head (7) of the exposure machine (6) faces the through hole.

2. The downlight exposure apparatus according to claim 1, characterized in that: a plurality of purified air outlet holes (2) are uniformly formed in the back plate of the purification platform (1) and used for blowing in purified air horizontally into the purification platform (1).

3. The downlight exposure apparatus according to claim 1, characterized in that: the through hole is a counter bore, and the mask (8) is arranged in the counter bore.

4. The downlight exposure apparatus according to claim 1, characterized in that: the mask plate bearing plate is characterized in that a first counter bore (12) is formed in the table top of the operating table (3), a mask plate bearing plate (4) is placed in the first counter bore (12), and a second counter bore (13) matched with a mask plate (8) is formed in the mask plate bearing plate (4).

5. The downlight exposure apparatus according to claim 4, characterized in that: the second counter bore (13) is polygonal, circular or elliptical.

6. The downlight exposure apparatus according to claim 1, characterized in that: the exposure machine (6) is fixedly arranged on the fixed support (5) and is placed below the operating platform (3).