CN210604723U - Testing device for three-dimensional packaged chip silicon through hole - Google Patents
Testing device for three-dimensional packaged chip silicon through hole Download PDFInfo
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- CN210604723U CN210604723U CN201921357471.2U CN201921357471U CN210604723U CN 210604723 U CN210604723 U CN 210604723U CN 201921357471 U CN201921357471 U CN 201921357471U CN 210604723 U CN210604723 U CN 210604723U
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Abstract
The utility model belongs to the test equipment field, especially, three-dimensional encapsulation chip through-silicon-via's testing arrangement is not convenient for remove the probe card to current testing arrangement, and is not convenient for carry out the problem of fixing to the wafer that awaits measuring, the scheme as follows is put forward now, and it includes the base and is located the probe card on the base, the bottom fixed mounting of base has the riser that two symmetries set up, and the top fixed mounting of riser has same crossbeam, and one side slidable mounting that two risers are close to each other has same connecting seat, and probe card fixed mounting is in the bottom of connecting seat, and the top fixed mounting of base has the seat of bearing, bears the top of seat and has seted up the standing groove, has placed the wafer that awaits measuring in the standing groove, and the bottom. The utility model relates to a rationally, the probe card of being convenient for removes, and can fix the wafer that awaits measuring when the probe card removes to make things convenient for people's detection.
Description
Technical Field
The utility model relates to a test equipment technical field especially relates to a three-dimensional encapsulation chip through-silicon via's testing arrangement.
Background
The patent document with the publication number of CN104701206A discloses a testing device for three-dimensional packaged chip through silicon via, which comprises a probe card, a stage, and a first test signal line and a second test signal line connected to the probe card and the stage respectively, forming a testing loop, wherein the test signal of the testing component can be transmitted to the lower surface of the wafer through silicon via to be tested on the stage through the probe card, the first test signal line and the second test signal line, and the probe of the probe card can test the upper surface of the through silicon via of the wafer one by one, thereby accurately testing the quality of the three-dimensional packaged chip through silicon via, further finding the reason for the failure of the through silicon via from the obtained result, and optimizing the manufacturing process.
However, the above design has disadvantages that, in the test, the wafer to be tested needs to be fixed first, and the test is performed by moving the probe card, which is troublesome to operate, and the probe card is inconvenient to move and the wafer to be tested is inconvenient to fix, so we propose a testing apparatus for three-dimensional packaged chip through silicon vias to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that the probe card is not convenient to move and the wafer to be tested is not convenient to fix in the prior art, and providing a three-dimensional packaging chip silicon through hole testing device.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a testing arrangement of three-dimensional encapsulation chip through-silicon-via, includes the base and is located the probe card on the base, the bottom fixed mounting of base has the riser that two symmetries set up, and the top fixed mounting of riser has same crossbeam, and one side slidable mounting that two risers are close to each other has same connecting seat, and probe card fixed mounting is in the bottom of connecting seat, and the top fixed mounting of base has the seat of bearing, bears the top of seat and has seted up the standing groove, has placed the wafer that awaits measuring in the standing groove, and the bottom fixed mounting of connecting seat has the montant that.
Preferably, the bottom of crossbeam is seted up the first groove that two symmetries set up, and slidable mounting has the removal seat in the first groove, and the bottom of removing the seat extends to the below of crossbeam and fixed mounting has the movable plate, and one side fixed mounting of movable plate has the fixing base that two symmetries set up, and one side fixed mounting that two fixing bases are close to each other has same stabilizer bar, owing to be provided with the removal seat, removes the removal that the seat can drive the movable plate and remove.
Preferably, the sliding sleeve is equipped with the sliding seat on the stabilizer bar, and one side of sliding seat articulates the one end that has the one end of first pole and the one end of second pole, and the other end of first pole articulates on the connecting seat, and the second pole even first articulates on the crossbeam, owing to be provided with the second pole, the removal of sliding seat can drive the connecting seat through first pole and remove.
Preferably, first spacing groove has all been seted up to one side that two risers are close to each other, and the equal fixed mounting in both sides of connecting seat has first stopper, and first stopper and the first spacing groove sliding connection that corresponds owing to be provided with first stopper and first spacing groove, can make the connecting seat carry out stable removal.
Preferably, the same first hole has been seted up on the one side inner wall that two first grooves are close to each other, and sliding mounting has the horizontal pole in the first hole, and the both sides of horizontal pole fixed mounting respectively have the rack on two removal seats, one side fixed mounting of horizontal pole, owing to be provided with the rack, the removal of rack can drive the horizontal pole and remove.
Preferably, the top fixed mounting of crossbeam has the rotating electrical machines, and the output shaft of rotating electrical machines extends to the first downthehole and fixed mounting has the gear, and gear and rack mesh mutually, has all seted up the second spacing groove on the top inner wall in first hole and on the bottom inner wall, and the equal fixed mounting in top and the bottom of horizontal pole has the second stopper, and second stopper and the second spacing groove sliding connection who corresponds, owing to be provided with second stopper and second spacing groove, can make the horizontal pole carry out stable removal.
Preferably, one side fixed mounting of montant has the first board, sets up the second hole that two symmetries set up on the first board, and the downthehole slidable mounting of second has the third pole, and the bottom fixed mounting of two third poles has same clamp plate, and the movable sleeve is equipped with fixed spring's one end on the third pole, and fixed spring's other end fixed mounting is on the clamp plate, owing to be provided with fixed spring, and fixed spring can extrude the clamp plate.
Preferably, the second groove has all been seted up on the both sides inner wall of standing groove, and slidable mounting has splint in the second groove, has seted up the third groove on one side inner wall in second groove, and one side fixed mounting of splint has the push rod, and push rod slidable mounting has seted up the inclined hole on the push rod at the third inslot, owing to be provided with splint, can carry out the centre gripping to the wafer that awaits measuring through splint.
Preferably, a fourth groove has been seted up on the top inner wall of third groove, fourth groove slidable mounting has the sliding plate, the bottom fixed mounting of sliding plate has the down tube, and down tube and the inclined hole looks adaptation that corresponds, the top fixed mounting of sliding plate has the one end of depression bar, the other end of depression bar extends to the top and the fixed mounting who bears the seat and has the baffle, the movable sleeve is equipped with reset spring on the depression bar, reset spring's one end fixed mounting is on the baffle, reset spring's other end fixed mounting bears the seat, owing to be provided with the resilience that resets, can make the baffle reset.
Compared with the prior art, the beneficial effects of the utility model are that:
placing a wafer to be tested in the placing groove, starting a rotating motor, driving a gear to rotate through an output shaft by the rotating motor, driving a rack to move by the gear, driving a cross rod to move by the rack, enabling the cross rod to stably move under the action of a second limiting block and a second limiting groove, driving a moving seat to move by the movement of the cross rod, and driving a moving plate to move by the movement of the moving seat;
the moving plate moves, under the action of the second rod, the second rod drives the sliding seat to move downwards, the sliding seat drives the first rod to move, the first rod drives the connecting seat to move, the connecting seat drives the first limiting block to slide in the first limiting groove, so that the connecting seat can stably move, the connecting seat can eject the probe card to move, the probe card can be in contact with a wafer to be detected, and the probe card can be conveniently moved;
the removal of connecting seat drives the first board through the montant and removes, the first board drives the clamp plate through fixed spring and removes, make the clamp plate contact with the wafer that awaits measuring, thereby can compress tightly fixedly to the wafer that awaits measuring, the removal of clamp plate, the clamp plate extrude the baffle, make the baffle move down and extrude reset spring, the removal of baffle drives the depression bar and removes, the depression bar drives the down tube and removes the down tube and drives the drive push rod through the inclined hole and remove, the push rod drives splint and removes, make splint can carry out horizontal centre gripping fixed to the wafer that awaits measuring, thereby can fix the wafer that awaits measuring.
The utility model relates to a rationally, simple structure, convenient operation, the probe card of being convenient for removes, and can fix the wafer that awaits measuring when the probe card removes to make things convenient for people's detection.
Drawings
Fig. 1 is a schematic structural diagram of a testing apparatus for three-dimensional package chip through silicon vias according to the present invention;
fig. 2 is a schematic structural diagram of a part a of a testing apparatus for three-dimensional package chip through silicon vias according to the present invention;
fig. 3 is a schematic structural diagram of a part B of a testing apparatus for three-dimensional packaged chip through silicon vias according to the present invention;
fig. 4 is a schematic structural diagram of a part C of a testing apparatus for three-dimensional packaged chip through silicon vias according to the present invention;
fig. 5 is a schematic view of a three-dimensional structure of a knot moving plate, a fixing base and a stabilizer bar of the testing device for three-dimensional packaged chip through silicon vias provided by the present invention.
In the figure: the probe card comprises a base 1, a probe card 2, a vertical plate 3, a cross beam 4, a bearing seat 5, a placing groove 6, a wafer to be tested 7, a connecting seat 8, a first limit groove 9, a first limit block 10, a first groove 11, a movable seat 12, a cross rod 13, a movable plate 14, a fixed seat 15, a stabilizing rod 16, a sliding seat 17, a first rod 18, a second rod 19, a rack 20, a rotating motor 21, a gear 22, a second limit groove 23, a second limit block 24, a first hole 25, a vertical rod 26, a first plate 27, a second hole 28, a third rod 29, a pressing plate 30, a fixing spring 31, a second groove 32, a clamping plate 33, a third groove 34, a pushing rod 35, a fourth groove 36, a sliding plate 37, a diagonal rod 38, a diagonal hole 39, a pressing rod 40, a baffle 41 and a reset spring 42.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example one
Referring to fig. 1-5, a testing device for three-dimensional package chip through silicon via holes comprises a base 1 and a probe card 2 positioned on the base 1, wherein the bottom of the base 1 is fixedly provided with two vertical plates 3 which are symmetrically arranged, the top of each vertical plate 3 is fixedly provided with a cross beam 4, one side of each vertical plate 3 close to each other is slidably provided with a connecting seat 8, the probe card 2 is fixedly arranged at the bottom of the connecting seat 8, the top of the base 1 is fixedly provided with a bearing seat 5, the top of the bearing seat 5 is provided with a placing groove 6, a wafer 7 to be tested is placed in the placing groove 6, and the bottom of the connecting seat 8 is fixedly provided with two vertical rods 26.
The utility model discloses in, the first groove 11 that two symmetries set up is seted up to the bottom of crossbeam 4, and slidable mounting has the removal seat 12 in the first groove 11, and the bottom of removing seat 12 extends to the below of crossbeam 4 and fixed mounting has movable plate 14, and one side fixed mounting of movable plate 14 has the fixing base 15 that two symmetries set up, and one side fixed mounting that two fixing bases 15 are close to each other has same stabilizer bar 16.
The utility model discloses in, the sliding sleeve is equipped with sliding seat 17 on stabilizer bar 16, and one side of sliding seat 17 articulates the one end that has first pole 18 and the one end of second pole 19, and the other end of first pole 18 articulates on connecting seat 8, and second pole 19 even first articulates on crossbeam 4.
The utility model discloses in, first spacing groove 9 has all been seted up to one side that two risers 3 are close to each other, and the equal fixed mounting in both sides of connecting seat 8 has first stopper 10, and first stopper 10 and the first spacing groove 9 sliding connection who corresponds.
The utility model discloses in, seted up same first hole 25 on the one side inner wall that two first grooves 11 are close to each other, slidable mounting has horizontal pole 13 in first hole 25, and the both sides of horizontal pole 13 fixed mounting respectively have rack 20 on two removal seats 12, one side fixed mounting of horizontal pole 13.
The utility model discloses in, the top fixed mounting of crossbeam 4 has rotating electrical machines 21, and rotating electrical machines 21's output shaft extends to in the first hole 25 and fixed mounting has gear 22, and gear 22 meshes with rack 20 mutually, has all seted up second spacing groove 23 on the top inner wall of first hole 25 and on the bottom inner wall, and the equal fixed mounting in top and the bottom of horizontal pole 13 has second stopper 24, and second stopper 24 and the 23 sliding connection of second spacing groove that corresponds.
The utility model discloses in, one side fixed mounting of montant 26 has first board 27, sets up the second hole 28 that two symmetries set up on the first board 27, and slidable mounting has third pole 29 in the second hole 28, and the bottom fixed mounting of two third poles 29 has same clamp plate 30, and the movable sleeve is equipped with fixed spring 31's one end on the third pole 29, and fixed spring 31's other end fixed mounting is on clamp plate 30.
The utility model discloses in, all seted up second groove 32 on the both sides inner wall of standing groove 6, slidable mounting has splint 33 in the second groove 32, has seted up third groove 34 on one side inner wall of second groove 32, and one side fixed mounting of splint 33 has push rod 35, and push rod 35 slidable mounting has seted up inclined hole 39 on the push rod 35 in third groove 34.
The utility model discloses in, fourth groove 36 has been seted up on the top inner wall of third groove 34, fourth groove 36 slidable mounting has sliding plate 37, sliding plate 37's bottom fixed mounting has down tube 38, and down tube 38 and the inclined hole 39 looks adaptations that correspond, sliding plate 37's top fixed mounting has depression bar 40's one end, depression bar 40's the other end extends to the top and fixed mounting who bears seat 5 has baffle 41, the movable sleeve is equipped with reset spring 42 on the depression bar 40, reset spring 42's one end fixed mounting is on baffle 41, reset spring 42's other end fixed mounting bears on seat 5.
Example two
Referring to fig. 1-5, a testing device for three-dimensional package chip through silicon via holes comprises a base 1 and a probe card 2 positioned on the base 1, wherein two vertical plates 3 symmetrically arranged are fixedly mounted at the bottom of the base 1, the same cross beam 4 is fixedly mounted at the top of each vertical plate 3, one side, close to each other, of the two vertical plates 3 is slidably mounted with the same connecting seat 8, the probe card 2 is fixedly mounted at the bottom of the connecting seat 8, a bearing seat 5 is fixedly mounted at the top of the base 1, a placing groove 6 is formed at the top of the bearing seat 5, a wafer 7 to be tested is placed in the placing groove 6, and two vertical rods 26 symmetrically arranged are fixedly mounted at the.
The utility model discloses in, the first groove 11 that two symmetries set up is seted up to the bottom of crossbeam 4, slidable mounting has removal seat 12 in first groove 11, the bottom of removing seat 12 extends to the below of crossbeam 4 and fixed mounting has movable plate 14, one side fixed mounting of movable plate 14 has the fixing base 15 that two symmetries set up, one side fixed mounting that two fixing bases 15 are close to each other has same stabilizer bar 16, owing to be provided with removal seat 12, the removal that removes seat 12 can drive movable plate 14 and remove.
The utility model discloses in, the sliding sleeve is equipped with sliding seat 17 on stabilizer bar 16, and one side of sliding seat 17 articulates there are the one end of first pole 18 and the one end of second pole 19, and the other end of first pole 18 articulates on connecting seat 8, and second pole 19 even first articulates on crossbeam 4, owing to be provided with second pole 19, sliding seat 17's removal can drive connecting seat 8 through first pole 18 and remove.
The utility model discloses in, first spacing groove 9 has all been seted up to one side that two risers 3 are close to each other, and the equal fixed mounting in both sides of connecting seat 8 has first stopper 10, and first stopper 10 and the first spacing groove 9 sliding connection that corresponds can make connecting seat 8 carry out stable removal owing to be provided with first stopper 10 and first spacing groove 9.
The utility model discloses in, seted up same first hole 25 on the one side inner wall that two first grooves 11 are close to each other, slidable mounting has horizontal pole 13 in first hole 25, and the both sides of horizontal pole 13 fixed mounting respectively on two removal seats 12, and one side fixed mounting of horizontal pole 13 has rack 20, owing to be provided with rack 20, rack 20's removal can drive horizontal pole 13 and remove.
The utility model discloses in, the top fixed mounting of crossbeam 4 has rotating electrical machines 21, rotating electrical machines 21's output shaft extends to in the first hole 25 and fixed mounting has gear 22, and gear 22 meshes with rack 20 mutually, second spacing groove 23 has all been seted up on the top inner wall of first hole 25 and on the bottom inner wall, the equal fixed mounting in top and the bottom of horizontal pole 13 has second stopper 24, and second stopper 24 and the second spacing groove 23 sliding connection who corresponds, owing to be provided with second stopper 24 and second spacing groove 23, can make horizontal pole 13 carry out stable removal.
The utility model discloses in, one side fixed mounting of montant 26 has first board 27, set up the second hole 28 that two symmetries set up on the first board 27, slidable mounting has third pole 29 in the second hole 28, the bottom fixed mounting of two third poles 29 has same clamp plate 30, the movable sleeve is equipped with fixed spring 31's one end on the third pole 29, fixed spring 31's other end fixed mounting is on clamp plate 30, owing to be provided with fixed spring 31, fixed spring 31 can extrude clamp plate 30.
The utility model discloses in, all seted up second groove 32 on the both sides inner wall of standing groove 6, slidable mounting has splint 33 in the second groove 32, has seted up third groove 34 on one side inner wall of second groove 32, and one side fixed mounting of splint 33 has push rod 35, and push rod 35 slidable mounting has seted up inclined hole 39 on the push rod 35 in third groove 34, owing to be provided with splint 33, can carry out the centre gripping to the wafer 7 that awaits measuring through splint 33.
The utility model discloses in, fourth groove 36 has been seted up on the top inner wall of third groove 34, fourth groove 36 slidable mounting has sliding plate 37, sliding plate 37's bottom fixed mounting has down tube 38, and down tube 38 and the inclined hole 39 looks adaptations that correspond, sliding plate 37's top fixed mounting has depression bar 40's one end, depression bar 40's the other end extends to the top and fixed mounting who bears seat 5 has baffle 41, the movable sleeve is equipped with reset spring 42 on the depression bar 40, reset spring 42's one end fixed mounting is on baffle 41, reset spring 42's other end fixed mounting bears on seat 5, owing to be provided with rebound 42 that resets, can make baffle 41 reset.
In the utility model, the wafer 7 to be tested is placed in the placing groove 6, then the rotating motor 21 is started, the rotating motor 21 drives the gear 22 to rotate through the output shaft, the gear 22 drives the rack 20 to move, the rack 20 drives the cross rod 13 to move, under the action of the second limit block 24 and the second limit groove 23, the cross rod 13 can stably move, the cross rod 13 moves to drive the moving seat 12 to move, the moving seat 12 moves to drive the moving plate 14 to move, the moving plate 14 moves, under the action of the second rod 19, the second rod 19 drives the sliding seat 17 to move downwards, the sliding seat 17 drives the first rod 18 to move, the first rod 18 drives the connecting seat 8 to move, the connecting seat 8 drives the first limit block 10 to slide in the first limit groove 9, so that the connecting seat 8 can stably move, the connecting seat 8 can move the elastic needle card 2, the probe card 2 can contact with the wafer 7 to be tested, thereby facilitating the movement of the probe card 2, the movement of the connecting seat 8 drives the first plate 27 to move through the vertical rod 26, the first plate 27 drives the pressing plate 30 to move through the fixing spring 31, so that the pressing plate 30 can contact with the wafer 7 to be tested, thereby compressing and fixing the wafer 7 to be tested, the movement of the pressing plate 30, the pressing plate 30 extrudes the baffle plate 41, the baffle plate 41 moves downwards and extrudes the reset spring 42, the movement of the baffle plate 41 drives the pressing rod 40 to move, the pressing rod 40 drives the inclined rod 38 to move, the inclined rod 38 drives the push rod 35 to move through the inclined hole 39, the push rod 35 drives the clamping plate 33 to move, so that the clamping plate 33 can transversely clamp and fix the wafer 7 to be tested, thereby facilitating the movement of the probe card 2, and the wafer 7 to be tested can be fixed while the probe card 2 moves, thereby facilitating the detection of people.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (9)
1. The utility model provides a testing arrangement of three-dimensional encapsulation chip through-silicon-via, includes the base and is located the probe card on the base, a serial communication port, the bottom fixed mounting of base has the riser that two symmetries set up, and the top fixed mounting of riser has same crossbeam, and one side slidable mounting that two risers are close to each other has same connecting seat, and probe card fixed mounting is in the bottom of connecting seat, and the top fixed mounting of base has the seat of bearing, bears the top of seat and has seted up the standing groove, has placed the wafer that awaits measuring in the standing groove, and the bottom fixed mounting of connecting seat has the montant.
2. The device for testing the through silicon via of the three-dimensional packaged chip as claimed in claim 1, wherein the bottom of the cross beam is formed with two first grooves which are symmetrically arranged, the first groove is slidably mounted with a movable seat, the bottom of the movable seat extends to the lower side of the cross beam and is fixedly mounted with a movable plate, one side of the movable plate is fixedly mounted with two fixed seats which are symmetrically arranged, and the side of the two fixed seats which are close to each other is fixedly mounted with the same stabilizer bar.
3. The device for testing the through-silicon-vias of the three-dimensional packaged chip as claimed in claim 2, wherein a sliding seat is slidably sleeved on the stabilizing rod, one side of the sliding seat is hinged with one end of a first rod and one end of a second rod, the other end of the first rod is hinged on the connecting seat, and the first end of the second rod is hinged on the cross beam.
4. The device for testing the through silicon via of the three-dimensional packaged chip of claim 1, wherein the two risers are provided with a first limiting groove at one side adjacent to each other, the two sides of the connecting seat are fixedly provided with a first limiting block, and the first limiting block is connected with the corresponding first limiting groove in a sliding manner.
5. The apparatus of claim 2, wherein the same first hole is formed in an inner wall of a side of the two first grooves adjacent to each other, a cross bar is slidably installed in the first hole, two sides of the cross bar are respectively and fixedly installed on the two movable seats, and a rack is fixedly installed on one side of the cross bar.
6. The device for testing the through silicon via of the three-dimensional packaged chip as claimed in claim 1, wherein a rotating motor is fixedly mounted at the top of the beam, an output shaft of the rotating motor extends into the first hole and is fixedly mounted with a gear, the gear is meshed with the rack, second limiting grooves are formed in the inner wall of the top and the inner wall of the bottom of the first hole, second limiting blocks are fixedly mounted at the top and the bottom of the cross bar, and the second limiting blocks are slidably connected with the corresponding second limiting grooves.
7. The device for testing the through silicon via of the three-dimensional packaged chip as claimed in claim 1, wherein a first plate is fixedly mounted on one side of the vertical rod, two second holes are symmetrically formed in the first plate, a third rod is slidably mounted in the second holes, the bottom ends of the two third rods are fixedly mounted with a same pressing plate, one end of a fixing spring is movably sleeved on the third rod, and the other end of the fixing spring is fixedly mounted on the pressing plate.
8. The device for testing the through silicon via of the three-dimensional packaged chip as claimed in claim 1, wherein the placing groove has a second groove formed on both inner walls thereof, a clamp plate is slidably mounted in the second groove, a third groove is formed on one inner wall of the second groove, a push rod is fixedly mounted on one side of the clamp plate, the push rod is slidably mounted in the third groove, and an inclined hole is formed on the push rod.
9. The device for testing the through-silicon vias of a three-dimensional packaged chip as claimed in claim 8, wherein a fourth slot is formed on an inner wall of a top of the third slot, a sliding plate is slidably mounted on the fourth slot, an inclined rod is fixedly mounted at a bottom of the sliding plate and is matched with the corresponding inclined hole, one end of a pressing rod is fixedly mounted on the top of the sliding plate, the other end of the pressing rod extends above the load-bearing seat and is fixedly mounted with a baffle plate, a return spring is movably sleeved on the pressing rod, one end of the return spring is fixedly mounted on the baffle plate, and the other end of the return spring is fixedly mounted on the load-bearing seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921357471.2U CN210604723U (en) | 2019-08-21 | 2019-08-21 | Testing device for three-dimensional packaged chip silicon through hole |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921357471.2U CN210604723U (en) | 2019-08-21 | 2019-08-21 | Testing device for three-dimensional packaged chip silicon through hole |
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| CN210604723U true CN210604723U (en) | 2020-05-22 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110456116A (en) * | 2019-08-21 | 2019-11-15 | 大同新成新材料股份有限公司 | A kind of test device and its method of three-dimension packaging chip through silicon via |
| CN117250383A (en) * | 2023-11-20 | 2023-12-19 | 安盈半导体技术(常州)有限公司 | Probe card grafting structure |
-
2019
- 2019-08-21 CN CN201921357471.2U patent/CN210604723U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110456116A (en) * | 2019-08-21 | 2019-11-15 | 大同新成新材料股份有限公司 | A kind of test device and its method of three-dimension packaging chip through silicon via |
| CN117250383A (en) * | 2023-11-20 | 2023-12-19 | 安盈半导体技术(常州)有限公司 | Probe card grafting structure |
| CN117250383B (en) * | 2023-11-20 | 2024-02-02 | 安盈半导体技术(常州)有限公司 | Probe card grafting structure |
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