CN111122914A - Test probe device and method for testing semiconductor bare chip - Google Patents
Test probe device and method for testing semiconductor bare chip Download PDFInfo
- Publication number
- CN111122914A CN111122914A CN202010009578.9A CN202010009578A CN111122914A CN 111122914 A CN111122914 A CN 111122914A CN 202010009578 A CN202010009578 A CN 202010009578A CN 111122914 A CN111122914 A CN 111122914A
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- fixedly connected
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- probe
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides test probe equipment and a test probe method for testing a semiconductor bare chip, and relates to the technical field of semiconductor material testing. This a test probe equipment for testing semiconductor bare chip, top through the stripper bar extrusion lifter plate promotes testing arrangement and descends, detect semiconductor material's specific position through the probe head, the in-process that testing arrangement descends, the internal drive gear who contracts back testing arrangement through the probe atress rotates, thereby drive rack board downstream, mode through compression second spring, slow down the distortion power of probe, make probe in use through the connecting sleeve that sets up, keep vertical state throughout, remove through testing arrangement and remove can detect semiconductor material's different positions, thereby improve the accuracy nature of wafer when the test.
Description
Technical Field
The invention relates to the technical field of semiconductor material testing, in particular to a test probe device and a method for testing a semiconductor bare chip.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination application, high-power conversion and the like, for example, a diode is a device manufactured by the semiconductor, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, and the probe station is mainly applied to the test of the semiconductor industry, the photoelectric industry, the integrated circuits and packaging, and is widely applied to the research and development of precise electrical measurement of complex and high-speed devices.
The existing testing device is used for detecting, probe equipment directly impacts on a detection material, the end of the probe is easily stressed, bent and broken, part of the probe is directly cracked, the material is further influenced to be tested, the accuracy of a measured result cannot be achieved, and along with the continuous increase of the volume of the detection material, the position which cannot be detected by the testing device is easy to appear, and therefore inconvenience is brought to detection.
Disclosure of Invention
The present invention is directed to overcoming the deficiencies of the prior art and providing a test probe apparatus for testing semiconductor dies.
Technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a test probe apparatus for testing semiconductor dies, comprising a test station and a test device, characterized in that: the top fixedly connected with bracing piece of detecting the platform, the top fixedly connected with regulating box of bracing piece, the inner wall swing joint of regulating box has the carousel, the outer fixed surface of carousel is connected with extrusion pole and rectangle frame, and the inside of bracing piece is equipped with the movable rod, and the positive fixedly connected with fixed block of movable rod, fixed block are established in the inside of rectangle frame, and the inner diapire of regulating box is equipped with the connecting rod, the top fixedly connected with lifter plate of connecting rod.
Further, the connecting rod runs through the interior diapire of regulating box and extends to the bottom of regulating box, the bottom fixedly connected with baffle of connecting rod, the first slide bar of a side fixedly connected with of baffle, the surface sliding connection of first slide bar has the movable block, a side swing joint of baffle has first screw rod, movable block threaded connection is at the surface of first screw rod, testing arrangement fixed connection is in the bottom of first screw rod.
Further, testing arrangement's inside wall fixedly connected with fixed plate, first loop bar of testing arrangement's interior roof fixedly connected with and second loop bar, the surface sliding connection of first loop bar has the probe, testing arrangement's bottom fixedly connected with connecting sleeve, the probe runs through the top of fixed plate in proper order, testing arrangement's interior diapire and connecting sleeve's top and extend to connecting sleeve's bottom, the bottom fixedly connected with probe head of probe, a side fixedly connected with rack of probe, testing arrangement's inner wall swing joint has the gear, the rack meshes with the gear mutually, the surface sliding connection of second loop bar has the rack board, the rack board meshes with the gear mutually, the second spring has been cup jointed to the surface of second loop bar.
Further, the equal fixedly connected with slide rail of interior roof and interior diapire of regulating box, the equal sliding connection in the inside of slide rail in both ends of movable rod, the top of probe and the equal fixedly connected with magnetic path of testing arrangement's interior roof, the magnetic pole direction of two magnetic paths is the same, through two magnetic paths, when the probe atress is when test arrangement's inside shrink, slows down the impact force that the probe head received, has increased the stability of movable rod in the side-to-side motion process through setting up the slide rail.
Furthermore, two dead levers of a side fixedly connected with of movable rod, two dead levers all run through a side of regulating box and extend to a side of regulating box, through connecting at the pull rod between two dead levers, drive the movable rod of regulating box inside through the pull rod between two dead levers of pulling and remove.
Further, the surface of connecting rod has cup jointed first spring, and the equal fixedly connected with pulley of one end of lifter and rectangle frame drives the lifter plate upward movement through the resilience of first spring when the top of lifter plate is not when the atress, has reduced the frictional force between one end of lifter and rectangle frame and the lifter plate top through the pulley.
Further, the spout has been seted up at the top of examining test table, and the inside wall fixedly connected with second slide bar of spout, the surface sliding connection of second slide bar has the slider, and the top fixedly connected with grip block of slider leans on recently to fix the semiconductor material that detects each other through two grip blocks, prevents that the testing process material from removing the influence testing result.
Furthermore, the top of the detection table is provided with an adjusting groove, the inner side wall of the adjusting groove is movably connected with a second screw rod, the outer surface of the second screw rod is in threaded connection with two adjusting blocks with inner rings in opposite thread directions, the adjusting blocks are fixedly connected with the bottoms of the clamping plates, the two clamping plates are close to each other by rotating the second screw rod, and the semiconductor material is fixed.
Further, the second screw rod runs through the inside wall of adjustment tank and extends to the side of examining test table, and the one end fixedly connected with handle of second screw rod, first screw rod run through the side of baffle and extend to the another side of baffle, and the one end fixedly connected with handle of first screw rod examines the bottom fixedly connected with foundation of test table, supports whole device through setting up the foundation, is convenient for drive first screw rod and second screw rod through setting up the handle and rotates.
Compared with the prior art, the test probe device for testing the semiconductor bare chip has the following beneficial effects:
1. the test probe equipment for testing the semiconductor bare chip can detect the specific position of a semiconductor material by rotating the first screw rod to adjust the test device to move left and right, increase the detection range of the semiconductor material by arranging two test devices, pull the fixed rod to drive the fixed block to push the rectangular frame to rotate around the turntable, so that the extrusion rod extrudes the top of the lifting plate to push the test device to descend, the specific position of the semiconductor material is detected by the probe head, in the descending process of the test device, the probe is contracted back to the internal drive gear of the test device by stress to rotate so as to drive the rack plate to move downwards, the twisting force of the probe is reduced by compressing the second spring, the probe is always kept in a vertical state by the connecting sleeve, and different positions of the semiconductor material can be detected by the left and right movement of the test device, thereby improving the accuracy of the material during testing.
2. The test probe equipment for testing the semiconductor bare chip is characterized in that the impact force borne by a probe head is relieved by two magnetic blocks when the probe is stressed to shrink towards the inside of a test device, the stability of a movable rod in the process of left-right movement is improved by arranging a slide rail, the movable rod in an adjusting box is driven to move by pulling a pull rod between two fixed rods, when the top of a lifting plate is not stressed, the lifting plate is driven to move upwards by resilience of a first spring, the friction force between an extrusion rod and one end of a rectangular frame and the top of the lifting plate is reduced by a pulley, detected semiconductor materials are fixed by the mutual approach of two clamping plates, the detection result is prevented from being influenced by the movement of the materials in the detection process, the two clamping plates are mutually close by rotating a second screw rod to fix the semiconductor materials, and the whole device is supported by arranging a bottom column, the handle is arranged to facilitate driving the first screw rod and the second screw rod to rotate.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a schematic view of the structure of the regulating box of the present invention;
FIG. 3 is an enlarged view of the invention at A;
FIG. 4 is a schematic structural diagram of a testing apparatus according to the present invention;
FIG. 5 is a schematic view of the structure of the inspection table of the present invention.
Wherein, 1, detecting the platform; 2. a support bar; 3. an adjusting box; 4. a testing device; 5. a turntable; 6. an extrusion stem; 7. a rectangular frame; 8. a movable rod; 9. a fixed block; 10. a lifting plate; 11. a connecting rod; 12. a baffle plate; 13. a first slide bar; 14. a movable block; 15. a first screw; 16. a first spring; 17. a slide rail; 18. fixing the rod; 19. a fixing plate; 20. a probe; 21. a probe head; 22. a rack; 23. a gear; 24. a first loop bar; 25. a second loop bar; 26. a rack plate; 27. a second spring; 28. a magnetic block; 29. a connecting sleeve; 30. a chute; 31. a second slide bar; 32. a slider; 33. a clamping plate; 34. an adjustment groove; 35. a second screw; 36. an adjusting block; 37. a bottom pillar.
Detailed Description
As shown in fig. 1 to 5, an embodiment of the present invention provides a test probe apparatus for testing semiconductor dies, including a test table 1 and a test device 4, a bottom pillar 37 is fixedly connected to the bottom of the test table 1, the entire device is supported by the bottom pillar 37, a support rod 2 is fixedly connected to the top of the test table 1, an adjusting box 3 is fixedly connected to the top of the support rod 2, a turntable 5 is movably connected to the inner wall of the adjusting box 3, an extruding rod 6 and a rectangular frame 7 are fixedly connected to the outer surface of the turntable 5, a movable rod 8 is disposed inside the support rod 2, a fixed block 9 is fixedly connected to the front of the movable rod 8, the fixed block 9 is disposed inside the rectangular frame 7, a connecting rod 11 is disposed on the inner bottom wall of the adjusting box 3, a lifting plate 10 is fixedly connected to the top of the connecting rod 11, the connecting rod 11 penetrates through the inner bottom wall of the adjusting box 3 and extends to the bottom, two dead levers 18 all run through a side of regulating box 3 and extend to a side of regulating box 3, through connecting at the pull rod between two dead levers 18, drive the inside movable rod 8 of regulating box 3 and remove through the pull rod that stimulates between two dead levers 18.
The top of the detection table 1 is provided with a chute 30, the inner side wall of the chute 30 is fixedly connected with a second slide bar 31, the outer surface of the second slide bar 31 is connected with a slide block 32 in a sliding way, the top of the slide block 32 is fixedly connected with a clamping plate 33, the detected semiconductor material is fixed by the two clamping plates 33 approaching each other, the material movement in the detection process is prevented from influencing the detection result, the top of the detection table 1 is provided with an adjusting groove 34, the inner side wall of the adjusting groove 34 is movably connected with a second screw 35, the outer surface of the second screw 35 is in threaded connection with two adjusting blocks 36 with opposite inner ring thread directions, the adjusting blocks 36 are fixedly connected with the bottoms of the clamping plates 33, the two clamping plates 33 approach each other by rotating the second screw 35, the semiconductor material is fixed, the second screw 35 penetrates through the inner side wall of the adjusting groove 34 and extends to one side face of the detection table 1, and one end of the second screw 35 is fixedly connected with a handle.
The bottom of the connecting rod 11 is fixedly connected with a baffle 12, one side of the baffle 12 is fixedly connected with a first slide rod 13, the outer surface of the first slide rod 13 is connected with a movable block 14 in a sliding manner, one side of the baffle 12 is movably connected with a first screw rod 15, the first screw rod 15 penetrates through one side of the baffle 12 and extends to the other side of the baffle 12, one end of the first screw rod 15 is fixedly connected with a handle, the movable block 14 is in threaded connection with the outer surface of the first screw rod 15, the testing device 4 is fixedly connected with the bottom of the first screw rod 15, the inner top wall and the inner bottom wall of the adjusting box 3 are both fixedly connected with slide rails 17, both ends of the movable rod 8 are both in sliding connection with the inside of the slide rails 17, the stability of the movable rod 8 in the process of left-right movement is increased by arranging the slide rails 17, the outer surface of the connecting, when the top of the lifting plate 10 is not stressed, the lifting plate 10 is driven to move upwards by the resilience of the first spring 16, and the friction between the extrusion rod 6 and one end of the rectangular frame 7 and the top of the lifting plate 10 is reduced by the pulley.
The inner side wall of the testing device 4 is fixedly connected with a fixing plate 19, the inner top wall of the testing device 4 is fixedly connected with a first loop bar 24 and a second loop bar 25, the outer surface of the first loop bar 24 is connected with a probe 20 in a sliding manner, the bottom of the testing device 4 is fixedly connected with a connecting sleeve 29, the probe 20 sequentially penetrates through the top of the fixing plate 19, the inner bottom wall of the testing device 4 and the top of the connecting sleeve 29 and extends to the bottom of the connecting sleeve 29, the bottom of the probe 20 is fixedly connected with a probe head 21, one side surface of the probe 20 is fixedly connected with a rack 22, the inner wall of the testing device 4 is movably connected with a gear 23, the rack 22 is meshed with the gear 23, the outer surface of the second loop bar 25 is connected with a rack plate 26 in a sliding manner, the rack plate 26 is meshed with the gear 23, the outer surface of the second loop bar 25 is sleeved, the magnetic poles of the two magnetic blocks 28 are in the same direction, and when the probe 20 is stressed to contract towards the inside of the testing device 4, the impact force applied to the probe head 21 is relieved through the two magnetic blocks 28.
When using the test probe apparatus for testing semiconductor dies, the test apparatus 4 is connected with an external receiving apparatus, a semiconductor material is placed on the top of the test table 1, the handle at one end of the second screw 35 is rotated to make the two clamping plates 33 approach each other, the two clamping plates 33 approach each other to fix the semiconductor material to be tested, the handle at one end of the first screw 15 is rotated according to the position of the material to be tested, the test apparatus 4 is driven to move left and right by the movable block 14, the test apparatus 4 and the position to be tested are on the same vertical plane, the pull rod at one end of the fixed rod 18 is pulled, the fixed block 9 pushes the rectangular frame 7 to rotate around the turntable 5 by the sliding of the movable rod 8 in the slide rail 17, so that the top of the lifting plate 10 is squeezed by the squeezing rod 6 to push the test apparatus 4 to descend, the specific position of the semiconductor material is tested by the probe head 21, in the process that the testing device 4 descends, the probe 20 is retracted to rotate in the internal driving gear 23 of the testing device 4 under the stress, so that the rack plate 26 is driven to move downwards, the twisting force of the probe 20 is reduced in a mode of compressing the second spring 27, the probe 20 is kept in a vertical state all the time when being used through the arranged connecting sleeve 29, and the testing device 4 moves left and right and is provided with the two testing devices 4, so that the detection range of semiconductor materials is enlarged.
Claims (10)
1. A test probe apparatus for testing semiconductor dies, comprising a test station (1) and a test device (4), characterized in that: detect top fixedly connected with bracing piece (2) of platform (1), top fixedly connected with regulating box (3) of bracing piece (2), the inner wall swing joint of regulating box (3) has carousel (5), the outer fixed surface of carousel (5) is connected with squeeze bar (6) and rectangle frame (7), the inside of bracing piece (2) is equipped with movable rod (8), positive fixedly connected with fixed block (9) of movable rod (8), establish the inside at rectangle frame (7) fixed block (9), the inner diapire of regulating box (3) is equipped with connecting rod (11), the top fixedly connected with lifter plate (10) of connecting rod (11).
2. A test probe apparatus for testing semiconductor dies according to claim 1, characterized in that: connecting rod (11) run through the interior diapire of regulating box (3) and extend to the bottom of regulating box (3), the bottom fixedly connected with baffle (12) of connecting rod (11), a side fixedly connected with first slide bar (13) of baffle (12), the surface sliding connection of first slide bar (13) has movable block (14), a side swing joint of baffle (12) has first screw rod (15), movable block (14) threaded connection is at the surface of first screw rod (15), testing arrangement (4) fixed connection is in the bottom of first screw rod (15).
3. A test probe apparatus for testing semiconductor dies according to claim 2, characterized in that: the inner side wall of the testing device (4) is fixedly connected with a fixing plate (19), the inner top wall of the testing device (4) is fixedly connected with a first loop bar (24) and a second loop bar (25), the outer surface of the first loop bar (24) is connected with a probe (20) in a sliding manner, the bottom of the testing device (4) is fixedly connected with a connecting sleeve (29), the probe (20) sequentially penetrates through the top of the fixing plate (19), the inner bottom wall of the testing device (4) and the top of the connecting sleeve (29) and extends to the bottom of the connecting sleeve (29), the bottom of the probe (20) is fixedly connected with a probe head (21), one side face of the probe (20) is fixedly connected with a rack (22), the inner wall of the testing device (4) is movably connected with a gear (23), the rack (22) is meshed with the gear (23), the outer surface of the second loop bar (25) is connected, the rack plate (26) is meshed with the gear (23), and the outer surface of the second loop bar (25) is sleeved with a second spring (27).
4. A test probe apparatus for testing semiconductor dies according to claim 1, characterized in that: the top of probe (20) and the equal fixedly connected with magnetic path (28) of the interior roof of testing arrangement (4), the magnetic pole direction of two magnetic path (28) is the same, the equal fixedly connected with slide rail (17) of interior roof and interior diapire of regulating box (3), the equal sliding connection in the inside of slide rail (17) in both ends of movable rod (8).
5. A test probe apparatus for testing semiconductor dies according to claim 1, characterized in that: one side face of the movable rod (8) is fixedly connected with two fixing rods (18), the two fixing rods (18) penetrate through one side face of the adjusting box (3) and extend to one side face of the adjusting box (3), and the two fixing rods (18) are connected through a pull rod.
6. A test probe apparatus for testing semiconductor dies according to claim 1, characterized in that: the outer surface of the connecting rod (11) is sleeved with a first spring (16), and pulleys are fixedly connected to one ends of the extrusion rod (6) and the rectangular frame (7).
7. A test probe apparatus for testing semiconductor dies according to claim 1, characterized in that: examine the top of test table (1) and seted up spout (30), the inside wall fixedly connected with second slide bar (31) of spout (30), the surface sliding connection of second slide bar (31) has slider (32), the top fixedly connected with grip block (33) of slider (32).
8. A test probe apparatus for testing semiconductor dies according to claim 1, characterized in that: the top of the detection table (1) is provided with an adjusting groove (34), the inner side wall of the adjusting groove (34) is movably connected with a second screw rod (35), the outer surface of the second screw rod (35) is in threaded connection with two adjusting blocks (36) with inner rings in opposite threaded directions, and the adjusting blocks (36) are fixedly connected with the bottom of the clamping plate (33).
9. A test probe apparatus for testing semiconductor dies according to claim 1, characterized in that: second screw rod (35) run through the inside wall of adjustment tank (34) and extend to the side that detects platform (1), the one end fixedly connected with handle of second screw rod (35), and first screw rod (15) run through the side of baffle (12) and extend to the another side of baffle (12), the one end fixedly connected with handle of first screw rod (15), the bottom fixedly connected with sill pillar (37) of detecting platform (1).
10. A method of testing a test probe apparatus for testing semiconductor dies according to claim 1, characterized in that:
s1, firstly, placing the semiconductor material on the top of the detection table (1), rotating a handle at one end of a second screw rod (35), and fixing the material on the top of the detection table (1) through a clamping plate (33);
s2, according to the detection position of the required material, rotating the handle at one end of the first screw rod (15) to adjust the test device (4) to fall right above the detection position;
s3, pulling the pull rod between the fixing rods (18) to vertically descend the testing device (4), and detecting through the contact of the probe head (21) at the bottom of the testing device (4) and the detected part of the semiconductor material;
and S4, after the detection is finished, loosening the pull rod of the fixed rod (18), lifting the testing device (4), and readjusting the detection of other parts of the semiconductor material by rotating the handle at one end of the first screw rod (15) again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010009578.9A CN111122914A (en) | 2020-01-06 | 2020-01-06 | Test probe device and method for testing semiconductor bare chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010009578.9A CN111122914A (en) | 2020-01-06 | 2020-01-06 | Test probe device and method for testing semiconductor bare chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111122914A true CN111122914A (en) | 2020-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010009578.9A Withdrawn CN111122914A (en) | 2020-01-06 | 2020-01-06 | Test probe device and method for testing semiconductor bare chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111122914A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112230116A (en) * | 2020-10-13 | 2021-01-15 | 宁波丞达精机股份有限公司 | Intelligent test unit of semiconductor test equipment |
| CN113241113A (en) * | 2021-05-14 | 2021-08-10 | 江苏华存电子科技有限公司 | Aging test equipment and method for semiconductor storage product |
| CN113433359A (en) * | 2021-08-25 | 2021-09-24 | 邳州众鑫机械有限公司 | Clamping tool and method for testing low-temperature electrical properties of semiconductor |
| CN113933686A (en) * | 2021-10-13 | 2022-01-14 | 深圳台达创新半导体有限公司 | Detection equipment for integrated circuit packaging finished product |
| CN114814553A (en) * | 2022-05-13 | 2022-07-29 | 昆山兢美电子科技有限公司 | Flying probe testing device |
| CN116930568A (en) * | 2023-09-14 | 2023-10-24 | 成都圣芯集成电路有限公司 | Millimeter wave chip test platform |
-
2020
- 2020-01-06 CN CN202010009578.9A patent/CN111122914A/en not_active Withdrawn
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112230116A (en) * | 2020-10-13 | 2021-01-15 | 宁波丞达精机股份有限公司 | Intelligent test unit of semiconductor test equipment |
| CN113241113A (en) * | 2021-05-14 | 2021-08-10 | 江苏华存电子科技有限公司 | Aging test equipment and method for semiconductor storage product |
| CN113241113B (en) * | 2021-05-14 | 2022-08-19 | 江苏华存电子科技有限公司 | Aging test equipment and method for semiconductor storage product |
| CN113433359A (en) * | 2021-08-25 | 2021-09-24 | 邳州众鑫机械有限公司 | Clamping tool and method for testing low-temperature electrical properties of semiconductor |
| CN113433359B (en) * | 2021-08-25 | 2021-11-26 | 邳州众鑫机械有限公司 | Clamping tool and method for testing low-temperature electrical properties of semiconductor |
| CN113933686A (en) * | 2021-10-13 | 2022-01-14 | 深圳台达创新半导体有限公司 | Detection equipment for integrated circuit packaging finished product |
| CN113933686B (en) * | 2021-10-13 | 2023-10-03 | 深圳台达创新半导体有限公司 | Detection equipment for integrated circuit packaging finished product |
| CN114814553A (en) * | 2022-05-13 | 2022-07-29 | 昆山兢美电子科技有限公司 | Flying probe testing device |
| CN114814553B (en) * | 2022-05-13 | 2023-11-03 | 昆山兢美电子科技有限公司 | Flying probe testing device |
| CN116930568A (en) * | 2023-09-14 | 2023-10-24 | 成都圣芯集成电路有限公司 | Millimeter wave chip test platform |
| CN116930568B (en) * | 2023-09-14 | 2023-12-19 | 成都圣芯集成电路有限公司 | Millimeter wave chip test platform |
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Application publication date: 20200508 |
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