CN210604340U - Bonding force test fixture and bonding force test device - Google Patents
Bonding force test fixture and bonding force test device Download PDFInfo
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- CN210604340U CN210604340U CN201921488804.5U CN201921488804U CN210604340U CN 210604340 U CN210604340 U CN 210604340U CN 201921488804 U CN201921488804 U CN 201921488804U CN 210604340 U CN210604340 U CN 210604340U
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Abstract
The utility model discloses a bonding force test fixture and bonding force testing arrangement, wherein, bonding force test fixture is used for the measurement of the bonding force of circuit board subassembly, circuit board subassembly includes first flexible circuit board, the second flexible circuit board, and the adhesive cement of bonding first flexible circuit board and second flexible circuit board, bonding force test fixture includes the base and compresses tightly the subassembly, set up the recess that is used for placing first flexible circuit board on the base, it locates on the base to compress tightly the subassembly, and the part stretches into and compresses tightly first flexible circuit board in the recess, it still is formed with an opening that is used for exposing second flexible circuit board on the subassembly to compress tightly, the opening communicates to the recess perpendicularly. The utility model discloses can compress tightly on the base through compressing tightly the first flexible circuit board in the subassembly with the FOF product to can utilize the test clamp of setting in bonding force test fixture top to get the second flexible circuit board, obtain the adhesion stress of real FOF product with the measurement, improve the accuracy of the intensity aassessment of FOF product structure.
Description
Technical Field
The utility model relates to a check out test set technical field especially relates to a bonding force test fixture and bonding force testing arrangement.
Background
At present, the binding mode of a Flexible Printed Circuit (FPC) of a display module in the mobile phone industry mainly includes two types: FOG (FPC on glass) binding and FOF (FPC on FPC) binding. FOG means that FPC is bound on LCD, FOF means that FPC is bound on FPC. An Anisotropic Conductive Film (ACF) is used as an adhesive for FPC bonding to conduct upper and lower circuits and bond, wherein the bonding force of the ACF is an important index for evaluating the tearing strength of an FPC bonding area. As shown in FIG. 1, the adhesion test method of FOF product 01 at present is as follows: by pulling the FPC up and down in parallel by the first test clip 02 and the second test clip 03, the ACF is broken and separated by a force, and the breaking force is the shearing force of the ACF and is not the adhesive force of the FOF product 01. The test result obtained by the test mode is used as the adhesive force, the result judgment of the ACF evaluation is seriously influenced, and the structural strength evaluation error of the FOF product 01 is caused.
Accordingly, there is a need for an adhesion testing fixture and an adhesion testing apparatus, which at least overcome or alleviate the above-mentioned shortcomings in the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a bonding force test fixture and bonding force testing arrangement aims at solving traditional bonding force test and can not obtain the real bonding force of FOF product and influence the technical problem of the structural strength aassessment of FOF product.
In order to realize the above object, the utility model provides a bonding force test fixture and bonding force testing arrangement, bonding force test fixture is used for the measurement of circuit board subassembly bonding force, circuit board subassembly includes first flexible circuit board, second flexible circuit board and bonds first flexible circuit board with the bonding glue of second flexible circuit board, wherein, bonding force test fixture includes the base and compresses tightly the subassembly, set up the recess that is used for placing first flexible circuit board on the base, it locates to compress tightly the subassembly on the base to the part stretch into to compress tightly in the recess first flexible circuit board, it is used for exposing still to be formed with one on the subassembly compress tightly the opening of second flexible circuit board, the opening communicates perpendicularly to the recess.
Preferably, the pressing assembly comprises a first pressing piece and a second pressing piece which are arranged at intervals, the opening is formed at the interval between the first pressing piece and the second pressing piece, and the first pressing piece and the second pressing piece are respectively used for being abutted to the first flexible circuit boards on two opposite sides of the adhesive glue.
Preferably, the first pressing member includes a first mounting plate disposed on the base, and a first pressing plate extending into the groove from the first mounting plate toward a direction close to the bottom wall of the groove, and a free end of the first pressing plate is used for abutting against the first flexible circuit board.
Preferably, the surface of the first pressing plate connected with the first mounting plate is in contact with the side wall surface of the groove, the surface of the first pressing plate far away from the first mounting plate is used for being in contact with the adhesive and the second flexible circuit board, and the bottom of the first pressing plate is arranged opposite to the bottom wall of the groove at intervals.
Preferably, the second compresses tightly the piece including setting up second mounting panel on the base, with the second mounting panel is close to the connecting plate that the border of first mounting panel is connected and certainly the connecting plate is close to the one end of recess diapire is to keeping away from the second clamp plate that first mounting panel direction was buckled and is extended, the second clamp plate extends to in the recess, be used for with first flexible circuit board butt, first clamp plate with the second clamp plate is used for the branch to locate the relative both sides of adhesive.
Preferably, a surface of the connection plate remote from the second mounting plate is for contact with the second flexible circuit board.
Preferably, the first pressing member further includes a first screw member connecting the first mounting plate and the base, and the second pressing member further includes a second screw member connecting the second mounting plate and the base.
Preferably, the base comprises a top surface and a bottom surface which are oppositely arranged, and a side surface which connects the top surface and the bottom surface, the top surface is recessed towards the direction close to the bottom surface to form the groove, and the bottom wall of the groove is connected with the side surface.
Preferably, the adhesion test fixture further comprises a fixing member arranged on the bottom wall of the groove, and the fixing member is used for fixing the first flexible circuit board.
Furthermore, the utility model provides a bonding force testing arrangement, wherein, bonding force testing arrangement includes more than bonding force test fixture, and with the test clamp that the opening corresponds, the test clamp is used for pressing from both sides to get the follow the opening exposes the second flexible circuit board, and to the perpendicular to is applyed to the second flexible circuit board the pulling force of base.
The technical scheme of the utility model, because the bonding force test fixture that provides includes the base and compresses tightly the subassembly, offer the recess that is used for placing first flexible circuit board on the base, compress tightly the subassembly and locate on the base to the part stretches into and compresses tightly first flexible circuit board in the recess, compresses tightly still to be formed with an opening that is used for exposing the second flexible circuit board on the subassembly, and the opening communicates to the recess perpendicularly. Can compress tightly the first flexible circuit board in the FOF product on the base reliably through compressing tightly the subassembly promptly, then press from both sides the second flexible circuit board through the test clamp that sets up in adhesion test fixture top again to can measure the adhesion force that obtains real FOF product, improve the accuracy of the intensity aassessment of FOF product structure.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural view of a FOF product in the prior art for a conventional adhesion test;
fig. 2 is a schematic structural view of an adhesion force testing jig according to an embodiment of the present invention;
fig. 3 is a disassembly schematic view of the adhesion force testing jig according to the embodiment of the present invention;
fig. 4 is a schematic structural view of a second pressing member according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of the adhesion testing apparatus according to the embodiment of the present invention during testing.
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Description of the reference numerals of fig. 1 in the background art:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 01 | |
02 | |
| 03 | Second test clip |
The embodiment of the present invention is illustrated in fig. 2 to 5 with reference numbers:
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 2, fig. 3 and fig. 5, according to an aspect of the present invention, there is provided a bonding force test fixture, wherein the bonding force test fixture is used for measuring the bonding force of a circuit board assembly, the circuit board assembly includes a first flexible circuit board 7, a second flexible circuit board 8, and a bonding glue 9 for bonding the first flexible circuit board 7 and the second flexible circuit board 8, wherein the bonding force test fixture includes: the flexible printed circuit board comprises a base 1 and a pressing component 2, wherein a groove 11 for placing a first flexible printed circuit board 7 is formed in the base 1; the pressing component 2 is arranged on the base 1, part of the pressing component extends into the groove 11 to press the first flexible circuit board 7, an opening 21 used for exposing the second flexible circuit board 8 is formed in the pressing component 2, and the opening 21 is vertically communicated with the groove 11. The utility model discloses in, it should explain in particular that, first flexible circuit board 7 is including the first bonding section that is provided with bond paste 9 and divide first free segment and the second free segment of locating first bonding section both ends, and the length of first free segment is shorter than the second free segment, and second flexible circuit board 8 includes the second bonding section of being connected through bond paste 9 and first bonding section and the third free segment of being connected with the second bonding section, and the third free end sets up with first free segment relative interval.
The technical scheme of the utility model, because the adhesion test fixture that provides includes base 1 and compresses tightly subassembly 2, offer the recess 11 that is used for placing first flexible circuit board 7 on the base 1, compress tightly subassembly 2 and locate on base 1 to the part stretches into and compresses tightly first flexible circuit board 7 in the recess 11, compresses tightly still to be formed with an opening 21 that is used for exposing second flexible circuit board 8 on the subassembly 2, and opening 21 communicates perpendicularly to recess 11. Can compress tightly the first flexible circuit board 7 in the FOF product on base 1 reliably through compressing tightly subassembly 2 promptly, then press from both sides through the test clamp 6 clamp that sets up in adhesion test fixture top and get second flexible circuit board 8 to can measure the adhesion force that obtains real FOF product, improve the accuracy of the intensity aassessment of FOF product structure.
Further, the pressing assembly 2 comprises a first pressing piece 3 and a second pressing piece 4 which are arranged at intervals, an opening 21 is formed at the interval between the first pressing piece 3 and the second pressing piece 4, and the first pressing piece 3 and the second pressing piece 4 are respectively used for being abutted to the first flexible circuit board 7 on two opposite sides of the bonding glue 9. The pressing assembly 2 is divided into a first pressing piece 3 and a second pressing piece 4, the first flexible circuit boards 7 on two opposite sides of the bonding glue 9 are respectively pressed, and the pressing reliability can be guaranteed.
Specifically, the first pressing member 3 includes a first mounting plate 31 disposed on the base 1, and a first pressing plate 32 extending from the first mounting plate 31 into the groove 11 in a direction close to the bottom wall of the groove 11, and a free end of the first pressing plate 32 is configured to abut against the first flexible circuit board 7. The connection surface of the first pressing plate 32 and the first mounting plate 31 is flush with the side wall surface of the groove 11, and the first pressing plate 32 is protruded from the first mounting plate 31 so that the first pressing plate 32 extends towards the bottom wall of the groove 11.
Meanwhile, the surface of the first pressing plate 32 connected with the first mounting plate 31 is in contact with the side wall surface of the groove 11, the surface of the first pressing plate 32 far away from the first mounting plate 31 is used for being in contact with the adhesive 9 and the second flexible circuit board 8, and the bottom of the first pressing plate 32 is arranged opposite to the bottom wall of the groove 11 at an interval. That is, the bottom of the first pressing plate 32 can be used to abut against the first free section of the first flexible circuit board 7, and the surface of the first pressing plate 32 on the side away from the first mounting plate 31 can abut against the side of the adhesive 9 and the third free section of the second flexible circuit board 8 at the same time, so that the third free section is perpendicular to the second adhesive section, and at this time, the test frame clamp is used to clamp the third free section to measure the shearing force of the ACF, but the actually required FOF adhesive force.
Referring to fig. 4, in an embodiment, the second pressing member 4 includes a second mounting plate 41 disposed on the base 1, a connecting plate 42 connected to an edge of the second mounting plate 41 close to the first mounting plate 31, and a second pressing plate 43 extending from an end of the connecting plate 42 close to a bottom wall of the groove 11 to a direction away from the first mounting plate 31, where the second pressing plate 43 extends into the groove 11 for abutting against the first flexible circuit board 7, and the first pressing plate 32 and the second pressing plate 43 are disposed on two opposite sides of the adhesive 9. The second pressing plate 43 can abut against the second free section of the first flexible circuit board 7, the area of the second free section is larger than that of the first free section, the abutting area between the second pressing piece 4 and the first flexible circuit board 7 can be increased by adopting the second pressing plate 43, and the pressing reliability is guaranteed.
More specifically, a side surface of the connection plate 42 remote from the second mounting plate 41 is for contact with the second flexible circuit board 8. That is, the connection plate 42 may abut against the second bonding section of the second flexible circuit board 8, so that the second pressing plate 43 may press the first flexible circuit board 7 close to the bonding glue 9, and the reliability of the pressing is ensured.
In addition, the first pressing member 3 further includes a first screw 33 connecting the first mounting plate 31 and the base 1, and the second pressing member 4 further includes a second screw 44 connecting the second mounting plate 41 and the base 1. So that the degree of pressing of the first pressing plate 32 and the second pressing plate 43 against the first flexible circuit board 7 can be adjusted by the first screw 33 and the second screw 44, respectively.
Further, the base 1 includes a top surface and a bottom surface which are oppositely disposed, and a side surface connecting the top surface and the bottom surface, the top surface is recessed toward the bottom surface to form a groove 11, and a bottom wall of the groove 11 is connected to the side surface. The bottom wall of the groove 11 is connected with the side surface of the base 1, namely the groove 11 arranged on the base 1 is communicated with the side surface of the base 1, so that the first flexible circuit board 7 is convenient to place.
Referring to fig. 5, in an embodiment, the adhesion test fixture further includes a fixing member 5 disposed on the bottom wall of the recess 11, and the fixing member 5 is used for fixing the first flexible circuit board 7. The fixing member 5 may be a double-sided tape, so that the first flexible circuit board 7 may be reliably fixed on the bottom wall of the groove 11 to improve the reliability of the test result.
Furthermore, referring to fig. 5, the present invention also provides a bonding force testing device, wherein the bonding force testing device comprises the above-mentioned bonding force testing jig, and the testing clamp 6 corresponding to the opening 21, the testing clamp 6 is used for clamping the second flexible circuit board 8 exposed from the opening 21, and applying a pulling force perpendicular to the base 1 to the second flexible circuit board 8. Since the adhesion testing device adopts all technical solutions of the above embodiments, at least all beneficial effects brought by the technical solutions of the above embodiments are achieved, and are not described in detail herein.
The above is only the preferred embodiment of the present invention, and not the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings or the direct or indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. The utility model provides a bonding force test fixture, bonding force test fixture is used for the measurement of circuit board assembly bonding force, circuit board assembly includes first flexible circuit board, second flexible circuit board and bonds first flexible circuit board with the bonding glue of second flexible circuit board, its characterized in that, bonding force test fixture includes:
the flexible printed circuit board comprises a base, wherein a groove for placing a first flexible printed circuit board is formed in the base;
the pressing assembly is arranged on the base, part of the pressing assembly extends into the groove to press the first flexible circuit board, an opening used for exposing the second flexible circuit board is formed in the pressing assembly, and the opening is vertically communicated with the groove.
2. The bonding force test fixture according to claim 1, wherein the pressing assembly includes a first pressing member and a second pressing member that are disposed at an interval, the opening is formed at an interval between the first pressing member and the second pressing member, and the first pressing member and the second pressing member are respectively used for abutting against the first flexible circuit board on two opposite sides of the bonding adhesive.
3. The adhesion testing fixture according to claim 2, wherein the first pressing member includes a first mounting plate disposed on the base, and a first pressing plate extending from the first mounting plate into the groove in a direction close to the bottom wall of the groove, and a free end of the first pressing plate is configured to abut against the first flexible circuit board.
4. The adhesion test fixture according to claim 3, wherein a surface of the first pressing plate connected to the first mounting plate contacts with a side wall surface of the groove, a surface of the first pressing plate away from the first mounting plate is used for contacting with the adhesive and the second flexible circuit board, and a bottom of the first pressing plate is spaced from a bottom wall of the groove.
5. The bonding force testing jig according to claim 3, wherein the second pressing member includes a second mounting plate disposed on the base, a connecting plate connected to an edge of the second mounting plate close to the first mounting plate, and a second pressing plate extending from an end of the connecting plate close to the bottom wall of the groove to a direction away from the first mounting plate, the second pressing plate extends into the groove and is configured to abut against the first flexible circuit board, and the first pressing plate and the second pressing plate are configured to be disposed on opposite sides of the bonding adhesive.
6. The adhesion test fixture of claim 5, wherein the surface of the connection plate away from the second mounting plate is used for contacting the second flexible circuit board.
7. The adhesion test fixture of claim 5, wherein the first pressing member further comprises a first screw member connecting the first mounting plate and the base, and the second pressing member further comprises a second screw member connecting the second mounting plate and the base.
8. The adhesion test fixture according to any one of claims 1 to 7, wherein the base includes a top surface and a bottom surface that are opposite to each other, and a side surface that connects the top surface and the bottom surface, the top surface is recessed toward the bottom surface to form the groove, and a bottom wall of the groove is connected to the side surface.
9. The adhesion test fixture according to any one of claims 1 to 7, further comprising a fixing member disposed on the bottom wall of the groove, the fixing member being configured to fix the first flexible circuit board.
10. An adhesion testing device, characterized in that the adhesion testing device comprises the adhesion testing jig according to any one of claims 1 to 9, and a testing clip corresponding to the opening, wherein the testing clip is used for clamping the second flexible circuit board exposed from the opening and applying a pulling force perpendicular to the base to the second flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921488804.5U CN210604340U (en) | 2019-09-06 | 2019-09-06 | Bonding force test fixture and bonding force test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921488804.5U CN210604340U (en) | 2019-09-06 | 2019-09-06 | Bonding force test fixture and bonding force test device |
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| Publication Number | Publication Date |
|---|---|
| CN210604340U true CN210604340U (en) | 2020-05-22 |
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| CN201921488804.5U Active CN210604340U (en) | 2019-09-06 | 2019-09-06 | Bonding force test fixture and bonding force test device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113504116A (en) * | 2021-06-23 | 2021-10-15 | 淮安帝泰华懋精密科技有限公司 | Detection device and method for reinforced steel sheet of FPC (Flexible printed Circuit) |
| WO2023115243A1 (en) * | 2021-12-20 | 2023-06-29 | 深圳先进电子材料国际创新研究院 | Device and method for testing bonding strength of interlayer soft matter |
-
2019
- 2019-09-06 CN CN201921488804.5U patent/CN210604340U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113504116A (en) * | 2021-06-23 | 2021-10-15 | 淮安帝泰华懋精密科技有限公司 | Detection device and method for reinforced steel sheet of FPC (Flexible printed Circuit) |
| WO2023115243A1 (en) * | 2021-12-20 | 2023-06-29 | 深圳先进电子材料国际创新研究院 | Device and method for testing bonding strength of interlayer soft matter |
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