CN210578808U

CN210578808U - Mounting structure of miniature CMOS image sensor module

Info

Publication number: CN210578808U
Application number: CN201921648987.2U
Authority: CN
Inventors: 秦操; 程帅; 毛业云; 龙刚; 李文华; 胡学成
Original assignee: Youcare Technology Co Ltd (wuhan)
Current assignee: Youcare Technology Co Ltd (wuhan)
Priority date: 2019-09-29
Filing date: 2019-09-29
Publication date: 2020-05-19
Anticipated expiration: 2029-09-29

Abstract

The utility model discloses a mounting structure of miniature CMOS image sensor module, including the image sensor module, be equipped with on the image sensor module and be used for the module contact of the external output of image signal that the image sensor module was shot, its characterized in that: the image sensor module is characterized by further comprising a connector which is connected with the image sensor module and outputs the image signals to the outside, wherein the connector comprises a male connector and a female connector matched with the male connector, a module contact fixing hole matched with the module contact is formed in the male connector, the module contact is fixed in the module contact fixing hole in a welding mode, the module contact fixing hole is communicated with the female connector through a conductive structure, and the female connector is connected with a socket which can output the image signals to image display equipment. Through the structure of connector, switch on the module contact with the wire, increased the assembly qualification rate of endoscope.

Description

Mounting structure of miniature CMOS image sensor module

Technical Field

The utility model relates to an endoscope image processing equipment technical field specifically indicates a mounting structure of miniature CMOS image sensor module.

Background

With the development of semiconductor technology, the size of a CMOS image sensor is gradually reduced, the CMOS image sensor is generally used as an image sensor in an endoscope product, and is further applied to the front end of an endoscope, and with the development of disposable electronic uretero-renoscope by more and more manufacturers, the demand for a micro CMOS image sensor is increasing. Because the CMOS module is small in size and the wires connected to the rear end of the CMOS module are very small, the packaging process at the present stage generally adopts the steps that after a section of insulating layer is stripped on each of 4 wires only with hairline thickness, the wires are welded and connected with the module contacts under the observation of a microscope, and then glue is applied to fix the wires and the module. Because the lead is fine, the module body type is small, the contact surface of the lead and the CMOS module contact is small, and the area for fixing glue is small, the module is low in packaging efficiency and infirm in packaging, the situation that the module cannot work due to poor contact or short circuit of the lead often occurs, the lead of the module falls off due to slight carelessness during endoscope assembly, and the whole endoscope product is scrapped.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the above-mentioned background art not enough, provide one kind and can effectively guarantee CMOS module and wire intercommunication, guarantee the mounting structure of the miniature CMOS image sensor module of endoscope product assembly success rate.

For realizing this purpose, the utility model discloses a mounting structure of miniature CMOS image sensor module, including the image sensor module, be equipped with on the image sensor module and be used for the module contact of the external output of image signal that the image sensor module was shot, its characterized in that: the image sensor module is characterized by further comprising a connector which is connected with the image sensor module and outputs the image signals to the outside, wherein the connector comprises a male connector and a female connector matched with the male connector, a module contact fixing hole matched with the module contact is formed in the male connector, the module contact is fixed in the module contact fixing hole in a welding mode, the module contact fixing hole is communicated with the female connector through a conductive structure, and the female connector is connected with a socket which can output the image signals to image display equipment.

Further, the male joint includes male joint base and perpendicular fixed connection in male joint spliced pole on the male joint base, the female joint including set up with the female joint groove seat of male joint spliced pole complex spliced pole constant head tank, the module contact fixed orifices is seted up in on the male joint base, the female joint groove seat passes through the wire and connects the socket.

Furthermore, a wire connecting hole is formed in the female connector groove seat, a wire fixing support is fixed on the hole wall of the wire connecting hole, and the wire is fixed on the wire fixing support in a welding mode.

Further, electrically conductive structure including set up in on the surface of male joint, one end extends to the top of male joint spliced pole, the other end extend to male joint base surface the male joint conductive coating of module contact fixed orifices department with set up in the inboard surface of female joint, one end extend to the top of female joint groove seat, the other end extend to the female joint conductive coating of wire fixed bolster, the male joint conductive coating with the contact of female joint conductive coating.

Furthermore, the male joint base and the female joint groove seat are respectively provided with a joint positioning hole and a joint positioning column which are matched with each other.

The utility model has the advantages that: through the butt joint structure of the male and female connectors, the module contact of the CMOS image sensor module is conducted with the lead, and the assembly is convenient. Because the wire and female joint butt joint, consequently can increase the wire size and increase the area of contact of wire and female joint, the welding operation of the wire of also being convenient for simultaneously has improved the welding precision, has increased the encapsulated area of glue, has guaranteed the effective intercommunication of wire and module contact. The assembly qualification rate of the endoscope is greatly increased, the rejection rate of products is reduced, and the cost is reduced.

Drawings

Fig. 1 is a perspective view of an image sensor module according to the present invention;

fig. 2 is a perspective view of the male connector of the present invention;

fig. 3 is a front view of the male connector of the present invention;

fig. 4 is a bottom view of the male connector of the present invention;

fig. 5 is a top view of the male connector of the present invention;

fig. 6 is a perspective view of the female joint of the present invention;

fig. 7 is a front view of the female joint of the present invention;

fig. 8 is a top view of the female connector of the present invention;

fig. 9 is a bottom view of the female connector of the present invention;

FIG. 10 is a perspective view of the image sensor module of the present invention

Fig. 11 is a perspective view of the female connector and the socket of the present invention;

the module comprises an image sensor module, 2-module contacts, 3-male connectors (3.1-male connector base, 3.2-male connector connecting column), 4-female connectors (4.1-connecting column positioning groove, 4.2-female connector groove seat), 5-wires, 6-sockets, 7-module contact fixing holes, 8-wire connecting holes, 9-wire fixing supports, 10-male connector conductive coating, 11-female connector conductive coating, 12-connector positioning holes and 13-connector positioning columns.

Detailed Description

The present invention will be described in further detail with reference to the following drawings and specific embodiments.

The mounting structure of the micro CMOS image sensor module shown in fig. 1-11 comprises an image sensor module 1 and a connector connected with the image sensor module 1 for outputting image signals, wherein the image sensor module 1 is provided with a module contact 2 for outputting image signals shot by the image sensor module 1, the connector comprises a male connector 3 matched with the image sensor module 1 and a female connector 4 matched with the male connector 3, the male connector 3 comprises a male connector base 3.1 and a male connector connecting post 3.2 vertically and fixedly connected with the male connector base 3.1, the female connector 4 comprises a female connector slot base 4.2 provided with a connecting post positioning slot 4.1 matched with the male connector connecting post 3.2, the male connector base 3.1 is provided with a module contact fixing hole 7 matched with the module contact 2 and fixedly welded with the module contact 2, the female connector slot base 4.2 is internally provided with a wire connecting hole 8, and a wire fixing support 9 is fixed on the hole wall of the wire connecting hole 8, and the wire 5 is welded and fixed on the wire fixing support 9.

The outer surface of the male connector 3 is provided with a male connector conductive coating 10, one end of which extends to the top of the male connector connecting column 3.2, and the other end of which extends to the module contact fixing hole 7 on the surface of the male connector base 3.1, and the inner side surface of the female connector 4 is provided with a female connector conductive coating 11, one end of which extends to the top of the female connector groove seat 4.2, and the other end of which extends to the lead fixing bracket 9.

The male joint base 3.1 and the female joint groove seat 4.2 are respectively provided with a joint positioning hole 12 and a joint positioning column 13 which are matched with each other.

As shown in fig. 10 to 11, the mounting method of the micro CMOS image sensor module is: an insulating layer at one end of the lead 5 is stripped, one end of the lead 5 is welded and fixed on the lead fixing support 9, and one end of the lead 5 is packaged in the lead connecting hole 8 through glue. The male connector 3 or the image sensor module 1 is moved through the chip mounter, so that the signal input structure is matched with the module contact 2 and the module contact is welded and fixed. And the module contact 2 is welded and fixed in the module contact fixing hole 7, the male connector 3 and the female connector 4 are butted and fixed, so that the conductive coatings on the male connector 3 and the female connector 4 are contacted with each other, and the socket 6 is connected with the image display equipment.

The utility model discloses in, through the butt joint structure of public female joint, switch on CMOS image sensor module's module contact 2 and wire 5 through conductive coating, convenient assembling. Because wire 5 and female joint 4 butt joint, consequently can increase wire 5's size and increase wire 5 and female joint 4's area of contact, the welding operation of wire 5 of also being convenient for simultaneously has improved the welding precision, has increased the encapsulated area of glue, has guaranteed wire 5 and module contact 2's effective intercommunication.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the structure of the present invention in any way. Any simple modification, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention all still fall within the scope of the technical solution of the present invention.

Claims

1. The utility model provides a mounting structure of miniature CMOS image sensor module, includes image sensor module (1), be equipped with on image sensor module (1) and be used for the module contact (2) of the external output of image signal that image sensor module (1) shot, its characterized in that: it still include with image sensor module (1) is connected, will image signal is to the connector of external output, the connector include male joint (3) and with male joint (3) complex female joint (4), seted up on male joint (3) with module contact (2) complex module contact fixed orifices (7), module contact (2) welded fastening in module contact fixed orifices (7), module contact fixed orifices (7) with communicate through conducting structure between female joint (4), female joint (4) are connected with can with image signal output to image display equipment's socket (6).

2. The mounting structure of a micro CMOS image sensor module according to claim 1, wherein: male joint (3) including male joint base (3.1) and perpendicular fixed connection in male joint spliced pole (3.2) on male joint base (3.1), female joint (4) including set up with female joint groove seat (4.2) of male joint spliced pole (3.2) complex spliced pole constant head tank (4.1), module contact fixed orifices (7) are seted up in on male joint base (3.1), female joint groove seat (4.2) are connected through wire (5) socket (6).

3. The mounting structure of a micro CMOS image sensor module according to claim 2, wherein: a lead connecting hole (8) is formed in the female connector groove seat (4.2), a lead fixing support (9) is fixed on the hole wall of the lead connecting hole (8), and the lead (5) is fixed on the lead fixing support (9) in a welded mode.

4. A mounting structure of a micro CMOS image sensor module according to claim 3, wherein: conductive structure including set up in on the surface of male joint (3), one end extends to the top of male joint spliced pole (3.2), the other end extend to male joint base (3.1) surface male joint conductive coating (10) of module contact fixed orifices (7) department with set up in the inboard surface of female joint (4), one end extend to the top of female joint groove seat (4.2), the other end extend to the female joint conductive coating (11) of wire fixed bolster (9), male joint conductive coating (10) with female joint conductive coating (11) contact.

5. The mounting structure of a micro CMOS image sensor module according to claim 2, wherein: and the male joint base (3.1) and the female joint groove seat (4.2) are respectively provided with a joint positioning hole (12) and a joint positioning column (13) which are matched with each other.