CN101312266A

CN101312266A - Wire clamper

Info

Publication number: CN101312266A
Application number: CNA2007101075471A
Authority: CN
Inventors: 张木财; 郑定群; 陈富明
Original assignee: Asustek Computer Inc
Current assignee: Asustek Computer Inc
Priority date: 2007-05-21
Filing date: 2007-05-21
Publication date: 2008-11-26

Abstract

Disclosed is a wire clamper, which is adaptable to retaining a plurality of wires extending from an electrical element. The wire clamper comprises a body and a plurality of limit projections integrated with the body, wherein the body is equipped with a plurality of concave holes, the limit projections are correspondingly arranged on the inner wall of the concave holes. When wires penetrate the concave holes, the limit projections can effectively limit dislocation of the wires.

Description

Wire clamper

Technical field

The invention relates to a kind of clamper, and particularly relevant for a kind of wire clamper in order to the fixing lead.

Background technology

General electronic product inside can set multiple electronic component, and can interconnect to transmit electric signal by lead usually between electronic component.Whether wherein, whether the excellent electrical property quality of connection is arranged between lead and electronic component, will be related to electronic product can normal operation.Fig. 1 promptly is depicted as the schematic diagram of known a kind of electronic product.Please refer to Fig. 1, in electronic product 100, the lead 112 of electronic component 110 is to be arranged in advance in the conductive hole 122 of wiring board 120, utilize the welding processing procedure that the end of a thread 112a of lead 112 and conductive hole 122 are electrically connected again, and then reach the purpose of electronic component 110 and wiring board 120 electric connections.

Yet, welding processing procedure so that lead 112 is welded in wiring board 120, part lead 112 ' no longer is arranged in the conductive hole 122 because of stressed bending causes the end of a thread 112a ' easily, cause between wiring board 120 and lead 112 ' situation of free weldering to take place, and then cause the electric connection quality of 120 of electronic component 110 and wiring boards not good.Thus, 120 of electronic component 110 and wiring boards promptly can't transmit electric signal effectively, and electronic product 100 also can't normal operation.

Please refer to Fig. 2, it is depicted as the schematic diagram of known another kind of electronic product.Please refer to Fig. 2, in electronic product 200, extension is to be integrated in the joint 214 from the lead 212 of electronic component 210, then be provided with a socket 222 of planting for joint 214 on the wiring board 220, and the user only needs joint 214 is inserted in electronic component 210 and wiring board 220 are electrically connected.Yet, additionally in electronic product 200, set up joint 214 and will cause the cost of electronic product 200 to increase with socket 222.In addition, the electrical connection that joint 214 and socket are 222 also takes place because of the plug number of times too frequently has the situation of loose contact easily, causes the electric connection quality of 220 of electronic component 210 and wiring boards not good.

Therefore, the electric connection quality of how taking into account between cost of manufacture and lead and wiring board is an important topic.

Summary of the invention

The invention provides a kind of wire clamper, it can solve and electrically connect the not good problem of quality between lead and wiring board.

The invention provides a kind of wire clamper, it has lower cost of manufacture.

The present invention proposes a kind of wire clamper, and it is suitable for fixing from an electronic component plurality of wires extending.Wire clamper comprises a body and a plurality of and integrated spacing preiection of body.Wherein, body has a plurality of shrinkage pools, and spacing preiection then is to be equipped on the shrinkage pool inwall.In the present invention, when lead wore shrinkage pool, spacing preiection can limit the displacement of lead effectively.

In one embodiment of this invention, shrinkage pool is positioned at the spacing preiection place and has an aperture, and it is less than the line footpath of lead.

In one embodiment of this invention, wire clamper is to be fixed on the wiring board.

In one embodiment of this invention, wire clamper is that (SurfaceMounting Technology SMT) is fixed on the wiring board with the surface soldered technology.

In one embodiment of this invention, wiring board is for having a plurality of conductive holes, and the corresponding formation of a plurality of shrinkage pools of these conductive holes and wire clamper.

In the present invention, be provided with a plurality of spacing preiections in the shrinkage pool of body, therefore when the lead of electronic component was arranged in shrinkage pool, spacing preiection can limit the displacement of lead effectively.Thus, wire clamper clamping lead firmly.

For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.

Description of drawings

Figure 1 shows that the schematic diagram of known a kind of electronic product.

Figure 2 shows that the schematic diagram of known another kind of electronic product.

Fig. 3 A is depicted as the stereogram of the wire clamper of one embodiment of the invention.

Fig. 3 B is depicted as the top view of the wire clamper of Fig. 3 A.

Fig. 3 C is depicted as the cutaway view of the wire clamper of Fig. 3 B along I-I ' line.

The lead that Figure 4 shows that an electronic component is assisted schematic diagram to electrically connect with a wiring board by wire clamper of the present invention.

Embodiment

Fig. 3 A is depicted as the stereogram of the wire clamper of one embodiment of the invention, and Fig. 3 B is depicted as the top view of the wire clamper of Fig. 3 A, and Fig. 3 C is depicted as the cutaway view of the wire clamper of Fig. 3 A along I-I ' line.Please also refer to Fig. 3 A, Fig. 3 B and Fig. 3 C, the wire clamper 300 of present embodiment for example is produced via ejection forming technique, and wire clamper 300 mainly is made up of a body 310 and a plurality of and body 310 integrated spacing preiections 320.In the present embodiment, body 310 has a plurality of shrinkage pools 312, and spacing preiection 320 is to be positioned at shrinkage pool 312 inwalls, is arranged in lead in the shrinkage pool 312 with clamping effectively.About the clamping relation of 300 of lead and wire clampers, present embodiment will be in hereinafter elaborating.

Fig. 4 promptly is depicted as the lead of an electronic component, the schematic diagram that electrically connects with a wiring board under the wire clamper of Fig. 3 A is auxiliary.Please refer to Fig. 4, the many leads 410 of an electronic component 400 are to be arranged in the shrinkage pool 312 of wire clamper 300, and a plurality of spacing preiections 320 that are equipped on shrinkage pool 312 inwalls can limit the displacement of lead 410 effectively.In more detail, in the present embodiment, the aperture D1 that shrinkage pool 312 is positioned at spacing preiection 320 places is the line footpath D2 less than lead 410.Therefore, being arranged in lead 410 in the shrinkage pool 312 can be subjected to the restriction of aperture D1 and be held in the shrinkage pool 312.From the above, since the wire clamper 300 of present embodiment effectively fixing from electronic component 400 extended leads 410, therefore in the process that electrically connects lead 410 and wiring board 500, the end of a thread 412 of lead 410 can firmly be arranged in the conductive hole 510 of wiring board 500 (conductive hole 510 for example is a plurality of shrinkage pools 312 corresponding wiring boards 500 that are formed at wire clamper 300) by the auxiliary of wire clamper 300, and is not vulnerable to the external force influence.Thus, welding processing procedure with after conductive hole 510 and 410 formation soldered balls 600 of lead, 510 of the end of a thread 412 and conductive holes promptly have good electrical connection, and 500 of electronic component 400 and wiring boards also have the excellent electrical property quality of connection.In the present embodiment, it for example is that the mode of surface soldered technology fixes on wiring board 500 that wire clamper 300 can utilize, with convenient follow-up electric connection operation.

In addition, in the present embodiment,, be arranged in lead 410 in the shrinkage pool 312 with clamping effectively though each shrinkage pool 312 of wire clamper 300 is provided with two corresponding spacing preiections 320.Yet in other embodiments, each shrinkage pool 312 also can only be provided with a spacing preiection 320, and the present invention does not impose any restrictions at this.Specifically, all formation and body 310 integrated spacing preiections 320 in shrinkage pool 312, and the wire clamper 300 that utilizes spacing preiection 320 to limit lead 410 displacements all belongs to spirit of the present invention and category.

In sum, the present invention is provided with and the integrated spacing preiection of body in shrinkage pool, to limit the displacement of lead effectively.Therefore, in the welding processing procedure, wire clamper of the present invention is the lead of fixing electronic component effectively, makes lead firmly to be arranged in the conductive hole, in order to the carrying out of welding processing procedure.Thus, preferable electric connection quality is promptly arranged between lead and wiring board.

In addition, because wire clamper of the present invention is an one-body molded member, therefore need set up one simultaneously in order to integrating the joint of lead compared to known technology, and one be equipped on the socket that plugs for joint on the wiring board, wire clamper of the present invention has lower cost of manufacture.

Though the present invention discloses as above with preferred embodiment; right its is not in order to limiting the present invention, anyly has the knack of this skill person, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.

Claims

1. a wire clamper is suitable for fixing from an electronic component plurality of wires extending, it is characterized in that above-mentioned wire clamper comprises:

One body have a plurality of shrinkage pools, and above-mentioned these leads is suitable for wearing above-mentioned these shrinkage pools; And

A plurality of spacing preiections are equipped on above-mentioned these shrinkage pool inwalls, to limit the displacement of above-mentioned lead, wherein above-mentioned these spacing preiections and this above-mentioned body by integral forming.

2 wire clampers according to claim 1 is characterized in that wherein each above-mentioned shrinkage pool is positioned at above-mentioned spacing preiection place and has an aperture, and it is less than the line footpath of above-mentioned lead.

3 wire clampers according to claim 1 is characterized in that it is fixed on the wiring board.

4 wire clampers according to claim 3 is characterized in that it is fixed on the wiring board with the surface soldered technology.

5 wire clampers according to claim 3 is characterized in that wherein above-mentioned wiring board for having a plurality of conductive holes, and the corresponding formation of above-mentioned these shrinkage pools of above-mentioned these conductive holes and above-mentioned wire clamper.