CN210575879U

CN210575879U - Quick feeding structure of packaging mold

Info

Publication number: CN210575879U
Application number: CN201921404436.1U
Authority: CN
Inventors: 童华
Original assignee: Donghe Semiconductor Equipment (nantong) Co Ltd
Current assignee: Donghe Semiconductor Equipment (nantong) Co Ltd
Priority date: 2019-08-28
Filing date: 2019-08-28
Publication date: 2020-05-19
Anticipated expiration: 2029-08-28

Abstract

The utility model discloses a quick feeding structure of packaging mold, the on-line screen storage device comprises a base, the equal fixedly connected with extension board in both ends of base, there is the die holder at the middle part of base through bolt fixed mounting, fixedly connected with roof between the top of extension board, the inside of die holder is equipped with the semiconductor chip body. The device inserts the feed inlet to the feeding branch pipe, the separation blade subassembly bends downwards under the elastic action of sheet rubber, alternate segregation between the magnetite piece, strutted by the feeding branch pipe promptly, inject into encapsulated raw materials can, annotate and take out the feeding branch pipe after the material is accomplished, realize the sealed to the feed inlet, the emergence that the raw materials spills over the phenomenon has effectively been avoided, the cleanness of feed inlet has been guaranteed, efficiency and the quality of moulding plastics have effectively been guaranteed, and be responsible for through the feeding, the mating reaction of feeding branch pipe and feed inlet, the encapsulation material loading work of a plurality of semiconductor chip bodies once only carries out, the material loading is fast, thereby packaging efficiency has been improved greatly.

Description

Quick feeding structure of packaging mold

Technical Field

The utility model belongs to the technical field of the semiconductor, concretely relates to packaging mold's quick feed structure.

Background

At present, in the field of semiconductor packaging, an injection molding process mainly comprises three steps, namely, firstly, a packaging substrate with a chip attached is placed in a lower mold cavity, and a plastic packaging material is placed in the lower mold cavity; closing the upper die, heating the die, melting the plastic packaging material by heating, and injecting the melted plastic packaging material into the die cavity to wrap the chip on the packaging substrate under the pushing of the injector; and finally, cooling and solidifying the plastic packaging material and completely combining the plastic packaging material with the packaging substrate to protect the chip. The existing packaging mold is generally provided with a plurality of mold cavities and injection molding ports for loading work in order to improve the packaging efficiency, the loading speed is improved, but the existing rapid loading structure is adopted, when the injection molding pipe is extracted after injection molding is completed, the raw material of the injection molding port is easy to overflow, the injection molding port is troublesome to clean, trouble and labor are wasted, the follow-up work is influenced, if the injection molding pipe is not extracted in time, the overflowing raw material is easy to bond the injection molding pipe, and the work efficiency and the packaging quality are greatly influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a packaging mold's quick material loading structure to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a quick feeding structure of packaging mold, includes the base, the equal fixedly connected with extension board in both ends of base, there is the die holder at the middle part of base through bolt fixed mounting, fixedly connected with roof between the top of extension board, the equal fixedly connected with telescopic cylinder in both ends of roof, telescopic cylinder's output runs through to the bottom fixedly connected with apron of roof, the both ends and the extension board sliding connection of apron, the middle part of apron is equipped with the feeding and is responsible for, fixedly connected with feeding branch pipe on the lateral wall that the feeding was responsible for, the tip of feeding branch pipe is pegged graft and is fixed to the die holder on, be equipped with the feed inlet on the die holder, fixedly connected with separation blade subassembly on the feed inlet, the separation blade subassembly includes the sheet rubber, separation blade subassembly and feeding branch pipe sliding connection, the inside of die holder.

Preferably, a die cavity is formed in the die holder, the conductor chip body is placed on the die cavity, and the die cavity is at least provided with four parts, and the upper ends of the four parts are correspondingly communicated with the feed inlet.

The device is convenient for injecting and packaging the semiconductor chip body and convenient to operate.

Preferably, at least four notch grooves are formed in the rubber sheet, the notch grooves are uniformly distributed in an annular array, the groove walls of the notch grooves are fixedly connected with magnet sheets, and the magnet sheets are mutually adsorbed and fixed.

This setting is when encapsulating the during operation, and under the elastic action of sheet rubber, the feeding branch pipe of being convenient for struts the separation blade subassembly and carries out injection molding work, and the back is accomplished in moulding plastics, makes the sheet rubber reset when taking out the feeding branch pipe to make the separation blade subassembly realize the sealed to the feed inlet, avoid the raw materials to spill over the emergence of phenomenon, guaranteed the cleanness of feed inlet, effectively guaranteed injection molding efficiency and quality, thereby improved encapsulation work efficiency.

Preferably, the upper end face and the lower end face of the baffle plate assembly are fixedly connected with fixed sliding blocks, the fixed sliding blocks and the notch grooves are distributed in a staggered mode, and the fixed sliding blocks are connected with the feeding branch pipes in a sliding mode.

This setting has effectively strengthened the bearing structure intensity of sheet rubber, and the steadiness is high to the pull of the feeding branch pipe of being convenient for removes, and stability is high, and the extraction removes convenient operation.

Preferably, the feeding branch pipes are at least four and are uniformly distributed on the feeding main pipe in an annular array.

This setting is convenient for once only encapsulate four at least semiconductor chip bodies simultaneously, has effectively improved material loading speed to work efficiency has been improved greatly.

Preferably, guide grooves are formed in two ends of the cover plate and are connected with the support plate in a matched mode.

This setting has effectively improved the stability of connection structure between apron and the extension board, and during the compound die for the apron removes stably, and feeding location is accurate, thereby has effectively guaranteed encapsulation quality.

Compared with the prior art, the utility model discloses a technological effect and advantage: this packaging mold's quick material loading structure, insert the feed inlet that corresponds in the branch pipe synchronous, the separation blade subassembly bends downwards under the elastic action of sheet rubber this moment, alternate segregation between the magnetite piece, be strutted by the feed branch pipe promptly, then toward the feed person in charge pour into encapsulation raw materials can, annotate take out the feed branch pipe after the material is accomplished, reset and adsorb each other between the magnetite piece between the sheet rubber this moment, thereby realize the sealed to the feed inlet, the emergence of raw materials overflow phenomenon has effectively been avoided, the cleanness of feed inlet has been guaranteed, injection molding efficiency and quality have effectively been guaranteed, and be responsible for through the feed, the mating reaction of feed branch pipe and feed inlet, the encapsulation material loading work of once only carrying out a plurality of semiconductor chip bodies, the material loading is fast, thereby packaging efficiency has been improved greatly.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic top view of the cover plate of the present invention;

FIG. 3 is a schematic view of the internal structure of the mold base of the present invention;

fig. 4 is a schematic view of the feed inlet of the present invention.

In the figure: 1. a base; 2. a support plate; 3. a top plate; 4. a cover plate; 401. a guide groove; 402. a feed inlet; 5. a die holder; 501. a semiconductor chip body; 502. a mold cavity; 6. a feeding main pipe; 601. a feed branch pipe; 7. a flap assembly; 701. a rubber sheet; 702. fixing the sliding block; 703. a notch groove; 704. a magnet sheet; 8. a telescopic cylinder.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-4, a fast loading structure of an encapsulation mold comprises a base 1, wherein both ends of the base 1 are fixedly connected with support plates 2, a mold base 5 is fixedly installed in the middle of the base 1 through bolts, a top plate 3 is fixedly connected between the tops of the support plates 2, both ends of the top plate 3 are fixedly connected with telescopic cylinders 8, the output ends of the telescopic cylinders 8 penetrate through the bottom of the top plate 3 and are fixedly connected with a cover plate 4, both ends of the cover plate 4 are slidably connected with the support plates 2, a feeding main pipe 6 is arranged in the middle of the cover plate 4, a feeding branch pipe 601 is fixedly connected to the side wall of the feeding main pipe 6, the end of the feeding branch pipe 601 is inserted and fixed to the mold base 5, a feeding port 402 is arranged on the mold base 5, a baffle assembly 7 is fixedly connected to the feeding port 402, and the, the baffle plate assembly 7 is slidably connected with the feeding branch pipe 601, and a semiconductor chip body 501 is arranged inside the die holder 5.

A die cavity 502 is arranged in the die holder 5, a conductor chip body is placed on the die cavity 502, at least four die cavities 502 are arranged, and the upper ends of the die cavities 502 are correspondingly communicated with the feed inlets 402; the semiconductor chip body 501 is convenient to inject and package, and operation is convenient.

The rubber sheet 701 is at least provided with four opening grooves 703, the opening grooves 703 are uniformly distributed in an annular array, the groove walls of the opening grooves 703 are fixedly connected with magnet sheets 704, and the magnet sheets 704 are mutually adsorbed and fixed; when encapsulating the during operation, under the elastic action of sheet rubber 701, the feeding branch pipe 601 of being convenient for struts separation blade subassembly 7 and carries out the work of moulding plastics, and the back of accomplishing of moulding plastics makes sheet rubber 701 reset when taking out feeding branch pipe 601 to make separation blade subassembly 7 realize the sealed to feed inlet 402, avoid the raw materials to spill over the emergence of phenomenon, guaranteed the cleanness of feed inlet 402, effectively guaranteed injection molding efficiency and quality, thereby improved encapsulation work efficiency.

The upper end face and the lower end face of the baffle plate component 7 are fixedly connected with fixed sliding blocks 702, the fixed sliding blocks 702 and the notch grooves 703 are distributed in a staggered mode, and the fixed sliding blocks 702 are connected with the feeding branch pipes 601 in a sliding mode; the bearing structure intensity of sheet rubber 701 has effectively been strengthened, and the steadiness is high to the pull of the feeding branch pipe 601 of being convenient for removes, and stability is high, and the extraction removes convenient operation.

The feeding branch pipes 601 are at least four and are uniformly distributed on the feeding main pipe 6 in an annular array; at least four semiconductor chip bodies 501 can be packaged simultaneously at one time, the feeding speed is effectively improved, and therefore the working efficiency is greatly improved.

Guide grooves 401 are formed in two ends of the cover plate 4, and the guide grooves 401 are connected with the support plates 2 in a matched mode; effectively improved the stability of connection structure between apron 4 and the extension board 2, during the compound die for apron 4 removes stably, and feeding location is accurate, thereby has effectively guaranteed encapsulation quality.

Specifically, when in use, the telescopic cylinder 8 is electrically connected with a power supply of a workshop, the telescopic cylinder 8 is started to drive the cover plate 4 and the die holder 5 to carry out die assembly work, then the feeding branch pipe 601 is synchronously inserted into the corresponding feeding hole 402, at the moment, the baffle plate component 7 is bent downwards under the elastic action of the rubber sheets 701, the magnet sheets 704 are separated from each other, namely, the baffle plate component is propped open by the feeding branch pipe 601, then the packaging raw material is injected into the feeding main pipe 6, the feeding branch pipe 601 is taken out after the injection is finished, at the moment, the rubber sheets 701 are reset and the magnet sheets 704 are mutually adsorbed, so that the sealing of the feeding hole 402 is realized, the phenomenon of raw material overflow is effectively avoided, the cleanness of the feeding hole 402 is ensured, the injection molding efficiency and quality are effectively ensured, and the packaging and feeding work of a plurality of semiconductor chip bodies 501 is carried out at one time through the matching action of, the feeding speed is high, so that the packaging efficiency is greatly improved.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a quick feeding structure of packaging mold, includes base (1), its characterized in that: the improved feeding device is characterized in that support plates (2) are fixedly connected to the two ends of the base (1), a die holder (5) is fixedly mounted in the middle of the base (1) through bolts, a top plate (3) is fixedly connected between the tops of the support plates (2), telescopic cylinders (8) are fixedly connected to the two ends of the top plate (3), an output end of each telescopic cylinder (8) penetrates through a cover plate (4) fixedly connected to the bottom of the top plate (3), the two ends of each cover plate (4) are slidably connected with the support plates (2), a feeding main pipe (6) is arranged in the middle of each cover plate (4), a feeding branch pipe (601) is fixedly connected to the side wall of each feeding main pipe (6), the end portion of each feeding branch pipe (601) is fixedly connected to the die holder (5) in an inserting mode, a feeding blocking piece (402) is arranged on the die holder (, the separation blade component (7) comprises a rubber sheet (701), the separation blade component (7) is in sliding connection with the feeding branch pipe (601), and a semiconductor chip body (501) is arranged inside the die holder (5).

2. The rapid loading structure of the packaging mold as claimed in claim 1, wherein: the conductor chip die is characterized in that a die cavity (502) is arranged inside the die holder (5), the conductor chip body is placed on the die cavity (502), at least four die cavities (502) are arranged, and the upper ends of the four die cavities are correspondingly communicated with the feed inlet (402).

3. The rapid loading structure of the packaging mold as claimed in claim 1, wherein: the rubber sheet (701) is at least provided with four opening grooves (703), the opening grooves (703) are uniformly distributed in an annular array, the groove walls of the opening grooves (703) are fixedly connected with magnet sheets (704), and the magnet sheets (704) are mutually adsorbed and fixed.

4. The rapid loading structure of the packaging mold as claimed in claim 1, wherein: the upper end face and the lower end face of the baffle plate component (7) are fixedly connected with fixed sliding blocks (702), the fixed sliding blocks (702) and the notch grooves (703) are distributed in a staggered mode, and the fixed sliding blocks (702) are connected with the feeding branch pipes (601) in a sliding mode.

5. The rapid loading structure of the packaging mold as claimed in claim 1, wherein: the feeding branch pipes (601) are at least provided with four and are uniformly distributed on the feeding main pipe (6) in an annular array.

6. The rapid loading structure of the packaging mold as claimed in claim 1, wherein: guide grooves (401) are formed in two ends of the cover plate (4), and the guide grooves (401) are connected with the support plates (2) in a matched mode.