CN210548829U - Double-station laser processing device - Google Patents
Double-station laser processing device Download PDFInfo
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- CN210548829U CN210548829U CN201920541182.1U CN201920541182U CN210548829U CN 210548829 U CN210548829 U CN 210548829U CN 201920541182 U CN201920541182 U CN 201920541182U CN 210548829 U CN210548829 U CN 210548829U
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Abstract
The application discloses duplex position laser beam machining device includes: the device comprises a device base, a lifting body, a laser system, a double-station rotating assembly, a jig mounting hole, a safety grating, a photoelectric button and a laser protective cover; the lifting body is arranged on the device base, the laser system is arranged at the upper end of the lifting body, the double-station rotating assembly is arranged on the device base, the jig mounting holes are symmetrically distributed in semi-circles on two sides of the double-station rotating assembly respectively, the two photoelectric buttons are arranged on the edge of one side of the device base respectively and on the left side and the right side of the feeding and discharging jig mounting holes, the safety grating is distributed on the boundary where the feeding and discharging jig mounting holes rotate to enter a laser working area, and the laser protective cover covers the lifting body and the laser system. The embodiment of the utility model provides a pair of duplex position laser beam machining device compact structure is simple, and laser work efficiency is high, and the operation security is reliable.
Description
Technical Field
The application relates to the field of laser processing, in particular to a double-station laser processing device.
Background
In the industrial field, laser processing is widely used as an advanced manufacturing technology, and laser processing equipment is rapidly developed, plays a very important role in the processing field, and has various advantages compared with the traditional processing field.
At present, the general laser processing device equipment is huge, especially the size of rack is great, and is with high costs, and this kind of structure has some problems in laser cleaning working process:
1. in the traditional laser processing working process, the laser system device is large in size and large in occupied area, field planning of a plurality of factories cannot be met, operation flexibility is low, and laser processing accuracy is low.
2. Traditional laser beam machining device installation protection is not comprehensive, leads to operating personnel to have the danger of incident in the production process.
SUMMERY OF THE UTILITY MODEL
The application aims to provide a double-station laser processing device which can solve the problems of large volume, large occupied area and safety accidents in the working process of operators of the existing laser processing equipment.
In order to solve the technical problem, the utility model discloses a technical scheme be: provided is a double-station laser processing device, including: the device comprises a device base, a lifting body, a laser system, a double-station rotating assembly, a jig mounting hole, a safety grating, a photoelectric button and a laser protective cover;
the lifting body is arranged on the device base, the laser system is arranged at the upper end of the lifting body, the double-station rotating assembly is arranged on the device base, the jig mounting holes are symmetrically arranged inside the semicircular discs on two sides of the double-station rotating assembly respectively, the photoelectric buttons are arranged on the edge of one side of the device base respectively and on the left side and the right side of the jig mounting holes, the safety gratings are distributed on the boundary of the jig mounting holes, which enters the laser working area in a rotating mode, and the lifting body and the laser system are provided with the laser protective cover.
Optionally, the surface of the device base is provided with a plurality of mounting hole sites, and the mounting hole sites are fixed right above the laser processing device to support the whole device and ensure the stability of the device.
Optionally, the bottom of the lower end of the lifting body is fixedly mounted on the device base, the upper end of the lifting body is fixedly connected with the laser system, the laser system can move up and down on the lifting body, and the lifting body and the laser system are provided with the laser protection cover, so that an operator is effectively protected from laser radiation; the lifting body ensures that the surface to be processed of the product is within the focal depth range of the laser system, and the laser system can effectively process the product by laser.
Optionally, the double-station rotating assembly is installed above the device base and is of a disc structure, the upper surface of the double-station rotating assembly is provided with a plurality of installation hole positions, the jig installation holes are respectively fixedly embedded in the semicircular discs on the two sides of the device base in a nested mode and drive the jig installation holes to rotate along the circle center, rotary switching of product stations is achieved, and optimal production efficiency is achieved.
Optionally, the safety grating is installed above the double-station rotating assembly and at the edge of the laser working area where the jig installation hole enters, the left photoelectric button and the right photoelectric button are installed on the left side and the right side, the working state of the laser processing device is controlled, and finger misoperation of an operator is effectively prevented from entering the double-station rotating area.
Optionally, the laser system includes a laser, a laser mounting plate, a laser fixing plate, a refraction cavity support, a light path shaping light cavity, a red light preview module, and a vibration lens.
One end of the laser is connected with the refraction cavity and the refraction cavity supporting seat, the other end of the refraction cavity is connected with the light path shaping light cavity, the other end of the light path shaping light cavity is connected with the red light preview module, and the other side of the red light preview module is connected with the vibration lens.
Optionally, one surface of the laser mounting plate is connected to the laser system, and the other surface of the laser mounting plate is connected to the lifting body, and is used for bearing the laser system and connecting the lifting body.
Optionally, the laser fixing plate is disposed on the laser, and one end of the laser is connected to the refraction cavity.
Optionally, one end of the refraction cavity supporting seat is connected to the laser mounting plate, and the other end of the refraction cavity supporting seat is connected to one side of the refraction cavity close to the laser, and is used for fixing and supporting the refraction cavity; the refraction cavity is used for changing the transmission direction of the laser and adjusting collimation.
Optionally, one end of the vibration lens is connected with the red light preview module, the other end of the red light preview module is connected with the light path shaping optical cavity, and the other end of the light path shaping optical cavity is connected with the light folding cavity, so that an operator can conveniently preview a laser line and control the whole laser system to perform high-precision high-speed scanning processing.
Compared with the prior art, the beneficial effects of the utility model are that:
1. by the arrangement of the foldable light path of the laser system, the length of the cabinet is shortened by 180mm, and the volume of the laser system is greatly reduced; the light folding cavity, the light path shaping cavity, the red light preview module and the vibration lens are connected, so that a laser processing path is effectively previewed, and the flexibility, accuracy and effectiveness of laser processing are improved.
2. The working state of the laser system is controlled in real time by matching the safety grating and the photoelectric button, so that the safety of operators is effectively protected; meanwhile, a laser protection cover is additionally arranged outside the laser system, so that the situation that an operator is irradiated by laser is effectively avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the structures shown in the drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a double-station laser processing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the laser protective cover of the embodiment of FIG. 1;
FIG. 3 is a schematic diagram of the laser system of the embodiment of FIG. 1;
reference numerals: 1-a device base; 2-a lifting body; 3-a laser system; 4-a double-station rotating assembly; 5-mounting a jig in a hole; 6-safety grating; 7-photoelectric button; 8-laser protection cover; 31-a laser; 32-a laser mounting plate; 33-laser fixation plate; 34-refractive cavity; 35-refractive cavity support base; 36-optical path shaping optical cavity; 37-red preview module; 38-galvanometer lens.
The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. If in the embodiments of the present application there is a description referring to "first", "second", etc., the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
In order to make the technical solutions of the present application better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
The laser processing device has the advantages that in the device processing process, due to the large size and the large occupied area, the layout of a factory site is not planned, meanwhile, laser in the laser processing process has radiation hazard to people, and the operation process also has the danger of safety accidents. In order to reduce the area of a laser device and protect the safety of operators, the application provides the double-station laser processing device, the double-station laser processing device not only reduces the size and the area of a laser system, but also can prevent laser radiation damage and misoperation accidents, and therefore the applicability and the safety protection of the laser processing device are improved.
The main technical scheme adopted by the application is as follows: a double-station laser processing apparatus comprising: the device comprises a device base, a lifting body, a laser system, a double-station rotating assembly, a jig mounting hole, a safety grating, a photoelectric button and a laser protective cover;
the utility model discloses a laser safety device, including device base, lifting body, laser system, duplex position rotating assembly, tool installation cave, safety grating, the lifting body is settled on the device base, laser system installs lifting body upper end, duplex position rotating assembly installs on the device base, tool installation cave symmetric distribution respectively is in inside the both sides semicircle dish of duplex position rotating assembly, two photoelectric button installs respectively the edge on one side of device base and the both sides about at last unloading tool installation cave, safety grating distributes tool installation cave rotatory entering laser work area's border, the lifting body with laser system is provided with the laser protection casing.
In this application technical scheme, duplex position rotating assembly is a disc subassembly, adopts the direct drive motor mode duplex position rotating assembly wherein a diameter is the central line and divides into both sides into half, inlays respectively on both sides tool installation cave, tool installation cave on one side are carrying out laser beam machining during operation, and the tool installation cave on the other side can go on unloading operation.
Referring to fig. 1 to 3, fig. 1 is a schematic perspective view of a double-station laser processing apparatus according to an embodiment of the present disclosure, fig. 2 is a schematic perspective view of an appearance of fig. 1, and fig. 3 is a schematic partial structural view of fig. 1.
Specifically, as shown in fig. 1 to 2, the flexible projectile launching device of the present embodiment includes: the device comprises a device base 1, a lifting body 2, a laser system 3, a double-station rotating assembly 4, a jig mounting hole 5, a safety grating 6, a photoelectric button 7 and a laser protective cover 8.
With continued reference to fig. 3, the laser system 3 includes a laser 31, a laser mounting plate 32, a laser fixing plate 33, a refraction cavity 34, a refraction cavity support 35, a light path shaping light cavity 36, a red light preview module 37, and a vibrating lens 38.
In the specific operation process, debugging work of the laser processing device is firstly carried out, two sets of jigs are installed in the jig installation holes 5, products to be processed by laser are put in, when the double-station rotating assembly 4 rotates to drive the products to rotate within the laser processing range, the height of the lifting body 2 is adjusted, the surfaces to be processed of the products are located within the focal depth range of laser, and the effect is adjusted, so that the laser processing of the products is realized; after the machine is debugged, the operator puts the product to be processed into the jig mounting hole, and the photoelectric button 7 and the rotary driving mechanism are started to rotate to switch the station.
In this application, photoelectric button 7 is the sensitive contact photoelectric button of high accuracy, and the operator just can start the work of duplex position rotating assembly 4 when touching the response region with both hands simultaneously, drives and treats that the processing product moves to the laser below.
In the application, the installation grating 6 is of a finger level type, the optical axis distance is 10mm, the minimum detection object is 14mm, and fingers of an operator can be effectively protected from entering a double-station rotating area due to misoperation.
In this application, every door of laser protection casing 8 is furnished with the safety sensor, and when the door was opened, laser system stopped the light-emitting, and duplex position rotary mechanism stop motion realizes the effect of protection operating personnel safety.
In this embodiment, in laser system 3 carries out laser beam machining working process to the product in tool installation cave 5, operating personnel is right the unloading and the material loading operation of product are processed to another tool installation cave 5 station of duplex position rotating assembly 4, and after the regional product processing of laser beam machining was accomplished, operating personnel both hands start photoelectric button 7, and tool installation cave 5 after will reloading is rotated and is carried out laser beam machining to laser system 3 below to realize duplex position laser beam machining effect, make machining efficiency obviously improve.
Of course, in another embodiment, the foldable optical path arrangement of the laser system effectively reduces the size of the cabinet and the floor space of the machine in the factory, thereby achieving the effect of saving cost.
In the application, through laser 31 produces laser, and laser passes through refraction chamber 34, light path plastic chamber 36, ruddiness preview module 37, shake lens 38 and focus lens, realize the accurate laser beam machining to the product.
Particularly, the beam-folding cavity 34 is used for changing the transmission direction of laser and adjusting collimation, the optical path shaping cavity 36 can be provided with optical elements such as a beam expander, a beam splitter and the like in the cavity according to the requirement of the optical path, and the red light preview module 37 is used for previewing the laser processing path and processing the surface of a product to be processed in the form of visible red light, so that the real-time monitoring of an operator is facilitated, and the accuracy and effectiveness of the laser processing of the product are improved.
The above embodiments are preferred embodiments of the present application, but the present application is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present application should be construed as equivalents and are included in the scope of the present application.
Claims (10)
1. A double-station laser processing device is characterized by comprising: the device comprises a device base (1), a lifting body (2), a laser system (3), a double-station rotating assembly (4), a jig mounting hole (5), a safety grating (6), a photoelectric button (7) and a laser protective cover (8);
wherein, the body (2) that goes up and down is settled on device base (1), laser system (3) are installed in the body (2) upper end that goes up and down, duplex position rotating assembly (4) are installed on device base (1), tool installation cave (5) symmetric distribution is inside the both sides semicircle disc of duplex position rotating assembly (4) respectively, two photoelectric button (7) are installed respectively at the edge on one side of device base (1) and on going on the both sides about going on tool installation cave (5) of unloading, safety grating (6) distribute in tool installation cave (5) rotatory border that gets into laser work area, laser protection casing (8) cover the body that goes up and down (2) and laser system (3).
2. The double-station laser processing device according to claim 1, characterized in that: the surface of the device base (1) is provided with a plurality of mounting hole positions which are fixed right above the laser processing device and used for supporting the whole device.
3. The double-station laser processing device according to claim 1, characterized in that: the bottom of the lower end of the lifting body (2) is fixedly arranged on the device base (1), the upper end of the lifting body (2) is connected with the fixed laser system (3), the laser system (3) can move up and down on the lifting body (2), and the lifting body (2) and the laser system (3) are provided with the laser protection cover (8).
4. The double-station laser processing device according to claim 1, characterized in that: the double-station rotating assembly (4) is arranged above the device base (1) and is of a disc structure, a plurality of mounting hole positions are arranged on the upper surface of the device base, and jig mounting holes (5) are respectively fixedly embedded in semicircular discs on two symmetrical sides and drive the jig mounting holes (5) to rotate along the circle center.
5. The double-station laser processing device according to claim 1, characterized in that: the safety grating (6) is arranged above the double-station rotating assembly (4) and at the edge of the laser working area where the jig mounting hole (5) enters, and the left side and the right side of the safety grating are provided with two photoelectric buttons (7) for controlling the working state of the laser processing device.
6. The double-station laser processing device according to claim 1, characterized in that: the laser system (3) comprises a laser (31), a laser mounting plate (32), a laser fixing plate (33), a refraction cavity (34), a refraction cavity supporting seat (35), a light path shaping light cavity (36), a red light preview module (37) and a vibration lens (38); one end of the laser (31) is connected with the refraction cavity (34) and the refraction cavity supporting seat (35), the other end of the refraction cavity (34) is connected with the light path shaping light cavity (36), the other end of the light path shaping light cavity (36) is connected with the red light preview module (37), and the other side of the red light preview module (37) is connected with the vibrating lens (38).
7. The double-station laser processing device according to claim 6, wherein: one surface of the laser installation plate (32) is connected with the side surface of the laser system (3), and the other surface is connected with the lifting body (2) and is used for bearing the laser system (3) and is connected with the lifting body (2).
8. The double-station laser processing device according to claim 6, wherein: the laser fixing plate (33) is arranged on the laser (31), and one end of the laser (31) is connected with the refraction cavity (34).
9. The double-station laser processing device according to claim 6, wherein: one end of the refraction cavity supporting seat (35) is connected to the laser installation plate (32), and the other end of the refraction cavity supporting seat is connected to one end, close to the laser (31), of the refraction cavity (34) and used for fixing and supporting the refraction cavity (34).
10. The double-station laser processing device according to claim 6, wherein: one end of the vibrating lens (38) is connected with the red light preview module (37), the other end of the red light preview module (37) is connected with the light path shaping light cavity (36), the other end of the light path shaping light cavity (36) is connected with the light folding cavity (34), and the whole laser system (3) is controlled to carry out high-precision high-speed scanning processing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920541182.1U CN210548829U (en) | 2019-04-19 | 2019-04-19 | Double-station laser processing device |
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| CN201920541182.1U CN210548829U (en) | 2019-04-19 | 2019-04-19 | Double-station laser processing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113941780A (en) * | 2020-07-16 | 2022-01-18 | 大族激光科技产业集团股份有限公司 | Laser processing device, laser marking equipment and laser processing method |
| CN114905161A (en) * | 2022-07-15 | 2022-08-16 | 张家港九霞激光设备有限公司 | Laser marking machine convenient to change work piece |
-
2019
- 2019-04-19 CN CN201920541182.1U patent/CN210548829U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113941780A (en) * | 2020-07-16 | 2022-01-18 | 大族激光科技产业集团股份有限公司 | Laser processing device, laser marking equipment and laser processing method |
| CN114905161A (en) * | 2022-07-15 | 2022-08-16 | 张家港九霞激光设备有限公司 | Laser marking machine convenient to change work piece |
| CN114905161B (en) * | 2022-07-15 | 2022-09-20 | 张家港九霞激光设备有限公司 | Laser marking machine convenient to change work piece |
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