CN210535799U - Coupler - Google Patents
Coupler Download PDFInfo
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- CN210535799U CN210535799U CN201921451077.5U CN201921451077U CN210535799U CN 210535799 U CN210535799 U CN 210535799U CN 201921451077 U CN201921451077 U CN 201921451077U CN 210535799 U CN210535799 U CN 210535799U
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Abstract
The utility model provides a coupler, include: the through holes are respectively arranged on the side walls of the edges of the coupler and penetrate through the coupler; each coupling line pattern layer comprises a coupling strip line and a first bonding pad which corresponds to the through hole and is connected with the through hole, and the coupling strip line is connected with at least one first bonding pad. Thereby improving the signal transmission efficiency of the coupler.
Description
Technical Field
The utility model relates to a coupler design technical field especially relates to a coupler.
Background
As a commonly used passive device in communication systems, couplers, particularly 3dB couplers, are widely used in radio frequency, microwave circuits and communication systems. The coupler is a general microwave/millimeter wave component, and can be used for separating and synthesizing signals. The 3dB coupler can continuously sample transmission power along a certain determined direction of a transmission line, can divide an input signal into two signals which are mutually equal in amplitude and have a phase difference of 90 degrees, can also be used for multi-signal synthesis, and improves the utilization rate of an output signal. The 3dB couplers may also be used in power amplifiers, low noise amplifiers, adjustable phase shifters and adjustable attenuators. In practical applications, the signal transmission efficiency of the coupler is an important index in application systems.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides a coupler to reach the effect that promotes coupler performance index.
In order to solve the above technical problem, the utility model provides a coupler, include: the through holes are respectively arranged on the edge side walls of the coupler and penetrate through the coupler; each coupled line pattern layer comprises a coupled strip line and a first bonding pad which is arranged corresponding to the through hole and connected with the through hole, and the coupled strip line is connected with at least one first bonding pad.
The through holes respectively comprise signal holes and ground holes, wherein the signal holes are respectively arranged at four corners of the coupler and penetrate through the coupler; the ground hole is arranged on the periphery of the coupler and penetrates through the coupler; the first bonding pad comprises a signal bonding pad and a grounding bonding pad, wherein the signal bonding pad is arranged corresponding to the signal hole and connected with the signal hole, and the grounding bonding pad is arranged corresponding to the grounding hole and connected with the grounding hole; the coupling strip line is connected with at least one signal bonding pad.
Wherein the signal pads include a first signal pad and a second signal pad, wherein the first signal pad is connected with the coupling stripline, and the second signal pad is not connected with the coupling stripline; the ground pad is located between the first signal pad and the second signal pad, and the distance between the ground pad and the first signal pad is smaller than the distance between the ground pad and the second signal pad.
The first bonding pads on each coupling line pattern layer comprise two first signal bonding pads, two second signal bonding pads and two grounding bonding pads; the two first signal pads have the same shape and size, the two second signal pads have the same shape and size, the two ground pads have the same shape and size, and the first signal pads and the second signal pads have different shapes and sizes.
In each of the coupled line pattern layers, the two first signal pads, the two second signal pads, and the two ground pads are symmetrical with respect to a center point.
In each coupling line pattern layer, the two first signal pads are located on one diagonal line of the coupler and connected to the signal holes at corresponding positions, and the two second signal pads are located on the other diagonal line of the coupler and connected to the signal holes at corresponding positions.
The coupling line pattern layer specifically comprises a first coupling line pattern layer and a second coupling line pattern layer; two first signal pads in the first coupling line pattern layer are connected with two signal holes on a first diagonal line of the coupler, and two second signal pads are correspondingly connected with two signal holes on a second diagonal line of the coupler; two first signal pads in the second coupling line pattern layer are correspondingly connected with two signal holes on the second diagonal line of the coupler, and two second signal pads are correspondingly connected with two signal holes on the first diagonal line of the coupler.
The two first signal pads, the two second signal pads and the two ground pads in the first coupling line pattern layer are mirror-symmetrical to the two first signal pads, the two second signal pads and the two ground pads in the second coupling line pattern layer.
Wherein the coupler further comprises: the signal holes and the ground holes respectively penetrate through the top layer core board, the middle core board and the bottom layer core board; the first coupling line pattern layer and the second coupling line pattern layer are respectively positioned on two opposite surfaces of the middle core board, and a top layer pattern layer and a bottom layer pattern layer are respectively arranged on the outward surfaces of the top layer core board and the bottom layer core board, wherein the top layer pattern layer and the bottom layer pattern layer respectively comprise second bonding pads.
Wherein the second pads comprise four signal pads and at least one ground pad; the four signal pads are respectively correspondingly connected with the four signal holes, and the grounding pad is sequentially connected with the plurality of grounding holes; the four signal pads in the top and bottom pattern layers have the same shape and size.
The utility model has the advantages that: through setting up the via hole that runs through the coupler at the marginal lateral wall of coupler, set up coupling stripline and corresponding the first pad that the via hole set up and connect the via hole in coupling line graph layer, coupling stripline connects at least one first pad to improve the signal transmission efficiency of coupler.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a coupler according to the present invention;
fig. 2 is a schematic structural diagram of a top pattern layer of a top core board of the coupler of the present invention;
fig. 3 is a schematic structural diagram of a first coupling line pattern layer of a middle core board of the coupler of the present invention;
fig. 4 is a schematic structural diagram of a second coupling line pattern layer of the intermediate core board of the coupler of the present invention;
fig. 5 is a schematic structural diagram of a bottom pattern layer of a bottom core board of the coupler of the present invention.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples.
Fig. 1 is a schematic structural diagram of an embodiment of a coupler according to the present invention. Specifically, the coupler 1 includes a top core board 11, a middle core board 12, and a bottom core board 13, which are stacked from top to bottom. The top core board 11, the middle core board 12 and the bottom core board 13 are bonded through dielectric layers respectively. In one embodiment, the dielectric layer is a prepreg. The top core board 11, the middle core board 12 and the bottom core board 13 are all copper clad boards, in a specific embodiment, two surfaces of the middle core board 12 are provided with metal layers, one surface of the top core board 11 and the bottom core board 13 is provided with a metal layer, and the metal layer is a copper foil. The metal layers on the surfaces of the top core board 11 and the bottom core board 13 are both far away from the middle core board 12.
The side walls of the edge of the coupler 1 are respectively provided with via holes penetrating through the coupler, wherein the via holes include signal holes 14 arranged at four corners of the coupler 1 and ground holes 15 arranged at the periphery of the coupler 1. With signal holes 14 passing through the top, middle and bottom core boards 11, 12, 13 of the coupler 1 and ground holes 15 passing through the top, middle and bottom core boards 11, 12, 13 of the coupler 1. In one embodiment, there may be a plurality of ground holes 15 on one edge, or there may be one ground hole 15.
The coupler also comprises coupled line pattern layers, wherein each coupled line pattern layer is provided with a coupled strip line and a first bonding pad which is arranged corresponding to the via hole and connected with the via hole, and the coupled strip line is connected with at least one first bonding pad.
In one embodiment, the first pads include signal pads and ground pads, the signal pads are disposed corresponding to the signal holes 14 and connected to the signal holes 14, and the ground pads are disposed corresponding to the ground holes 15 and connected to the ground holes 15; the coupling strip line is connected with at least one signal pad.
The top core board 11 of the coupler 1 includes a top pattern layer 111 far from the middle core board 12, please refer to fig. 2, and the top pattern layer 111 is located on a metal layer on a surface of the top core board 11 far from the middle core board 12.
The top pattern layer 111 includes a second pad, wherein the second pad includes four signal pads 1111 connected to four signal holes 14 at four corners of the coupler 1 and at least one ground pad 1112 connected to a plurality of ground holes 15 at four sides of the coupler 1, and the ground pad 1112 is a whole metal layer, i.e., a copper layer, and corresponds to the ground hole 15 at the side. The four signal pads 1111 are identical in shape and size.
The central core 12 of the coupler 1 includes at least one pair of coupled line pattern layers (as shown in fig. 3 and 4). In an embodiment, the at least one pair of coupled line pattern layers comprises a first coupled line pattern layer 121 (fig. 3) and a second coupled line pattern layer 122 (fig. 4).
As shown in fig. 3, the signal pads in the first coupled line pattern layer 121 include a first signal pad 1212 and a second signal pad 1213, wherein the first coupled line pattern layer 121 includes two first signal pads 1212 and two second signal pads 1213. Two first signal pads 1212 are located on a first diagonal and two second signal pads 1213 are located on a second diagonal. The coupling strip line 1211 is connected to at least one first signal pad 1212, and specifically, the coupling strip line 1211 is connected between two first signal pads 1212. In the present embodiment, the ground pads 1214 in the first pads of the first coupling line pattern layer 121 include two pads, which are respectively located between the adjacent first signal pads 1212 and second signal pads 1213. Therefore, the isolation of the coupler port is enhanced through the interaction between the grounding bonding pad and the first signal bonding pad and the second signal bonding pad, and the performance index of the coupler is further enhanced. In one embodiment, two ground pads 1214 are located on the short sides of coupler 1. The first signal pads 1212 and the second signal pads 1213 have the same shape and size, and the ground pads 1214 have the same shape and size. Wherein the two first signal pads 1212 and the second signal pads 1213 are different in shape and size.
In one embodiment, the first signal pad 1212, the second signal pad 1213, and the ground pad 1214 are polygonal, and contact positions with the signal hole 14 or the ground hole 15 are arc-shaped edges matching the signal hole 14 or the ground hole 15, and the rest are straight edges.
Where ground pad 1214 has a straight side parallel to one side of first signal pad 1212 at a location adjacent to first signal pad 1212 and a straight side parallel to one side of second signal pad 1213 at a location adjacent to second signal pad 1213.
Wherein two first signal pads 1212, two second signal pads 1213, and two ground pads 1214 are symmetrical about a center point. Specifically, as shown in fig. 3, the first signal pad 1212, the second signal pad 1213, and the ground pad 1214 on the left side of the first coupling line pattern layer 121 are rotated 180 degrees along the center point to coincide with the first signal pad 1212, the second signal pad 1213, and the ground pad 1214 on the right side.
As shown in fig. 4, the signal pads in the second coupled line pattern layer 122 include a first signal pad 1222 and a second signal pad 1223, wherein the second coupled line pattern layer 122 includes two first signal pads 1222 and two second signal pads 1223. The two first signal pads 1222 are located on the second diagonal line, and the two second signal pads 1223 are located on the first diagonal line. The coupling stripline 1221 is connected to at least one first signal pad 1222, and specifically, the coupling stripline 1221 is connected between two first signal pads 1222. In the present embodiment, the ground pads 1224 in the first pads of the second coupled line pattern layer 122 include two, which are respectively located between the adjacent first signal pads 1222 and second signal pads 1223. Therefore, the isolation of the coupler port is enhanced through the interaction between the grounding bonding pad and the first signal bonding pad and the second signal bonding pad, and the performance index of the coupler is further enhanced. In one embodiment, two ground pads 1224 are located on the short sides of coupler 1. The first signal pads 1222 and the second signal pads 1223 have the same shape and size, and the ground pads 1224 have the same shape and size. The two first signal pads 1222 and the second signal pad 1223 are different in shape and size.
In one embodiment, the first signal pad 1222, the second signal pad 1223, and the ground pad 1224 are polygonal, and contact positions with the signal hole 14 or the ground hole 15 are arc-shaped edges matching the signal hole 14 or the ground hole 15, and the rest are straight edges.
Where ground pad 1224 has a straight side parallel to one side of first signal pad 1222 adjacent to first signal pad 1222 and a straight side parallel to one side of second signal pad 1223 adjacent to second signal pad 1223.
Wherein the two first signal pads 1222, the two second signal pads 1223, and the two ground pads 1224 are symmetrical with respect to a center point. Specifically, as shown in fig. 4, the first signal pad 1222, the second signal pad 1223, and the ground pad 1224 on the left side of the second coupled line pattern layer 122 are rotated 180 degrees along a center point to coincide with the first signal pad 1222, the second signal pad 1223, and the ground pad 1224 on the right side.
In an embodiment, the first coupled line pattern layer 121 is symmetrical to the second coupled line pattern layer 122, and specifically, as shown in fig. 3 and 4, the first coupled line pattern layer 121 is rotated 180 degrees along a central point to coincide with the second coupled line pattern layer 122.
Referring to fig. 5, the bottom core board 13 of the coupler 1 includes a bottom pattern layer 131 far away from the middle core board 12, and the bottom pattern layer 131 is located on a metal layer on a surface of the bottom core board 13 far away from the middle core board 12.
The bottom pattern layer 131 includes second pads, wherein the second pads include four signal pads 1311 connected to four signal holes 14 at four corners of the coupler 1 and at least one ground pad 1312 connected to a plurality of ground holes 15 at four sides of the coupler 1, and the ground pad 1312 is a whole metal layer, i.e., a copper layer, and corresponds to the ground hole 15 at the side. The four signal pads 1311 are all the same in shape and size.
In one embodiment, the top pattern layer 111 is symmetrical to the bottom pattern layer 131. Specifically, as shown in fig. 2 and 5, the top pattern layer 111 completely overlaps the bottom pattern layer 131.
The coupler also includes other devices, which are the same as other devices and functions of the coupler in the prior art, and are not described in detail herein.
The utility model provides a coupler, through the via hole that runs through the coupler in the marginal lateral wall setting of coupler, and the position department that corresponds the via hole on coupling line graphic layer sets up the first pad of connecting the via hole, and at least one first pad is connected to the coupling stripline, with this signal transmission efficiency through the pad reinforcing coupler, first pad includes signal pad and ground connection pad, the signal pad includes first signal pad and second signal pad, first signal pad is connected the coupling stripline, second signal pad is not connected the coupling stripline, the ground connection pad is located between first signal pad and the second signal pad, with this through the isolation between ground connection pad reinforcing second signal pad and the first signal pad, reduce the energy overflow loss of second signal pad and first signal pad, thereby improve the signal energy transmission efficiency of coupler.
The above is only the embodiment of the present invention, not the limitation of the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A coupler, comprising:
the through holes are respectively arranged on the edge side walls of the coupler and penetrate through the coupler;
each coupled line pattern layer comprises a coupled strip line and a first bonding pad which is arranged corresponding to the through hole and connected with the through hole, and the coupled strip line is connected with at least one first bonding pad.
2. The coupler of claim 1,
the via holes respectively comprise signal holes and ground holes, wherein the signal holes are respectively arranged at four corners of the coupler and penetrate through the coupler; the ground hole is arranged on the periphery of the coupler and penetrates through the coupler;
the first bonding pad comprises a signal bonding pad and a grounding bonding pad, wherein the signal bonding pad is arranged corresponding to the signal hole and connected with the signal hole, and the grounding bonding pad is arranged corresponding to the grounding hole and connected with the grounding hole;
the coupling strip line is connected with at least one signal bonding pad.
3. The coupler of claim 2,
the signal pads include a first signal pad and a second signal pad, wherein the first signal pad is connected with the coupling stripline, and the second signal pad is not connected with the coupling stripline;
the ground pad is located between the first signal pad and the second signal pad, and the distance between the ground pad and the first signal pad is smaller than the distance between the ground pad and the second signal pad.
4. The coupler of claim 3, wherein the first pads on each of the coupled line pattern layers include two of the first signal pads, two of the second signal pads, and two of the ground pads;
the two first signal pads have the same shape and size, the two second signal pads have the same shape and size, the two ground pads have the same shape and size, and the first signal pads and the second signal pads have different shapes and sizes.
5. The coupler of claim 4, wherein in each of the coupled line pattern layers, the two first signal pads, the two second signal pads, and the two ground pads are symmetrical with respect to a center point.
6. The coupler of claim 4, wherein in each of the coupled line pattern layers, two of the first signal pads are located on one diagonal of the coupler and connect the signal holes at corresponding locations, and two of the second signal pads are located on the other diagonal of the coupler and connect the signal holes at corresponding locations.
7. The coupler of claim 6, wherein the coupled line pattern layers specifically include a first coupled line pattern layer and a second coupled line pattern layer;
two first signal pads in the first coupling line pattern layer are connected with two signal holes on a first diagonal line of the coupler, and two second signal pads are correspondingly connected with two signal holes on a second diagonal line of the coupler;
two first signal pads in the second coupling line pattern layer are correspondingly connected with two signal holes on the second diagonal line of the coupler, and two second signal pads are correspondingly connected with two signal holes on the first diagonal line of the coupler.
8. The coupler of claim 7,
the two first signal pads, the two second signal pads and the two ground pads in the first coupling line pattern layer are mirror-symmetrical to the two first signal pads, the two second signal pads and the two ground pads in the second coupling line pattern layer.
9. The coupler of claim 8, wherein the coupler further comprises: the signal holes and the ground holes respectively penetrate through the top layer core board, the middle core board and the bottom layer core board;
the first coupling line pattern layer and the second coupling line pattern layer are respectively positioned on two opposite surfaces of the middle core board, and a top layer pattern layer and a bottom layer pattern layer are respectively arranged on the outward surfaces of the top layer core board and the bottom layer core board, wherein the top layer pattern layer and the bottom layer pattern layer respectively comprise second bonding pads.
10. The coupler of claim 9, wherein the second pads include four signal pads and at least one ground pad;
the four signal pads are respectively correspondingly connected with the four signal holes, and the grounding pad is sequentially connected with the plurality of grounding holes; the four signal pads in the top and bottom pattern layers have the same shape and size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921451077.5U CN210535799U (en) | 2019-09-02 | 2019-09-02 | Coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921451077.5U CN210535799U (en) | 2019-09-02 | 2019-09-02 | Coupler |
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| CN210535799U true CN210535799U (en) | 2020-05-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114614230A (en) * | 2020-12-09 | 2022-06-10 | 深南电路股份有限公司 | Coupler and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114614230A (en) * | 2020-12-09 | 2022-06-10 | 深南电路股份有限公司 | Coupler and electronic equipment |
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