CN204011664U - The banded three-dimensional domain topological structure of the high-power broadband of V-band 3dB orthocoupler - Google Patents
The banded three-dimensional domain topological structure of the high-power broadband of V-band 3dB orthocoupler Download PDFInfo
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- CN204011664U CN204011664U CN201420439511.9U CN201420439511U CN204011664U CN 204011664 U CN204011664 U CN 204011664U CN 201420439511 U CN201420439511 U CN 201420439511U CN 204011664 U CN204011664 U CN 204011664U
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Abstract
The utility model relates to the banded three-dimensional domain topological structure of the high-power broadband of a kind of V-band 3dB orthocoupler, include 1 upper banded PCB single sided board 1, banded PCB single sided board 3 under 1 banded PCB double sided board 2 and 1, from top to bottom successively by mounting-positioning holes h1, h2 and h3, and be closely connected through rivet 4, combining, it is whole to form a laminated type modular construction; Wherein banded PCB double sided board 2 comprises upper and lower snakelike banded track, and their coupling unit knee adopts round and smooth arc transition; Upper banded PCB single sided board 1 and lower banded PCB single sided board 3, size is identical, and applying copper silvered face 11 and 31 is ground plane and all placements outwardly; Adopt the three-dimensional domain topological structure of this band shape, the high-power broadband of the V-band 3dB orthocoupler of producing, has that volume is little, standing wave is functional, insertion loss is low, isolation is high, can bear the features such as high-power.
Description
Technical field
The utility model relates to a kind of coupler framework, particularly the topological structure of the banded three-dimensional domain of the high-power broadband of a kind of high-performance V-band 3dB orthocoupler.
Background technology
Along with developing rapidly of electronic information industry, various electronic products improve constantly the performance requirement of related electronic devices, assembly and module.Such as, for being operated between the electronic equipment of V-band, first there is location interference problem altogether, address this problem, most occasions can adopt the high performance wideband 3dB directional coupler of features such as possessing low insertion loss, high-isolation.
Directional coupler is a kind of electronic device that signal power can be distributed according to a certain percentage.Signal after power division, its phase place also meets certain relation, the quadrature in phase of end as straight-through in orthocoupler and coupled end signal.Wherein 3dB orthocoupler can be divided into two signal power, and two paths of signals performance number is before half of shunt; The quadrature in phase of straight-through end and coupled end signal.
Along with strip line directional coupler is more and more, be applied in various radio frequencies, microwave circuit and system, adopt different coupling schemes, coupled structure, wire laying mode and band linear dimension, can be made into the 3dB directional coupler of various performances.The at present main flow of more domestic microwave devices design manufacturer has has researched and developed and has designed V-band ultra broadband 3dB orthocoupler and the marketization as Chengdu Tag etc., but these couplers still cannot meet some to low insertion loss, high-isolation, can bear the needs of the harsh occasion of the performance requirement such as high-power, this is insider's problem demanding prompt solution.
Utility model content
The purpose of this utility model is to solve the deficiency of above-mentioned prior art, provides the high-power broadband of a kind of V-band reasonable in design, dependable performance 3dB orthocoupler banded three-dimensional domain topological structure.
In order to achieve the above object, the technical scheme that the utility model adopts is:
The banded three-dimensional domain topological structure of the high-power broadband of V-band 3dB orthocoupler, include 1 upper banded PCB single sided board 1, banded PCB single sided board 3 under 1 banded PCB double sided board 2 and 1, from top to bottom successively by mounting-positioning holes h1, h2 and h3, and be closely connected through rivet 4, combining, it is whole to form a laminated type modular construction, wherein:
Described banded PCB double sided board 2, its upper and lower faces is respectively arranged with snakelike banded track 21 and lower snakelike banded track 23, adopts snakelike banded track, in order to reduction of device overall dimensions.
Described snakelike banded track 21 and lower snakelike banded track 23, their coupling unit knee adopts round and smooth arc transition, and the radius of circular arc is greater than 1.5 times of these places with the live width of line, in order to reduce impedance discontinuity, improve the overall performance of coupler.
Described snakelike banded track 21 and lower snakelike banded track 23, their snakelike banded track number of bends should be the least possible, in order to reduce impedance discontinuity, improves the overall performance of coupler.
Described snakelike banded track 21, includes again coupling line 212, non-coupling line 211, non-coupling line 213; Non-coupling line 211, draws the input port as coupler integral body, and non-coupling line 213, draws the straight-through port as coupler integral body.
Described lower snakelike banded track 23, includes again coupling line 232, non-coupling line 231, non-coupling line 233; Non-coupling line 231, draws the coupling port as coupler integral body, and non-coupling line 233, draws the isolated port as coupler integral body.
Described banded PCB single sided board 1 and lower banded PCB single sided board 3, size is all identical, and one side is deposited copper silver coating outwardly; One side is medium substrate inwardly, and correspondence is connected mutually with upper snakelike banded track 21 and lower snakelike banded track 23 in banded PCB double sided board 2 respectively.
The deposited copper silver coating of described banded PCB single sided board 1 and lower banded PCB single sided board 3 is ground plane, by rivet 4 is installed in location hole h1, h2, h3, realizes altogether.
Remarkable result of the present utility model:
Three-dimensional dimension is less, standing wave is functional, insertion loss is little, isolation is high, can bear the high-power of 300W, than already, more business-like coupler has good lifting with performance parameters such as coupling port phase differences for standing wave in respective bandwidth, insertion loss, isolation, straight-through port, can meet the have relatively high expectations needs of occasion of relevant parameter simultaneously.
accompanying drawing explanation:
Fig. 1 is the utility model overall architecture schematic diagram;
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of the banded PCB double sided board 2 of the utility model;
The test result figure of Fig. 3 insertion loss and input standing wave performance when to be the utility model synthetic by power;
The test result figure of isolation and input standing wave performance when Fig. 4 is the straight-through and coupling termination matched load of the utility model;
Symbol description in figure:
The 1st, upper banded PCB single sided board;
The 2nd, banded PCB double sided board;
The 3rd, lower banded PCB single sided board;
The 4th, rivet is installed;
The 11st, the deposited copper silver coating of upper banded PCB single sided board 1;
The 12nd, the medium substrate of upper banded PCB single sided board 1;
The 21st, the upper snakelike banded track of banded PCB double sided board 2;
The 22nd, the medium substrate of banded PCB double sided board 2;
The 23rd, the lower snakelike banded track of banded PCB double sided board 2;
The 211st, the non-coupling line of upper snakelike banded track 21;
The 212nd, the coupling line of upper snakelike banded track 21;
The 213rd, the non-coupling line of upper snakelike banded track 21;
The 231st, the non-coupling line of lower snakelike banded track 23;
The 232nd, the coupling line of lower snakelike banded track 23;
The 233rd, the non-coupling line of lower snakelike banded track 23;
The 31st, the deposited copper silver coating of lower banded PCB single sided board 3;
The 32nd, the medium substrate of lower banded PCB single sided board 3;
H1 is the mounting-positioning holes of upper banded PCB single sided board 1;
H2 is the mounting-positioning holes of banded PCB double sided board 2;
H3 is the mounting-positioning holes of lower banded PCB single sided board 3.
Embodiment
Referring to shown in Fig. 1 to Fig. 4, is the utility model specific embodiment.
1 can find out to accompanying drawing 2 by reference to the accompanying drawings:
The utility model includes 1 upper banded PCB single sided board 1, banded PCB single sided board 3 under 1 banded PCB double sided board 2 and 1, from top to bottom successively by mounting-positioning holes h1, h2 and h3, and is closely connected through rivet 4, combining, it is whole to form a laminated type modular construction, wherein:
Described banded PCB double sided board 2, its upper and lower faces is respectively arranged with snakelike banded track 21 and lower snakelike banded track 23, adopts snakelike banded track, in order to reduction of device overall dimensions.
Described snakelike banded track 21 and lower snakelike banded track 23, their coupling unit knee adopts round and smooth arc transition, and the radius of circular arc is greater than 1.5 times of these places with the live width of line, in order to reduce impedance discontinuity, improve the overall performance of coupler; Snakelike banded track 21 and lower snakelike banded track 23 on this example, the radius of their coupling unit knee circular arc is got 2 times of these places with the live width of line.
Described snakelike banded track 21 and lower snakelike banded track 23, their snakelike banded track number of bends should be the least possible, in order to reduce impedance discontinuity, improves the overall performance of coupler; On this example, the coupling unit of snakelike banded track 21 and lower snakelike banded track 23 has 12 knees.
Described snakelike banded track 21, includes again coupling line 212, non-coupling line 211, non-coupling line 213; Non-coupling line 211, draws the input port as coupler integral body, and non-coupling line 213, draws the straight-through port as coupler integral body.
Described lower snakelike banded track 23, includes again coupling line 232, non-coupling line 231, non-coupling line 233; Non-coupling line 231, draws the coupling port as coupler integral body, and non-coupling line 233, draws the isolated port as coupler integral body.
Described banded PCB single sided board 1 and lower banded PCB single sided board 3, size is all identical, and one side is deposited copper silver coating outwardly; One side is medium substrate inwardly, and correspondence is connected mutually with upper snakelike banded track 21 and lower snakelike banded track 23 in banded PCB double sided board 2 respectively.
The deposited copper silver coating of described banded PCB single sided board 1 and lower banded PCB single sided board 3 is ground plane, by rivet 4 is installed in location hole h1, h2, h3, realizes altogether.
From Fig. 3, it can also be seen that:
The test result of insertion loss and input standing wave performance when the utility model embodiment is synthetic by power, wherein the performance of insertion loss is by straight-through port and coupling port are distinguished to ground connection, half again input and the S21 that measures of isolated port being taken absolute value, obtains the insertion loss of single coupler; As shown in FIG. | S21| is less than 0.5dB, therefore single coupler inserts to damage, is less than 0.25dB; In addition, the standing wave performance of coupler | S11| is greater than 15dB, as can be seen here, under same three-dimensional dimension, performance more business-like V-band broadband 3dB orthocoupler has good optimization to promote (industry be take business-like Domestic V band high-power broadband 3dB orthocoupler insertion loss as 0.6dB left and right, cannot meet the demand of some occasion).
From Fig. 4, it can also be seen that:
When the utility model embodiment leads directly to and is coupled termination matched load, the test result of isolation and input standing wave performance, is wherein greater than 20dB in the whole frequency range of the return loss of coupler; The full section of isolation is all greater than 20dB.
What deserves to be explained is:
It is suitable that the live width of described snakelike banded track 21 and lower snakelike banded track 23, thickness, coupling space, distance over the ground and these parameters of baseplate material will be chosen, otherwise cannot meet device, bears powerful requirement.
In the utility model embodiment, the model of banded PCB double sided board 2 is microwave complex media coating foil substrate TP-2, and the model of upper banded PCB single sided board 1, lower banded PCB single sided board 3 is microwave complex media coating foil substrate TP-1.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; do not departing from the prerequisite that the utility model discloses; can also make some improvements and modifications; these are revised, are equal to replacement and improvement etc., all should be included in protection range of the present utility model.
Claims (7)
1. the banded three-dimensional domain topological structure of the high-power broadband of V-band 3dB orthocoupler, include 1 upper banded PCB single sided board (1), banded PCB single sided board (3) under 1 banded PCB double sided board (2) and 1, from top to bottom successively by mounting-positioning holes h1, h2 and h3, and be closely connected through rivet (4), combining, it is whole to form a laminated type modular construction, it is characterized in that:
Described banded PCB double sided board (2), its upper and lower faces is respectively arranged with snakelike banded track (21) and lower snakelike banded track (23), adopts snakelike banded track, in order to reduction of device overall dimensions.
2. the banded three-dimensional domain topological structure of the high-power broadband of V-band as claimed in claim 1 3dB orthocoupler, is characterized in that:
Described snakelike banded track (21) and lower snakelike banded track (23), their coupling unit knee adopts round and smooth arc transition, and the radius of circular arc is greater than 1.5 times of these places with the live width of line, in order to reduce impedance discontinuity, improve the overall performance of coupler.
3. the banded three-dimensional domain topological structure of the high-power broadband of V-band as claimed in claim 1 3dB orthocoupler, is characterized in that:
Described snakelike banded track (21) and lower snakelike banded track (23), their snakelike banded track number of bends should be the least possible, in order to reduce impedance discontinuity, improves the overall performance of coupler.
4. the banded three-dimensional domain topological structure of the high-power broadband of V-band as claimed in claim 1 3dB orthocoupler, is characterized in that:
Described snakelike banded track (21), includes again coupling line (212), non-coupling line (211), non-coupling line (213); Non-coupling line (211), draws the input port as coupler integral body, and non-coupling line (213), draws the straight-through port as coupler integral body.
5. the banded three-dimensional domain topological structure of the high-power broadband of V-band as claimed in claim 1 3dB orthocoupler, is characterized in that:
Described lower snakelike track (23), includes again coupling line (232), non-coupling line (231), non-coupling line (233); Non-coupling line (231), draws the coupling port as coupler integral body, and non-coupling line (233), draws the isolated port as coupler integral body.
6. the banded three-dimensional domain topological structure of the high-power broadband of V-band as claimed in claim 1 3dB orthocoupler, is characterized in that:
Described banded PCB single sided board (1) and lower banded PCB single sided board (3), size is all identical, and one side is deposited copper silver coating outwardly; One side is medium substrate inwardly, and correspondence is connected mutually with upper snakelike banded track (21) and lower snakelike banded track (23) in banded PCB double sided board (2) respectively.
7. the banded three-dimensional domain topological structure of the high-power broadband of V-band as claimed in claim 6 3dB orthocoupler, is characterized in that:
The deposited copper silver coating of described banded PCB single sided board (1) and lower banded PCB single sided board (3) is ground plane, by rivet (4) is installed in location hole h1, h2, h3, realizes altogether.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420439511.9U CN204011664U (en) | 2014-08-06 | 2014-08-06 | The banded three-dimensional domain topological structure of the high-power broadband of V-band 3dB orthocoupler |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420439511.9U CN204011664U (en) | 2014-08-06 | 2014-08-06 | The banded three-dimensional domain topological structure of the high-power broadband of V-band 3dB orthocoupler |
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| CN204011664U true CN204011664U (en) | 2014-12-10 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157947A (en) * | 2014-08-06 | 2014-11-19 | 武汉中元通信股份有限公司 | Strip-shaped three-dimensional layout topology structure of V-waveband and high-power broadband 3dB quadrature coupler |
| CN108879097A (en) * | 2017-05-16 | 2018-11-23 | 财团法人工业技术研究院 | three-dimensional Butler matrix |
-
2014
- 2014-08-06 CN CN201420439511.9U patent/CN204011664U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157947A (en) * | 2014-08-06 | 2014-11-19 | 武汉中元通信股份有限公司 | Strip-shaped three-dimensional layout topology structure of V-waveband and high-power broadband 3dB quadrature coupler |
| CN108879097A (en) * | 2017-05-16 | 2018-11-23 | 财团法人工业技术研究院 | three-dimensional Butler matrix |
| CN108879097B (en) * | 2017-05-16 | 2021-01-29 | 财团法人工业技术研究院 | Three-dimensional Butler matrix |
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