CN210534600U

CN210534600U - Temperature control assembly for airborne equipment and mounting structure thereof

Info

Publication number: CN210534600U
Application number: CN201921616729.6U
Authority: CN
Inventors: 韩光韬
Original assignee: Xi'an Shicheng Aviation Technology Co Ltd
Current assignee: Xi'an Shicheng Aviation Technology Co Ltd
Priority date: 2019-09-26
Filing date: 2019-09-26
Publication date: 2020-05-15
Anticipated expiration: 2029-09-26

Abstract

The utility model provides a temperature control assembly for airborne equipment and mounting structure thereof, wherein temperature control assembly is including installing semiconductor refrigeration piece and the control by temperature change board at airborne equipment inner space, and the control by temperature change board is integrated installs temperature sensor, the inside ambient temperature of temperature sensor monitoring airborne equipment casing, when the inside temperature of equipment is less than a certain threshold value of predetermineeing, control by temperature change board control semiconductor refrigeration piece forward circular telegram, for the inside heating that begins of airborne equipment casing, when the inside temperature of equipment is higher than a certain threshold value of predetermineeing, control by temperature change board control semiconductor refrigeration piece reverse circular telegram, for the inside cooling that begins of airborne equipment casing. The temperature control assembly has no sliding part, small volume, high reliability and no refrigerant pollution; therefore, the refrigerant is applied to some onboard equipment with limited space, and no refrigerant pollution exists.

Description

Temperature control assembly for airborne equipment and mounting structure thereof

Technical Field

The utility model belongs to the technical field of the machine carries the accessory, especially, relate to a control by temperature change subassembly and mounting structure for machine carries equipment.

Background

Special subjects such as high temperature and high cold are indispensable important links of flight tests, and the dependence on outdoor weather is high due to the particularity of the test environment. However, the uncontrollable weather is large, and the test can be completed only when the requirements of special subjects on the external environment (temperature, air pressure, wind speed, wind direction and the like) are met. However, some devices in the airborne test equipment, such as photoelectric devices such as sensors, in particular, airborne cameras, can only work at normal temperature (-10 ℃ to 50 ℃) due to the self devices, and are difficult to work at high temperature and low temperature (-45 ℃ to 70 ℃), which brings great errors to the precision of test data. Weather conditions meeting flight standards often have a short period of time, so that airborne equipment is required to quickly and accurately measure test data within the limited time.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a realize through following technical scheme:

the utility model provides a control by temperature change subassembly for airborne equipment, including installing semiconductor refrigeration piece and the control by temperature change board at airborne equipment inner space, just temperature sensor is installed to the control by temperature change board integration, temperature sensor is connected with control by temperature change board signal input part, control by temperature change board signal output part is connected with the semiconductor refrigeration piece, temperature sensor monitoring airborne equipment casing internal environment temperature, when the inside temperature of equipment is less than a certain threshold value of predetermineeing, the positive circular telegram of control by temperature change board control semiconductor refrigeration piece gives the inside heating that begins of airborne equipment casing, and when the inside temperature of equipment is higher than a certain threshold value of predetermineeing, the control by temperature change board control semiconductor refrigeration piece is reverse circular telegram, for the inside cooling that begins of airborne equipment casing.

The utility model discloses another aspect provides a mounting structure for airborne equipment temperature control assembly, especially a mounting structure for airborne camera goes up temperature control assembly, including airborne camera go up the casing, install lower casing, camera circuit board, the camera main part of casing below on airborne camera, semiconductor refrigeration piece, the control panel of installing temperature sensor, a set of first mount and a set of second mount, go up casing and lower casing concatenation and constitute airborne camera shell body part, the camera main part is installed at airborne camera shell body central point and is put, around the camera main part after first mount and second mount concatenation are fixed, just the mounting groove has all been seted up on a side that first mount and second mount are close to the camera main part, semiconductor refrigeration piece is installed in the mounting groove, bar piece and the arch at middle part that first mount is connected by both sides and other position mounts are integrative to become the piece The type, the outside radian of arch-shaped piece is the same with machine carries camera shell body relevant position radian for the close contact utilizes screw locking connection between arch-shaped piece and the machine carries the camera shell body, the second mount is the square sheet structure of not with machine carries the contact of camera shell body inner wall, the control panel fixed mounting is on one of them second mount lateral surface, camera circuit board fixed mounting is in machine carries camera shell body inner wall bottom position.

As a further explanation of the utility model: the first fixing frame and the second fixing frame are further provided with wire grooves on one side face close to the camera main body, and the wire grooves are located on two sides of the mounting groove and communicated with the inside of the mounting groove.

As a further explanation of the utility model: the center position of the arch-shaped block is also provided with a strip-shaped groove.

As a further explanation of the utility model: and a gap is reserved between the camera circuit board and the second fixing frame at the bottom end.

Compared with the prior art, the utility model discloses following profitable technological effect has:

(1) the temperature control assembly has the advantages of no sliding part, small volume, high reliability and no refrigerant pollution; therefore, the temperature control device is applied to airborne equipment with limited space, has no refrigerant pollution, can increase or reduce the input of the current of the refrigerating sheet according to actual needs, can adjust the rising or falling of the temperature, has good effect on equipment with the temperature difference which cannot be too large, and can realize the purpose of reliably controlling the temperature of a heating main body of the equipment.

(2) The mounting structure of the temperature control assembly is characterized in that a fixing frame for fixing the semiconductor refrigeration sheet is a square structure formed by splicing a first fixing frame and a second fixing frame, so that the semiconductor refrigeration sheet can be uniformly attached to the periphery of a main body of a heating main camera, the temperature control area is effectively increased, the first fixing frame is a structure consisting of two parts, namely an arch block and a strip block, the semiconductor refrigeration sheet fixing frame can be tightly contacted with an outer arc surface of an airborne camera shell by utilizing the outer arc surface of the arch block and can realize locking connection, the contact area between the fixing frame and the airborne camera shell is effectively increased, the stable connection between the fixing frame and the shell is realized, the other half of the semiconductor refrigeration sheet fixing frame is designed into a square structure which is not contacted with the inner wall of the airborne camera shell, the assembly firmness of the fixing frame is not influenced, not only can play a role of weight reduction, but also can enhance the heat dissipation function.

Drawings

Fig. 1 is a schematic view of the installation structure of the temperature control assembly of the present invention;

fig. 2 is a schematic structural view of the temperature control assembly mounting structure of the present invention after being assembled with the camera main body;

fig. 3 is the external structure schematic diagram of the camera housing of the present invention.

Description of the reference numerals

In the figure: the camera comprises a camera circuit board 1, a wire casing 2, a second fixing frame 3, a first fixing frame 4, a strip-shaped block 41, an arch-shaped block 42, a strip-shaped groove 44, a temperature control plate 5, a mounting groove 6, a semiconductor refrigeration piece 7, a lower shell 8, an upper shell 9 and a camera main body 10.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1 and 2, a temperature control assembly for airborne equipment comprises a semiconductor refrigeration sheet 7 and a temperature control plate 5 which are installed in the internal space of the airborne equipment, wherein a temperature sensor is integrally installed on the temperature control plate 5, the temperature sensor is connected with a signal input end of the temperature control plate 5, a signal output end of the temperature control plate 5 is connected with the semiconductor refrigeration sheet 7, the temperature sensor monitors the internal environment temperature of a shell of the airborne equipment, when the internal temperature of the equipment is lower than a certain preset threshold value, the temperature control plate 5 controls the semiconductor refrigeration sheet 7 to be powered on in the forward direction to heat the interior of the shell of the airborne equipment, and when the internal temperature of the equipment is higher than the certain preset threshold value, the temperature control plate 5 controls the semiconductor refrigeration sheet 7 to be powered on in the reverse direction to cool;

when the temperature control assembly of the airborne equipment is used, the assembly is required to be installed inside an equipment shell, the semiconductor refrigerating sheet 7 is attached to a heating main body inside the equipment, the semiconductor refrigerating sheet 7 is powered on in the forward direction for heating, and the semiconductor refrigerating sheet 7 is powered on in the reverse direction for refrigerating, the thermal effect of semiconductor materials is utilized, the principle is that when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, and the aim of refrigerating can be achieved; the refrigerating technology which generates negative thermal resistance is characterized by no moving parts and higher reliability.

Temperature sensor can real-time monitoring facilities casing internal environment temperature, when the inside temperature of equipment is less than a certain threshold value (the threshold value can be established), the temperature control board gives semiconductor refrigeration piece forward circular telegram, begins to heat for equipment, when the inside temperature of equipment is higher than a certain threshold value, and intelligence temperature control board gives semiconductor refrigeration piece reverse circular telegram, begins the cooling for equipment. Thereby, the temperature balance inside the equipment is ensured;

the temperature control assembly has the advantages of no sliding part, small volume, high reliability and no refrigerant pollution; therefore, the temperature control device is applied to airborne equipment with limited space, has no refrigerant pollution, and can realize the purpose of reliably controlling the temperature of the equipment heating main body.

For example, the mounting structure is applied to an object of an airborne camera, as shown in fig. 1, 2 and 3, and specifically relates to a mounting structure for a temperature control assembly of airborne equipment, which includes an upper casing 9 of the airborne camera, a lower casing 8 mounted below the upper casing 9 of the airborne camera, a camera circuit board 1, a camera main body 10, a semiconductor refrigeration sheet 7, a temperature control plate 5 mounted with a temperature sensor, a group of first fixing frames 4 and a group of second fixing frames 3, wherein the upper casing 9 and the lower casing 8 are spliced to form an outer casing part of the airborne camera, the camera main body 10 is mounted at the center position of the outer casing of the airborne camera, the first fixing frames 4 and the second fixing frames 3 are spliced and fixed to surround the camera main body 10, and one side surfaces of the first fixing frames 4 and the second fixing frames 3 close to the camera main body 10, semiconductor refrigeration piece 7 is installed in mounting groove 6, bar piece 41 and the arch-shaped piece 42 integrated into one piece at middle part that first mount 4 is connected with other position mounts by both sides, the outside radian of arch-shaped piece 42 is the same with airborne camera shell body relevant position radian for in close contact with utilizes screw locking connection between arch-shaped piece 42 and the airborne camera shell body, second mount 3 is the square sheet structure of not contacting with airborne camera shell body inner wall, 5 fixed mounting of temperature control plate is on 3 lateral surfaces of one of them second mount, camera circuit board 1 fixed mounting is in airborne camera shell body inner wall bottom position.

The fixing frame for fixing the semiconductor refrigeration sheet 7 is a square structure formed by splicing a first fixing frame 4 and a second fixing frame 3, so that the semiconductor refrigeration sheet 7 can be uniformly attached to the periphery of a main body 10 of a heating main camera, the temperature control area is effectively increased, the first fixing frame 4 is a structure consisting of two parts, namely an arch block 42 and a strip block 41, the fixing frame of the semiconductor refrigeration sheet 7 can utilize the tight contact between the outer arc surface of the arch block 42 and the outer shell of the airborne camera and can realize locking connection, the contact area between the fixing frame and the outer shell of the airborne camera is effectively increased, the stable connection between the fixing frame and the outer shell is realized, the other half of the fixing frame of the semiconductor refrigeration sheet 7 is designed to be a square sheet structure which is not in contact with the inner wall of the outer shell of the airborne camera, the assembling firmness of the fixing frame, not only can play a role of weight reduction, but also can enhance the heat dissipation function.

First mount 4 and second mount 3 still seted up wire casing 2 on being close to the side of camera main part 10, just wire casing 2 is located mounting groove 6 both sides and rather than inside intercommunication, and this wire casing 2's design can conveniently be connected the connecting wire that semiconductor refrigeration piece 7 was drawn forth with external components and parts.

In order to further enhance the heat dissipation effect while not affecting the assembly firmness of the fixing frame, the center position of the arch block 42 is further provided with a strip-shaped groove 44.

In order to ensure that the heat generated by the heating main body camera main body 10 and the semiconductor refrigerating sheet 7 is transmitted to the camera circuit board 1 as little as possible to influence the camera circuit board 1, a gap is reserved between the camera circuit board 1 and the second fixing frame 3 at the bottom end.

The embodiments given above are preferred examples for implementing the present invention, and the present invention is not limited to the above-described embodiments. Any non-essential addition and replacement made by the technical features of the technical solution of the present invention by those skilled in the art all belong to the protection scope of the present invention.

Claims

1. A temperature control assembly for an airborne device, comprising: including installing semiconductor refrigeration piece (7) and temperature control plate (5) at airborne equipment inner space, just temperature sensor is installed in temperature control plate (5) integration, temperature sensor is connected with temperature control plate (5) signal input part, temperature control plate (5) signal output part is connected with semiconductor refrigeration piece (7), temperature sensor monitoring airborne equipment casing internal environment temperature, when equipment internal temperature is less than a certain threshold value of predetermineeing, control plate (5) control semiconductor refrigeration piece (7) forward circular telegram gives airborne equipment casing inside and begins to heat, and when equipment internal temperature is higher than a certain threshold value of predetermineeing, control plate (5) control semiconductor refrigeration piece (7) reverse circular telegram gives airborne equipment casing inside and begins to cool down.

2. A mounting structure for airborne equipment temperature control subassembly which characterized in that: the camera comprises an onboard camera upper shell (9), a lower shell (8) arranged below the onboard camera upper shell (9), a camera circuit board (1), a camera main body (10), a semiconductor refrigerating sheet (7), a temperature control plate (5) provided with a temperature sensor, a group of first fixing frames (4) and a group of second fixing frames (3), wherein the onboard camera outer shell part is formed by splicing the upper shell (9) and the lower shell (8), the camera main body (10) is arranged at the central position of the onboard camera outer shell, the first fixing frames (4) and the second fixing frames (3) are spliced and fixed and then surround the camera main body (10), mounting grooves (6) are formed in one side face, close to the camera main body (10), of the first fixing frames (4) and the second fixing frames (3), and the semiconductor refrigerating sheet (7) is arranged in the mounting grooves (6), first mount (4) are by strip-shaped piece (41) that both sides and other position mounts are connected and arch piece (42) integrated into one piece at middle part, the outside radian of arch piece (42) is the same with machine carries camera shell body relevant position radian for between arch piece (42) and the machine carries the camera shell body in close contact with and utilize screw locking to be connected, second mount (3) are the square sheet structure of not contacting with machine carries camera shell body inner wall, temperature control plate (5) fixed mounting is on one of them second mount (3) lateral surface, camera circuit board (1) fixed mounting is in machine carries camera shell body inner wall bottom position.

3. The mounting structure for the on-board equipment temperature control assembly according to claim 2, wherein: the first fixing frame (4) and the second fixing frame (3) are close to one side face of the camera main body (10) and are provided with wire grooves (2), and the wire grooves (2) are located on two sides of the mounting groove (6) and are communicated with the inside of the mounting groove.

4. The mounting structure for the on-board equipment temperature control assembly according to claim 2, wherein: the center of the arch block (42) is also provided with a strip-shaped groove (44).

5. The mounting structure for the on-board equipment temperature control assembly according to claim 2, wherein: and a gap is reserved between the camera circuit board (1) and the second fixing frame (3) at the bottom end.