CN210375429U - GIS shell temperature measuring device - Google Patents
GIS shell temperature measuring device Download PDFInfo
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- CN210375429U CN210375429U CN201921835192.2U CN201921835192U CN210375429U CN 210375429 U CN210375429 U CN 210375429U CN 201921835192 U CN201921835192 U CN 201921835192U CN 210375429 U CN210375429 U CN 210375429U
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Abstract
The embodiment of the application discloses GIS casing temperature measuring device includes: the sensor comprises a medium window, a sensor packaging shell and a shell packaging top cover; an infrared temperature measuring channel is arranged on the medium window; the infrared temperature measuring channel comprises a glass pressing plate mounting groove, an infrared glass mounting groove and a through hole; the infrared glass mounting groove and the glass pressing plate mounting groove are respectively provided with infrared glass and a glass pressing plate; the glass pressing plate is fixed in the glass pressing plate mounting groove through a fixing piece; the dielectric window is arranged at the bottom of the sensor packaging shell; an infrared temperature measuring component is arranged in the sensor packaging shell; the bottom of the sensor packaging shell is provided with a concave platform which is used for matching the infrared temperature measurement component and is in butt joint with the medium window; the shell packaging top cover is arranged at the top of the sensor packaging shell. The utility model discloses a medium window and sensor package shell's cooperation can realize contactless contact and the infrared temperature measurement of generating line, when having guaranteed contact and generating line temperature measurement, GIS's operation is stable and insulating security.
Description
Technical Field
The application relates to the technical field of GIS temperature measurement, in particular to a GIS shell temperature measuring device.
Background
In the field of GIS temperature measurement, currently common methods comprise a sensing temperature measurement method, an infrared imaging temperature measurement method and a contact type wireless temperature measurement method, the sensing temperature measurement methods have defects respectively, the sensing temperature measurement method is low in safety, low in real-time performance and high in misjudgment rate; the infrared imaging thermometry method has the advantages that an infrared light path is uncertain and is greatly influenced by factors such as environment, equipment, human factors and the like; contact wireless temperature measurement method, its measuring accuracy is influenced by environmental factor great, and contact temperature measurement has the problem of installation comparison difficulty moreover, for this reason, the utility model provides a GIS casing temperature measuring device.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a GIS shell temperature measuring device, and the infrared temperature measurement of contact and generating line of contactless can be realized through the cooperation of medium window and sensor packaging shell, when having guaranteed contact and generating line temperature measurement, GIS's operation is stable and insulating security, and then makes the measured temperature more reliable, accurate.
In view of this, the present application provides a GIS casing temperature measuring device, including: the sensor comprises a medium window, a sensor packaging shell and a shell packaging top cover;
an infrared temperature measuring channel is arranged on the medium window;
the infrared temperature measuring channel comprises a glass pressing plate mounting groove formed in the bottom of the medium window, an infrared glass mounting groove formed in the glass pressing plate mounting groove and a through hole vertically formed in the infrared glass mounting groove along the top of the medium window;
the infrared glass mounting groove and the glass pressing plate mounting groove are respectively internally provided with infrared glass and a glass pressing plate for pressing the infrared glass;
the glass pressing plate is fixed in the glass pressing plate mounting groove through a fixing piece;
the dielectric window is arranged at the bottom of the sensor packaging shell;
an infrared temperature measuring component for measuring temperature is arranged in the sensor packaging shell;
the bottom of the sensor packaging shell is provided with a concave platform which is used for matching the infrared temperature measurement component and is in butt joint with the medium window;
the shell packaging top cover is arranged at the top of the sensor packaging shell.
Optionally, the infrared temperature measurement component comprises a main PCB, a battery pack component and a power supply electric quantity indication module;
the battery pack assembly and the power supply electric quantity indicating module are electrically connected with the main PCB.
Optionally, be provided with the interface that charges and be used for the electric quantity display module butt joint interface with the pilot lamp butt joint on the casing encapsulation top cap.
Optionally, the glass press plate mounting groove and the infrared glass mounting groove are both cylindrical grooves.
Optionally, the radius of the glass press plate mounting groove is larger than that of the infrared glass mounting groove;
the radius of the infrared glass mounting groove is larger than that of the through hole.
Optionally, one end of the glass pressing plate close to the infrared glass is fixedly provided with a circular boss for fastening the infrared glass.
Optionally, ethylene-propylene-diene monomer sealing gaskets are arranged on two sides of the infrared glass.
Optionally, a buffer gasket is arranged between the infrared glass and the glass pressing plate.
Optionally, the medium window is fixedly connected with the GIS housing.
Optionally, the material of the sensor package casing is an aluminum alloy.
According to the technical scheme, the embodiment of the application has the following advantages: the device is provided with a medium window, a sensor packaging shell and a shell packaging top cover, wherein an infrared temperature measuring channel is arranged on the medium window, infrared glass and a glass pressing plate are arranged in the infrared temperature measuring channel, the medium window is arranged at the bottom of the sensor packaging shell, an infrared temperature measuring component for measuring temperature is arranged in the sensor packaging shell, a concave table for matching the infrared temperature measuring component with the medium window to be in butt joint is arranged at the bottom of the sensor packaging shell, the shell packaging top cover is arranged at the top of the sensor packaging shell, the non-contact type infrared temperature measurement of a contact and a bus can be realized through the matching of the medium window and the sensor packaging shell, the operation stability and the insulation safety of the GIS are ensured when the temperature of the contact and the bus is measured, and the measured temperature is more reliable and accurate, meanwhile, the optical path for measuring the temperature by, and is more beneficial to the development of infrared temperature measurement.
Drawings
FIG. 1 is a cross-sectional view of a dielectric window in an embodiment of the present application;
FIG. 2 is a top view of a media window in an embodiment of the present application;
FIG. 3 is a cross-sectional view of a glass platen in an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a sensor package in an embodiment of the present application;
FIG. 5 is a cross-sectional view of a sensor package in an embodiment of the present application;
FIG. 6 is a schematic structural diagram of a top cover of the housing package in the embodiment of the present application;
FIG. 7 is a schematic layout view of a 110KV temperature measuring medium window in the embodiment of the present application;
FIG. 8 is a schematic layout view of a 220KV temperature measuring dielectric window in the embodiment of the present application;
wherein the reference numerals are:
1-medium window, 2-sensor packaging shell, 3-shell packaging top cover, 11-glass pressing plate, 12-infrared glass, 13-infrared temperature measuring channel, 14-first mounting threaded hole, 21-concave table, 22-central sensor mounting piece, 23-second mounting threaded hole, 31-charging interface, 32-electric quantity display module butt joint interface, 33-indicator light, 34-power main switch, 111-circular boss and 112-pressing plate mounting threaded hole.
Detailed Description
In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The present application provides an embodiment of a GIS housing temperature measurement device, and particularly refers to fig. 1 to 6.
GIS casing temperature measuring device in this embodiment includes: a dielectric window 1, a sensor packaging shell 2 and a shell packaging top cover 3, wherein the dielectric window 1 is provided with an infrared temperature measuring channel 13, the infrared temperature measuring channel 13 comprises a glass pressure plate mounting groove arranged at the bottom of the dielectric window 1, the infrared glass mounting groove and the infrared glass mounting groove that set up in the glass clamp plate mounting groove are along the perpendicular through-hole of seting up in 1 top of medium window, be provided with infrared glass 12 and the glass clamp plate 11 that is used for compressing tightly infrared glass 12 in infrared glass mounting groove and the glass clamp plate mounting groove respectively, glass clamp plate 11 is fixed in the glass clamp plate mounting groove through the mounting, medium window 1 is installed in the bottom of sensor packaging shell 2, be provided with the infrared temperature measurement subassembly that is used for the temperature measurement in the sensor packaging shell 2, the bottom of sensor packaging shell 2 is provided with the concave station 21 that is used for cooperating infrared temperature measurement subassembly and medium window 1 butt joint, casing encapsulation top cap 3 is installed in the top.
It should be noted that: the temperature measurement device is provided with a medium window 1, a sensor packaging shell 2 and a shell packaging top cover 3, wherein an infrared temperature measurement channel 13 is arranged on the medium window 1, infrared glass 12 and a glass pressing plate 11 are arranged in the infrared temperature measurement channel 13, the medium window 1 is arranged at the bottom of the sensor packaging shell 2, an infrared temperature measurement component for measuring temperature is arranged in the sensor packaging shell 2, a concave table 21 for matching the infrared temperature measurement component with the medium window 1 to be in butt joint is arranged at the bottom of the sensor packaging shell 2, the shell packaging top cover 3 is arranged at the top of the sensor packaging shell 2, the non-contact type infrared temperature measurement of a contact and a bus can be realized through the matching of the medium window 1 and the sensor packaging shell 2, the operation stability and the insulation safety of a GIS are ensured when the temperature of the contact and the bus is measured, the measured temperature is more reliable and accurate, and meanwhile, the interference of an infrared light path is reduced, and the development of infrared temperature measurement is facilitated.
The above is a first embodiment of the GIS housing temperature measuring device provided in the embodiment of the present application, and the following is a second embodiment of the GIS housing temperature measuring device provided in the embodiment of the present application, please refer to fig. 1 to 8 specifically.
GIS casing temperature measuring device in this embodiment includes: the infrared temperature measurement device comprises a medium window 1, a sensor packaging shell 2 and a shell packaging top cover 3, wherein an infrared temperature measurement channel 13 is formed in the medium window 1, and the infrared temperature measurement channel 13 comprises a glass pressing plate mounting groove formed in the bottom of the medium window 1, an infrared glass mounting groove formed in the glass pressing plate mounting groove and a through hole vertically formed in the infrared glass mounting groove along the top of the medium window 1, wherein chamfers with the radius of 0.5mm are required to be formed in four corners of the infrared glass mounting groove so as to ensure the safety of infrared glass 12; the infrared glass mounting groove and the glass pressing plate mounting groove are respectively internally provided with infrared glass 12 and a glass pressing plate 11 for pressing the infrared glass 12, the glass pressing plate 11 is fixed in the glass pressing plate mounting groove through a fixing piece, specifically, the glass pressing plate 11 is provided with a plurality of pressing plate mounting threaded holes 112 for mounting the glass pressing plate 11, and the glass pressing plate 11 is fixed in the glass pressing plate mounting groove of the medium window 1 through 8 compression screws.
One side of the dielectric window 1, which is provided with the glass pressing plate 11, is arranged at the bottom of the sensor packaging shell 2, specifically, 8 first mounting threaded holes 14 for fixedly connecting with the sensor packaging shell 2 are formed in the outermost side of the dielectric window 1, an infrared temperature measurement component for measuring temperature is arranged in the sensor packaging shell 2, a concave platform 21 for matching the infrared temperature measurement component with the dielectric window 1 in a butt joint mode is arranged at the bottom of the sensor packaging shell 2, and the dielectric window 1 adopts a low-pull opening packaging mode, so that the infrared temperature measurement component can measure temperature by being closer to a GIS shell; the shell packaging top cover 3 is arranged at the top of the sensor packaging shell 2; the medium window 1 is fixedly connected with the GIS shell.
It should be noted that: when the GIS normally works, high-pressure gas is filled in the shell, so that the pressure resistance of the GIS shell packaging form is guaranteed to be qualified, no influence or almost negligible influence on the air tightness is caused, and the influence on the electric field distribution of the GIS shell cannot be influenced or reduced as much as possible by adding the medium window 1 is considered. Again, it must be taken into account that the dielectric window 1, which serves as a channel for measuring the temperature, must be matched to the temperature measuring sensor. In consideration of the above 3 factors, the dielectric window 1 in the temperature measuring device is packaged by infrared cylindrical glass which can transmit 7-14 um wavelength, and the diameter of the infrared glass 12 can be 30mm by 18 mm.
The infrared temperature measurement assembly comprises a main PCB, a battery pack assembly and a power supply electric quantity indication module, and the battery pack assembly and the power supply electric quantity indication module are electrically connected with the main PCB.
Specifically, a central sensor mounting piece 22 is arranged above the concave table 21, and the inner side surface of the central sensor mounting piece is provided with a thread which is matched with the thread at the head of the infrared temperature measurement component, so that the infrared temperature measurement component is positioned and fixed to a certain extent; the bottom of the sensor packaging shell 2 is provided with second mounting threaded holes 23 in one-to-one correspondence with the first mounting threaded holes 14, the parts above the second mounting threaded holes 23 are designed into a cylindrical cavity, the non-threaded part at the tail part of the infrared temperature measurement assembly and the lead part of the sensor are distributed at the center of the cavity, the head part of the mounting position of the infrared temperature measurement assembly starts to face the direction of the top cover 3 of the shell packaging, a main PCB is distributed in sequence, a steel plug platform is arranged, a battery pack assembly and a power supply electric quantity indication module, the steel plug platform is used for isolating the main PCB from the battery pack assembly and playing a supporting role, a base of the battery pack assembly is used in the vertical direction, and the safety of.
A charging interface 31 and an electric quantity display module docking interface 32 for docking with an indicator light 33 are arranged on the shell packaging top cover 3, and specifically, a waterproof plug is arranged on the charging interface 31, so that circuit faults caused by water entering the charging interface 31 can be prevented; the shell packaging top cover 3 is provided with a power main switch 34 for controlling the power on-off of the whole temperature measuring circuit.
The glass pressing plate mounting groove and the infrared glass mounting groove are cylindrical grooves.
The radius of the glass press plate mounting groove is larger than that of the infrared glass mounting groove; the radius of infrared glass mounting groove is greater than the radius of through-hole, and whole appearance is outside protruding form, and such design has guaranteed that GIS casing electric field receives the influence less, more is favorable to medium window 1's encapsulation to, the gas tightness of GIS casing has indirectly been guaranteed. Meanwhile, the structure enables the assembly of the sensor packaging shell 2 to be simpler, and enables operations such as screwing to be easy to operate.
As shown in fig. 3, an annular boss 111 for fastening the infrared glass 12 is fixedly provided at one end of the glass platen 11 close to the infrared glass 12.
Both sides of the infrared glass 12 are provided with ethylene-propylene-diene monomer sealing gaskets, and the medium window 1 adopts the infrared glass 12 and the ethylene-propylene-diene monomer sealing gaskets for encapsulation, so that the air tightness of the GIS device is solved, the sensor encapsulation shell 2 and the GIS shell are mutually independent, and the sensor is replaced more safely and conveniently in the later period.
It can be understood that: the infrared glass 12 is selected to take into account the uncertainty of the sensor's optical path, the price of the infrared glass 12, and the need for sealing and soldering as the aperture is larger, among other factors, in a particular application.
Be provided with the buffer spacer between infrared glass 12 and the glass clamp plate 11, have the effect of buffering, prevent that infrared glass 12 from taking place to damage when fastening glass clamp plate 11.
The sensor packaging shell 2 is made of aluminum alloy, and is low in density and convenient to mount; it can be understood that: in order to cooperate with the dielectric window 1, the sensor package 2 can be designed as a cylinder with a hollow interior.
In specific implementation, as shown in fig. 7, temperature measuring medium windows 1 in a 110KV voltage-class GIS system are mainly arranged at two sides and a middle position of a straight-tube section shell, wherein 3 medium windows 1 at two sides are respectively used as channels for measuring the temperature of a three-phase contact, 3 medium windows 1 at a middle position are used as channels for measuring the temperature of a middle three-phase bus, each group of 3 medium windows 1 is distributed on the shell at an angle of 120 degrees and respectively faces a, B, and C three-phase contacts or buses, in addition, 1 temperature measuring medium window 1 is arranged at a position right above an isolation disconnecting link contact of a 110KV GIS three-station shell section, the medium window 1 is used as a temperature measuring channel for measuring the temperature of a phase moving contact of a three-station isolation switch, and 10 medium windows 1 are provided in total for the 110 KV.
As shown in fig. 8, in a GIS system with 220KV voltage class, temperature measuring dielectric windows 1 are mainly distributed at contact positions on two sides of a GIS housing, different from a 110KV housing, A, B and C three phases of 220KV are separated, the three phases need to be separately provided with the dielectric windows 1, the three-phase dielectric windows 1 are respectively arranged at positions right above contacts on two sides of each phase of the housing, the positions of the contacts of the disconnecting link isolated from a and C are respectively provided with the dielectric windows 1 for monitoring and measuring the temperature of the moving contact of the disconnecting link isolated from a and C, and the GIS housing with 220KV voltage class has 8 dielectric windows 1 in total. This dielectric window 1 can be used for temperature measurement including various forms of contact failure.
The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (10)
1. A GIS shell temperature measuring device is characterized by comprising: the sensor comprises a medium window, a sensor packaging shell and a shell packaging top cover;
an infrared temperature measuring channel is arranged on the medium window;
the infrared temperature measuring channel comprises a glass pressing plate mounting groove formed in the bottom of the medium window, an infrared glass mounting groove formed in the glass pressing plate mounting groove and a through hole vertically formed in the infrared glass mounting groove along the top of the medium window;
the infrared glass mounting groove and the glass pressing plate mounting groove are respectively internally provided with infrared glass and a glass pressing plate for pressing the infrared glass;
the glass pressing plate is fixed in the glass pressing plate mounting groove through a fixing piece;
the dielectric window is arranged at the bottom of the sensor packaging shell;
an infrared temperature measuring component for measuring temperature is arranged in the sensor packaging shell;
the bottom of the sensor packaging shell is provided with a concave platform which is used for matching the infrared temperature measurement component and is in butt joint with the medium window;
the shell packaging top cover is arranged at the top of the sensor packaging shell.
2. The GIS shell temperature measuring device of claim 1, wherein the infrared temperature measuring assembly comprises a main PCB, a battery pack assembly and a power supply electric quantity indicating module;
the battery pack assembly and the power supply electric quantity indicating module are electrically connected with the main PCB.
3. The GIS shell temperature measuring device of claim 2, wherein the shell packaging top cover is provided with a charging interface and a power display module docking interface for docking with the indicator light.
4. The GIS housing temperature measurement device of claim 1, wherein the glass press plate mounting groove and the infrared glass mounting groove are both cylindrical grooves.
5. The GIS shell temperature measuring device of claim 4, wherein the radius of the glass press plate mounting groove is larger than the radius of the infrared glass mounting groove;
the radius of the infrared glass mounting groove is larger than that of the through hole.
6. The GIS shell temperature measuring device of claim 1, wherein a circular boss for fastening the infrared glass is fixedly arranged at one end of the glass pressing plate close to the infrared glass.
7. The GIS shell temperature measuring device of claim 1, wherein ethylene-propylene-diene monomer sealing gaskets are arranged on two sides of the infrared glass.
8. The GIS shell temperature measurement device of claim 1, wherein a buffer gasket is disposed between the infrared glass and the glass pressing plate.
9. The GIS shell temperature measurement device of claim 1, wherein the dielectric window is fixedly connected to the GIS shell.
10. The GIS shell temperature measurement device of claim 1, wherein the sensor package is made of aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921835192.2U CN210375429U (en) | 2019-10-29 | 2019-10-29 | GIS shell temperature measuring device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921835192.2U CN210375429U (en) | 2019-10-29 | 2019-10-29 | GIS shell temperature measuring device |
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| CN210375429U true CN210375429U (en) | 2020-04-21 |
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| CN201921835192.2U Active CN210375429U (en) | 2019-10-29 | 2019-10-29 | GIS shell temperature measuring device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110631713A (en) * | 2019-10-29 | 2019-12-31 | 广东电网有限责任公司 | GIS shell temperature measuring device |
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- 2019-10-29 CN CN201921835192.2U patent/CN210375429U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110631713A (en) * | 2019-10-29 | 2019-12-31 | 广东电网有限责任公司 | GIS shell temperature measuring device |
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