CN210532802U

CN210532802U - High-efficiency refrigerating system

Info

Publication number: CN210532802U
Application number: CN201921299299.XU
Authority: CN
Inventors: 姚利; 姚旺
Original assignee: Shenzhen City Olks Technology Co ltd
Current assignee: Shenzhen City Olks Technology Co ltd
Priority date: 2019-08-12
Filing date: 2019-08-12
Publication date: 2020-05-15
Anticipated expiration: 2029-08-12

Abstract

The utility model discloses a high-efficiency refrigerating system, which comprises a shell, a water tank is arranged in the shell, one side of the water tank is communicated with the water pumping end of a water pump, the water outlet end of the water pump is communicated with a second pipe body, one end of the second pipe body is communicated with a thermocouple refrigerating device, one side of the thermocouple refrigerating device is communicated with a first pipe body, the first pipe body is communicated with the water tank, and the thermocouple refrigerating device comprises a first heat dissipation block, a semiconductor refrigeration piece, a second heat dissipation block, a fixed plate and a first heat dissipation fan; when the refrigeration temperature of glue is adjusted according to actual conditions, the rotational speed of water pump is adjusted through the second switch, and the velocity of flow and the temperature of control water through the refrigeration effect of third switch control semiconductor refrigeration piece for UV glue can be in people required temperature, and the staff can know the actual temperature of UV glue through looking over the temperature information on the display screen simultaneously, is convenient for control the temperature of UV glue.

Description

High-efficiency refrigerating system

Technical Field

The utility model relates to a refrigeration technology field specifically is a high-efficient refrigerating system.

Background

In the field of glue curing application, the LED lamp industry and the like, the water-cooling solidification of the two-component glue is often required to slow down the mixing and curing rate of the glue, and an external condensation measure is often required. In single-component UV glue, also often need ultraviolet light source heating to shine, however, because solidification efficiency is not very ideal, often need increase irradiation intensity, the light source generates heat and has just become additional problem, and at this moment, still need the cooling measure, current glue refrigeration plant can not satisfy and adjust the refrigeration temperature of glue according to actual conditions, for this reason, provides a high-efficient refrigerating system.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high-efficient refrigerating system to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient refrigerating system, includes the casing, the internally mounted of casing has the water tank, one side of water tank communicates in the end of taking out water of water pump, the play water end intercommunication of water pump has the second body, the one end intercommunication of second body has the electric heat couple refrigerating plant, one side intercommunication of electric heat couple refrigerating plant has first body, first body with the water tank intercommunication, electric heat couple refrigerating plant includes first radiating block, semiconductor refrigeration piece, second radiating block, fixed plate and first radiator fan.

As further preferable in the present technical solution: the inside of first radiating block has the cavity, the both sides of first radiating block respectively with first body and second body intercommunication, the semiconductor refrigeration piece is located the upper surface of first radiating block, the second radiating block is located the upper surface of semiconductor refrigeration piece, first radiating block the semiconductor refrigeration piece with the second radiating block all is located the inside of fixed plate.

As further preferable in the present technical solution: the upper surface of water tank intercommunication has the water injection pipe, the one end of water injection pipe runs through the casing.

As further preferable in the present technical solution: the second radiating block comprises a plane portion, a protruding portion and a U-shaped groove portion, the lower surface of the plane portion is attached to the upper surface of the semiconductor refrigerating sheet, the protruding portion is integrally formed on the upper surface of the plane portion, and the U-shaped groove portion is arranged on the upper surface of the protruding portion.

As further preferable in the present technical solution: the first heat dissipation fan is installed on the upper surface of the second heat dissipation block, the second heat dissipation block is provided with a plurality of protruding portions, and the number of the protruding portions is not less than seven.

As further preferable in the present technical solution: a second cooling fan is installed on one side of the water tank, and a dustproof screen frame is installed on one side of the shell.

As further preferable in the present technical solution: temperature sensor is installed to one side of electric heat couple refrigerating plant, the front surface mounting of casing has controller and display screen, the front surface mounting of casing has first switch, second switch and third switch, first radiator fan second radiator fan the second switch with the electrical input of third switch all with the electrical output electric connection of first switch, the electrical output of second switch all with the electrical input electric connection of water pump, the electrical output of third switch with the electrical input electric connection of semiconductor refrigeration piece, temperature sensor's signal output part with the signal input part signal connection of controller.

Compared with the prior art, the beneficial effects of the utility model are that: when the refrigeration temperature of glue is adjusted according to actual conditions, the rotational speed of water pump is adjusted through the second switch, and the velocity of flow and the temperature of control water through the refrigeration effect of third switch control semiconductor refrigeration piece for UV glue can be in people required temperature, and the staff can know the actual temperature of UV glue through looking over the temperature information on the display screen simultaneously, is convenient for control the temperature of UV glue.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the internal structure of the housing of the present invention;

FIG. 3 is a schematic structural view of a second heat sink of the present invention;

fig. 4 is a connection diagram of the second heat dissipation block and the semiconductor refrigeration sheet of the present invention.

In the figure: 1. a housing; 2. a display screen; 3. a first switch; 4. a second switch; 5. a third switch; 6. a controller; 7. a thermocouple refrigeration device; 71. a first heat dissipation block; 72. a semiconductor refrigeration sheet; 73. a second heat dissipation block; 731. a planar portion; 732. a boss portion; 733. a U-shaped groove portion; 74. a fixing plate; 75. a first heat dissipation fan; 8. a water tank; 81. a water injection pipe; 82. a first pipe body; 9. a water pump; 91. a second tube body; 10. a temperature sensor; 11. a second heat dissipation fan; 12. a dustproof screen frame.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a high-efficient refrigerating system, includes casing 1, casing 1's internally mounted has water tank 8, one side of water tank 8 communicates in the end of drawing water of water pump 9, the play water end intercommunication of water pump 9 has second body 91, the one end intercommunication of second body 91 has thermocouple refrigerating plant 7, one side intercommunication of thermocouple refrigerating plant 7 has first body 82, first body 82 with water tank 8 intercommunication, thermocouple refrigerating plant 7 includes first radiating block 71, semiconductor refrigeration piece 72, second radiating block 73, fixed plate 74 and first radiator fan 75.

In this embodiment, specifically: a cavity is formed inside the first heat dissipation block 71, two sides of the first heat dissipation block 71 are respectively communicated with the first tube 82 and the second tube 91, the semiconductor chilling plate 72 is located on the upper surface of the first heat dissipation block 71, the second heat dissipation block 73 is located on the upper surface of the semiconductor chilling plate 72, and the first heat dissipation block 71, the semiconductor chilling plate 72 and the second heat dissipation block 73 are all located inside the fixing plate 74; through the above arrangement, the water pump 9 radiates the semiconductor refrigeration piece 72 from the water source extracted from the water tank 8 through the second pipe 91 into the first heat dissipation block 71, and then through the first pipe 82 into the water tank 8, and meanwhile, the second heat dissipation block 73 radiates the semiconductor refrigeration piece 72, and the semiconductor refrigeration piece 72 radiates the UV glue.

In this embodiment, specifically: the upper surface of the water tank 8 is communicated with a water injection pipe 81, and one end of the water injection pipe 81 penetrates through the shell 1; a water supply can be injected into the water tank 8 through the water injection pipe 81.

In this embodiment, specifically: the second heat dissipation block 73 includes a planar portion 731, a protruding portion 732, and a U-shaped groove portion 733, the lower surface of the planar portion 731 is attached to the upper surface of the semiconductor chilling plate 72, the protruding portion 732 is integrally formed on the upper surface of the planar portion 731, and the U-shaped groove portion 733 is opened on the upper surface of the protruding portion 732; with the above arrangement, the plane portion 731 is used for enlarging the contact area between the second heat dissipation block 73 and the semiconductor chilling plate 72, so as to improve the heat dissipation effect, and the protrusion portion 732 is provided with the U-shaped groove portion 733, so as to enlarge the contact area between the second heat dissipation block 73 and the outside air, so as to improve the heat dissipation effect of the second heat dissipation block 73 to the outside.

In this embodiment, specifically: the first heat dissipation fan 75 is mounted on the upper surface of the second heat dissipation block 73, the second heat dissipation block 73 is provided with a plurality of protrusions 732, and the number of the protrusions 732 is not less than seven; by providing the plurality of bosses 732 and the first heat dissipation fan 75, the heat dissipation effect of the second heat dissipation block 73 to the outside can be improved.

In this embodiment, specifically: a second cooling fan 11 is installed on one side of the water tank 8, and a dustproof screen frame 12 is installed on one side of the shell 1; through the above arrangement, the second heat dissipation fan 11 can improve the heat dissipation effect of the water tank 8, and the dustproof screen frame 12 can prevent dust from entering the inside of the housing 1.

In this embodiment, specifically: a temperature sensor 10 is installed on one side of the thermocouple refrigerating device 7, a controller 6 and a display screen 2 are installed on the front surface of the shell 1, a first switch 3, a second switch 4 and a third switch 5 are installed on the front surface of the shell 1, electrical input ends of the first heat dissipation fan 75, the second heat dissipation fan 11, the second switch 4 and the third switch 5 are electrically connected with an electrical output end of the first switch 3, an electrical output end of the second switch 4 is electrically connected with an electrical input end of the water pump 9, an electrical output end of the third switch 5 is electrically connected with an electrical input end of the semiconductor refrigerating sheet 72, a signal output end of the temperature sensor 10 is in signal connection with a signal input end of the controller 6 and is installed between the thermocouple refrigerating device 7 and the UV glue through the temperature sensor 10, the actual temperature can be measured, the measured temperature information is transmitted to the controller 6, the information is processed by the controller 6 and is converted into text information to be displayed on the display screen 2, a worker can adjust the rotating speed of the water pump 9 through the second switch 4 according to the temperature information and the required temperature condition, and the heat absorption effect of the semiconductor refrigeration sheet 72 can be adjusted according to the third switch 5.

In this embodiment: the model of the semiconductor refrigerating sheet 72 is TEC-12703.

In this embodiment: the water pump 9 is of the type NMBP 12.

In this embodiment: the temperature sensor 10 is model number DS18B 20.

In this embodiment: the controller 6 is a controller structure made of a PLC board of model ZG 043.

In this embodiment: the first and second

heat dissipation fans

75 and 11 are ZP 011.

Working principle or structural principle: when the refrigerating temperature of the glue is adjusted according to actual conditions, the rotating speed of the water pump 9 is adjusted through the second switch 4, the flow rate and the temperature of water are controlled, meanwhile, the refrigerating effect of the semiconductor refrigerating sheet 72 is controlled through the third switch 5, so that the UV glue can be at the temperature required by people, the temperature of the UV glue is convenient to control, a worker can know the actual temperature of the UV glue by looking up the temperature information on the display screen 2, when the UV glue is radiated, a water source is injected into the water tank 8 through the water injection pipe 81, the water pump 9 extracts the water source from the water tank 8, the extracted water source enters the first radiating block 71 through the second pipe body 91 to radiate the semiconductor refrigerating sheet 72, then enters the water tank 8 through the first pipe body 82, meanwhile, the second radiating block 73 radiates the semiconductor refrigerating sheet 72, and the UV glue is radiated by the semiconductor refrigerating sheet 72, the utility model discloses refrigeration efficiency is high and fast, job stabilization and longe-lived, and it is simple and convenient to use, easily installation application.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high efficiency refrigeration system comprising a housing (1), characterized in that: the internally mounted of casing (1) has water tank (8), one side of water tank (8) communicates in the end of drawing water of water pump (9), the play water end intercommunication of water pump (9) has second body (91), the one end intercommunication of second body (91) has electric heat couple refrigerating plant (7), one side intercommunication of electric heat couple refrigerating plant (7) has first body (82), first body (82) with water tank (8) intercommunication, electric heat couple refrigerating plant (7) include first radiating block (71), semiconductor refrigeration piece (72), second radiating block (73), fixed plate (74) and first radiator fan (75).

2. A high efficiency refrigeration system as set forth in claim 1 wherein: the inside of first radiating block (71) has the cavity, the both sides of first radiating block (71) respectively with first body (82) and second body (91) intercommunication, semiconductor refrigeration piece (72) are located the upper surface of first radiating block (71), second radiating block (73) are located the upper surface of semiconductor refrigeration piece (72), first radiating block (71) semiconductor refrigeration piece (72) with second radiating block (73) all are located the inside of fixed plate (74).

3. A high efficiency refrigeration system as set forth in claim 1 wherein: the upper surface of water tank (8) intercommunication has water injection pipe (81), the one end of water injection pipe (81) is run through casing (1).

4. A high efficiency refrigeration system as set forth in claim 1 wherein: the second heat dissipation block (73) comprises a plane portion (731), a protruding portion (732) and a U-shaped groove portion (733), the lower surface of the plane portion (731) is attached to the upper surface of the semiconductor refrigeration sheet (72), the protruding portion (732) is integrally formed on the upper surface of the plane portion (731), and the U-shaped groove portion (733) is formed in the upper surface of the protruding portion (732).

5. A high efficiency refrigeration system as set forth in claim 4 wherein: the first heat dissipation fan (75) is mounted on the upper surface of the second heat dissipation block (73), the second heat dissipation block (73) is provided with a plurality of protrusions (732), and the number of the protrusions (732) is not less than seven.

6. A high efficiency refrigeration system as set forth in claim 1 wherein: a second cooling fan (11) is installed on one side of the water tank (8), and a dustproof screen frame (12) is installed on one side of the shell (1).

7. A high efficiency refrigeration system as set forth in claim 6 wherein: a temperature sensor (10) is arranged on one side of the electric thermocouple refrigerating device (7), the front surface of the shell (1) is provided with a controller (6) and a display screen (2), a first switch (3), a second switch (4) and a third switch (5) are arranged on the front surface of the shell (1), the electrical input ends of the first heat dissipation fan (75), the second heat dissipation fan (11), the second switch (4) and the third switch (5) are electrically connected with the electrical output end of the first switch (3), the electrical output end of the second switch (4) is electrically connected with the electrical input end of the water pump (9), the electrical output end of the third switch (5) is electrically connected with the electrical input end of the semiconductor refrigeration piece (72), and the signal output end of the temperature sensor (10) is in signal connection with the signal input end of the controller (6).