CN210513448U

CN210513448U - Temperature detection device for electronic product

Info

Publication number: CN210513448U
Application number: CN201921411618.1U
Authority: CN
Inventors: 艾纯; 侯春明
Original assignee: Chongqing Senci Electric Machinery Co Ltd
Current assignee: Chongqing Senci Electric Machinery Co Ltd
Priority date: 2019-08-28
Filing date: 2019-08-28
Publication date: 2020-05-12
Anticipated expiration: 2029-08-28

Abstract

The utility model discloses a temperature-detecting device for electronic product, including PCB base plate, radiator and thermistor, the radiator is installed on the PCB base plate, thermistor passes through the copper foil subsides to be welded just the next-door neighbour on the PCB base plate the radiator, thermistor with the copper foil electricity is connected, the copper foil top covers there is one deck high temperature insulating film, the copper foil extends to the below of radiator, the radiator install extremely cover completely during the PCB base plate high temperature insulating film. The utility model provides a temperature detection device, with low costs, simple to operate to the sampling precision is high.

Description

Temperature detection device for electronic product

Technical Field

The utility model relates to an electron device temperature detects technical field, concretely relates to temperature-detecting device for electronic product.

Background

When the electronic components run, heat is generated and accumulated in the electronic components to cause temperature rise, and the excessive temperature causes damage of the electronic components to affect the safety of the electric appliances. Usually, a heat sink is disposed on a power supply or a circuit board inside the electronic device to avoid the problem of damage to the electronic device caused by temperature rise due to excessive heat accumulation inside the electronic device. In addition, to better regulate the operating conditions of the products inside the system, the temperature inside the electronic device is typically sampled and monitored in real time.

The temperature sampling of the existing electronic product usually adopts a thermistor as a temperature sampling element, and the common mounting mode of the thermistor is as follows: the thermistor is directly fixed on the radiator through a lead and a screw; in the other method, the thermistor is bonded to the aluminum substrate and the aluminum substrate is fixed to the heat sink, but this method also requires lead wires and screws for fixing, and therefore, the process is complicated and the sampling error is large.

SUMMERY OF THE UTILITY MODEL

In order to solve the above-mentioned technical problem that exists among the prior art at least, the utility model provides a temperature-detecting device for electronic product, including PCB base plate, radiator and thermistor, the radiator is installed on the PCB base plate, thermistor passes through the copper foil subsides to be welded on the PCB base plate and next-door neighbour the radiator, thermistor with the copper foil electricity is connected, the copper foil top covers there is one deck high temperature insulating film, the copper foil extends to the below of radiator, the radiator install extremely cover completely during the PCB base plate high temperature insulating film.

In a preferred embodiment of the present invention, the heat sink is fixedly mounted to the PCB substrate by bolts or screws.

In a preferred embodiment of the present invention, the thermistor is further electrically connected to a control system.

Since the technical scheme is used, the beneficial effects of the utility model are that: the utility model provides a temperature detection device for electronic product, its thermistor need not to utilize auxiliary component such as lead wire and screw, directly pastes through the copper foil and welds on electronic product's PCB base plate to adopt the high temperature insulating film to do insulating treatment, simple to operate and cost reduction; the thermistor is close to the radiator, so that the sampling precision is improved.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is a schematic top view of the temperature detection device for electronic products according to the present invention.

Fig. 2 is a schematic cross-sectional structure diagram of the temperature detection device for electronic products according to the present invention.

Description of reference numerals:

1-a PCB substrate; 2-a radiator; 3-a thermistor; 4-copper foil; 5-high temperature insulating film.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, unless otherwise specified and limited, it is to be noted that the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, mechanically or electrically connected, or may be internal to two elements, directly or indirectly connected through an intermediate medium, and specific meanings of the terms may be understood by those skilled in the art according to specific situations.

Fig. 1 shows a top view structure of the temperature detection device for electronic products of the present invention, in which the heat sink 2 and the high temperature insulating film 5 are not mounted to the PCB substrate 1. Fig. 2 shows a cross-sectional structure of the temperature detection device for electronic products of the present invention. As shown in fig. 1 and 2, the temperature detecting device of the present invention includes a PCB substrate 1, a heat sink 2, and a thermistor 3. The heat sink 2 is mounted on the PCB substrate 1, and for example, the heat sink 2 may be fixedly mounted to the PCB substrate 1 by bolts or screws. The thermistor 3 is attached to the PCB substrate 1 via a copper foil 4, and the thermistor 3 is mounted on the PCB substrate 1 next to the heat sink 2. The thermistor 3 is adjacent to, but not in direct contact with, the heat sink 2.

The thermistor 3 is electrically connected with a copper foil 4, and a high-temperature insulating film 5 is covered on the copper foil 4. The copper foil 4 extends to below the heat spreader 2, and the heat spreader 2 completely covers the high-temperature insulating film 5 when mounted to the PCB substrate 1.

The thermistor 3 is electrically connected with the control system. The utility model discloses a temperature-detecting device is at the during operation, the temperature of 3 sensing radiators of thermistor 2 to give control system, thereby the operating condition of system control product with the temperature transmission that the sensing was arrived.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A temperature detection device for electronic products, includes PCB base plate (1), radiator (2) and thermistor (3), its characterized in that: radiator (2) are installed on PCB base plate (1), thermistor (3) are pasted through copper foil (4) and are welded PCB base plate (1) is last and the next-door neighbour radiator (2), thermistor (3) with copper foil (4) electricity is connected, copper foil (4) top covers has one deck high temperature insulation film (5), copper foil (4) extend to the below of radiator (2), radiator (2) install extremely completely cover during PCB base plate (1) high temperature insulation film (5).

2. The temperature detecting device for electronic products according to claim 1, wherein: the heat sink (2) is fixedly mounted to the PCB substrate (1) by bolts or screws.

3. The temperature detecting device for electronic products according to claim 2, wherein: the thermistor (3) is also electrically connected with a control system.