CN210505559U - MEMS flexible lead bonding equipment - Google Patents
MEMS flexible lead bonding equipment Download PDFInfo
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- CN210505559U CN210505559U CN201921037377.9U CN201921037377U CN210505559U CN 210505559 U CN210505559 U CN 210505559U CN 201921037377 U CN201921037377 U CN 201921037377U CN 210505559 U CN210505559 U CN 210505559U
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- protection casing
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Abstract
The utility model discloses a MEMS flexible lead bonding equipment, including the main casing, be connected with bonding operation equipment on the main casing, its characterized in that, fixedly connected with a pair of spacing post on the main casing, a pair of all rotate on the spacing post and be connected with the connecting plate, a pair of fixedly connected with transparent protection casing between the connecting plate, transparent protection casing and bonding operation equipment and main casing all match, cut a shifting chute on the lateral wall of transparent protection casing keeping away from bonding operation equipment, sliding connection has convex lens in the shifting chute, the shifting chute includes first spout and second spout, and first spout and second spout cross distribution; the utility model provides a flexible lead bonding equipment of MEMS, it installs the detachable protection casing, when not influencing ventilation cooling, is convenient for carry out detailed observation to bonding operation equipment, is difficult to produce the operation part that causes the mistake to touch and disturb to the bonding machine at research and development and teaching etc. in-process.
Description
Technical Field
The utility model relates to a MEMS bonding equipment technical field especially relates to a flexible lead bonding equipment of MEMS.
Background
Aiming at the characteristics of small quantity and multiple varieties of the current MEMS industrialization, the miniature MEMS flexible lead bonding machine aims at high performance, high adaptability and easy operation, the miniature MEMS flexible lead bonding machine in the prior art has multiple functions of single-spot welding, deep cavity welding, ball planting, wire arc control and the like, can adapt to lead operation of multiple packaging structures such as a PCB (printed circuit board), a dual-in-line tube shell, DIP (dual in-line package) and COB (chip on board), and is suitable for research institutions such as scientific research institutions and colleges, colleges and universities and professional companies engaged in research and development of MEMS sensor products to be used in the processes of product research and development, sample making, sizing, small-batch manufacturing and the like.
In the prior art, an operating part of a small and medium-sized MEMS flexible lead wire bonding machine is generally exposed, an operator needs to operate the bonding machine on a display screen through a nearby collocated microscopic vision system, error touch and interference to the operating part of the bonding machine are easily caused in the processes of research, development, teaching and the like, and artificially generated impurities also easily influence the bonding quality.
Therefore, in view of the above technical problems, it is necessary to provide a MEMS flexible wire bonding apparatus.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing a flexible lead bonding equipment of MEMS, it installs the detachable protection casing, when not influencing ventilation cooling, is convenient for carry out detailed observation to bonding operation equipment, is difficult to produce the operation part that causes the mistake to touch and disturb to the bonding machine at research and development and teaching etc. in-process.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
the utility model provides a flexible lead bonding equipment of MEMS, includes main shell, be connected with bonding operation equipment on the main shell, a serial communication port, a pair of spacing post of fixedly connected with on the main shell, it is a pair of all rotate on the spacing post and be connected with the connecting plate, it is a pair of the transparent protection casing of fixedly connected with between the connecting plate, transparent protection casing all matches with bonding operation equipment and main shell, the shifting chute is dug on the lateral wall that bonding operation equipment was kept away from to transparent protection casing, sliding connection has convex lens in the shifting chute, the shifting chute includes first spout and second spout, and first spout and second spout cross distribution.
As a further improvement of the utility model, the transparent protective cover is acrylic glass material, convex lens is resin material.
As a further improvement, the connecting plate is provided with a through hole, and the limiting column is positioned in the through hole.
As a further improvement, the main housing is provided with a limiting groove matched with the lower end of the transparent protective cover, and the lower end of the transparent protective cover is paved with a protective pad matched with the limiting groove.
As a further improvement of the utility model, the surfaces of the transparent protective cover and the convex lens are coated with oil-sparse layers.
As a further improvement of the present invention, the first sliding groove and the second sliding groove are vertically distributed.
As a further improvement of the utility model, the inner walls of the first sliding groove and the second sliding groove are both provided with polishing layers.
The utility model has the advantages that: the utility model provides a flexible lead bonding equipment of MEMS, it installs the detachable protection casing, when not influencing ventilation cooling, is convenient for carry out detailed observation to bonding operation equipment, is difficult to produce the operation part that causes the mistake to touch and disturb to the bonding machine at research and development and teaching etc. in-process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of an opening structure of a transparent protective cover of an MEMS flexible wire bonding apparatus according to an embodiment of the present invention;
fig. 2 is a partially exploded schematic view of a MEMS flexible wire bonding apparatus according to an embodiment of the present invention;
fig. 3 is a schematic view of a closed structure of a transparent shield of an MEMS flexible wire bonding apparatus according to an embodiment of the present invention;
fig. 4 is a close-up cross-sectional view of a transparent shield of a MEMS flexible wire bonding apparatus according to an embodiment of the present invention.
In the figure: 1. the device comprises a main shell, 2 bonding operation equipment, 3 limiting columns, 4 connecting plates, 5 transparent protective covers, 6 first sliding grooves, 7 second sliding grooves, 8 convex lenses, 9 limiting grooves, 10 protective pads and 11 through holes.
Detailed Description
In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
In the various figures of the present invention, certain dimensions of structures or portions are exaggerated relative to other structures or portions for ease of illustration, and thus, are used only to illustrate the basic structure of the subject matter of the present invention.
Terms such as "left", "right", and the like, used herein to denote relative spatial positions, are used for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "to the right" of other elements or features would then be oriented "to the left" of the other elements or features. Thus, the exemplary term "right side" may encompass both left and right orientations. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Referring to fig. 1-4, in a specific embodiment of the present invention, a flexible lead bonding device for MEMS, including main housing 1, main housing 1 is connected with bonding operation device 2, bonding operation device 2 is used for realizing flexible lead bonding, a pair of spacing posts 3 is fixedly connected with main housing 1, a pair of spacing posts 3 are connected with connecting plate 4 in a rotating manner, a pair of transparent protective cover 5 is fixedly connected between connecting plate 4, transparent protective cover 5 is matched with bonding operation device 2 and main housing 1, a side wall of bonding operation device 2 is kept away from to transparent protective cover 5, a moving groove is cut on, sliding connection has convex lens 8 in the moving groove, the moving groove includes first spout 6 and second spout 7, and first spout 6 and second spout 7 are distributed in a crossing manner.
The moving groove is used for limiting the convex lens 8, so that the convex lens 8 can move in the first sliding groove 6 and the second sliding groove 7.
Further, the transparent protective cover 5 is made of acrylic glass material, the convex lens 8 is made of resin material, and the transparent protective cover and the convex lens both have good light transmission performance and do not affect the observation of the bonding operation equipment 2 in the teaching or research process.
Further, a through hole 11 is drilled in the connecting plate 4, and the limiting column 3 is located in the through hole 11.
Specifically, connecting plate 4 and transparent protection casing 5 are integral structure, have certain elasticity, can be with connecting plate 4 joint on main casing 1 through the cooperation of through-hole 11 and spacing post 3, convenient to detach and change simultaneously, convenient to use
Furthermore, the main shell 1 is provided with a limit groove 9 matched with the lower end of the transparent protective cover 5, and the lower end of the transparent protective cover 5 is paved with a protective pad 10 matched with the limit groove 9, so that the fitting degree between the transparent protective cover 5 and the main shell 1 can be enhanced.
Furthermore, the surfaces of the transparent protective cover 5 and the convex lens 8 are coated with oil-repellent layers, so that fingerprints and oil stains are not easy to adhere when the transparent protective cover 5 and the convex lens 8 are pulled by hands, and the transparent protective cover is easy to clean.
Further, the first sliding chute 6 and the second sliding chute 7 are vertically distributed, and are reasonably arranged, and the main position of the bonding operation equipment 2 can be observed by moving the convex lens 8.
Further, the inner walls of the first sliding groove 6 and the second sliding groove 7 are provided with polishing layers, so that the sliding resistance of the convex lens 8 in the first sliding groove 6 and the second sliding groove 7 can be greatly reduced.
Specifically, convex lens 8 is close to the central point of 5 one ends of transparent protection casing and puts fixedly connected with stopper, and the stopper is located the shifting chute, can realize spacing convex lens 8, makes convex lens 8 can not drop.
When the multifunctional bonding operation device is used, as shown in fig. 3 and 4, the convex lens 8 is positioned at the lower part of the transparent protective cover 5 under the action of gravity, the gravity center of the transparent protective cover 5 can be lowered, the transparent protective cover 5 has a better stabilizing effect, gaps are reserved between the transparent protective cover 5 and the main shell 1 and between the transparent protective cover 5 and the bonding operation device 2, heat dissipation and ventilation are not easily influenced, when the local part of the bonding operation device 2 needs to be magnified and observed, the convex lens 8 can be moved to a proper position by hands to magnify the local part of the bonding operation device 2, the convex lens 8 is provided with two paths, namely a first chute 6 and a second chute 7, multi-angle observation on the bonding operation device 2 is convenient to realize, and the transparent protective cover 5 has a good frontal protection effect on the;
referring to fig. 1, when the bonding operation device 2 needs to be adjusted, the transparent protective cover 5 can be lifted, the bonding operation device 2 can be completely exposed, the operation is convenient, the transparent protective cover 5 and the connecting plate 4 can be integrally disassembled, and the transparent protective cover 5 and the connecting plate 4 can also be disassembled or replaced according to the needs.
According to the technical scheme provided by the utility model, the utility model discloses following beneficial effect has:
the utility model provides a flexible lead bonding equipment of MEMS, it installs the detachable protection casing, when not influencing ventilation cooling, is convenient for carry out detailed observation to bonding operation equipment, is difficult to produce the operation part that causes the mistake to touch and disturb to the bonding machine at research and development and teaching etc. in-process.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The utility model provides a flexible lead bonding equipment of MEMS, includes main shell (1), be connected with bonding operation equipment (2) on main shell (1), its characterized in that, a pair of spacing post (3) of fixedly connected with is gone up in main shell (1), and is a pair of all rotate on spacing post (3) and be connected with connecting plate (4), and is a pair of fixedly connected with transparent protection casing (5) between connecting plate (4), transparent protection casing (5) all match with bonding operation equipment (2) and main shell (1), cut the shifting chute on the lateral wall that bonding operation equipment (2) was kept away from in transparent protection casing (5), sliding connection has convex lens (8) in the shifting chute, the shifting chute includes first spout (6) and second spout (7), and first spout (6) and second spout (7) cross distribution.
2. The MEMS flexible wire bonding apparatus according to claim 1, wherein the transparent protective cover (5) is made of acrylic glass material, and the convex lens (8) is made of resin material.
3. The MEMS flexible wire bonding device according to claim 1, wherein the connecting plate (4) is provided with a through hole (11) and the limiting column (3) is located in the through hole (11).
4. The MEMS flexible wire bonding device according to claim 1, wherein the main housing (1) is provided with a limiting groove (9) matched with the lower end of the transparent protective cover (5), and the lower end of the transparent protective cover (5) is provided with a protective pad (10) matched with the limiting groove (9).
5. A MEMS flexible wire bonding apparatus according to claim 1, wherein the transparent protective cover (5) and the convex lens (8) are coated with an oil-repellent layer on their surfaces.
6. The MEMS flexible wire bonding apparatus according to claim 1, wherein the first runner (6) and the second runner (7) are vertically distributed.
7. The MEMS flexible wire bonding apparatus according to claim 1, wherein the inner walls of the first runner (6) and the second runner (7) are provided with polishing layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921037377.9U CN210505559U (en) | 2019-07-04 | 2019-07-04 | MEMS flexible lead bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921037377.9U CN210505559U (en) | 2019-07-04 | 2019-07-04 | MEMS flexible lead bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210505559U true CN210505559U (en) | 2020-05-12 |
Family
ID=70581363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921037377.9U Expired - Fee Related CN210505559U (en) | 2019-07-04 | 2019-07-04 | MEMS flexible lead bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210505559U (en) |
-
2019
- 2019-07-04 CN CN201921037377.9U patent/CN210505559U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200512 Termination date: 20210704 |