CN210489584U - Silicon chip cooling device - Google Patents

Abstract

The application discloses silicon chip cooling arrangement, including carrier, cooling body and the transport mechanism that is used for bearing the weight of the silicon chip, cooling body includes quick-witted case and the subassembly of blowing, and the subassembly of blowing is located quick-witted incasement, and the carrier is sent into quick-witted case via transport mechanism, and the subassembly of blowing is bloied to the carrier that gets into quick-witted case to the silicon chip in the cooling carrier. This application will carry the quick-witted case that sends into cooling body of silicon chip carrier through transport mechanism initiative, is equipped with the subassembly of blowing in the quick-witted case, is blown the cooling to the silicon chip by the subassembly of blowing, and the back is cooled off, is shifted out the carrier by transport mechanism initiative again to realize high-efficient, automatic cooling.

Description

Silicon chip cooling device

Technical Field

The application relates to the technical field of silicon wafer preparation equipment, in particular to equipment for cooling a silicon wafer.

Background

Silicon wafers, also called cells, are important components of solar devices, and in practical use, the silicon wafers are used for absorbing light energy and converting the light energy into electric energy. In order to improve the absorption and conversion capacity of the silicon wafer, the silicon wafer needs to be subjected to process treatment. After the process, the silicon wafer is in a high-temperature state, and the temperature of the silicon wafer needs to be reduced. In the traditional equipment, a carrier carrying silicon wafers is taken out manually and sent into cooling equipment, the cooling equipment is used for cooling the carrier in a centralized manner, and then the carrier is taken out manually, so that the efficiency is low.

Disclosure of Invention

The application aims to provide automatic equipment for efficiently cooling a silicon wafer.

In order to achieve the technical purpose, the technical scheme of the application is as follows:

a silicon chip cooling device comprises a carrier for bearing a silicon chip, a cooling mechanism and a conveying mechanism, wherein the cooling mechanism comprises a case and a blowing assembly, the blowing assembly is arranged in the case, the carrier is sent into the case through the conveying mechanism, and the blowing assembly blows air to the carrier entering the case so as to cool the silicon chip in the carrier.

Further, the subassembly of blowing includes a plurality of ventilation pipes, has all seted up a plurality of gas pockets on each ventilation pipe, ventilation pipe intercommunication air feeder, and air feeder blows off through the gas pocket to the ventilation pipe air feed, air current.

Further, the conveying mechanism comprises a conveying driving assembly and a conveying transfer assembly, the carrier is arranged on the conveying transfer assembly, and the conveying driving assembly is connected with and drives the conveying transfer assembly to enter and exit the chassis.

Further, the transfer driving assembly comprises a transfer driving member and a transfer guide member, the transfer guide member is arranged towards the chassis, the transfer assembly is connected with the transfer guide member in a sliding mode, and the transfer driving member is connected with and drives the transfer assembly to move along the transfer guide member.

Further, the transmission driving part comprises a motor and a gear arranged at the output end of the motor, the transmission transfer component comprises a rack meshed with the gear and a follower in sliding connection with the transmission guide part, the follower is connected with the rack, the rack is parallel to the transmission guide part, the carrier is arranged on the rack, the motor drives the gear to rotate, and the gear drives the rack and the follower to move along the transmission guide part.

Furthermore, the conveying guide piece comprises two opposite and parallel guide strips, the follower comprises two groups of rollers, one group of rollers are correspondingly arranged on one guide strip in a sliding mode, and the two groups of rollers are arranged on two opposite sides of the rack, so that the rack is hung between the two guide strips.

Furthermore, a hook is arranged below the rack, a hanger is arranged on the carrier, and the hanger can be sleeved into the hook, so that the carrier is suspended below the rack.

Furthermore, the conveying driving assembly further comprises a conveying limiting part for limiting the carrier to be far away from one side of the rack, the conveying limiting part comprises two limiting strips which are arranged oppositely and parallelly, the limiting strips are parallel to the conveying guide part, a follower clamped between the two limiting strips is arranged on the carrier, and the follower can move along the limiting strips.

Furthermore, the transmission driving assembly comprises at least two groups of transmission driving parts, and the two groups of transmission driving parts are respectively arranged at two ends of the extension direction of the transmission guide part.

Furthermore, a plurality of groups of conveying driving assemblies are arranged in the case, the plurality of groups of conveying driving assemblies are sequentially connected and penetrate through the case, and the conveying transfer assembly carries the carriers to be sequentially conveyed through the plurality of groups of conveying driving assemblies and penetrates through the case.

Compared with the prior art, the cooling mechanism is arranged on the machine case, the machine case is provided with the blowing assembly, the silicon wafer carrier is blown by the blowing assembly to be cooled, and the carrier is actively transferred out by the conveying mechanism after being cooled, so that efficient and automatic cooling is realized.

Drawings

FIG. 1 is a schematic view of a carrier according to the present application;

fig. 2 is a schematic structural diagram of an embodiment of the present application.

The figures of the above drawings are numbered: 100-carrier, 110-bottom plate, 111-positioning hole, 112-positioning pin, 120-cover plate, 130-hanger, 140-hook, 200-cooling mechanism, 210-cabinet, 220-blowing component, 221-ventilation pipe, 222-air hole, 300-transmission mechanism, 310-transmission driving component, 311-transmission driving component, 312-transmission guiding component, 320-transmission transfer component, 321-rack, 322-follower, 330-transmission limiting component, 331-limiting strip and 332-follower.

Detailed Description

For further explanation of the principles and construction of the present application, reference will now be made in detail to the embodiments of the present application, which are illustrated in the accompanying drawings. In addition, the following preferred embodiments are only some examples of the present application, and not all examples. Other embodiments, which can be derived by one of ordinary skill in the art from the embodiments given herein without making any creative effort, shall fall within the scope of the present application.

In the description of the present application, it is to be understood that the positional or orientational relationships indicated by the directional terms such as "front, rear, left, right, upper, lower", "lateral, vertical, horizontal" and "top, bottom" and the like are generally based on the positional or orientational relationships shown in the drawings and are for convenience of description and simplicity of description only, and that these directional terms are not intended to indicate and imply that the referenced device or element must have a particular orientation or be constructed and operated in a particular orientation and therefore should not be construed as limiting the scope of the present invention. The terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

The relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.

The coordinates in the following description are taken: in FIG. 1, the left and right are left and right, the up and down are up and down, the vertical direction is outward from the paper surface and is forward, otherwise, the vertical direction is backward.

As shown in fig. 1 and 2, the present application discloses a silicon wafer cooling apparatus, which includes a carrier 100 for carrying silicon wafers, a cooling mechanism 200 and a conveying mechanism 300. The cooling mechanism 200 includes a chassis 210 and a blowing assembly 220, the blowing assembly 220 is disposed in the chassis 210, the carrier 100 is sent into the chassis 210 through the conveying mechanism 300, and the blowing assembly 220 blows air to the carrier 100 entering the chassis 210 to cool the silicon wafer in the carrier 100.

Specifically, as shown in fig. 1, the carrier 100 includes a bottom plate 110 and a cover plate 120, wherein a plurality of accommodating cavities are formed at intervals on the bottom plate 110, each accommodating cavity can accommodate a silicon wafer, and the cover plate 120 covers the bottom plate 110 and can fix each silicon wafer. In order to facilitate the processing and cooling of the silicon wafer, the cover plate 120 is opened at positions corresponding to the receiving cavities, so that most of the silicon wafer can be exposed in the opening after the cover plate 120 covers the bottom plate 110. More specifically, the opening of the cover plate 120 is smaller than the silicon wafer, so that the cover plate 120 partially covers the silicon wafer to fix the silicon wafer in the accommodating cavity. Preferably, since the silicon wafer is regular quadrilateral, the position of the opening on the cover plate 120 corresponding to the four corners of the quadrilateral protrudes inwards, so that the cover plate 120 can cover the four corners of the silicon wafer, and ensure that most of the silicon wafer is exposed in the opening while the silicon wafer is stably fixed.

Further, in order to ensure that the cover plate 120 accurately covers the base plate 110 and the silicon wafers, the base plate 110 and the cover plate 120 are correspondingly provided with positioning holes 111 and positioning pins 112, and when the cover plate 120 covers the base plate 110, the positioning pins 112 are inserted into the corresponding positioning holes 111, so that the base plate 110 and the cover plate 120 are relatively fixed. Furthermore, since the carrier 100 carries a plurality of silicon wafers, in order to better fix each silicon wafer in the carrier 100, a plurality of sets of positioning holes 111 and positioning pins 112 are disposed on the carrier 100 and distributed around each accommodating cavity and the corresponding opening. It should be noted that the bottom plate 110 may be provided with a positioning hole 111, and the cover plate 120 may be correspondingly provided with a positioning pin 112; or the cover plate 120 is provided with a positioning hole 111, and the bottom plate 110 is correspondingly provided with a positioning pin 112; alternatively, the bottom plate 110 may be provided with positioning holes 111 and positioning pins 112, and the cover plate 120 may be provided with positioning pins 112 opposite to the positioning holes 111 of the bottom plate 110 and positioning holes 111 opposite to the positioning pins 112 of the bottom plate 110.

Further, in order to ensure the service life of the device, the cover plate 120 is mostly made of metal. Thus, the magnet is provided in the bottom plate 110, and the cover plate 120 can be fixed to the bottom plate 110 more preferably.

In an embodiment of the present application, the blowing assembly 220 includes a plurality of ventilation pipes 221, and each ventilation pipe 221 has a plurality of air holes 222. The air ducts 221 communicate with an external air supply device (not shown) which can supply air to the air ducts 221, and the air flows out through the air holes 222 to cool the carrier 100 and the silicon wafer.

The air supply device can provide air and cold air; when air is supplied, the air temperature is lower than the temperature of the carrier 100 and the silicon wafers in the carrier 100, so that heat can be dissipated, meanwhile, the air blowing assembly 220 blows air towards the carrier 100, air flow circulation can be accelerated, and cooling is facilitated; preferably, the air supply device supplies cold air, and the cold air is blown to the carrier 100 through the ventilation pipe 221 and the air hole 222 and also blown into the case 210, so that the temperature inside the case 210 can be reduced, and the carrier 100 and the silicon wafers therein can be continuously and efficiently cooled.

Further, air holes 222 of ventilation duct 221 are preferably provided toward vehicle 100 entering chassis 210, so that the air flow blown out through air holes 222 can be directly blown toward vehicle 100, thereby ensuring cooling efficiency. Further, the ventilation duct 221 is preferably provided in plurality around the vehicle 100 entering the chassis 210, ensuring a cooling effect.

The conveying mechanism 300 includes a conveying driving assembly 310 and a conveying transfer assembly 320, the carrier 100 is disposed on the conveying transfer assembly 320, and the conveying driving assembly 310 is connected to and drives the conveying transfer assembly 320 and the carrier 100 carried by the conveying transfer assembly 320 to enter the chassis 210 for cooling; after cooling, the transfer driving assembly 310 drives the transfer relay assembly 320 and the carrier 100 carried by the transfer relay assembly to leave the chassis 210.

Specifically, the transfer driving assembly 310 includes a transfer driving member 311 and a transfer guiding member 312, wherein the transfer guiding member 312 is disposed toward the chassis 210, the transfer relay assembly 320 is slidably connected to the transfer guiding member 312, and the transfer driving member 311 is connected to and drives the transfer relay assembly 320 to move along the transfer guiding member 312. Therefore, after the carrier 100 to be cooled enters the conveying mechanism 300, the conveying driving element 311 operates to drive the conveying relay assembly 320 to carry the carrier 100 and move along the conveying guide 312 to the chassis 210, and after the carrier 100 enters the chassis 210 and is cooled, the conveying driving element 311 drives the conveying relay assembly 320 to carry the carrier 100 and leave the chassis 210 along the conveying guide 312.

In an embodiment of the present invention, the chassis 210 is provided with only one entrance, and after the transfer driving element 311 drives the transfer transferring assembly 320 to carry the carrier 100, enter the chassis 210 along the transfer guiding element 312, and complete the cooling, the transfer driving element 311 reverses to drive the transfer transferring assembly 320 to carry the carrier 100, and leave the chassis 210 along the transfer guiding element 312.

In another embodiment of the present application, the chassis 210 has an entrance and an exit, and the transfer guide 312 is disposed from the entrance to the exit, that is, after the transfer driving unit 311 drives the transfer transferring assembly 320 to carry the carrier 100, enters the chassis 210 along the transfer guide 312, and completes cooling, the transfer driving unit 311 continues to drive the transfer transferring assembly 320 to carry the carrier 100, moves forward along the transfer guide 312, and the transfer transferring assembly 320 and the carrier 100 carried thereby exit the chassis 210 from the exit. In this embodiment, since the transfer driving member 311 drives the transfer transferring assembly 320 to transfer into and out of the chassis 210 along the transfer guiding member 312, the transfer transferring assembly 320 can continuously enter the chassis 210 without reverse transportation, that is, the transferring mechanism 300 may include a plurality of sets of transfer transferring assemblies 320, each set of transfer transferring assembly 320 may carry a carrier 100, and when one set of transfer transferring assembly 320 is transferred to the chassis 210 through the transfer driving assembly 310, the next set of transfer transferring assembly 320 can be transferred to the chassis 210 through the transfer driving assembly 310; alternatively, after a set of transfer modules 320 carrying cooled carriers 100 is moved out of the housing 210 by the transfer drive module 310, a new set of transfer modules 320 is moved into the housing 210 by the transfer drive module 310. Therefore, the working efficiency of the cooling equipment can be improved, and uninterrupted and efficient cooling is realized.

In order to facilitate the circulation of the carrier 100 and avoid the need for external loading and unloading devices to assist the loading and unloading of the carrier 100 when the carrier 100 enters or exits the conveying mechanism 300, in an embodiment of the present invention, the conveying driving member 311 includes a motor and a gear disposed at an output end of the motor, and the conveying transferring assembly 320 includes a rack 321 engaged with the gear and a follower 322 slidably connected to the conveying guiding member 312. The follower 322 is connected to a rack 321, and the rack 321 is parallel to the transfer guide 312. In order to facilitate carrying of the carrier 100, a hanger 130 is disposed on one side of the carrier 100, and correspondingly, a hook 140 is disposed on the rack 321, and the carrier 100 is hung in the hook 140 through the hanger 130, so that the carrier 100 can be conveniently hung on the transfer transferring assembly 320 or taken down from the transfer transferring assembly 320. In summary, the transmission driving element 311 is operated, the motor drives the gear to rotate, the gear drives the rack 321 engaged with the gear and the follower 322 on the rack 321 to move along the transmission guiding element, and the rack 321 further drives the carrier 100 to move. Through the cooperation of the gear and the rack 321, the transmission driving component 311 is fixedly arranged, and the transmission transferring component 320 can carry the carrier 100 to be separated from the current transmission driving component 310, so as to realize active feeding and discharging.

Since the carrier 100 is hung on the hook 140 by the hanger 130, the transfer driving assembly 310 is preferably disposed above the carrier 100 and is in transmission connection with the transfer relay assembly 320. Specifically, the transmission guide 312 includes two opposite and parallel guide bars, and correspondingly, the follower 322 includes two sets of rollers, one set of rollers is correspondingly slidably disposed on one guide bar, and the two sets of rollers are disposed on two opposite sides of the rack 321, so that the rack 321 is hung between the two guide bars.

Further, since the rack 321 extends in a direction parallel to the conveying guide 312, has a certain length, and one set of rollers includes a plurality of rollers arranged in parallel to and spaced apart from the extending direction of the conveying guide 312, the rack 321 can be stably hung between the two guide bars by the two sets of rollers. Specifically, the upper surface of the guide bar for receiving the follower 322 is a guide surface, and the guide surface is flat and extends toward the chassis 210 to provide a reliable guide for the movement of the follower 322. When the rack 321 is hung between two guide bars, the follower 322 at two sides of the rack is correspondingly pressed on the guide surface, and the roller wheel surface of the follower 322 contacts the guide surface. When the transmission driving part 311 acts, the motor drives the gear to rotate, and the gear drives the rack 321 meshed with the gear and the carrier 100 carried by the rack to move, the followers 322 on two sides of the rack 321 respectively move along the corresponding guide surfaces.

Further, in order to facilitate the guide bar to receive the rack 321 during feeding, an inlet end of the guide bar is provided with a slope, and the slope gradually rises along the moving direction of the transfer unit 320.

Since the carrier 100 is suspended below the rack 321 by the hanger 130 and the hook 140, that is, the side of the carrier 100 close to the rack 321 is fixed relative to the transfer transferring assembly 320, in order to prevent the side of the carrier 100 away from the rack 321 from swinging due to unfixed state during the transfer process, which affects the transfer stability, the transfer driving assembly 310 further includes a transfer stopper 330 for limiting the side of the carrier 100 away from the rack 321. Specifically, the conveying stopper 330 includes two opposite and parallel stopper strips 331, the two stopper strips 331 are parallel to the conveying guide 312 and are disposed toward the chassis 210, and the carrier 110 is provided with a follower 332 engaged between the two stopper strips 331. When the motor drives the gear to rotate, and the gear drives the rack 321 engaged with the gear and the carrier 100 carried by the rack to move, the follower 332 can move along the two limit strips 331. Preferably, the follower 332 is a roller, and the two limiting strips 331 are disposed right below the two guiding strips to ensure that the carrier 100 is suspended below the rack 321 in a vertical state during the conveying process.

It should be noted that, unlike the above-described cooperation of the follower 322 and the transmission guide 312, the follower 332 is caught between the two stopper bars 331. The two stop strips 331 are disposed opposite to each other, and a gap therebetween forms a passage parallel to the conveying guide 312 and disposed toward the housing 210, and is just for the follower 332 to penetrate. When the follower 332 moves between the channels, the two limiting strips 331 are just clamped at two sides of the follower 332, on one hand, the follower 332 is limited, and the relative positions of the carrier 100 and the transfer assembly 320 are ensured to be consistent; on the other hand, the follower 332 is clamped between the two limiting strips 331 and can only move along the channel, and the channel can further provide guidance for the movement of the carrier 100 and the transfer assembly 320, so as to ensure stable and accurate transfer of the carrier 100.

Further, because the two limiting strips 331 can block the follower 332, in order to ensure that the follower 332 below the carrier 100 can accurately and quickly enter the channel under the driving of the transfer assembly 320, the ends of the two limiting strips 331 at the inlet end of the channel are outwardly expanded, so that the inlet of the channel is in a horn shape, that is, the inlet of the channel is gradually reduced, and the follower 332 is conveniently guided to enter after receiving the follower 332 and finally block the follower 332.

Further, since the carrier 100 extends in a direction parallel to the conveying guide 312 and has a certain length, a plurality of followers 332 are provided at intervals on a side of the carrier 100 away from the rack 321 to ensure that the side of the carrier 100 is stably confined between the two position-limiting strips 331 during the transportation.

Further, in order to ensure that the transfer transferring assembly 320 can carry the carrier 100 away from the current transfer driving assembly 310, so as to realize loading and unloading, the transfer driving assembly 310 includes at least two sets of transfer driving members 311, and the two sets of transfer driving members 311 are respectively disposed at two ends of the extension direction of the transfer guide 312 (i.e., the inlet end and the outlet end of the transfer guide 312).

In one embodiment, the present application includes only one set of the transfer driving assembly 310, and the transfer driving assembly 310 includes two sets of the transfer driving elements 311 and the transfer guiding elements 312. During loading, the rack 321 of the transfer transferring assembly 320 is engaged with the gear of the transfer driving element 311 disposed at the inlet end of the transfer guiding element 312, and the motor of the transfer driving element 311 drives the gear to rotate, so as to drive the rack 321 to move toward the chassis 210 along the transfer guiding element 312, until the carrier 100 enters the chassis 210, thereby achieving cooling. When the cooling is completed and the blanking is completed, the rack 321 continues to move forward under the driving of the gear until the rack is separated from the current transmission driving assembly 310. At this time, the rack 321 will be disengaged from the transfer driving member 311 at the entrance end of the transfer guiding member 312, and before the rack is completely disengaged, the rack 321 will be engaged with the gear of the transfer driving member 311 at the exit end of the transfer guiding member 312, so as to ensure that the transfer driving member 311 at the exit end of the transfer guiding member 312 continuously drives the transfer transferring assembly 320 to be disengaged from the transfer driving assembly 310, thereby completing the blanking process.

In another embodiment, in order to increase the processing efficiency of the apparatus, the present application includes a plurality of sets of conveyor driving assemblies 310, and the plurality of sets of conveyor driving assemblies 310 are connected in sequence and extend through the chassis 210. It should be noted that, in this embodiment, the plurality of sets of conveying driving assemblies 310 may respectively include a set of conveying guiding elements 312, and the plurality of sets of conveying guiding elements 312 are sequentially connected to penetrate through the chassis 210; the plurality of sets of transfer drive assemblies 310 may also share a set of transfer guides 312, the transfer guides 312 extending through the chassis 210. At this time, the carrier 100 carried by the transfer transferring assembly 320 can be sequentially transferred through the plurality of sets of transfer driving assemblies 310 and pass through the chassis 210, so as to realize loading, cooling and unloading. Since the plurality of sets of transfer driving assemblies 310 are disposed in the chassis 210, and the plurality of sets of transfer driving assemblies 310 include the plurality of sets of transfer driving members 311, after one set of transfer transferring assembly 320 is separated from one set of transfer driving member 311, the next set of transfer transferring assembly 320 can enter the transfer driving assembly 310, and thus, the plurality of sets of carriers 100 can be processed in the chassis 210 at the same time. It should be noted that, in the present embodiment, the set of transferring driving assembly 310 may include a set of transferring driving member 311, when feeding, the rack 321 of the transferring assembly 320 is engaged with the gear of the set of transferring driving member 311, and the motor of the transferring driving member 311 drives the gear to rotate, so as to drive the rack 321 to continuously move forward until the carrier 100 carried by the rack enters the chassis 100. As the rack 321 moves forward, it enters the next transport driving assembly 310, and the rack 321 engages with the gear of the next transport driving assembly 310 and gradually disengages from the previous gear, continuing further into the chassis 210. At this time, the rack 321 of the next transfer transferring assembly 320 can be engaged with the previous disengaged gear, and move … … toward the chassis 210. in this embodiment, one set of the transfer driving assemblies 310 may also include two sets of the transfer driving members 311 respectively disposed at two ends of the extension direction of the transfer guiding member 312. at this time, after the end of the carrier 100 is disengaged from the transfer driving member 311 at the entrance end, the next transfer transferring assembly 320 can enter the transfer driving assembly 310, so as to ensure stable loading and unloading and at the same time accelerate the loading speed.

Although the preferred embodiments of the present application have been described above with reference to the accompanying drawings, the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive. Those skilled in the art, having the benefit of this disclosure, may effect numerous modifications thereto and changes may be made without departing from the scope of the invention as defined by the appended claims. Therefore, all equivalent changes and modifications made according to the spirit of the present application should be covered in the protection scope of the present application.

Claims (10)

1. A silicon wafer cooling apparatus comprising a carrier (100) for carrying a silicon wafer, characterized in that: the silicon wafer cooling device is characterized by further comprising a cooling mechanism (200) and a conveying mechanism (300), wherein the cooling mechanism (200) comprises a case (210) and a blowing assembly (220), the blowing assembly (220) is arranged in the case (210), the carrier (100) is conveyed into the case (210) through the conveying mechanism (300), and the blowing assembly (220) blows air to the carrier (100) entering the case (210) so as to cool the silicon wafers in the carrier (100).

2. The wafer cooling apparatus of claim 1, wherein: the blowing assembly (220) comprises a plurality of ventilation pipes (221), a plurality of air holes (222) are formed in the ventilation pipes (221), the ventilation pipes (221) are communicated with an air supply device, the air supply device supplies air to the ventilation pipes (221), and air flow blows out through the air holes (222).

3. The wafer cooling apparatus of claim 1, wherein: the conveying mechanism (300) comprises a conveying driving assembly (310) and a conveying transfer assembly (320), the carrier (100) is arranged on the conveying transfer assembly (320), and the conveying driving assembly (310) is connected with and drives the conveying transfer assembly (320) to enter and exit the chassis (210).

4. The wafer cooling apparatus of claim 3, wherein: the conveying driving assembly (310) comprises a conveying driving part (311) and a conveying guide part (312), the conveying guide part (312) is arranged towards the case (210), the conveying transfer assembly (320) is connected with the conveying guide part (312) in a sliding mode, and the conveying driving part (311) is connected with and drives the conveying transfer assembly (320) to move along the conveying guide part (312).

5. The wafer cooling apparatus of claim 4, wherein: the conveying driving part (311) comprises a motor and a gear arranged at the output end of the motor, the conveying transfer component (320) comprises a rack (321) meshed with the gear and a follower (322) connected with the conveying guide part (312) in a sliding mode, the follower (322) is connected with the rack (321), the rack (321) is parallel to the conveying guide part (312), the carrier (100) is arranged on the rack (321), the motor drives the gear to rotate, and the gear drives the rack (321) and the follower (322) to move along the conveying guide part (312).

6. The wafer cooling apparatus of claim 5, wherein: the conveying guide piece (312) comprises two opposite and parallel guide strips, the follower (322) comprises two groups of rollers, one group of rollers are correspondingly arranged on one guide strip in a sliding mode, and the two groups of rollers are arranged on two opposite sides of the rack (321), so that the rack (321) is hung between the two guide strips.

7. The wafer cooling apparatus of claim 6, wherein: a hook (140) is arranged below the rack (321), a hanger (130) is arranged on the carrier (100), and the hanger (130) can be sleeved into the hook (140), so that the carrier (100) is suspended below the rack (321).

8. The wafer cooling apparatus of claim 7, wherein: the conveying driving assembly (310) further comprises a conveying limiting part (330) limiting one side of the carrier (100) far away from the rack (321), the conveying limiting part (330) comprises two limiting strips (331) which are arranged oppositely and in parallel, the limiting strips (331) are parallel to the conveying guide part (312), a follower (332) clamped between the two limiting strips (331) is arranged on the carrier (100), and the follower (332) can move along the limiting strips (331).

9. The wafer cooling apparatus of claim 5, wherein: the conveying driving assembly (310) comprises at least two groups of conveying driving pieces (311), and the two groups of conveying driving pieces (311) are respectively arranged at two ends of the extending direction of the conveying guide (312).

10. The silicon wafer cooling apparatus as claimed in any one of claims 3 to 9, wherein: the conveying transfer assembly (320) carries the carriers (100), and the carriers are sequentially conveyed through the plurality of conveying drive assemblies (310) and pass through the case (210).

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