CN210467787U

CN210467787U - Cleaning device

Info

Publication number: CN210467787U
Application number: CN201921880436.9U
Authority: CN
Inventors: 刘召军; 林大野; 莫炜静
Original assignee: Shenzhen Stan Technology Co Ltd
Current assignee: Shenzhen Stan Technology Co Ltd
Priority date: 2019-11-04
Filing date: 2019-11-04
Publication date: 2020-05-05
Anticipated expiration: 2029-11-04

Abstract

The utility model discloses a cleaning device relates to semiconductor manufacturing technical field. The cleaning device comprises a cleaning mechanism and a leakage-proof mechanism, wherein the leakage-proof mechanism comprises a receiving groove, the cleaning mechanism is arranged in the receiving groove, and the projections of the cleaning mechanism along the vertical direction are all positioned in the receiving groove; the bottom end of the leakage-proof mechanism is provided with a liquid outlet which is configured to be communicated with a sewage treatment device. This belt cleaning device is including being provided with the leak protection mechanism who accepts the groove, and the wiper mechanism all is located and accepts the inslot along the projection of vertical direction, has guaranteed that the washing liquid that leaks in the wiper mechanism and spills can fall into and accept in the groove. The leak protection mechanism bottom is provided with the leakage fluid dram, and the leakage fluid dram is linked together with sewage treatment plant, therefore during the washing liquid can be discharged into sewage treatment plant through the leakage fluid dram, has avoided the washing liquid to spill to workshop ground, reduces the conflagration hidden danger in semiconductor workshop.

Description

Cleaning device

Technical Field

The utility model relates to a semiconductor manufacturing technical field especially relates to a belt cleaning device.

Background

Wet cleaning is an important procedure in a semiconductor manufacturing process, the wet cleaning also comprises dozens of cleaning procedures, when the cleaning procedures are switched, a semiconductor chip is generally required to be moved from one cleaning tank to another cleaning tank, the cleaning solution remained on the chip in the moving or taking-out process is easy to drip onto the floor of a workshop, and further various electrical wires under the floor can be corroded, so that fire hazards are caused. In addition, because the cleaning tank is aged, cleaning liquid in the tank can also leak to the floor of a workshop to avoid hidden troubles of burying.

Accordingly, there is a need for a cleaning device to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a belt cleaning device can avoid the washing liquid in the washing tank to leak and spill to the workshop floor, reduces the conflagration hidden danger in semiconductor workshop.

To achieve the purpose, the utility model adopts the following technical proposal:

a cleaning device comprises a cleaning mechanism and a leakage-proof mechanism, wherein the leakage-proof mechanism comprises a receiving groove, the cleaning mechanism is arranged in the receiving groove, and the projections of the cleaning mechanism along the vertical direction are all positioned in the receiving groove; the bottom end of the leakage-proof mechanism is provided with a liquid outlet which is configured to be communicated with a sewage treatment device.

Optionally, an installation groove is formed in the receiving groove, and the bottom of the cleaning mechanism is installed in the installation groove.

Optionally, a projection is arranged in the receiving groove, the height of the projection is not less than the depth of the highest liquid level in the receiving groove, and the cleaning mechanism is mounted on the projection.

Optionally, the leak protection mechanism is made of a polyvinyl chloride material.

Optionally, the cleaning mechanism includes a cleaning tank and a mounting bracket disposed at the bottom of the cleaning tank, and the mounting bracket is disposed in the receiving tank.

Optionally, a drainage component is disposed within the receiving groove, the drainage component configured to direct liquid into the liquid discharge port.

Optionally, the leakage prevention mechanism is provided with an early warning component configured to sense whether liquid in the leakage prevention mechanism reaches an early warning liquid level line.

Optionally, an overflow port is arranged at the upper part of the leakage prevention mechanism, the overflow port is arranged above the early warning liquid level line, and the overflow port is communicated with the liquid discharge port.

Optionally, a plurality of liquid discharge ports are arranged in the leakage prevention mechanism.

Optionally, a floor drain is arranged at the liquid discharge opening.

The utility model has the advantages that:

the utility model provides a pair of belt cleaning device, including being provided with the leak protection mechanism who accepts the groove, the wiper mechanism all is located and accepts the inslot along the projection of vertical direction, has guaranteed that the washing liquid that leaks in the wiper mechanism and spill falls into and accepts the groove. The leak protection mechanism bottom is provided with the leakage fluid dram, and the leakage fluid dram is linked together with sewage treatment plant, therefore during the washing liquid can be discharged into sewage treatment plant through the leakage fluid dram, has avoided the washing liquid to spill to workshop ground, reduces the conflagration hidden danger in semiconductor workshop.

Drawings

Fig. 1 is a schematic structural view of a cleaning device according to a first embodiment of the present invention;

fig. 2 is a schematic structural view of a cleaning device provided in the second embodiment of the present invention;

fig. 3 is a schematic structural view of a cleaning device provided in the third embodiment of the present invention.

In the figure:

1. a cleaning mechanism; 2. a leakage prevention mechanism;

11. a cleaning tank; 12. a mounting frame; 21. a receiving groove; 22. a liquid discharge port; 23. an early warning component; 24. an overflow port;

211. mounting grooves; 212. and (4) a bump.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

The first embodiment is as follows:

as shown in fig. 1, the present embodiment provides a cleaning apparatus including a cleaning mechanism 1, the cleaning mechanism 1 being capable of cleaning a semiconductor chip. Since wet cleaning is required in a semiconductor manufacturing process and includes dozens of cleaning processes, semiconductor chips need to be transferred in a plurality of cleaning mechanisms in the cleaning process, corrosive cleaning liquid remained on the chips is easy to drip onto the floor of a workshop in the moving or taking-out process, and various electrical wires under the floor are further possibly corroded, so that fire hazards are caused. In addition, because the cleaning tank is aged, cleaning liquid in the tank may leak to the floor of a workshop to be buried.

For solving the above problem, the cleaning device of this embodiment further includes the leakage-proof mechanism 2, the receiving groove 21 is provided in the leakage-proof mechanism 2, the cleaning mechanism 1 is disposed in the receiving groove 21, and the projection of the cleaning mechanism 1 along the vertical direction is located in the receiving groove 21, so as to ensure that the cleaning liquid leaked in the cleaning mechanism 1 can fall into the receiving groove 21. In addition, leak protection mechanism 2 bottom is provided with leakage fluid dram 22, and leakage fluid dram 22 is configured as through-hole on the workshop floor and communicates the sewage treatment plant of floor below, therefore the washing liquid can be discharged into sewage treatment plant through leakage fluid dram 22, has avoided the washing liquid to spill to workshop ground, reduces the fire hazard in semiconductor workshop.

In order to facilitate the wet cleaning of the semiconductor chip, as shown in fig. 1, the cleaning mechanism 1 includes a cleaning tank 11 and a mounting bracket 12 disposed at the bottom of the cleaning tank 11 to elevate the cleaning mechanism 1 for performing the operation, in this embodiment, the mounting bracket 12 is disposed in the receiving tank 21 to ensure that the cleaning liquid leaked from the cleaning tank 11 falls into the receiving tank 21.

Preferably, the leakage preventing mechanism 2 is made of Polyvinyl Chloride (PVC) material, which has good corrosion resistance, is inexpensive, safe and durable, and is easily processed by various different types of equipment, changing its surface structure and texture. Through using polyvinyl chloride material preparation leak protection mechanism 2, can bear the weight of the washing liquid safely, avoided when the washing liquid is corrosive liquid leak protection mechanism 2 corroded and cause the consequence that the washing liquid spills.

In order to prevent the cleaning liquid leaked from the cleaning tank 11 from accumulating in the receiving tank 21, a drainage member is provided in the receiving tank 21 to ensure that the cleaning liquid flows into the liquid outlet 22 quickly. Specifically, the drainage component can be an inclined structure, and the liquid discharge port 22 is arranged on the lower side of the terrain, so that the cleaning liquid in the receiving groove 21 can be drained to the liquid discharge port 22 under the action of gravity. In addition, drainage component also can set up to groove structure, and the washing liquid is via recess drainage to leakage fluid dram 22 position, and when accepting the interior washing liquid of groove 21 less, the design through groove structure makes in the liquid inflow recess, and then has avoided washing liquid and 1 bottom large tracts of land contact of wiper mechanism. Other drainage structures may be adopted, and are not particularly limited herein.

Preferably, in order to accelerate the discharging rate of the cleaning liquid, a plurality of liquid discharging ports 22 are arranged in the leakage-proof mechanism 2, the drainage component is arranged corresponding to the positions of the liquid discharging ports 22, the cleaning liquid is discharged through the liquid discharging ports 22 simultaneously, when the cleaning liquid is prevented from being leaked in the receiving groove 21, the leakage-proof effect of the leakage-proof mechanism 2 is improved due to the fact that the liquid is discharged untimely.

Preferably, the drain port 22 is provided with a drain, so that on one hand, the drain rate can be increased through the structure of the drain, and on the other hand, the semiconductor chip can be prevented from carelessly falling in the clamping process, and further the accident that the semiconductor chip falls to the sewage treatment device through the drain port 22 can be prevented. Specifically, the floor drain can be set as an air-seal floor drain core, the floor drain device is opened by applying the permanent magnet gravity principle to brake up and down, hanging blockage cannot be formed during liquid drainage, meanwhile, the sealing gasket is automatically closed under the action of magnetic force after the liquid is cut off, gas in the pipeline is thoroughly sealed, and the phenomenon that cleaning liquid overflows back to the anti-leakage mechanism 2 when the sewage treatment device generates negative pressure is avoided. The floor drain can also be set up to eccentric formula water seal floor drain core, and the clearance is convenient and can prevent to return the excessive, and in addition, the floor drain also can adopt other structures, does not do not specifically limit here.

In order to improve safety when the cleaning liquid accumulated in the receiving tank 21 is excessive, as shown in fig. 1, the leakage preventing mechanism 2 is provided with an early warning part 23, and the early warning part 23 is configured to sense whether the liquid in the leakage preventing mechanism 2 reaches an early warning water level. When the cleaning liquid reaches the early warning water level line, the early warning part 23 gives an alarm to remind an operator, so that early warning can be timely realized when the water level line in the receiving groove 21 is too high, and meanwhile, if the cleaning liquid in the cleaning groove 11 is excessively leaked due to the fact that the liquid discharge port 22 in the receiving groove 21 is blocked or the cleaning mechanism 1 is aged, the operator can be warned to repair in time.

Specifically, the early warning part 23 may be a water level alarm, and is composed of a water level sensor and a buzzer, when the water level of the cleaning solution submerges the early warning water level line, the water level sensor outputs a signal to make the buzzer sound, and when the water level is normal, the alarm is automatically stopped when the water level is normal. The water level alarm can also be provided with a silencing button, and the buzzer stops working after the silencing button is pressed.

Preferably, in order to further improve the safety, as shown in fig. 1, an overflow port 24 is arranged at the upper part of the leakage-proof mechanism 2, the overflow port 24 is arranged above the early warning water level line, when the cleaning liquid level line crosses the early warning water level line, the cleaning liquid reaches the position of the overflow port 24, the overflow port 24 is communicated with the liquid discharge port 22, and the cleaning liquid overflowing from the overflow port 24 and the liquid in the liquid discharge port 22 are discharged into the sewage treatment device together.

In this embodiment, when the semiconductor chip is leaked by dripping the residual cleaning solution on the chip during the process of taking out the semiconductor chip from the cleaning mechanism 1 or the cleaning solution leaks due to aging of the cleaning mechanism 1, the cleaning solution can fall into the receiving tank 21 arranged in the leakage prevention mechanism 2 and is discharged into the sewage treatment device through the liquid discharge port 22 arranged at the bottom end of the leakage prevention mechanism 2. A floor drain structure is arranged at the liquid outlet 22, so that the accidents that articles fall to the sewage treatment device when the semiconductor chip is clamped or other accidents happen are prevented. For guaranteeing belt cleaning device's security, set up a plurality of leakage fluid ports 22 and set up drainage component in accepting groove 21 in order improving flowing back speed, in addition, still be provided with early warning part 23 to the warning operator accepts the interior washing liquid of groove 21 and reaches early warning water level line, after the early warning water level line is crossed to the washing liquid water level, can spill over through overflow port 24 that leak protection mechanism 2 set up, avoided the washing liquid to spill to workshop ground, reduced the fire hazard in semiconductor workshop.

Example two:

the present embodiment provides a cleaning apparatus, which is different from the first embodiment in that, as shown in fig. 2, a mounting groove 211 is provided in the receiving groove 21, and the bottom of the cleaning mechanism 1 is mounted in the mounting groove 211, that is, the mounting bracket 12 is mounted in the mounting groove 211. Through the setting of installing support 12 and mounting groove 211, fixed wiper mechanism 1 has been in the position of leak protection mechanism 2, has avoided wiper mechanism 1 to change the position in the belt cleaning device operation, has improved belt cleaning device's stability.

In this embodiment, mounting groove 211 is enclosed by protruding bounding wall of locating accepting the groove 21 bottom surface, compares and directly sets up the cell body structure of indent in the bottom surface of mounting groove 211, is favorable to guaranteeing the intensity of mounting groove 211, avoids mounting groove 211 to damage, can also reduce the height of accepting groove 21, is favorable to reduce cost.

Example three:

the present embodiment provides a cleaning device, which is different from the second embodiment in that, as shown in fig. 3, a projection 212 is disposed in the receiving tank 21, and the height of the projection 212 is not less than the depth of the highest liquid level allowed in the receiving tank 21. The cleaning mechanism 1 is mounted on the projection 212, and the projection 212 is not smaller than the leg of the mounting bracket 12, so that the mounting bracket 12 can be stably placed on the projection 212. The convex block 212 arranged below the cleaning mechanism 1 can heighten the height of the cleaning mechanism 1, so that the support legs of the mounting bracket 12 are prevented from being corroded by the cleaning liquid in the bearing groove 21, the safety is improved, and the service life of the cleaning device is prolonged.

The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.

Claims

1. A cleaning device comprises a cleaning mechanism (1) and is characterized by further comprising a leakage-proof mechanism (2), wherein the leakage-proof mechanism (2) comprises a receiving groove (21), the cleaning mechanism (1) is arranged in the receiving groove (21), and projections of the cleaning mechanism (1) along the vertical direction are located in the receiving groove (21); the bottom end of the leakage-proof mechanism (2) is provided with a liquid outlet (22), and the liquid outlet (22) is configured to be communicated with a sewage treatment device.

2. A cleaning device according to claim 1, characterized in that a mounting groove (211) is provided in the receiving groove (21), and the bottom of the cleaning mechanism (1) is mounted in the mounting groove (211).

3. A cleaning device according to claim 1, characterized in that a projection (212) is arranged in the receiving tank (21), the height of the projection (212) is not less than the depth of the highest liquid level in the receiving tank (21), and the cleaning mechanism (1) is mounted on the projection (212).

4. A cleaning device according to claim 1, characterized in that said leakproof means (2) is made of polyvinyl chloride material.

5. A cleaning device according to any one of claims 1-4, characterized in that the cleaning mechanism (1) comprises a cleaning tank (11) and a mounting bracket (12) arranged at the bottom of the cleaning tank (11), the mounting bracket (12) being arranged in the receiving tank (21).

6. A cleaning device according to any one of claims 1-4, characterized in that a drainage member is arranged in the reception trough (21), said drainage member being configured to guide liquid into the discharge opening (22).

7. A cleaning device according to any one of claims 1-4, characterized in that the leakage preventing means (2) is provided with a pre-warning member (23), the pre-warning member (23) being configured to sense whether the liquid in the leakage preventing means (2) reaches a pre-warning liquid level.

8. A cleaning device according to claim 7, characterized in that an overflow port (24) is arranged at the upper part of the leakage-proof mechanism (2), the overflow port (24) is arranged above the early warning liquid level line, and the overflow port (24) is communicated with the liquid discharge port (22).

9. A cleaning device according to any one of claims 1-4, characterized in that a plurality of drainage ports (22) are provided in the leakage preventing means (2).

10. A cleaning device according to any one of claims 1-4, characterized in that a floor drain is arranged at the discharge opening (22).