CN210435868U

CN210435868U - Round edge device for quartz wafer production

Info

Publication number: CN210435868U
Application number: CN201921461628.6U
Authority: CN
Inventors: 夏良军
Original assignee: Feitejing Nanjing Electronics Co ltd
Current assignee: Feitejing Nanjing Electronics Co ltd
Priority date: 2019-09-04
Filing date: 2019-09-04
Publication date: 2020-05-01
Anticipated expiration: 2029-09-04

Abstract

The utility model provides a round edge device for quartz wafer production, which comprises a bracket, the bracket comprises a transverse supporting block and a vertical supporting block, the vertical supporting block is provided with a first cylinder, the telescopic rod of the first cylinder is connected with a motor fixing plate, the motor fixing plate is provided with a grinding wheel motor, the grinding wheel motor is connected with a grinding wheel rotating shaft, the end part of the grinding wheel rotating shaft is provided with a grinding wheel, one side of the grinding wheel is provided with a dust hood, and the dust hood is connected with a dust collection box through a dust collection hose; the wafer sucking disc device is characterized in that a second air cylinder is arranged on the transverse supporting block, a telescopic rod of the second air cylinder is connected with an L-shaped movable plate, a rotating motor is arranged on the movable plate and connected with a sucking disc rotating shaft, and the sucking disc rotating shaft is connected with a wafer sucking disc. The utility model discloses usable emery wheel carries out the chamfer operation to the wafer, the utility model discloses still be equipped with the suction hood to utilize suction box, dust absorption hose etc. to adsorb the emery wheel and produce the granule at the grinding in-process.

Description

Round edge device for quartz wafer production

Technical Field

The utility model relates to a wafer production technical field, concretely relates to circle limit device for production of quartz wafer.

Background

In the processing of quartz wafers, there is generally a chamfering step, and the edge rounding device is a device for chamfering. If the wafer is assembled, the chamfering operation is not performed on the wafer, so that the edge of the wafer is sharp, operators are easily cut, and the assembling difficulty of the wafer is increased. However, the method of grinding and chamfering by using a grinding wheel manually is difficult to operate, the product quality is unstable, and abraded particles are easy to remain on the surface of the wafer and are difficult to clean. Therefore, there is an urgent need for a round edge apparatus for quartz wafer production that can solve the existing problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at the defects of the prior art and provides a round edge device for producing quartz wafers.

The utility model provides a following technical scheme:

a round edge device for quartz wafer production comprises a support, wherein the support comprises a transverse supporting block and a vertical supporting block, a first air cylinder is arranged on the vertical supporting block, a telescopic rod of the first air cylinder is connected with a motor fixing plate, a grinding wheel motor is arranged on the motor fixing plate and connected with a grinding wheel rotating shaft, a grinding wheel is arranged at the end part of the grinding wheel rotating shaft, a dust hood is arranged on one side of the grinding wheel, and the dust hood is connected with a dust box through a dust collection hose; the wafer sucking disc device is characterized in that a second air cylinder is arranged on the transverse supporting block, a telescopic rod of the second air cylinder is connected with an L-shaped movable plate, a rotating motor is arranged on the movable plate and connected with a sucking disc rotating shaft, and the sucking disc rotating shaft is connected with a wafer sucking disc.

Preferably, a fan is installed on the dust collection box.

Preferably, the dust collection box is arranged on the cross support block.

Preferably, the dust hood is connected with the motor fixing plate through a connecting rod.

Preferably, the vertical supporting block is provided with a hose through hole, and a rubber pad is arranged in the hose through hole.

Preferably, a plurality of T-shaped sliding blocks are arranged on one side of the motor fixing plate, T-shaped guide grooves are formed in the vertical supporting blocks, the T-shaped sliding blocks are arranged in the T-shaped guide grooves, and the T-shaped sliding blocks slide along the T-shaped guide grooves.

Preferably, a sliding rail is arranged on the transverse supporting block, a pulley is arranged at the bottom of the moving plate, and the pulley moves along the sliding rail.

The utility model has the advantages that:

the utility model utilizes the second cylinder to push the wafer sucker to a proper position, utilizes the first cylinder to move the grinding wheel to the position for processing the wafer, and the grinding wheel motor drives the grinding wheel to rotate so as to polish the edge of the wafer; the utility model discloses still be equipped with the suction hood, utilize suction box, dust absorption hose etc. to adsorb the emery wheel and produce the granule at the grinding in-process, and the length of dust absorption hose needs enough length to be convenient for the removal of emery wheel.

Drawings

The accompanying drawings are included to provide a further understanding and description of the invention.

Fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is a schematic view of the connection between the T-shaped slider and the motor fixing plate of the present invention.

Labeled as: 1. a cross support block; 2. a vertical supporting block; 3. a first cylinder; 4. a motor fixing plate; 5. a grinding wheel motor; 6. a grinding wheel rotating shaft; 7. a grinding wheel; 8. a dust hood; 9. a dust collection hose; 10. a dust collection box; 11. a second cylinder; 12. moving the plate; 13. a rotating electric machine; 14. a sucker rotating shaft; 15. a wafer chuck; 16. a fan; 17. a connecting rod; 18. a T-shaped slider; 19. a pulley.

Detailed Description

As shown in fig. 1 and 2, a round edge device for quartz wafer production comprises a support, the support comprises a lateral support block 1 and a vertical support block 2, a first cylinder 3 is arranged on the vertical support block 2, a telescopic rod of the first cylinder 3 is connected with a motor fixing plate 4, one side of the motor fixing plate 4 is provided with a plurality of T-shaped sliders 18, the vertical support block 2 is provided with T-shaped guide grooves, the T-shaped sliders 18 are arranged in the T-shaped guide grooves, the T-shaped sliders 18 slide along the T-shaped guide grooves, the motor fixing plate 4 is provided with a grinding wheel 7 motor 5, the grinding wheel 7 motor 5 is connected with a grinding wheel rotating shaft 6, the end of the grinding wheel rotating shaft 6 is provided with a grinding wheel 7, one side of the grinding wheel 7 is provided with a dust collection cover 8, the dust collection cover 8 is connected with a dust collection box 10 through a dust collection hose 9, the dust collection box 10 is provided with a fan 16, the dust collection cover 8, and the vertical supporting block 2 is provided with a hose through hole, and a rubber pad is arranged in the hose through hole.

The wafer cleaning device is characterized in that a second cylinder 11 is arranged on the transverse supporting block 1, an expansion rod of the second cylinder 11 is connected with an L-shaped moving plate 12, a sliding rail is arranged on the transverse supporting block 1, a pulley 19 is arranged at the bottom of the moving plate 12, the pulley 19 moves along the sliding rail, a rotating motor 13 is arranged on the moving plate 12, the rotating motor 13 is connected with a sucking disc rotating shaft 14, and the sucking disc rotating shaft 14 is connected with a wafer sucking disc 15.

In the embodiment, the wafer suction cup 15 is pushed to a proper position by using the second air cylinder 11, the grinding wheel 7 is moved to a position for processing the wafer by using the first air cylinder 3, the grinding wheel 7 is driven by the motor 5 of the grinding wheel 7 to rotate so as to grind the edge of the wafer, the motor fixing plate 4 of the embodiment is further provided with a T-shaped slide block 18, and the bottom of the moving plate 12 is provided with a pulley 19 so as to facilitate the movement of the motor fixing plate 4 and the moving plate 12; the present embodiment is further provided with a dust hood 8, which uses a dust box 10, a dust hose 9, etc. to absorb particles generated by the grinding wheel 7 during the grinding process, and the length of the dust hose 9 needs to be long enough to facilitate the movement of the grinding wheel 7.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A round edge device for quartz wafer production is characterized by comprising a support, wherein the support comprises a transverse supporting block and a vertical supporting block, a first air cylinder is arranged on the vertical supporting block, a telescopic rod of the first air cylinder is connected with a motor fixing plate, a grinding wheel motor is arranged on the motor fixing plate and connected with a grinding wheel rotating shaft, a grinding wheel is arranged at the end part of the grinding wheel rotating shaft, a dust hood is arranged on one side of the grinding wheel, and the dust hood is connected with a dust box through a dust collection hose; the wafer sucking disc device is characterized in that a second air cylinder is arranged on the transverse supporting block, a telescopic rod of the second air cylinder is connected with an L-shaped movable plate, a rotating motor is arranged on the movable plate and connected with a sucking disc rotating shaft, and the sucking disc rotating shaft is connected with a wafer sucking disc.

2. The apparatus of claim 1, wherein the suction box is provided with a fan.

3. The apparatus of claim 1, wherein the suction box is disposed on the cross-support block.

4. The apparatus of claim 1, wherein the suction hood is connected to the motor fixing plate through a connecting rod.

5. The edge rounding device of claim 1, wherein said vertical support block has a hose through hole, and a rubber pad is disposed in said hose through hole.

6. The edge rounding device for quartz wafer production as claimed in claim 1, wherein a plurality of T-shaped sliders are disposed on one side of the motor fixing plate, a T-shaped guide slot is disposed on the vertical supporting block, the T-shaped slider is disposed in the T-shaped guide slot, and the T-shaped slider slides along the T-shaped guide slot.

7. The apparatus of claim 1, wherein the supporting block has a slide rail, and the moving plate has a pulley at the bottom thereof, and the pulley moves along the slide rail.